Liquid cooling server

Abstract

The utility model discloses a liquid cooling server, and the server comprises a data processing module which comprises a computing power board and a first liquid cooling board; the first liquid cooling plate and the computing force plate are stacked along a first direction; the first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet; the power supply module comprises a power supply module and a third liquid cooling plate, the third liquid cooling plate comprises a third liquid inlet and a third liquid outlet, and the third liquid outlet is communicated to the first liquid inlet; and the data processing module and the power module are stacked through a communicating pipe. Mechanical connection is provided between the computing power board and the power supply module, so that the computing power board and the power supply module form a whole and are convenient to install and transport.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling heat dissipation, in particular to a liquid cooling server. Background Art

[0002] With the continuous development of artificial intelligence, servers need to perform operations with higher density and higher computing power. The components that perform operations on the server will generate a large amount of heat. If not discharged in time, the high temperature caused by a large amount of heat may cause the server to shut down, internal circuit short circuit, or even burn out components.

[0003] Liquid cooling heat dissipation has advantages such as low noise and low power consumption, and the server can adopt a liquid cooling heat dissipation solution.

[0004] However, in existing liquid cooling servers, most are configured with a liquid cooling plate for each computing power board, and the coolant flows in from the liquid inlet of the liquid cooling plate and out from the liquid outlet. At this time, for the computing power board, the coolant has a single flow direction and a short flow path. In this way, it is necessary to use coolant with a lower temperature to participate in heat exchange to maintain the chip temperature within the normal range, and the heat dissipation efficiency is not high. In addition, in existing liquid cooling servers, there is only an electrical connection between the power supply module that powers the computing power board and the computing power board, and it is necessary to rely on the chassis to provide physical support for the two to form the entire server, which is inconvenient for installation and transportation. Summary of the Utility Model

[0005] In view of at least one of the above technical problems, an embodiment of the present application provides a liquid cooling server, including a data processing module and a power supply module. The data processing module includes a computing power board and a first liquid cooling plate, and the power supply module includes a power supply module and a third liquid cooling plate. The data processing module and the power supply module are stacked through a communication pipe, that is, a mechanical connection is provided between the computing power board and the power supply module to form an integral body, which is convenient for installation and transportation.

[0006] An embodiment of the present application provides a liquid cooling server, including:

[0007] A data processing module, including a computing power board and a first liquid cooling plate; the first liquid cooling plate and the computing power board are stacked along a first direction; the first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet;

[0008] A power supply module, including a power supply module and a third liquid cooling plate. The third liquid cooling plate includes a third liquid inlet and a third liquid outlet, and the third liquid outlet is communicated with the first liquid inlet;

[0009] The data processing module and the power supply module are stacked through a communication pipe.

[0010] In one embodiment, the data processing module and the power supply module are fixedly connected through a fixing plate. The fixing plate extends along the first direction. One end of the fixing plate is fixedly installed with the first liquid cooling plate, and the other end of the fixing plate is fixedly installed with the third liquid cooling plate.

[0011] In one embodiment, the data processing module further includes a second liquid cooling plate. The second liquid cooling plate is disposed on a side of the computing power board facing away from the first liquid cooling plate. The first liquid cooling plate, the computing power board, and the second liquid cooling plate are stacked along the first direction. The second liquid cooling plate is provided with a second liquid inlet and a second liquid outlet, and the first liquid outlet is communicated with the second liquid inlet.

[0012] In one embodiment, the second liquid cooling plate and the computing power board are fastened to the first liquid cooling plate through an elastic fixing structure. Two ends of the elastic fixing structure are elastically abutted against the computing power board and the second liquid cooling plate respectively.

[0013] In one embodiment, limiting grooves are respectively provided on two opposite surfaces of the first liquid cooling plate. A limiting boss matching the limiting groove is provided on a surface of the second liquid cooling plate facing the first liquid cooling plate. The first liquid cooling plate and the second liquid cooling plate are installed in a limited docking manner.

[0014] In one embodiment, on an end face of the data processing module, the first liquid inlet and the first liquid outlet are respectively disposed at two ends in a direction perpendicular to the first direction. The second liquid inlet and the second liquid outlet are respectively disposed at two ends in a direction perpendicular to the first direction. The first liquid inlet is close to the second liquid outlet, and the first liquid outlet is close to the second liquid inlet, so that the flow direction of the coolant in the first liquid cooling plate is opposite to its flow direction in the second liquid cooling plate.

[0015] In one embodiment, when the first liquid cooling plate is disposed between a pair of the computing power boards, a pair of the second liquid cooling plates are respectively disposed on sides of the pair of the computing power boards facing away from the first liquid cooling plate. The first liquid cooling plate, the pair of the computing power boards, and the pair of the second liquid cooling plates are stacked along the first direction. The first liquid outlet is simultaneously communicated with the pair of the second liquid inlets.

[0016] The data processing module further includes a liquid distributor and a liquid collector. A liquid distribution port of the liquid distributor is used for being respectively communicated and installed with the first liquid outlet and the pair of the second liquid inlets; a liquid collection port of the liquid collector is used for being respectively communicated and installed with the pair of the second liquid outlets, so that the coolant flows out from the water outlet after flowing through the pair of the second liquid cooling plates.

[0017] In one embodiment, the first liquid outlet, the second liquid inlet, and the second liquid outlet are respectively provided with insertion flanges at their respective positions, the liquid distribution port and the liquid collection port are respectively provided with insertion grooves at their respective positions, and the insertion flange is sealingly inserted and installed with the insertion groove.

