Photoresist coating equipment

Abstract

The utility model relates to photoresist coating equipment, which comprises a workbench 10, wherein the workbench 10 is used for placing a wafer 20 and driving the wafer 20 to rotate; the glue discharging device comprises a glue discharging rod 30, the glue discharging rod 30 is located above the workbench 10, the length direction of the glue discharging rod 30 is parallel to the radius direction of the wafer 20, and a plurality of glue discharging holes 31 are formed in the glue discharging rod 30; and the scraping plate 40 is located between the workbench 10 and the glue outlet rod 30, and the length direction of the scraping plate 40 is parallel to the radius direction of the wafer 20. According to the photoresist coating equipment provided by the embodiment of the utility model, a uniform photoresist layer can be formed on the wafer, the production process can be simplified, and the production cost can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a photoresist coating device. Background Art

[0002] The photoresist coating process is an important process in the manufacturing process of semiconductor silicon wafers. When coating the photoresist, the nozzle drops the photoresist solution at the center position of the upper surface of the wafer, and then rotates the wafer to level the glue, so that the photoresist solution uniformly flows to cover the entire upper surface of the wafer, and the solution rapidly flows into a film under the action of the centrifugal force of high-speed rotation. After the diluent in the solution volatilizes, a glue layer with a certain thickness is formed on the wafer.

[0003] During the process of spin-coating the photoresist, under the action of the centrifugal force of high-speed rotation, most of the photoresist solution will be thrown out, resulting in waste, and the centrifugal force will cause the solution to accumulate at the edge and back of the wafer, resulting in the photoresist formed at the edge and back of the wafer bulging, and an additional edge cleaning process is required to remove it, and the process steps are complex.

[0004] Therefore, there is an urgent need to provide a photoresist coating device, which is beneficial to forming a uniform photoresist on the wafer and can reduce the waste of the photoresist. Summary of the Utility Model

[0005] The technical problem solved by the utility model is to provide a photoresist coating device, which can form a photoresist layer with uniform thickness on the surface of the wafer, and during the coating process, the waste of the photoresist solution can be reduced, the production cost can be reduced, and the production process can be simplified.

[0006] To solve the above technical problem, an embodiment of the utility model provides a photoresist coating device, including: a workbench for placing the wafer and driving the wafer to rotate; a glue discharging device, the glue discharging device includes a glue discharging rod located above the workbench, the length direction of the glue discharging rod is parallel to the radius direction of the wafer, and a plurality of glue discharging holes are arranged on the glue discharging rod; a scraper located between the workbench and the glue discharging rod, and the length direction of the scraper is parallel to the radius direction of the wafer.

[0007] Optionally, the scraper is arranged on the glue discharging rod or the scraper is independently arranged from the glue discharging rod.

[0008] Optionally, the angle range of the included angle between the scraper and the glue discharging rod is 0° to 30°.

[0009] Optionally, when the scraper is arranged on the glue discharging rod, the scraper is connected to one side edge in the length direction of the glue discharging rod.

[0010] Optionally, the length of the squeegee is greater than or equal to the radius of the wafer, and the difference between the squeegee and the radius of the wafer ranges from 0 to 1 cm.

[0011] Optionally, the rotation speed range of the workbench is 30 r / min to 120 r / min.

[0012] Optionally, the number of the glue outlet holes includes one or more.

[0013] Optionally, when the number of the glue outlet holes is multiple, the wafer is divided into n coating areas along the radial direction, the number of the coating areas is the same as the number of the glue outlet holes, and n is a natural number greater than or equal to 2.

[0014] Optionally, the widths of the n coating areas are the same or the areas of the n coating areas are the same.

[0015] Optionally, one glue outlet hole is arranged above each coating area, and the glue output of the glue outlet hole is positively correlated with the area of the coating area.

[0016] Optionally, the glue discharging device further includes a glue storage tank, and the glue storage tank is communicated with the glue outlet hole through a conduit.

[0017] Optionally, the glue discharging device further includes a pressure pump, the pressure pump is connected with the glue storage tank, and the pressure pump is used for pumping the photoresist solution in the glue storage tank into the glue outlet hole.

[0018] Optionally, it further includes a robotic arm, the glue discharging rod and the squeegee are installed on the robotic arm, and the robotic arm drives the glue discharging rod and the squeegee to move in a direction perpendicular to the surface of the wafer.

[0019] Optionally, the glue discharging rod is a metal glue discharging rod.

[0020] Optionally, the squeegee is a rubber squeegee.

