Heat dissipation structure for integrated circuit

Abstract

The utility model relates to the technical field of integrated circuits, and provides a heat dissipation structure for an integrated circuit, which comprises a shell, a groove is arranged in the shell, two sides of the shell are respectively provided with a first square groove and a second square groove, four corners of the bottom end of the groove are fixedly connected with supporting blocks, an integrated circuit board is arranged in the shell in an attached manner, and the integrated circuit board is connected with the first square groove and the second square groove. A heat conduction block is attached to the top end of the integrated circuit board, the top end of the heat conduction block is fixedly connected with a heat conduction plate, the heat conduction plate is inserted into the first square groove in a penetrating mode, one side of the heat conduction plate is fixedly connected with cooling fins, the upper portion of the shell is connected with a connecting column in a penetrating mode, and the top end of the connecting column is fixedly connected with a fan. According to the technical scheme, the problems that in the prior art, water-cooling heat dissipation is prone to leakage, an integrated circuit is damaged, and extra electric power and space are needed are solved, the problem that the integrated circuit is damaged due to liquid leakage is avoided through heat dissipation of the heat dissipation plate, the production cost is reduced, and the use space is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, and particularly to a heat dissipation structure for integrated circuits. Background Art

[0002] An integrated circuit is a microelectronic device or component. Using a certain process, components such as transistors, resistors, capacitors, and inductors required in a circuit, as well as wirings, are interconnected and fabricated on a small piece or several small pieces of semiconductor wafers or dielectric substrates. Therefore, it is very important to solve the heat generated by multiple components, which helps the normal operation of the integrated circuit.

[0003] The patent specification with the application number 202120476210.3 discloses a heat dissipation structure for a high-power circuit chip, including a circuit board, a chip group, a dust-proof cover, a support frame, a cooling fan, and a water tank. The chip group is installed on the circuit board, and the dust-proof cover is covered on the chip group; the top edge of the dust-proof cover is fixed with a support frame, the top of the support frame is fixed with a water tank, an installation port is arranged at the center of the water tank, and a cooling fan is fixed in the installation port; the inner wall of the support frame is bent and coiled with a cooling pipe, and a plurality of heat conduction sleeves are sleeved on the cooling pipe, and the heat conduction sleeves are fixed on the inner wall of the support frame; a micro pump is fixed on the outer side wall of the support frame. One end of the cooling pipe is connected to the bottom of the water tank, and the other end of the cooling pipe is connected to the micro pump; the micro pump is connected to the bottom of the water tank through a connecting pipe; this structure can prevent external dust from accumulating on the chip surface and affecting the heat dissipation of the chip itself; at the same time, it can reduce the temperature of the environment around the chip and accelerate the heat dissipation of the chip.

[0004] However, it is found in the implementation of the related technology that the above heat dissipation structure for a high-power circuit chip has the following problems: when using water cooling for heat dissipation, there may be a risk of leakage. If leakage occurs accidentally, it will damage the entire circuit board, increase losses, and additional power and space are required, increasing costs. For this reason, we propose a heat dissipation structure for integrated circuits. Summary of the Utility Model

[0005] The utility model provides a heat dissipation structure for integrated circuits, which solves the problem in the related technology of not using water cooling for heat dissipation to prevent damage to the integrated circuit caused by liquid leakage.

[0006] The technical solution of the utility model is as follows:

[0007] A heat dissipation structure for an integrated circuit, comprising a housing. A groove is provided inside the housing. First square grooves and second square grooves are provided on both sides of the housing. Support blocks are fixedly connected to the four corners of the bottom end of the groove. An integrated circuit board is fitted inside the housing. A heat conducting block is fitted on the top end of the integrated circuit board. A heat conducting plate is fixedly connected to the top end of the heat conducting block. The heat conducting plate penetrates inside the first square groove. A heat sink is fixedly connected to one side of the heat conducting plate. A connecting column is inserted through the upper part of the housing. A fan is fixedly connected to the top end of the connecting column.

[0008] Preferably, a heat conducting silica gel block is fitted on the bottom end of the integrated circuit board. A heat conducting strip is fixedly connected to the top end of the heat conducting silica gel block. The heat conducting strip penetrates inside the second square groove. One side of the top end of the heat conducting strip is fixedly connected to the bottom end of the heat sink.

[0009] Preferably, a buffer pad is fixedly connected to the top end of the support block. The material of the buffer pad is rubber.

[0010] Preferably, a dust-proof net is sleeved outside the heat conducting block. The top end of the dust-proof net is in contact with the bottom surface of the heat conducting plate.

[0011] Preferably, a heat insulation plate is sleeved outside the heat conducting silica gel block. The heat insulation plate is between the integrated circuit board and the heat conducting strip.

[0012] Preferably, a fixing block is fixedly connected to the outer side of the lower part of the housing. A through hole is provided inside the fixing block.

[0013] Preferably, the bottom surface of the fan is not in contact with the heat conducting plate. The material of the connecting column is amorphous metal.

