Chip liquid cooling structure

Abstract

The utility model discloses a chip liquid cooling structure. The chip liquid cooling structure comprises a chip and a lead frame, wherein the chip is provided with a silicon through hole penetrating through the chip along the thickness direction; the lead frame comprises a liquid cooling frame; the liquid cooling frame comprises a first liquid cooling part and a second liquid cooling part, the first liquid cooling part is arranged on the first surface of the chip, and the second liquid cooling part is arranged on the second surface of the chip; the first liquid cooling part is provided with a first half etching groove, and the second liquid cooling part is provided with a second half etching groove; the orthographic projection of the first half etching groove on the first surface covers at least part of the first surface, and the orthographic projection of the second half etching groove on the second surface covers at least part of the second surface; the first half etching groove is communicated with the silicon through hole, and the second half etching groove is communicated with the silicon through hole, so that a circulating liquid channel covering the first surface and the second surface of the chip is formed. According to the technical scheme of the embodiment of the utility model, the heat dissipation capability, the rigidity and the reliability of the chip can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip liquid cooling structure. Background Art

[0002] As the core component of an electronic device, a large amount of heat is generated during the process of a chip completing functions such as data processing, storage, and transmission. However, too high a chip temperature will affect the working performance of the electronic device and even cause damage to the electronic device. Therefore, cooling the chip is crucial during application.

[0003] The methods for dissipating heat from a chip proposed in the prior art mainly involve setting through-silicon vias (TSV holes) in a wafer, and transmitting liquid through the TSV holes to enable the liquid to carry away the heat generated by the chip, thereby achieving heat dissipation of the chip. However, if too few TSV holes are set in the above method, the heat dissipation effect is not ideal; if more TSV holes are set, although the heat dissipation effect is good, it will result in poor overall stiffness of the chip and have a greater impact on the reliability of the chip. In addition, since TSV holes generally have a certain depth and are mainly set at positions close to one surface of the chip, mainly at positions close to the silicon surface of the chip. And the TSV holes being close to the chip surface easily cause abnormalities such as cracks in the integrated circuit layer of the chip. Summary of the Utility Model

[0004] The utility model provides a chip liquid cooling structure to improve the heat dissipation ability of the chip and improve the stiffness and reliability of the chip.

[0005] According to one aspect of the utility model, a chip liquid cooling structure is provided, including: a chip and a lead frame; wherein, the chip is provided with through-silicon vias penetrating the chip in the thickness direction;

[0006] The lead frame includes a liquid cooling frame; the liquid cooling frame includes a first liquid cooling part and a second liquid cooling part, the first liquid cooling part is arranged on a first surface of the chip, and the second liquid cooling part is arranged on a second surface of the chip; wherein, the first surface and the second surface are arranged opposite to each other;

[0007] The first liquid cooling part is provided with a first half-etching groove, and the second liquid cooling part is provided with a second half-etching groove; the orthographic projection of the first half-etching groove on the first surface covers at least part of the first surface, and the orthographic projection of the second half-etching groove on the second surface covers at least part of the second surface;

[0008] The first half-etching groove communicates with the through-silicon via, and the second half-etching groove communicates with the through-silicon via to form a circulating liquid channel covering the first surface and the second surface of the chip.

[0009] Optionally, at least two first enclosing parts are provided on the first liquid cooling part, and a first half etching groove is formed between every two adjacent first enclosing parts;

[0010] At least two second enclosing parts are provided on the second liquid cooling part, and a second half etching groove is formed between every two adjacent second enclosing parts.

[0011] Optionally, along the thickness direction, a liquid inlet and a liquid outlet penetrating through the first liquid cooling part are provided on the first liquid cooling part, and at least two first half etching grooves are provided on the first liquid cooling part;

[0012] The liquid inlet and the liquid outlet communicate with two different first half etching grooves.

[0013] Optionally, along the thickness direction, a liquid inlet penetrating through the first liquid cooling part is provided on the first liquid cooling part, and a liquid outlet penetrating through the second liquid cooling part is provided on the second liquid cooling part;

[0014] The liquid inlet communicates with at least one first half etching groove, and the liquid outlet communicates with at least one second half etching groove.

