Module diode plastic package structure

Abstract

A module diode plastic package structure relates to the technical field of semiconductor power devices. Comprising a chip, and further comprises a metal base, a jumper wire and a plastic package body, the negative electrode of the bottom of the chip is connected with the metal base, the positive electrode of the top of the chip is connected with the jumper wire, a first bus bar hole and a second bus bar hole are formed in the positions, located on the two sides of the jumper wire, of the metal base respectively, and the plastic package body is used for wrapping the chip, the jumper wire, the second bus bar hole and part of the metal base. The top surface of the plastic package body is provided with a placement hole, the jumper wire is located in the placement hole, and the plastic package body is provided with a hole shaped like a Chinese character'hui 'and communicated with the second bus bar hole. The jumper wire is rectangular. The jumper wire is a copper jumper wire. The metal base is a copper material or a copper-aluminum composite plate. The module is different from a conventional positive and negative electrode symmetrical module, is convenient to process, and is reliable in heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor power devices, in particular to a module diode plastic package structure. Background Art

[0002] For photovoltaic junction boxes, affected by the increasing power of photovoltaic modules, the over-current requirements continue to increase, from the early 10 - 15A to the current 20 - 25A, then to 30 - 35A and even larger currents. It is very difficult to meet the requirements only through the original junction box system for larger currents and stronger heat dissipation capabilities. It is necessary to develop a junction box system with stronger heat dissipation capabilities, and the current-carrying capacity of the junction box has become a pain point for component-end customers.

[0003] The original junction box is composed of a diode + potting glue + junction box. The potting glue is basically common in the industry. To improve the heat dissipation capacity of the junction box, it is mainly started from the diode and the junction box. At present, there are a large number of applications in the module diode industry, and the basic form is the positive and negative copper heat sinks + chip + copper jumper.

[0004] At present, the positive and negative poles of the diode module in the photovoltaic junction box are basically symmetrically designed (such as the patent with the application number 202223342922.X and the name "A Photovoltaic Junction Box with High-Efficiency Heat Dissipation"). During actual application and testing, it is found that the heat dissipation tasks borne by the positive and negative poles are not the same. Affected by the chip structure and jumper welding, first, the negative pole of the chip is directly welded to the negative heat sink for heat dissipation. There is a terminal non-welding structure in the positive pole structure of the chip. The weldable area of the chip also needs to be connected to the positive heat sink through copper jumper bumps with about 50% of the weldable area. The connection channel between the positive heat sink and the heat source attenuates layer by layer. Although the actual sizes of the positive and negative heat sinks are basically the same, the positive heat sink "does nothing", and the negative pole undertakes the main heat dissipation task. Therefore, this product structure is not the optimal heat dissipation structure for heat dissipation.

[0005] How to achieve reliable heat dissipation of the diode module is the problem faced at present. Summary of the Utility Model

[0006] The utility model aims at the above problems and provides a module diode plastic package structure with simple structure, convenient processing and improved heat dissipation reliability.

[0007] The technical solution of the utility model is: the module diode plastic package structure includes a chip, and also includes a metal base, a jumper and a plastic package body.

[0008] The negative pole at the bottom of the chip is connected to the metal base, and the positive pole at the top of the chip is connected to the jumper.

[0009] On the metal base, a first bus bar hole and a second bus bar hole are respectively arranged on both sides of the jumper.

[0010] The plastic package is used to cover the chip, jumper, bus bar hole two and part of the metal base.

[0011] An installation hole is provided on the top surface of the plastic package, and the jumper is located in the installation hole.

[0012] A circular hole communicating with the bus bar hole two is provided on the plastic package.

[0013] The jumper is rectangular.

[0014] The jumper is a copper jumper.

[0015] The metal base is made of copper or a copper-aluminum composite plate.

[0016] The metal base is in the shape of a cuboid, and the length of the metal base is 25 - 50 mm and the width is 10 - 20 mm.

[0017] Positioning holes are respectively provided around the metal base.

[0018] In the working process of the present utility model, an integral metal base is connected to the negative electrode of the chip as the main heat dissipation channel, solving the problem of small heat dissipation of the negative electrode of the conventional module and improving the overall heat dissipation capacity of the module.