[0021] Compared with the prior art, the technical solution of the embodiment of the present utility model has the following beneficial effects:

[0022] The photoresist coating equipment provided by this technical solution is provided with a glue discharging rod and a squeegee above the workbench. The squeegee is located between the workbench and the glue discharging rod. A plurality of glue outlet holes are arranged on the glue discharging rod. The photoresist solution drops from the glue outlet holes onto the surface of the wafer to be coated with photoresist. During the rotation of the wafer driven by the workbench, the squeegee smears the photoresist solution on the surface of the wafer onto the entire surface of the wafer, which is beneficial to forming a uniform photoresist layer on the surface of the wafer. Moreover, the process steps are simple, and the waste of the photoresist solution can also be reduced, which is beneficial to reducing costs.

[0023] Further, the length of the squeegee is greater than or equal to the radius of the wafer, and the difference between the length of the squeegee and the radius of the wafer ranges from 0 to 1 cm. When the length of the squeegee is greater than or equal to the radius of the wafer, it can prevent the situation where the center position of the wafer is not coated with photoresist and reduce the accumulation of the glue liquid at the center of the wafer, which is further conducive to forming a uniform photoresist layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 FIG. 6 is a schematic side structure diagram of a photoresist coating device according to an embodiment of the present invention;

[0025] Figure 2 FIG. 10 is a schematic connection structure diagram of a glue applicator rod and a squeegee according to an embodiment of the present invention;

[0026] Figure 3 FIG. 14 is a schematic top view structure diagram of a wafer and a glue applicator rod according to an embodiment of the present invention;

[0027] Figure 4 FIG. 18 is a schematic top view structure diagram of a wafer and a glue applicator rod according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] As known from the background art, in the process of forming a photoresist layer on the surface of a wafer by the commonly used spin coating method, the centrifugal force generated by high-speed rotation is used to make the glue liquid flow rapidly into a film, which will cause a large part of the glue liquid to be thrown out during the rotation, resulting in waste of the glue liquid and an increase in production costs. In addition, due to the action of the centrifugal force, the glue liquid will accumulate at the edge and back of the wafer, and the formed photoresist layer will bulge at the edge and back of the wafer, and an additional edge washing process is required to remove the bulged photoresist layer, and the process steps are complex.

[0029] To solve the above problems, an embodiment of the present invention provides a photoresist coating device, which includes a workbench for carrying and driving the wafer to rotate, a glue applicator rod located above the workbench, and a squeegee located between the workbench and the glue applicator rod. A plurality of glue outlet holes are provided on the glue applicator rod, and the glue liquid falls onto the surface of the wafer through the glue outlet holes. As the wafer rotates, the squeegee contacts the photoresist glue liquid on the surface of the wafer and coats the glue liquid on the entire surface of the wafer, forming a uniform photoresist layer on the surface of the wafer, which can reduce the waste of the photoresist glue liquid and is beneficial to cost control. Moreover, with the assistance of the squeegee, no bulges will be formed at the edge and back of the wafer, and an additional edge washing process is not required to remove the excess bulges, simplifying the process flow and improving the efficiency.

[0030] In order to make the above objects, features and beneficial effects of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be given with reference to the accompanying drawings.

[0031] Figure 1It is a schematic side view of a photoresist coating device in an embodiment of the present utility model; Figure 2 It is a schematic connection structure view of a glue discharging rod and a squeegee in an embodiment of the present utility model; Figure 3 It is a schematic top view of a wafer and a glue discharging rod in an embodiment of the present utility model; Figure 4 It is a schematic top view of a wafer and a glue discharging rod in another embodiment of the present utility model.

[0032] With reference to Figure 1 and Figure 2 , the photoresist coating device includes: a workbench 10 for placing a wafer 20 and driving the wafer 20 to rotate; a glue discharging device including a glue discharging rod 30 located above the workbench 10, the length direction of the glue discharging rod 30 being parallel to the radius direction of the wafer 20, and a plurality of glue discharging holes 31 being provided on the glue discharging rod 30; a squeegee 40 located between the workbench 10 and the glue discharging rod 30, the length direction of the squeegee 40 being parallel to the radius direction of the wafer 20.

[0033] In this embodiment, the photoresist liquid reaches the surface of the wafer 20 through the glue discharging holes 31. The workbench 10 drives the wafer 20 to rotate, and the squeegee 40 smears the photoresist liquid onto the entire surface of the wafer 20 as the wafer 20 rotates. With the auxiliary effect of the squeegee 40, a uniform photoresist layer can be formed on the surface of the wafer 20.

[0034] In this embodiment, it further includes: a driving device (not shown) connected to the workbench 10 to drive the workbench 10 to rotate.