[0015] Optionally, a first bonding part corresponding to the first enclosing part one by one is provided on the first surface; the first liquid cooling part is bonded to the first surface through the first enclosing part and the first bonding part to be fixed on the first surface;

[0016] A second bonding part corresponding to the second enclosing part one by one is provided on the second surface; the second liquid cooling part is bonded to the second surface through the second enclosing part and the second bonding part to be fixed on the second surface.

[0017] Optionally, a first metal layer is provided on the first surface, and the orthographic projection of the first metal layer on the first surface covers a part of the first surface; the side wall of the through-silicon via is covered with a second metal layer;

[0018] The first metal layer is electrically connected to the second metal layer;

[0019] A redistribution layer is provided on one side of the second surface close to the first surface, and the redistribution layer is electrically connected to the second metal layer;

[0020] The through-silicon via is used for signal transmission of the chip.

[0021] Optionally, the lead frame further includes: a signal transmission frame disposed around the periphery of the chip;

[0022] The signal transmission framework is connected to the first metal layer by wire bonding to achieve signal transmission.

[0023] Optionally, the materials of the liquid cooling framework and the signal transmission framework are metal materials.

[0024] Optionally, the liquid cooling framework and the signal transmission framework are of an integral structure.

[0025] Optionally, the chip liquid cooling structure further includes: a plastic encapsulation part;

[0026] The plastic encapsulation part covers the side surface of the chip, the liquid cooling framework and the signal transmission framework and is flattened so that the surface of the plastic encapsulation part is flush with the surface of the liquid cooling framework.

[0027] The chip liquid cooling structure provided by the embodiment of the present invention includes a chip and a lead frame. Through-silicon vias penetrating the chip in the thickness direction are provided in the chip. The through-silicon vias are used for signal transmission and also serve as cooling liquid channels. The liquid cooling framework in the lead frame includes a first liquid cooling part and a second liquid cooling part. The first liquid cooling part is disposed on the first surface of the chip, and the second liquid cooling part is disposed on the second surface of the chip. A first half-etching groove is provided in the first liquid cooling part, and a second half-etching groove is provided in the second liquid cooling part. Both the first half-etching groove and the second half-etching groove communicate with the through-silicon vias. The first half-etching groove and the second half-etching groove serve as cooling liquid channels, thereby forming a liquid circulation flow channel flowing through the first surface and the second surface of the chip. In this way, without the need to separately provide through-silicon vias used as liquid channels, the through-silicon vias for signal transmission can be utilized to enable the cooling liquid to circulate simultaneously on the front and back surfaces of the chip, thereby effectively improving the heat dissipation capacity of the chip and effectively reducing the number of through-silicon vias, which is beneficial to improving the stiffness and reliability of the chip.

[0028] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 is a schematic cross-sectional structure diagram of a chip liquid cooling structure provided by an embodiment of the present invention;

[0031] Figure 2 is a schematic cross-sectional structure diagram of another chip liquid cooling structure provided according to an embodiment of the present invention;

[0032] Figure 3 is a schematic cross-sectional structure diagram of another chip liquid cooling structure provided according to an embodiment of the present invention;

[0033] Figure 4 is a schematic cross-sectional structure diagram of another chip liquid cooling structure provided according to an embodiment of the present invention;

[0034] Figure 5 is a schematic flow diagram of a preparation method of a chip liquid cooling structure provided according to an embodiment of the present invention;

[0035] Figure 6 is a schematic cross-sectional structure diagram corresponding to each step in a preparation method of a chip liquid cooling structure provided according to an embodiment of the present invention. Detailed implementation manners

[0036] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0037] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0038] The embodiment of the present invention provides a chip liquid cooling structure. Figure 1 is a schematic cross-sectional structure diagram of a chip liquid cooling structure provided according to an embodiment of the present invention. As Figure 1 shown, the chip liquid cooling structure includes: a chip 10 and a lead frame 20; wherein, the chip 10 is provided with a through-silicon via 11 penetrating through the chip 10 in the thickness direction.

[0039] The lead frame 20 includes a liquid cooling frame 21; the liquid cooling frame 21 includes a first liquid cooling portion 211 and a second liquid cooling portion 212. The first liquid cooling portion 211 is disposed on the first surface 101 of the chip 10, and the second liquid cooling portion 212 is disposed on the second surface 102 of the chip 10; wherein, the first surface 101 and the second surface 102 are oppositely disposed.