[0018] In one embodiment, the first liquid cooling plate is convexly provided with a liquid inlet flange for opening the first liquid inlet, the first liquid inlet is opened on a surface of the liquid inlet flange perpendicular to the first direction, and the first liquid inlet is communicated to the third liquid outlet through the communication pipe arranged along the first direction.

[0019] In one embodiment, an operation panel is externally provided for the data processing module and the power supply module, and a water inlet joint and a water outlet joint are provided on the operation panel. The water inlet joint is communicated to the third liquid inlet, and the water outlet joint is communicated to the water outlet of the data processing module.

[0020] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0021] The embodiment of the present application provides a liquid-cooled server. By stacking the data processing module and the power supply module included therein through a communication pipe, a mechanical connection is provided between the computing power board and the power module, so that the two form an integral body, which is convenient for installation and transportation. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is a schematic structural diagram of the data processing module in the embodiment of the present application.

[0024] Figure 2 It is a schematic structural diagram of the first liquid cooling plate in the embodiment of the present application.

[0025] Figure 3 It is a schematic structural diagram of the second liquid cooling plate in the embodiment of the present application.

[0026] Figure 4 It is a schematic cross-sectional structural diagram of the data processing module in the embodiment of the present application.

[0027] Figure 5 For Figure 4 Partial enlarged view of

[0028] Figure 6 Schematic structural diagram of the liquid distributor described in the embodiment of the present application.

[0029] Figure 7 Schematic structural diagram of the liquid distributor described in the embodiment of the present application after being installed on the stacked first liquid cooling plate and second liquid cooling plate.

[0030] Figure 8 For Figure 7 Partial enlarged view of

[0031] Figure 9 Schematic structural diagram of the liquid collector described in the embodiment of the present application.

[0032] Figure 10 Schematic structural diagram of the liquid collector described in the embodiment of the present application after being installed on the stacked first liquid cooling plate and second liquid cooling plate.

[0033] Figure 11 For Figure 10 Partial enlarged view of

[0034] Figure 12 Schematic structural diagram of the liquid distributor described in another embodiment of the present application.

[0035] Figure 13 For Figure 12 Schematic structural diagram of the liquid distributor after being installed on the stacked first liquid cooling plate and second liquid cooling plate.

[0036] Figure 14 Internal cross-sectional view of the data processing module described in the embodiment of the present application.

[0037] Figure 15 For Figure 14 Partial enlarged view of

[0038] Figure 16 Schematic structural diagram of the liquid-cooled server described in the embodiment of the present application.

[0039] Figure 17 Schematic structural diagram of the stacked installation of the data processing module and the power module described in the embodiment of the present application.

[0040] Figure 18 Schematic semi-sectional view of the connecting pipe described in the embodiment of the present application.

[0041] Figure 19 For Figure 18 Partial enlarged view of

[0042] Figure 20 Schematic structural diagram of the fixing plate described in the embodiment of the present application.

[0043] Wherein, reference numerals:

[0044] 100 - Data processing module,

[0045] 200 - Power supply module,

[0046] 300 - Server housing, 301 - Chassis, 302 - Top cover, 303 - Fixed plate, 304 - Operation panel, 305 - Water inlet joint, 306 - Water outlet joint,

[0047] 3031 - Fixing hole,

[0048] 400 - Sealing ring,

[0049] 10 - First liquid cooling plate, 11 - First liquid inlet, 12 - First liquid outlet, 13 - Liquid inlet flange, 14 - Insertion flange, 15 - Screw hole, 16 - Limit groove, 17 - First fixing flange,

[0050] 141 - Joint thread hole,

[0051] 20 - Second liquid cooling plate, 21 - Second liquid inlet, 22 - Second liquid outlet, 23 - First through hole, 24 - Rib, 25 - Limit boss,

[0052] 30 - Third liquid cooling plate, 31 - Third liquid inlet, 32 - Third liquid outlet, 33 - Second fixing flange,

[0053] 40 - Computing power board, 41 - Second through hole, 42 - Chip, 43 - Positive pole of computing power board, 44 - Negative pole of computing power board,

[0054] 50 - Power module, 51 - Power plug,

[0055] 60 - Liquid distributor, 61 - Liquid distribution port, 62 - Insertion groove, 63 - Sealing sleeve ring,

[0056] 70 - Liquid collector, 71 - Liquid collection port, 72 - Water outlet,

[0057] 80 - Connecting pipe, 81 - Male head, 82 - Female head,

[0058] 90 - Spring screw, 91 - Screw post, 92 - Threaded post, 93 - Nut, 94 - Spring,

[0059] X - First direction. Detailed implementation manners

[0060] To better understand the above - mentioned technical solutions, the exemplary embodiments of the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein.

[0061] Figure 1It is a schematic structural diagram of a data processing module. Figure 2 It is a schematic structural diagram of a first liquid cooling plate. Figure 3 It is a schematic structural diagram of a second liquid cooling plate. Figure 4 It is a schematic cross-sectional structural diagram of a data processing module. Please refer to Figures 1 to 4 , which provides a data processing module based on liquid cooling heat dissipation. The data processing module includes a computing power board 40, a first liquid cooling plate 10, and a second liquid cooling plate 20. Among them, the first liquid cooling plate 10 is arranged between a pair of computing power boards 40, and a pair of second liquid cooling plates 20 are respectively arranged on one side of a pair of computing power boards 40 facing away from the first liquid cooling plate 10, so that the first liquid cooling plate 10, a pair of computing power boards 40, and a pair of second liquid cooling plates 20 are stacked along the first direction X. Among them, the first liquid cooling plate 10 is provided with a first liquid inlet 11 and a first liquid outlet 12, and the second liquid cooling plate 20 is provided with a second liquid inlet 21 and a second liquid outlet 22. And, the first liquid outlet 12 is simultaneously communicated with a pair of second liquid inlets 21, so that after the coolant flows in from the first liquid inlet 11 and flows through the first liquid cooling plate 10, it simultaneously flows through a pair of second liquid cooling plates 20.