[0014] The working principle and beneficial effects of the present utility model are as follows:

[0015] In the present utility model, during the use of the integrated circuit, most of the generated heat will be absorbed by the heat conducting block fixedly connected to the top end of the integrated circuit board and transferred to the heat conducting plate. The heat conducting plate transfers the heat to the heat sinks fixedly connected to both sides for cooling and heat dissipation. At this time, the fan above the heat conducting plate will also absorb the dissipated heat, transfer the heat to the air, reduce the heat dissipation pressure of the heat sink, improve the heat dissipation capacity of the overall structure, avoid the problem of water-cooled heat dissipation leakage causing damage to the integrated circuit, do not require additional power and space, reduce costs, and improve the working ability of the integrated circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following further describes the present utility model in detail with reference to the drawings and specific embodiments.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0018] Figure 2 This is a schematic diagram of the cutaway structure of the housing proposed by the utility model;

[0019] Figure 3 It is a schematic diagram of the structural decomposition proposed by the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the lower heat conduction module of the circuit proposed by the utility model.

[0021] In the figure: 1. outer shell; 2. groove; 3. support block; 4. buffer pad; 5. integrated circuit board; 6. dustproof net; 7. heat conductive block; 8. heat conductive plate; 9. fan; 10. connecting column; 11. heat sink; 12. thermal conductive silicone block; 13. thermal conductive strip; 14. thermal insulation board; 15. heat dissipation hole; 16. fixing block; 17. first square groove; 18. second square groove. DETAILED DESCRIPTION

[0022] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Example 1

[0024] like Figures 1 to 4 As shown, this embodiment proposes a heat dissipation structure for integrated circuits, including a shell 1, a groove 2 is provided inside the shell 1, a first square groove 17 and a second square groove 18 are provided on both sides of the shell 1, the first square groove 17 is located above the second square groove 18, and support blocks 3 are fixedly connected to the four corners of the bottom end of the groove 2. An integrated circuit board 5 is fitted inside the shell 1, and a heat conduction block 7 is fitted on the top of the integrated circuit board 5. The number of the heat conduction blocks 7 is multiple groups, and no less than ten, which is conducive to effectively transferring the heat generated by the integrated circuit board 5 during operation and preventing the heat from being poorly transferred. The temperature of the integrated circuit board 5 rises, which reduces the working efficiency. The top of the heat-conducting block 7 is fixedly connected to a heat-conducting plate 8. There is a space between the top of the heat-conducting plate 8 and the bottom of the fan 9, and they do not contact each other, so as to prevent direct heat transfer to the fan 9. The heat-conducting plate 8 is inserted into the first square groove 17, and a heat sink 11 is fixedly connected to one side of the heat-conducting plate 8. A connecting column 10 is inserted into the upper part of the shell 1. The connecting column 10 is made of amorphous metal with low thermal conductivity, so as to prevent the heat generated by the fan 9 from being transferred to the shell 1, so as to increase the temperature of the integrated circuit board 5. The top of the connecting column 10 is fixedly connected to the fan 9.

[0025] In this embodiment, a buffer pad 4 is fixedly connected to the top end of the support block 3. The buffer pad 4 is made of rubber to prevent damage to the integrated circuit board 5 caused by bumps during actual use in daily life, playing a buffering role. A dust-proof net 6 is sleeved outside the heat-conducting block 7. The top end of the dust-proof net 6 is attached to the bottom surface of the heat-conducting plate 8. The dust-proof net 6 can effectively block dust in the air, prevent dust from falling on the surface of the integrated circuit board 5, increase resistance, and cause circuit damage. The bottom surface of the fan 9 is not attached to the heat-conducting plate 8. The connecting column 10 is made of amorphous metal, and the amorphous metal has a low heat conductivity, effectively preventing the heat generated by the fan 9 itself during the heat dissipation process from being transferred to the outer shell 1 and indirectly transferred to the integrated circuit board 5 to increase the temperature.

[0026] Embodiment 2

[0027] As Figures 1 to 4 shown, based on the same concept as the above Embodiment 1, this embodiment also proposes a heat dissipation structure for an integrated circuit. A heat-conducting silica gel block 12 is attached to the bottom end of the integrated circuit board 5. The heat-conducting silica gel block 12 can support the integrated circuit board 5 to prevent damage to the integrated circuit board 5. A heat-conducting strip 13 is fixedly connected to the top end of the heat-conducting silica gel block 12. The number of the heat-conducting strips 13 is three. The heat-conducting strips 13 are inserted into the inside of the second square groove 18. One side of the top end of the heat-conducting strip 13 is fixedly connected to the bottom end of the heat sink 11.