[0040] The first liquid cooling portion 211 is provided with a first half-etching groove 2111, and the second liquid cooling portion 212 is provided with a second half-etching groove 2121; the orthographic projection of the first half-etching groove 2111 on the first surface 101 covers at least a part of the first surface 101, and the orthographic projection of the second half-etching groove 2121 on the second surface 102 covers at least a part of the second surface 102; the first half-etching groove 2111 communicates with the through-silicon via 11, and the second half-etching groove 2121 communicates with the through-silicon via 11 to form a circulating liquid channel covering the first surface 101 and the second surface 102 of the chip 10.

[0041] Exemplarily, the thickness direction can be represented by Figure 1 the Y direction in, and a through-silicon via 11 for signal transmission is provided in the chip 10. The through-silicon via 11 penetrates through the chip 10 along the thickness direction. Wherein, the number of the through-silicon vias 11 can be set according to the actual needs during the application of the chip 10, as long as the chip 10 can complete the normal signal transmission function, and no limitation is made here.

[0042] A liquid cooling frame 21 is provided for the chip 10. Among them, a first liquid cooling portion 211 is disposed on the first surface 101 of the chip 10, and a second liquid cooling portion 212 is disposed on the second surface 102 of the chip 10. The first surface 101 and the second surface 102 are two oppositely disposed surfaces in the chip 10. Exemplarily, the first surface 101 can be the front surface of the chip 10, and the second surface 102 is the back surface of the chip 10; or, the first surface 101 can also be the back surface of the chip 10, and the second surface 102 is the front surface of the chip 10, and no limitation is made here. The first half-etching groove 2111 provided in the first liquid cooling portion 211 is to perform half-etching on the surface of the first liquid cooling portion 211 close to the chip 10, that is, not to etch through the first liquid cooling portion 211 along the thickness direction, so as to form a groove on the surface of the first liquid cooling portion 211 close to the chip 10; similarly, a groove is formed by half-etching the surface of the second liquid cooling portion 212 close to the chip 10.

[0043] The first half-etching groove 2111 serves as a liquid channel on one side of the first surface 101 of the chip 10, and the second half-etching groove 2121 serves as a liquid channel on one side of the second surface 102 of the chip 10. They can carry cooling liquid, enabling the cooling liquid to flow in the first half-etching groove 2111 and the second half-etching groove 2121. It should be noted that the through-silicon via 11 provided in the chip 10 is used not only for signal transmission but also as a channel for the cooling liquid. It is connected to the first half-etching groove 2111 on the first surface 101 and the second half-etching groove 2121 on the second surface 102 to form a circulating flow channel for the cooling liquid. In this way, the cooling liquid flowing in the first half-etching groove 2111 can flow to the second half-etching groove 2121 through the through-silicon via 11, enabling the cooling liquid to circulate on both the front and back surfaces of the chip 10, thereby effectively improving the heat dissipation capacity of the chip 10. And there is no need to separately provide a through-silicon via for the cooling liquid channel in the chip 10. Without affecting the normal signal transmission function of the chip 10, the number of through-silicon vias 11 is effectively reduced, which is beneficial to improving the stiffness and reliability of the chip 10 and ensuring that the chip 10 has good heat dissipation capacity.

[0044] The chip liquid cooling structure provided by the embodiment of the present invention includes a chip and a lead frame. A through-silicon via penetrating the chip in the thickness direction is provided in the chip. The through-silicon via is used for signal transmission and also serves as a cooling liquid channel. The liquid cooling frame in the lead frame includes a first liquid cooling part and a second liquid cooling part. The first liquid cooling part is disposed on the first surface of the chip, and the second liquid cooling part is disposed on the second surface of the chip. A first half-etching groove is provided in the first liquid cooling part, and a second half-etching groove is provided in the second liquid cooling part. The first half-etching groove and the second half-etching groove are both connected to the through-silicon via. The first half-etching groove and the second half-etching groove serve as cooling liquid channels, thereby forming a liquid circulating flow channel flowing through the first surface and the second surface of the chip. In this way, without separately providing a through-silicon via for the liquid channel, the through-silicon via for signal transmission is utilized to enable the cooling liquid to circulate on both the front and back surfaces of the chip, thereby effectively improving the heat dissipation capacity of the chip, and the number of through-silicon vias can be effectively reduced, which is beneficial to improving the stiffness and reliability of the chip.