[0062] Specifically, in this embodiment, the data processing module includes a first liquid cooling plate, a pair of computing power boards, and a pair of second liquid cooling plates. Among them, one computing power board is arranged on each side of the first liquid cooling plate, and then, a second liquid cooling plate is arranged on one side of each computing power board facing away from the first liquid cooling plate. In this way, the first liquid cooling plate, a pair of computing power boards, and a pair of second liquid cooling plates can form a stacked arrangement along the first direction. In other words, the first liquid cooling plate is in the middle of the stack, then, the computing power boards are on both sides of the first liquid cooling plate, and the other side of each computing power board is the second liquid cooling plate.

[0063] Thus, for any one of the pair of computing power boards, the first liquid cooling plate and the second liquid cooling plate are on both sides of it, and the first liquid cooling plate and the second liquid cooling plate can simultaneously perform liquid cooling heat dissipation for it. In this embodiment, the first liquid outlet is simultaneously communicated with a pair of second liquid inlets, that is, the flow channels of the first liquid cooling plate and the overall flow channel are arranged in series, and the flow channels of a pair of second liquid cooling plates are arranged in parallel.

[0064] Thus, the coolant first flows into the first liquid cooling plate from the first liquid inlet, and then, flows out from the first liquid outlet of the first liquid cooling plate. Next, the coolant will be divided into a pair of second liquid cooling plates, that is, part of the coolant flows into one of the second liquid cooling plates, and the remaining part of the coolant flows into the other second liquid cooling plate. Finally, the two parts of the coolant flow out from a pair of second liquid outlets respectively, completing the liquid cooling heat dissipation of a pair of computing power boards.

[0065] It can be seen that for any computing power board, the flow channels of the liquid cooling plates on both sides are in series, increasing the heat dissipation process of the coolant for the computing power board. On the basis of ensuring that the temperature of the chips on the computing power board is maintained within the normal range, the temperature difference between the coolant and the chips can be effectively reduced. That is to say, the inlet temperature and outlet temperature of the coolant can be increased, and it is no longer necessary to use coolant at a lower temperature to maintain the chip temperature within the normal range.

[0066] Furthermore, on the basis that both the inlet temperature and outlet temperature of the coolant can be increased, on the one hand, the higher inlet temperature of the coolant can effectively reduce the energy consumption of coolant refrigeration; on the other hand, the higher outlet temperature of the coolant means that the coolant with a higher outlet temperature can further participate in heat exchange cycles such as heating. In essence, this is to transfer the heat generated by the computing power board consuming electricity to the heating link through the coolant, rather than wasting it, thereby improving the energy utilization rate.

[0067] In a possible implementation manner, the first liquid inlet 11, the first liquid outlet 12, the second liquid inlet 21, and the second liquid outlet 22 are all located on the same end face of the data processing module.

[0068] That is, specifically in combination with Figure 1 , the first liquid cooling plate stacked along the first direction and a pair of second liquid cooling plates form a shape similar to a cuboid, that is, the data processing module is, for example, cuboid-shaped. Then, among the four end faces of the data processing module parallel to the first direction, in this embodiment, the liquid inlets and outlets of each liquid cooling plate can be specifically arranged on the same end face, so as to effectively reduce the volume of the data processing module, facilitate installation and maintenance, and improve the space utilization rate at the same time.

[0069] Wherein, the first direction is, for example, the vertical direction, and the first liquid inlet, the first liquid outlet, the second liquid inlet, and the second liquid outlet are, for example, all located on the front end face of the data processing module.

[0070] In a specific implementation manner, on the end face of the data processing module:

[0071] The first liquid inlet 11 and the first liquid outlet 12 are respectively arranged at both ends in the direction perpendicular to the first direction X;

[0072] The second liquid inlet 21 and the second liquid outlet 22 are respectively arranged at both ends in the direction perpendicular to the first direction X;

[0073] And, the first liquid inlet 11 is close to the second liquid outlet 22, and the first liquid outlet 12 is close to the second liquid inlet 21, so that the flow direction of the coolant in the first liquid cooling plate 10 is opposite to its flow direction in the second liquid cooling plate 20.

[0074] That is, in combination with Figure 1 and Figure 4, for example, on the front surface of the data processing module, the first liquid inlet and the first liquid outlet of the first liquid cooling plate are respectively arranged at the left and right ends, and the second liquid inlet and the second liquid outlet of the second liquid cooling plate are respectively arranged at the left and right ends; moreover, the first liquid inlet of the first liquid cooling plate is close to the second liquid outlet of the second liquid cooling plate, and the first liquid outlet of the first liquid cooling plate is close to the second liquid inlet of the second liquid cooling plate; that is to say, it can be combined with Figure 4 , for example, on the front surface, the first liquid inlet and the second liquid outlet are located at the same end ( Figure 4 the left side in Figure 4 ), the first liquid outlet and the second liquid inlet are located at the same end ( Figure 4 the right side in Figure 4 ), thus, it can be understood that for the first liquid cooling plate, when the coolant flows into the first liquid cooling plate from the first liquid inlet, it enters from the

[0075] left side in

[0076] and flows out from the right side, and when the coolant flows into the second liquid cooling plates on the upper and lower sides, it flows in from the

[0077] right side in Figure 4 and flows out from the left side, that is, the flow direction of the coolant in the first liquid cooling plate (left in and right out) is opposite to its flow direction in the second liquid cooling plates (right in and left out) as a whole.