[0035] The rotation speed of the workbench 10 is 30 r / min to 120 r / min. If the rotation speed of the workbench is too high, under the action of the centrifugal force at high speed, the glue liquid is easily thrown out of the surface of the wafer 20, resulting in waste of the glue liquid and increased production cost; if the rotation speed of the workbench is too low, the time required to complete one circle is longer, and it takes a longer time for the squeegee 40 to smear the glue liquid over the entire surface of the wafer 20, reducing the production efficiency. Therefore, the rotation speed of the workbench 10 is controlled between 30 r / min and 120 r / min.

[0036] The length of the glue discharging rod 30 is greater than or equal to the radius of the wafer 20, which is beneficial to the glue discharging holes 31 being more evenly distributed along the radius direction above the wafer 20. In this embodiment, the length of the glue discharging rod 30 is equal to the radius of the wafer 20.

[0037] One or more dispensing holes 31 are provided on the glue stick 30. In this embodiment, a plurality of dispensing holes 31 are provided on the glue stick 30, and the plurality of dispensing holes 31 are arranged along the length direction of the glue stick 30. Providing a plurality of dispensing holes 31 is conducive to the relatively even distribution of the glue liquid on the wafer, which is conducive to subsequent uniform application to the entire surface of the wafer.

[0038] Reference Figure 3 , in this embodiment, the wafer 20 is divided into n coating regions 21 along its radial direction, and the number of the coating regions 21 is the same as the number of the dispensing holes 31, and n is a natural number greater than or equal to 2.

[0039] In other embodiments, the number of the coating regions 21 may not be the same as the number of the dispensing holes 31.

[0040] In this embodiment, the n coating regions 21 include a central circle located at the center of the wafer 20 and each ring surrounding the central circle.

[0041] Reference Figure 3 , in this embodiment, the widths of the divided n coating regions 21 are the same. It should be noted that the width of the central circle here is its radius, and the width of each ring is the difference between its outer diameter and inner diameter.

[0042] In this embodiment, each coating region 21 corresponds to a dispensing hole 31, and the dispensing hole 31 is located at the center position of the width of each coating region 21, which is conducive to the uniform arrangement of the dispensing positions.

[0043] In other embodiments, it is not necessary to provide a dispensing hole 31 for each coating region 21. One dispensing hole may be provided for every 2 or 3 coating regions.

[0044] The dispensing amount of the dispensing hole 31 is positively correlated with the area size of the corresponding coating region 21. If the area of the coating region 21 is large, the dispensing amount of the corresponding dispensing hole 31 is large, which is conducive to forming a photoresist layer with uniform thickness and avoiding too much or too little photoresist liquid in some regions.

[0045] In this embodiment, the widths of the coating regions 21 are the same. Along the direction from the center of the wafer 20 to the circumference, the areas of the coating regions 21 increase in sequence, and the dispensing amounts of the dispensing holes 31 increase in sequence.

[0046] Reference Figure 4 , in another embodiment, the areas of the divided n coating regions 21 are the same. Along the direction from the center of the wafer 20 to the circumference, the widths of the coating regions 21 decrease in sequence, and the dispensing amounts of the dispensing holes 31 are the same.

[0047] In this embodiment, the length directions of the glue stick 30 and the squeegee 40 are both parallel to the radial direction of the wafer 20. In this embodiment, the length direction of the squeegee 40 is also parallel to the length direction of the glue stick 30.

[0048] In other embodiments, an angle may be formed between the length direction of the squeegee 40 and the length direction of the glue stick 30, and the angle range of the formed angle is 0° to 30°.

[0049] It should be noted that the angle here refers to the acute angle between the length direction of the squeegee 40 and the length direction of the glue stick 30.

[0050] The angle of the included angle cannot be too large. If the angle of the included angle is too large, the squeegee is far from the glue stick, and it takes a long time for the glue liquid to reach the position of the squeegee after falling onto the surface of the wafer, which affects the formation time of the photoresist.

[0051] In this embodiment, the length of the squeegee 40 is equal to the radius of the wafer 20. Such a setting can make the action range of the squeegee 40 cover the entire surface of the wafer 20, avoiding the lack of photoresist glue liquid at the center position of the wafer 20.

[0052] In other embodiments, the length of the squeegee 40 may also be slightly longer than the radius of the wafer, which can reduce the accumulation of glue liquid at the center of the wafer, and the difference between the two is set within 1 cm.

[0053] In this embodiment, the squeegee 40 is provided on the glue stick 30; in other embodiments, the squeegee 40 may also be independently provided from the glue stick 30.

[0054] In this embodiment, the squeegee 40 is connected to one side edge in the length direction of the glue stick 30.

[0055] In this embodiment, the squeegee 40 is pasted on the side edge of the glue stick 30 with glue; in other embodiments, the squeegee 40 may also be connected to the side edge of the glue stick 30 by means of welding, clamping, etc., or the glue stick 30 and the squeegee 40 may be formed by an integral molding method.