[0045] Optionally, on the basis of the above embodiment, continue to refer to Figure 1 , the first liquid cooling part 211 is provided with at least two first enclosing parts 2112, and a first half-etching groove 2111 is formed between every two adjacent first enclosing parts 2112; the second liquid cooling part 212 is provided with at least two second enclosing parts 2122, and a second half-etching groove 2121 is formed between every two adjacent second enclosing parts 2122.

[0046] Exemplarily, on the side of the first liquid cooling part 211 close to the chip 10, at least two first enclosing parts 2112 are provided, and the first enclosing parts 2112 are arranged at intervals. A first half-etching groove 2111 is formed between two adjacent first enclosing parts 2112. Similarly, on the side of the second liquid cooling part 212 close to the chip 10, at least two second enclosing parts 2122 are provided, and the second enclosing parts 2122 are arranged at intervals. A second half-etching groove 2121 is formed between two adjacent second enclosing parts 2122. Therefore, at least one first half-etching groove 2111 is provided in the first liquid cooling part 211, and at least one second half-etching groove 2121 is provided in the second liquid cooling part 212. Exemplarily, Figure 1 The situation where two first half-etching grooves 2111 are provided in the first liquid cooling part 211 and four second half-etching grooves 2121 are provided in the second liquid cooling part 212 is shown. Cooling liquid flows in at least one first half-etching groove 2111 on the first surface 101 of the chip 10, and heat dissipation of the chip 10 can be performed on the first surface 101; cooling liquid flows in at least one second half-etching groove 2121 on the second surface 102 of the chip 10, and heat dissipation of the chip 10 can be performed on the second surface 102.

[0047] To enable the cooling liquid to circulate within the chip liquid cooling structure, thereby taking away the heat generated by the chip 10 and achieving heat dissipation of the chip 10, therefore, an inlet and an outlet for the cooling liquid need to be provided on the liquid cooling frame 21. And there are various ways to arrange the liquid inlet and the liquid outlet, and the following embodiments will illustrate various arrangement ways.

[0048] Optionally, Figure 2 is a schematic cross-sectional structure diagram of another chip liquid cooling structure provided by an embodiment of the present invention. On the basis of the above embodiments, as Figure 2 shown, in the thickness direction, the first liquid cooling part 211 is provided with a liquid inlet 2113 and a liquid outlet 2114 penetrating through the first liquid cooling part 211, and the first liquid cooling part 211 is provided with at least two first half-etching grooves 2111; the liquid inlet 2113 and the liquid outlet 2114 communicate with two different first half-etching grooves 2111.

[0049] Specifically, the liquid inlet 2113 and the liquid outlet 2114 are arranged on the liquid cooling frame 21 on the same side surface of the chip 10. Exemplarily, the liquid inlet 2113 and the liquid outlet 2114 can be both arranged in the first liquid cooling part 211, and the liquid inlet 2113 and the liquid outlet 2114 communicate with two different first half-etching grooves 2111 in the first liquid cooling part 211. Figure 2The direction of flow of the cooling liquid in the chip liquid cooling structure is shown by the direction of the arrow. The cooling liquid flows into a first half-etching groove 2111 from a liquid inlet 2113, flows into a second half-etching groove 2121 through a connected silicon through-hole 11, flows through the second surface 102 of the chip 10, then flows into another first half-etching groove 2111 through the silicon through-hole 11 connected to the liquid outlet 2114, and flows out from the liquid outlet 2114 provided in the other first half-etching groove 2111, so as to enable the cooling liquid to flow through the chip 10 and take away the heat generated by the chip 10, and dissipate the heat of the chip 10.

[0050] Optionally, Figure 3 is a schematic cross-sectional structure diagram of another chip liquid cooling structure provided by an embodiment of the present invention. On the basis of the above embodiments, as Figure 3 shown, along the thickness direction, the first liquid cooling part 211 is provided with a liquid inlet 2113 penetrating through the first liquid cooling part 211, and the second liquid cooling part 212 is provided with a liquid outlet 2114 penetrating through the second liquid cooling part 212; the liquid inlet 2113 is communicated with at least one first half-etching groove 2111, and the liquid outlet 2114 is communicated with at least one second half-etching groove 2121.