[0078] It can be understood that at this time, for any computing power board, the flow directions of the coolant in the liquid cooling plates on both sides are opposite, which can improve the overall heat dissipation uniformity of the computing power board.

[0079] In a specific embodiment, the first liquid outlet 12 and a pair of second liquid inlets 21 are arranged in an up-and-down alignment along the first direction X; the first liquid inlet 11 and a pair of second liquid outlets 22 are arranged in an up-and-down offset along the first direction X.

[0077] In this embodiment, continue to refer to Figure 4 , the first liquid outlet and a pair of second liquid inlets located at the same end can be specifically arranged in an up-and-down alignment along the first direction, and then, the first liquid inlet and a pair of second liquid outlets located at the same end can be arranged in an up-and-down offset along the first direction, which can facilitate the installation of the liquid distributor and the liquid collector mentioned in the subsequent embodiments.

[0078] In a possible implementation manner, the data processing module further includes a liquid distributor 60 and a liquid collector 70; wherein, the liquid distributor 60 is provided with three liquid distribution ports 61, the three liquid distribution ports 61 are internally connected in the liquid distributor 60, and the three liquid distribution ports 61 are respectively used for being connected and installed with the first liquid outlet 12 and a pair of second liquid inlets 21 so that the first liquid outlet 12 and a pair of second liquid inlets 21 are simultaneously connected; wherein, the liquid collector 70 is provided with two liquid collection ports 71 and a water outlet 72, the two liquid collection ports 71 and the water outlet 72 are internally connected in the liquid collector 70, and the two liquid collection ports 71 are respectively used for being connected and installed with a pair of second liquid outlets 22 so that the coolant flows out from the water outlet 72 after flowing through a pair of second liquid cooling plates 20 simultaneously.

[0079] On the one hand, in combination with Figures 6 to 8 , in this embodiment, a liquid distributor can be specifically used to connect the first liquid outlet and a pair of second liquid inlets simultaneously.

[0080] Specifically, the liquid distributor can be provided with three liquid distribution ports. Then, the three liquid distribution ports are connected inside the liquid distributor. In this way, the three liquid distribution ports can be respectively connected and installed with the first liquid outlet and a pair of second liquid inlets. That is to say, one of the three liquid distribution ports connected to the first liquid outlet ( Figure 6 the middle liquid distribution port 61 among them) serves as the water inlet of the liquid distributor. Then, the other two liquid distribution ports ( Figure 6 the upper and lower liquid distribution ports 61 among them) serve as the water outlets of the liquid distributor. Thus, after the coolant flows out from the first liquid outlet, it can flow into a pair of second liquid inlets respectively through this liquid distributor, that is, be split and flow to a pair of second liquid cooling plates.

[0081] On the other hand, in combination with Figures 9 to 11 , in this embodiment, a liquid collector can also be specifically used to combine the coolant flowing out from a pair of second liquid outlets.

[0082] Specifically, the liquid collector can be provided with two liquid collection ports and one liquid outlet. The two liquid collection ports and one liquid outlet are connected inside the liquid collector. In this way, the two liquid collection ports can be respectively connected and installed with a pair of second liquid outlets. Thus, after the split coolant flows out from a pair of second liquid outlets, it can be combined through this liquid collector and flow out from the liquid outlet of the liquid collector.

[0083] It can be understood that in combination with the first liquid inlet of the above-mentioned first liquid cooling plate, at this time, for the overall data processing module, it has an inlet of the coolant, that is, the first liquid inlet, and at the same time has an outlet of the coolant, that is, the liquid outlet, which is convenient for implementation.

[0084] In a specific embodiment, the three liquid distribution ports 61 are arranged on the same end face of the liquid distributor 60; the two liquid collection ports 71 are arranged on the same end face of the liquid collector 70, and moreover, the liquid collection port 71 and the liquid outlet 72 are respectively arranged on a pair of opposite end faces of the liquid collector 70.

[0085] That is, first in combination with Figure 6 , for the liquid distributor, the three liquid distribution ports can be specifically arranged on the same end face thereof; then please combine Figure 9 , for the liquid collector, the two liquid collection ports can be specifically arranged on the same end face thereof, and then, the liquid outlet is arranged on the end face opposite to the end face where the liquid collection ports are arranged, which is convenient for installation.

[0086] In a specific embodiment, the first liquid outlet 12, the second liquid inlet 21 and the second liquid outlet 22 are respectively arranged on the plugging flanges 14 at their respective positions, the liquid distribution ports 61 and the liquid collection ports 71 are respectively arranged in the plugging grooves 62 at their respective positions, and the plugging flanges 14 and the plugging grooves 62 are hermetically plugged and installed.

[0087] Regarding the installation of the above-mentioned liquid distributor, liquid collector and liquid cooling plate, in combination with Figure 2 , Figure 3 , insertion flanges 14 can be specifically provided on the first liquid cooling plate and the second liquid cooling plate. Then, a first liquid outlet, a second liquid inlet and a second liquid outlet are respectively opened at the end parts of the insertion flanges. Correspondingly, for example, referring to Figure 12 , insertion grooves 62 can be provided on the liquid distributor and the liquid collector. Then, the above-mentioned liquid distribution ports and liquid collection ports are respectively opened in the insertion grooves. In this way, by simply inserting and installing the insertion flanges and the insertion grooves, the three liquid distribution ports of the liquid distributor can be respectively connected and installed with the first liquid outlet and a pair of second liquid inlets, and the two liquid collection ports of the liquid collector can be respectively connected and installed with a pair of second liquid outlets.