[0056] In this embodiment, the glue is epoxy resin glue.

[0057] In this embodiment, the material of the squeegee 40 is rubber material, and the hardness of the rubber is between 80 and 100 degrees, and the hardness unit is Shore hardness.

[0058] Using rubber material with a hardness of 80 to 100 degrees enables the squeegee 40 to have a certain hardness to apply the photoresist glue liquid and also avoids scratching the surface of the wafer 20 when applying the glue liquid.

[0059] In this embodiment, the material of the glue stick 30 is metal, specifically stainless steel, and other metals such as titanium alloy can also be used. The glue stick made of metal is wear-resistant and easy to form, and can extend the service life of the glue stick.

[0060] In this embodiment, the photoresist coating equipment further includes: a robotic arm (not shown), the glue stick 30 and the squeegee 40 are installed on the robotic arm, and the robotic arm drives the glue stick and the squeegee to move in a direction perpendicular to the surface of the wafer 20.

[0061] On different wafers, photoresist layers with different thicknesses need to be formed. By the robotic arm, the distance between the glue stick and the squeegee and the wafer surface can be adjusted to facilitate the formation of different subsequent photoresist layers.

[0062] In this embodiment, the photoresist coating equipment further includes: a glue storage tank (not shown), and the glue storage tank is communicated with the glue outlet hole 31 through a conduit 32.

[0063] In this embodiment, the photoresist coating equipment further includes: a pressure pump (not shown), and the pressure pump is used to pump the photoresist liquid in the glue storage tank into the glue outlet hole.

[0064] In this embodiment, under the action of the pressure pump, the photoresist liquid in the glue storage tank flows through the conduit 32 to the glue outlet hole 31, and then falls onto the surface of the wafer 20 through the glue outlet hole 31.

[0065] In this embodiment, the pressure pump adopts a diaphragm pump; in other embodiments, other power devices can also be used.

[0066] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. A photoresist coating device, characterized in that: include: A workbench, the workbench is used to place the wafer and drive the wafer to rotate; A glue dispensing device, the glue dispensing device comprising a glue dispensing rod, the glue dispensing rod being located above the workbench, the length direction of the glue dispensing rod being parallel to the radius direction of the wafer, and the glue dispensing rod being provided with a plurality of glue dispensing holes; A scraper is located between the workbench and the glue dispensing rod, and the length direction of the scraper is parallel to the radius direction of the wafer.

2. The photoresist coating device according to claim 1, characterized in that: The scraper is arranged on the glue dispensing rod or the scraper and the glue dispensing rod are arranged independently.

3. The photoresist coating device according to claim 2, characterized in that: The angle between the scraper and the glue discharge rod ranges from 0° to 30°.

4. The photoresist coating device according to claim 2, characterized in that: When the scraper is arranged on the glue dispensing rod, the scraper is connected to one side of the glue dispensing rod in the length direction.

5. The photoresist coating device according to claim 1, characterized in that: The length of the scraper is greater than or equal to the radius of the wafer, and the difference between the radius of the scraper and the radius of the wafer is in the range of 0 to 1 cm.

6. The photoresist coating device according to claim 1, characterized in that: The rotation speed range of the workbench is 30r / min to 120r / min.

7. The photoresist coating device according to claim 1, characterized in that: The number of the glue outlet holes includes one or more.

8. The photoresist coating device according to claim 7, characterized in that: When there are multiple glue outlet holes, the wafer is divided into n coating areas along the radial direction, the number of the coating areas is consistent with the number of the glue outlet holes, and n is a natural number ≥2.

9. The photoresist coating device according to claim 8, characterized in that: The n coating regions have the same width or the n coating regions have the same area.

10. The photoresist coating device according to claim 9, characterized in that: A glue outlet hole is arranged above each coating area, and the glue outlet amount of the glue outlet hole is positively correlated with the area size of the coating area.

11. The photoresist coating device according to claim 1, characterized in that: The glue discharging device further comprises a glue storage tank, and the glue storage tank is connected with the glue discharging hole through a conduit.

12. The photoresist coating device according to claim 11, characterized in that: The glue discharging device also includes a pressure pump, which is connected to the glue storage tank and is used to pump the photoresist glue liquid in the glue storage tank into the glue discharging hole.

13. The photoresist coating device according to claim 1, characterized in that: Also includes: A mechanical arm, the glue stick and the scraper are installed on the mechanical arm, and the mechanical arm drives the glue stick and the scraper to move in a direction perpendicular to the surface of the wafer.

14. The photoresist coating device according to claim 1, characterized in that: The glue dispensing rod is a metal glue dispensing rod.

15. The photoresist coating device according to claim 1, characterized in that: The scraper is a rubber scraper.

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