[0051] Specifically, the liquid inlet 2113 and the liquid outlet 2114 are arranged on a liquid cooling frame 21 located on different side surfaces of the chip 10. Exemplarily, the liquid inlet 2113 can be arranged on the first liquid cooling part 211, the liquid outlet 2114 can be arranged on the second liquid cooling part 212, and the liquid inlet 2113 can be arranged on the first half-etching groove 2111 communicated with the silicon through-hole 11, and the liquid outlet 2114 can be arranged on any second half-etching groove 2121; preferably, the liquid outlet 2114 can be arranged on a second half-etching groove 2121 that is far away from the first half-etching groove 2111 communicated with the liquid inlet 2113, so that the area of the cooling liquid flowing through the surface of the chip 10 can be larger, and thus the heat dissipation capacity of the chip 10 can be effectively improved. Figure 3 The direction of flow of the cooling liquid in the chip liquid cooling structure is shown by the direction of the arrow. Thus, after the cooling liquid flows into the first half-etching groove 2111 from the liquid inlet 2113, it flows through the silicon through-hole 11 and into the second half-etching groove 2121, and finally flows out from the liquid outlet 2114 provided in the second half-etching groove 2121, realizing the circulating flow of the cooling liquid and better dissipating the heat of the chip 10.

[0052] Optionally, on the basis of the above embodiments, continue to refer to Figure 2 or Figure 3, a first surface 101 is provided with first bonding portions 103 corresponding one-to-one to the first enclosing portions 2112; the first liquid cooling portion 211 is bonded to the first bonding portions 103 through the first enclosing portions 2112 so as to be fixed to the first surface 101; a second surface 102 is provided with second bonding portions 104 corresponding one-to-one to the second enclosing portions 2122; the second liquid cooling portion 212 is bonded to the second bonding portions 104 through the second enclosing portions 2122 so as to be fixed to the second surface 102.

[0053] Exemplarily, by providing the first bonding portions 103 corresponding one-to-one to the first enclosing portions 2112 on the first surface 101 of the chip 10, the first liquid cooling portion 211 can be bonded to the first bonding portions 103 through the first enclosing portions 2112, so as to strengthen the bonding force between the first liquid cooling portion 211 and the chip 10, and make the first liquid cooling portion 211 firmly fixed to the first surface 101 of the chip 10. Similarly, by providing the second bonding portions 104 corresponding one-to-one to the second enclosing portions 2122 on the second surface 102 of the chip 10, the second liquid cooling portion 212 can be bonded to the second bonding portions 104 through the second enclosing portions 2122, so as to strengthen the bonding force between the second liquid cooling portion 212 and the chip 10, and make the second liquid cooling portion 212 firmly fixed to the second surface 102 of the chip 10. Exemplarily, the materials of the first bonding portions 103 and the second bonding portions 104 can adopt organic bonding materials or inorganic bonding materials. Among them, the organic bonding materials can include polymers or resins; the inorganic bonding materials can include metals or metal compounds, which are not limited herein.

[0054] Optionally, Figure 4 is a schematic cross-sectional structure diagram of another chip liquid cooling structure provided by an embodiment of the present invention. On the basis of the above embodiments, as Figure 4 shown, a first metal layer 105 is provided on the first surface 101, and the orthographic projection of the first metal layer 105 on the first surface 101 covers a part of the first surface 101; the side wall of the through-silicon via 11 is covered with a second metal layer 106; the first metal layer 105 is electrically connected to the second metal layer 106; a redistribution layer 107 is provided on one side of the second surface 102 close to the first surface 101, and the redistribution layer 107 is electrically connected to the second metal layer 106; the through-silicon via 11 is used for signal transmission of the chip 10.