[0088] It can be understood that, in order to prevent the leakage of the coolant, the insertion and installation of the above-mentioned insertion flanges and insertion grooves should be a sealed insertion and installation. For example, referring to Figure 8 , Figure 11 , a sealing ring 400 etc. can be used to achieve this.

[0089] In addition, a joint threaded hole 141 can be provided beside the above-mentioned insertion flange. In this way, screws etc. can be used to tightly install the liquid distributor, the liquid collector and the liquid cooling plate.

[0090] In a specific embodiment, the insertion groove 62 is provided with a sealing collar 63, and the sealing collar 63 is movably installed in the radial direction relative to the insertion groove 62.

[0091] In this embodiment, referring to Figure 12 , taking the liquid distributor as an example, considering installation tolerances (the installation tolerances here refer to the installation tolerances when each liquid cooling plate and each computing power plate are stacked), a sealing collar 63 that can move in the radial direction relative to it can be specifically provided in the insertion groove 62, so as to adapt to the position deviation of each insertion flange 14.

[0092] In a possible implementation manner, the first liquid cooling plate 10 protrudes with a liquid inlet flange 13 for opening a first liquid inlet 11. Among them, the first liquid inlet 11 is opened on the surface of the liquid inlet flange 13 perpendicular to the first direction X, so that the first liquid inlet 11 is connected to the third liquid outlet 32 of the third liquid cooling plate 30 in the power supply module 200 through a connecting pipe 80 telescopically arranged along the first direction X.

[0093] In this embodiment, the first liquid inlet of the first liquid cooling plate can be specifically arranged on the liquid inlet flange protruding from it. Further, the first liquid inlet can be opened on the surface of the liquid inlet flange perpendicular to the first direction, so as to facilitate the installation of the connecting pipe described later.

[0094] Regarding the fixation of the liquid cooling plate and the computing power board 40, in a possible implementation, screw holes 15 are respectively provided on two opposite sides of the first liquid cooling plate 10; at positions corresponding to the screw holes 15, the second liquid cooling plate 20 is provided with first through holes 23, and the computing power board 40 is provided with second through holes 41; so that after the screw passes through the first through hole 23, the second through hole 41 in sequence and is fastened to the screw hole 15, the second liquid cooling plate 20 and the computing power board 40 are fastened to the first liquid cooling plate 10.

[0095] That is, the first liquid cooling plate and the second liquid cooling plate can be specifically fastened and installed using screws.

[0096] Specifically, referring to Figure 2 、 Figure 3 , screw holes can be respectively provided on two opposite sides of the first liquid cooling plate. Then, at positions corresponding to the screw holes, the second liquid cooling plate is provided with first through holes, and the computing power board is provided with second through holes. In this way, after the screw passes through the first through hole and the second through hole in sequence, and then is fastened to the screw hole, the second liquid cooling plate and the computing power board can be fastened to the first liquid cooling plate.

[0097] It can be understood that for the first liquid cooling plate, the second liquid cooling plate and the computing power board on one side are fastened to the surface of this side of the first liquid cooling plate by screws, and the second liquid cooling plate and the computing power board on the other side are fastened to the surface of the other side of the first liquid cooling plate by screws.

[0098] In a specific implementation, in combination with Figure 14 and Figure 15 、as well as Figure 4 and Figure 5 , the first through hole 23 is a counterbore structure, and the screw is a spring screw 90; wherein, the spring screw 90 includes a screw post 91, one end of the screw post 91 is a nut 93, and the other end is a threaded post 92. The diameter of the threaded post 92 is smaller than the diameter of the screw post 91. A spring 94 is sleeved outside the screw post 91, so that when the spring screw 90 is fastened, the threaded post 92 is fastened to the screw hole 15, and the abutting end surface of the screw post 91 protruding relative to the threaded post 92 abuts against the surface of the computing power board 40, and both ends of the spring 94 elastically abut against the nut 93 and the counterbore structure respectively.

[0099] Please refer to Figure 5 or Figure 15 , in this embodiment, a counterbore structure and a spring screw can be specifically used to make the fastening of the second liquid cooling plate and the first liquid cooling plate a flexible fixing structure. In this way, it can adapt to the installation tolerances caused by the uneven surfaces of the liquid cooling plate and the computing power board, especially the tolerances caused by the unevenness of the second liquid cooling plate.

[0100] Specifically, the spring screw includes a screw post in the middle. One end of the screw post is a nut, and the other end is a threaded post. Among them, the diameter of the threaded post is smaller than the diameter of the screw post, and a spring is also sleeved outside the screw post.

[0101] Thus, during fastening installation, the threaded post is fastened in the threaded hole of the first liquid cooling plate. At the same time, the abutting end surface of the screw post protruding relative to the threaded post abuts against the surface of the computing power board, specifically the surface facing the second liquid cooling plate, pressing the computing power board. At the same time, both ends of the spring are elastically abutted against the nut and the counterbore structure respectively, so as to eliminate the installation tolerance of the second liquid cooling plate caused by unevenness, etc.