[0028] In this embodiment, a heat-insulating plate 14 is sleeved outside the heat-conducting silica gel block 12. The heat-insulating plate 14 is between the integrated circuit board 5 and the heat-conducting strip 13. The heat-insulating plate 14 can effectively prevent the heat of the heat-conducting strip 13 from being transferred to the integrated circuit board 5. A fixing block 16 is fixedly connected to the outer side of the lower part of the outer shell 1. A through hole is opened inside the fixing block 16 to effectively fix the whole device and prevent displacement. Heat dissipation holes 15 are opened on the side surface of the outer shell 1. The number of heat dissipation holes 15 on one side is two, which can effectively improve the heat dissipation capacity of the outer shell 1 and reduce the pressure on the heat sink 11 and the fan 9.

[0029] Among them, the integrated circuit board 5 is a prior art and will not be elaborated here; at the same time, the present utility model also includes a power supply, a controller, a switch, etc., which are not the main technical points of this patent and will not be elaborated here; the "front, back, left, and right" perspectives of this device are based on Figure 1 the direction shown in the figure.

[0030] Working principle: The staff installs the integrated circuit board 5 inside the housing 1, making the bottom end of the integrated circuit board 5 fit against the top of the buffer pad 4 on the top of the support block 3. After that, the installation of other structures is completed, and then the overall structure is fixed to the installation position through the fixing block 16. Most of the heat generated during the operation of the integrated circuit board 5 will be absorbed by the heat conduction block 7 fixedly connected to the top of the integrated circuit board 5 and transferred to the heat conduction plate 8. The heat conduction plate 8 transfers it to the heat sinks 11 fixedly connected on both sides for cooling and heat dissipation. At this time, the fan 9 above the heat conduction plate 8 will also absorb the dissipated heat and transfer the heat to the air. Since the bottom surface of the fan 9 does not fit against the heat conduction plate 8 and the connecting column 10 is made of amorphous metal with low thermal conductivity, it can effectively prevent the heat generated by the fan 9 itself during the heat dissipation process from being transferred to the housing 1 and prevent the temperature of the integrated circuit board 5 from rising. The heat generated at the bottom of the integrated circuit board 5 will be absorbed by the heat conduction silicone block 12 and transferred to the heat conduction strip 13. The heat conduction strip 13 then transfers the heat to the heat sinks 11, improving the heat dissipation capacity of the heat sinks 11. The heat dissipation holes 15 on both sides of the housing 1 can also conduct the heat inside the structure, increasing the heat dissipation capacity of the overall structure. Using the heat sinks 11 and the fan 9 instead of water cooling for heat dissipation can prevent the problem of integrated circuit damage caused by liquid leakage, without the need for additional power and space, reducing costs and improving the working ability of the integrated circuit.

[0031] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A heat dissipation structure for an integrated circuit, comprising a housing (1), characterized in that: The shell (1) is provided with a groove (2) inside, and both sides of the shell (1) are provided with a first square groove (17) and a second square groove (18), and the four corners of the bottom end of the groove (2) are fixedly connected to support blocks (3), and the inside of the shell (1) is fitted with an integrated circuit board (5), and the top of the integrated circuit board (5) is fitted with a heat conduction block (7), and the top of the heat conduction block (7) is fixedly connected to a heat conduction plate (8), and the heat conduction plate (8) is inserted into the inside of the first square groove (17), and one side of the heat conduction plate (8) is fixedly connected to a heat sink (11), and the upper part of the shell (1) is inserted and connected with a connecting column (10), and the top of the connecting column (10) is fixedly connected to a fan (9).

2. The heat dissipation structure for an integrated circuit according to claim 1, characterized in that: A heat-conducting silicone block (12) is attached to the bottom end of the integrated circuit board (5), a heat-conducting strip (13) is fixedly connected to the top end of the heat-conducting silicone block (12), the heat-conducting strip (13) is inserted into the interior of the second square groove (18), and one side of the top end of the heat-conducting strip (13) is fixedly connected to the bottom end of the heat sink (11).

3. The heat dissipation structure for an integrated circuit according to claim 1, characterized in that: The top end of the support block (3) is fixedly connected to a buffer pad (4), and the buffer pad (4) is made of rubber.

4. The heat dissipation structure for an integrated circuit according to claim 1, characterized in that: The outer side of the heat conducting block (7) is provided with a dustproof net (6), and the top end of the dustproof net (6) is in contact with the bottom surface of the heat conducting plate (8).

5. The heat dissipation structure for an integrated circuit according to claim 1, characterized in that: A heat dissipation hole (15) is provided on the side of the housing (1), and the number of the heat dissipation holes (15) on one side is two.

6. The heat dissipation structure for an integrated circuit according to claim 2, characterized in that: The outer side of the heat-conducting silica gel block (12) is provided with a heat-insulating plate (14), and the heat-insulating plate (14) is between the integrated circuit board (5) and the heat-conducting strip (13).

7. The heat dissipation structure for an integrated circuit according to claim 1, characterized in that: A fixing block (16) is fixedly connected to the outer side of the lower part of the housing (1), and a through hole is provided inside the fixing block (16).

8. The heat dissipation structure for an integrated circuit according to claim 1, characterized in that: The bottom surface of the fan (9) is not in contact with the heat conducting plate (8), and the material of the connecting column (10) is amorphous metal.

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