[0055] Exemplarily, a second metal layer 106 is provided on the sidewall of the through-silicon via 11, and a first metal layer 105 is provided on the first surface 101 outside the through-silicon via 11. The orthographic projection of the first metal layer 105 on the first surface 101 only covers a part around the through-silicon via 11, and the first metal layer 105 is electrically connected to the second metal layer 106. A redistribution layer 107 is provided on one side of the second surface 102 of the chip 10 close to the first surface 101. The second metal layer 106 provided on the sidewall of the through-silicon via 11 is electrically connected to the redistribution layer 107, so that the through-silicon via 11 can transmit signals through the redistribution layer 107.

[0056] Optionally, on the basis of the above embodiments, continue to refer to Figure 4 , the lead frame 20 further includes: a signal transmission frame 22, which is arranged around the periphery of the chip 10; the signal transmission frame 22 is connected to the first metal layer 105 through wire bonding to achieve signal transmission.

[0057] Exemplarily, the signal transmission frame 22 is arranged between two adjacent chips 10 and surrounds the chip 10. The materials of the liquid cooling frame 21 and the signal transmission frame 22 are metal materials. Exemplarily, in this embodiment, the materials of the liquid cooling frame 21 and the signal transmission frame 22 can be copper metal, that is, copper foil. And the first metal layer 105 connecting the signal transmission frame 22 and the through-silicon via 11 is electrically connected through a bonding wire, so that the through-silicon via 11 for signal transmission in the chip 10 is electrically connected to the signal transmission frame 22 to complete signal transmission. It should be noted that the signal transmission frame 22 can be arranged on one side close to the first liquid cooling part 211 or on one side close to the second liquid cooling part 212, which is not limited here. Preferably, when both the liquid inlet 2113 and the liquid outlet 2114 are arranged in the first liquid cooling part 211, the signal transmission frame 22 is arranged on one side close to the second liquid cooling part 212 to reduce the influence of the liquid cooling function of the chip 10 on the signal transmission function of the chip 10. Exemplarily, the liquid cooling frame 21 and the signal transmission frame 22 are an integral structure. By setting the liquid cooling frame 21 and the signal transmission frame 22 as an integral structure, in the preparation process, the liquid cooling frame 21 and the signal transmission frame 22 can be formed by etching and stamping a copper foil, thus simplifying the preparation process.

[0058] Optionally, on the basis of the above embodiments, continue to refer to Figure 4 , the chip liquid cooling structure further includes: a plastic encapsulation part 30.

[0059] The plastic encapsulation part 30 covers the side surface of the chip 10, the liquid cooling frame 21 and the signal transmission frame 22 and is flattened so that the surface of the plastic encapsulation part 30 is flush with the surface of the liquid cooling frame 21.

[0060] Exemplarily, by pouring and encapsulating materials on the side surface of the chip 10, and the surfaces of the liquid cooling frame 21 and the signal transmission frame 22, the gap between the liquid cooling frame 21 and the signal transmission frame 22 is filled, so that the chip 10, the liquid cooling frame 21 and the signal transmission frame 22 form an integral body, and the surface of the encapsulation part 30 is flush with the surfaces of the liquid cooling frame 21 and the signal transmission frame 22, thereby achieving good encapsulation of the chip 10.

[0061] The embodiment of the present invention also provides a preparation method of a chip liquid cooling structure. Figure 5 It is a schematic flow chart of a preparation method of a chip liquid cooling structure provided by the embodiment of the present invention. Figure 6 It is a schematic cross-sectional structure diagram corresponding to each step in a preparation method of a chip liquid cooling structure provided by the embodiment of the present invention. Combining Figure 5 and Figure 6 , the preparation method of the chip liquid cooling structure may specifically include the following steps:

[0062] S110. Form through-silicon vias 11 and redistribution layers 107 in the wafer 00; wherein, a first metal layer 105 is provided on the first surface 101 of the wafer 00, and the first metal layer 105 is electrically connected to a second metal layer 106 on the side wall of the through-silicon via 11.

[0063] S120. Cut the wafer 00.

[0064] S130. Fix the pre-prepared lead frame 20 to the first surface 101 and the second surface 102 of the wafer 00; wherein, the lead frame 20 includes a liquid cooling frame 21 and a signal transmission frame 22.

[0065] S140. Perform wire bonding on the signal transmission frame 22 and the first metal layer 105.

[0066] S150. Perform injection molding to form an encapsulation part 30 to complete the encapsulation, and perform singulation to form individual chips 10.