[0102] In addition, in this embodiment, the compression amount of the spring should be greater than the locking stroke of the threaded post, so that when the spring screw is locked, all the springs are in a movable state, playing a role in adjusting the flatness of the second water cooling plate in contact with the computing power board and ensuring its heat dissipation performance. Obviously, the spring (or spring screw) can be any elastic fixing structure known to those skilled in the art. When assembling the second liquid cooling plate, the installation effect of the second liquid cooling plate can be adjusted through this elastic fixing structure, which can play an adjustment role when the contact surface between the second liquid cooling plate and the computing power board is uneven, and protect the chips on the computing power board from bearing too much locking force.

[0103] In a specific embodiment, a chip 42 is provided on the surface of the computing power board 40 facing the second liquid cooling plate 20, and a convex rib 24 is provided on the surface of the second liquid cooling plate 20 facing the computing power board 40, and the convex rib 24 is used to abut against the chip 42.

[0104] In this embodiment, continuing to combine Figure 4 、 Figure 5 , the computing power board is, for example, an aluminum substrate. Specifically, the chip can be arranged on the surface of the aluminum substrate facing the second liquid cooling plate. For example, the chips are arranged in an array; in this way, most of the heat generated when the chips work will be transferred to the side of the aluminum substrate facing away from the chips through the aluminum substrate, that is, the side of the aluminum substrate facing the first liquid cooling plate. After that, since the external coolant first flows through the first liquid cooling plate and then through the second liquid cooling plate, when the coolant flows through the second liquid cooling plate, the chips can be cooled for the second time, improving the heat dissipation effect.

[0105] Correspondingly to the chips on the aluminum substrate, convex ribs can be provided on the side of the second liquid cooling plate facing the aluminum substrate, that is, the second liquid cooling plate specifically abuts against the chips through the convex ribs; in addition, a thermal conductive gel (in other embodiments, thermal conductive silicone grease can also be used; the viscosity of the thermal conductive gel is relatively large, and the filling thickness is relatively large, which can play a role in buffering and protecting the chips. The fluidity of the thermal conductive silicone grease is relatively good, and it is relatively thin after being filled and pressed, and the heat conduction will be relatively good) etc. can be provided between the chips and the convex ribs.

[0106] Of course, in other embodiments, thermal conductive silicone grease (in other embodiments, thermal conductive gel can also be used) can also be provided between the aluminum substrate and the first liquid cooling plate.

[0107] In a specific embodiment, limiting grooves 16 are respectively provided on two opposite surfaces of the first liquid cooling plate 10, and a limiting boss 25 matching the limiting grooves 16 is provided on the surface of the second liquid cooling plate 20 facing the first liquid cooling plate 10, so that the first liquid cooling plate 10 is installed in a limiting and butt-joint manner with a pair of the second liquid cooling plates 20.

[0108] That is, return Figure 2 and Figure 3 , in this embodiment, the first liquid cooling plate and the second liquid cooling plates on both sides can be specifically installed in a limiting and butt-joint manner through the limiting grooves and the limiting bosses.

[0109] Based on the above data processing module, the present application also discloses a liquid-cooled server, for example, a liquid-cooled server having this data processing module.

[0110] A liquid-cooled server, in combination with Figure 16 、 Figure 17 and Figure 18 , the liquid-cooled server includes a data processing module 100 and a power supply module 200, and the two can be arranged inside a server housing 300. The server housing 300 includes, for example, a chassis 301 and a top cover 302.

[0111] Among them, the data processing module is the data processing module disclosed in the above embodiments, and the power supply module includes a power supply module and a third liquid cooling plate for liquid-cooling and dissipating heat from the power supply module. The third liquid cooling plate and the liquid cooling plates in the data processing module are arranged in series as a whole.

[0112] Specifically, the third liquid cooling plate includes a third liquid inlet and a third liquid outlet. Among them, the third liquid outlet is communicated with the first liquid inlet of the first liquid cooling plate in the data processing module; thus, the cooling liquid first flows into the third liquid cooling plate from the third liquid inlet of the third liquid cooling plate, that is, first liquid-cools and dissipates heat from the power supply module; then, after the cooling liquid flows out from the third liquid outlet of the third liquid cooling plate, it flows into the first liquid cooling plate through the first liquid inlet. For the embodiment that does not include the second liquid cooling plate, the cooling liquid flows out from the first liquid cooling plate after dissipating heat from the computing power board in the data processing module. For the embodiment that includes the second liquid cooling plate, as described above, the cooling liquid is shunted to a pair of second liquid cooling plates after flowing through the first liquid cooling plate to continue dissipating heat from the computing power board in the data processing module.

[0113] It can be seen that for the computing power board in the data processing module, in this embodiment, the cooling liquid for liquid-cooling and dissipating heat from it first flows through the power supply module, that is, liquid-cools and dissipates heat from the power supply module. In this way, on the basis of increasing the flow path of the cooling liquid in the above data processing module, by making the cooling liquid flow through the third liquid cooling plate first, the flow path of the cooling liquid is further increased.

[0114] In a possible implementation manner, the power supply module 200 and the data processing module 100 are arranged in an up-and-down stacking manner along the first direction X. In other embodiments, the power supply module 200 and the data processing module 100 are arranged in other stacking manners.

[0115] In this embodiment, the power supply module and the data processing module of the liquid-cooled server are specifically arranged in an up-and-down stacking manner. In this way, it is convenient for the fixed installation of the power supply module and the data processing module, and for the connection installation of the third liquid-cooled plate and the first liquid-cooled plate.

[0116] In a possible implementation manner, the third liquid outlet 32 is arranged on the surface of the third liquid-cooled plate 30 perpendicular to the first direction X, and the first liquid inlet 11 is opened on the surface of the liquid inlet flange 13 perpendicular to the first direction X. Moreover, the first liquid inlet 11 and the third liquid outlet 32 are arranged facing each other, so that the first liquid inlet 11 is connected to the third liquid outlet 32 through a connecting pipe 80 (which can also be called a telescopic connecting pipe or a telescopic joint) arranged to be telescopic along the first direction X.

[0117] See Figure 18 and Figure 19 , in this embodiment, the connecting pipe can be specifically used to connect the third liquid outlet 32 of the third liquid-cooled plate 30 and the first liquid inlet 11 of the first liquid-cooled plate 10.

[0118] Specifically, in this embodiment, the third liquid outlet is arranged on the surface of the third liquid-cooled plate perpendicular to the first direction, and then the first liquid inlet is arranged on the liquid inlet flange of the first liquid-cooled plate, specifically located on the surface of the liquid inlet flange perpendicular to the first direction; moreover, the first liquid inlet and the third liquid outlet are arranged facing each other; in this way, the first liquid inlet and the third liquid outlet can be connected through a connecting pipe extending along the first direction.

[0119] Specifically, the connecting pipe in this embodiment is arranged to be telescopic along the first direction, so as to eliminate the installation tolerance between the power supply module and the data processing module.

[0120] For easy implementation, the above-mentioned connecting pipe includes, for example, a male head 81 and a female head 82 that are telescopically inserted. For example, the male head 81 is installed at the first liquid inlet 11 of the first liquid-cooled plate 10, and the female head 82 is installed at the third liquid outlet 32 of the third liquid-cooled plate 30. At least one sealing ring 400 is arranged in the female head 82. During assembly, the male head can be inserted into the female head and pass through the sealing ring to achieve connection and sealing; along the first direction, the length of the male head is greater than the setting depth of the sealing ring in the female head to ensure that the sealing position of the male head and the female head can be adjusted, which is convenient for assembly.

[0121] In a possible implementation, the data processing module 100 and the power supply module 200 are fixedly connected through a fixing plate 303. The fixing plate 303 extends along the first direction X. One end of the fixing plate 303 is fixedly installed with the first liquid cooling plate 10 of the data processing module 100, and the other end of the fixing plate 303 is fixedly installed with the third liquid cooling plate 30.

[0122] That is, referring to Figure 17 and Figure 20 , for the fixation of the data processing module and the power supply module, it can be realized by a pair of fixing plates on both sides; specifically, the fixing plate extends along the first direction, and fixing holes 3031 can be respectively arranged at both ends of the fixing plate along the first direction; then, one end of the fixing plate can be specifically fixed to the first fixing flange 17 of the first liquid cooling plate 10, and the other end of the fixing plate can be specifically fixed to the second fixing flange 33 of the third liquid cooling plate 30.

[0123] In a possible implementation, the operation panel 304 can be located on the server housing 300; wherein, the operation panel 304 is provided with a water inlet joint 305 and a water outlet joint 306. The water inlet joint 305 is communicated with the third liquid inlet 31, and the water outlet joint 306 is communicated with the water outlet 72 of the data processing module 100; and, on the operation panel 304, the water inlet joint 305 and the water outlet joint 306 are arranged vertically along the first direction X. The water inlet joint 305 and the water outlet joint 306 are located at one end of the operation panel 304 along the vertical direction of the first direction X, and the power plug 51 of the power supply module 200 is located at the other end of the operation panel 304 along the vertical direction of the first direction X.

[0124] Please refer to Figure 16 , among the four end faces of the server housing parallel to the first direction, the operation panel can be arranged on one of them. Among them, the water inlet joint and the water outlet joint on the operation panel are specifically arranged vertically along the first direction. For example, the water inlet joint is located below and the water outlet joint is located above. The water inlet joint is specifically communicated with the third liquid inlet of the third liquid cooling plate, and the water outlet joint is specifically communicated with the water outlet of the liquid collector, so as to complete the assembly of the coolant flow path in the liquid-cooled server.

[0125] Wherein, if the above-mentioned first direction is, for example, the vertical direction, then the water inlet joint and the water outlet joint can be arranged at one end of the operation panel perpendicular to the first direction, for example, the left end, and then, at the other end of the operation panel perpendicular to the first direction, for example, the right end, the power plug of the power supply module is arranged to achieve the separation of water and electricity.

[0126] In addition, a computing power board positive electrode 43 and a computing power board negative electrode 44 can be arranged at one end of the computing power board 40 facing away from the operation panel 304. The computing power board positive electrode and the computing power board negative electrode are electrically connected to the power module, and the power module supplies power to the computing power board.

[0127] Obviously, in other embodiments, the liquid-cooled server may not include the second liquid-cooled plate. In this case, the data processing module including the computing power board and the first liquid-cooled plate and the power module including the power supply module and the third liquid-cooled plate can still be stacked through the connecting pipe to provide a mechanical connection between the computing power board and the power supply module, so that the two form an integral body, which is convenient for installation and transportation. At this time, the data processing module and the power module can also strengthen the connection strength through the aforementioned fixing plate.