[0067] For the chip with an integrated liquid cooling function prepared by using the preparation method provided in the above embodiment, through the liquid cooling frames provided on the first surface and the second surface of the chip, which are communicated with the through-silicon vias as cooling liquid channels, the cooling liquid can flow through the front and back of the chip, improving the heat dissipation effect of the chip. And by using the through-silicon vias for signal transmission as liquid channels at the same time, the number of through-silicon vias provided in the chip can be effectively reduced, which is beneficial to improving the stiffness and reliability of the chip.

[0068] The above specific embodiments do not constitute a limitation to the protection scope of the present utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A chip liquid cooling structure, characterized in that: include: A chip and a lead frame; wherein the chip is provided with a through silicon via penetrating the chip along a thickness direction; The lead frame includes a liquid cooling frame; the liquid cooling frame includes a first liquid cooling part and a second liquid cooling part, the first liquid cooling part is arranged on the first surface of the chip, and the second liquid cooling part is arranged on the second surface of the chip; wherein the first surface is arranged opposite to the second surface; The first liquid cooling part is provided with a first half-etched groove, and the second liquid cooling part is provided with a second half-etched groove; the orthographic projection of the first half-etched groove on the first surface covers at least a portion of the first surface, and the orthographic projection of the second half-etched groove on the second surface covers at least a portion of the second surface; The first half-etched groove is communicated with the through silicon via, and the second half-etched groove is communicated with the through silicon via to form a circulating liquid channel covering the first surface and the second surface of the chip.

2. The chip liquid cooling structure according to claim 1, characterized in that: The first liquid cooling part is provided with at least two first enclosure parts, and a first half-etched groove is formed between each two adjacent first enclosure parts; The second liquid cooling part is provided with at least two second enclosure parts, and a second half-etched groove is formed between every two adjacent second enclosure parts.

3. The chip liquid cooling structure according to claim 2, characterized in that: Along the thickness direction, the first liquid cooling part is provided with a liquid inlet and a liquid outlet penetrating the first liquid cooling part, and the first liquid cooling part is provided with at least two first half-etched grooves; The liquid inlet and the liquid outlet are connected to two different first half etching grooves.

4. The chip liquid cooling structure according to claim 2, characterized in that: Along the thickness direction, the first liquid cooling part is provided with a liquid inlet penetrating the first liquid cooling part, and the second liquid cooling part is provided with a liquid outlet penetrating the second liquid cooling part; The liquid inlet is communicated with at least one of the first half etching grooves, and the liquid outlet is communicated with at least one of the second half etching grooves.

5. The chip liquid cooling structure according to claim 2, characterized in that: The first surface is provided with a first bonding portion corresponding to the first enclosure portion one by one; the first liquid cooling portion is bonded to the first bonding portion through the first enclosure portion to be fixed to the first surface; The second surface is provided with a second bonding portion corresponding to the second enclosure portion one by one; the second liquid cooling portion is bonded to the second bonding portion through the second enclosure portion to be fixed to the second surface.

6. The chip liquid cooling structure according to claim 1, characterized in that: The first surface is provided with a first metal layer, and the orthographic projection of the first metal layer on the first surface covers a portion of the first surface; the sidewall of the through silicon via is covered with a second metal layer; The first metal layer is electrically connected to the second metal layer; A redistribution layer is disposed on a side of the second surface close to the first surface, and the redistribution layer is electrically connected to the second metal layer; The through silicon via is used for signal transmission to the chip.

7. The chip liquid cooling structure according to claim 6, characterized in that: The lead frame further includes: a signal transmission frame, and the signal transmission frame is arranged around the chip; The signal transmission frame is connected to the first metal layer through wire bonding to achieve signal transmission.

8. The chip liquid cooling structure according to claim 7, characterized in that: The liquid cooling frame and the signal transmission frame are made of metal materials.

9. The chip liquid cooling structure according to claim 7, characterized in that: The liquid cooling frame and the signal transmission frame are an integrated structure.

10. The chip liquid cooling structure according to claim 7, characterized in that: Also includes: Plastic sealing department; The plastic sealing part covers the side surfaces of the chip, the liquid cooling frame and the signal transmission frame and is planarized so that the surface of the plastic sealing part is flush with the surface of the liquid cooling frame.

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