[0128] In addition, in other embodiments, there may be only one computing power board in the data processing module of the liquid-cooled server. Correspondingly, the liquid-cooled server may not include the second liquid-cooled plate (correspondingly, the water outlet can correspond to the first liquid outlet or the water outlet joint on the operation panel), or may only include one second liquid-cooled plate (correspondingly, the water outlet can correspond to the second liquid outlet or the water outlet joint on the operation panel). When only one second liquid-cooled plate is included, the second liquid-cooled plate can be located on the side of the computing power board facing away from the first liquid-cooled plate, and the first liquid outlet is communicated with the second liquid inlet. The specific structures are the same as those described above and will not be repeated.

[0129] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, advantages, effects, etc. mentioned in the present application are only examples and not limitations. It cannot be considered that these advantages, advantages, effects, etc. are essential for each embodiment of the present application. In addition, the above-disclosed specific details are only for the purpose of illustration and easy understanding, rather than limitations. The above details do not limit the present application to necessarily adopt the above specific details to implement.

[0130] The block diagrams of the devices, apparatuses, equipment, and systems involved in the present application are only illustrative examples and do not intend to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any way. Words such as "including", "comprising", "having", etc. are open-ended words, meaning "including but not limited to", and can be used interchangeably with each other. The words "or" and "and" used here refer to the word "and / or" and can be used interchangeably with each other, unless the context clearly indicates otherwise. The word "such as" used here refers to the phrase "such as but not limited to" and can be used interchangeably with each other.

[0131] It should also be noted that in the devices, equipment, and methods of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present application.

[0132] The foregoing description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Accordingly, the present application is not intended to be limited to the aspects shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0133] The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the form disclosed herein. Although several example aspects and embodiments have been discussed above, those skilled in the art will recognize that some of their variations, modifications, alterations, additions, and sub-combinations should be within the scope of protection of the present utility model.

Claims

1. A liquid cooling server, characterized in that: include: A data processing module, comprising a computing board and a first liquid cooling plate; the first liquid cooling plate and the computing board are stacked along a first direction; the first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet; A power module, comprising a power module and a third liquid cooling plate, wherein the third liquid cooling plate comprises a third liquid inlet and a third liquid outlet, and the third liquid outlet is connected to the first liquid inlet; The data processing module and the power supply module are stacked via a connecting pipe.

2. The liquid cooling server according to claim 1, characterized in that: The data processing module is connected to the power supply module via a fixing plate, the fixing plate extends along the first direction, one end of the fixing plate is fixedly mounted to the first liquid cooling plate, and the other end of the fixing plate is fixedly mounted to the third liquid cooling plate.

3. The liquid cooling server according to claim 1, characterized in that: The data processing module also includes a second liquid cooling plate, which is arranged on a side of the computing board facing away from the first liquid cooling plate, the first liquid cooling plate, the computing board and the second liquid cooling plate are stacked along a first direction, and the second liquid cooling plate is provided with a second liquid inlet and a second liquid outlet, and the first liquid outlet is connected to the second liquid inlet.

4. The liquid cooling server according to claim 3, characterized in that: The second liquid cooling plate and the computing power plate are fastened to the first liquid cooling plate through an elastic fixing structure, and two ends of the elastic fixing structure are elastically abutted against the computing power plate and the second liquid cooling plate respectively.

5. The liquid cooling server according to claim 3, characterized in that: The first liquid cooling plate has two opposite sides provided with limiting grooves, and the second liquid cooling plate has a limiting boss matching the limiting grooves on its surface facing the first liquid cooling plate. The first liquid cooling plate and the second liquid cooling plate are fixedly docked.

6. The liquid cooling server according to claim 3, characterized in that: On the end surface of the data processing module, the first liquid inlet and the first liquid outlet are respectively arranged at two ends of a direction perpendicular to the first direction, the second liquid inlet and the second liquid outlet are respectively arranged at two ends of a direction perpendicular to the first direction, the first liquid inlet is close to the second liquid outlet, and the first liquid outlet is close to the second liquid inlet, so that the flow direction of the coolant in the first liquid cooling plate is opposite to the flow direction in the second liquid cooling plate.

7. The liquid cooling server according to claim 3, characterized in that: When the first liquid cooling plate is disposed between the pair of computing boards, the pair of the second liquid cooling plates are respectively disposed on the side of the pair of computing boards facing away from the first liquid cooling plate, the first liquid cooling plate, the pair of computing boards and the pair of the second liquid cooling plates are stacked along the first direction, and the first liquid outlet is connected to the pair of the second liquid inlets at the same time. The data processing module also includes a liquid separator and a liquid collector. The liquid separator port is used to be connected and installed with the first liquid outlet and a pair of the second liquid inlets respectively; the liquid collector port is used to be connected and installed with a pair of the second liquid outlets respectively, so that the coolant flows out from the water outlet after flowing through a pair of the second liquid cooling plates.

8. The liquid cooling server according to claim 7, characterized in that: The first liquid outlet, the second liquid inlet and the second liquid outlet are respectively arranged at respective plug-in flanges, the liquid separation port and the liquid collection port are respectively arranged at respective plug-in grooves, and the plug-in flanges are sealed and plug-in-installed with the plug-in grooves.

9. The liquid cooling server according to claim 1, characterized in that: The first liquid cooling plate is provided with a liquid inlet flange for opening the first liquid inlet, the first liquid inlet is opened on the surface of the liquid inlet flange perpendicular to the first direction, and the first liquid inlet is connected to the third liquid outlet through the connecting pipe arranged along the first direction.

10. The liquid cooling server according to claim 1, characterized in that: The data processing module and the power supply module are externally provided with an operation panel, and the operation panel is provided with a water inlet joint and a water outlet joint, the water inlet joint is connected to the third liquid inlet, and the water outlet joint is connected to the water outlet of the data processing module.

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