[0019] The bus bar hole one is used to pass through the bus bar and connect to the top surface of the metal base; the bus bar hole two and the circular hole are used to pass through the bus bar and connect to the jumper.

[0020] In the present utility model, the positive electrode of the diode is attached to the surface of the plastic package, and the positive electrode design meets the welding requirements of the bus bar at the application end. When the plastic package is molded, the positive and negative electrodes of the chip can be insulated.

[0021] The present utility model is different from the conventional positive and negative electrode symmetric modules, which is convenient for processing and has reliable heat dissipation. Description of the Drawings

[0022] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. In the drawings, each part is not necessarily drawn according to the actual ratio.

[0023] Figure 1 is the structural schematic diagram of the present utility model,

[0024] Figure 2 is the three-dimensional structural schematic of the present utility model Figure 1 ,

[0025] Figure 3 is the structural schematic of the present utility model Figure 2 ,

[0026] In the figure, 1 is the metal base, and 2 is the chip.

[0027] 3 is the jumper.

[0028] 4 is the plastic package body, 41 is the loop hole, and 42 is the mounting hole.

[0029] 51 is the bus bar hole one, and 52 is the bus bar hole two.

[0030] 6 is the positioning hole. Specific implementation manner

[0031] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0032] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0033] In the description of the present utility model, it should be noted that, unless otherwise clearly defined and limited, the terms "mounted", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0034] As shown in the present utility model Figures 1-3 The module diode plastic package structure includes the chip 2, and also includes the metal base 1, the jumper 3, and the plastic package body 4.

[0035] The bottom negative electrode of the chip 2 is connected to the metal base 1, and the top positive electrode of the chip 2 is connected to the jumper 3.

[0036] On the metal base, a bus bar hole one 51 and a bus bar hole two 52 are respectively provided on both sides of the jumper.

[0037] The plastic package 4 is used to cover the chip, jumper, bus bar hole two and part of the metal base. In application, the plastic package covers the four peripheral edges of the bus bar hole two to achieve insulation treatment, facilitating subsequent connection to the bus bar;

[0038] The top surface of the plastic package 4 is provided with a placement hole 42, and the jumper is located within the placement hole.

[0039] The plastic package is provided with a through hole 41 that penetrates through the bus bar hole two.

[0040] In the operation of the present utility model, an integral metal base is connected to the negative electrode of the chip as the main heat dissipation channel, solving the problem of small heat dissipation of the negative electrode in conventional modules and improving the overall heat dissipation capacity of the module.

[0041] The bus bar hole one is used to pass through the bus bar and connect to the top surface of the metal base; the bus bar hole two and the through hole are used to pass through the bus bar and connect to the jumper.

[0042] In the present utility model, the positive electrode of the diode is attached to the surface of the plastic package, and the positive electrode design meets the welding requirements of the bus bar at the application end. When the plastic package is encapsulated, the positive and negative electrodes of the chip can be insulated.

[0043] In the present utility model, the jumper (i.e., copper jumper) and the metal base jointly dissipate heat, with high efficiency and reliability.

[0044] The present utility model is different from conventional positive and negative symmetric modules, facilitating processing and having reliable heat dissipation.

[0045] The jumper 3 is rectangular. In this way, the chip is on one side of the jumper, and the bus bar is connected to the other side of the jumper, avoiding damage to the chip.

[0046] The jumper 3 is a copper jumper, facilitating connection.

[0047] The metal base 1 is made of copper or a copper-aluminum composite plate.

[0048] It can be selected according to actual processing needs.

[0049] If a copper-aluminum composite plate is used for heat dissipation, the copper on the surface is used for chip soldering, and together with the thick aluminum sheet on the back, it constitutes the main heat dissipation channel, achieving high-speed heat dissipation of the chip.

[0050] The metal base 1 is in the shape of a cuboid, and the length of the metal base is 25 - 50 mm, and the width is 10 - 20 mm.

[0051] In this way, the size of the metal base is similar to the overall size of the positive and negative heat sinks in existing modules, facilitating installation.

[0052] Positioning holes 6 are respectively provided around the metal base 1.

[0053] Positioning holes are provided to facilitate the connection of the module inside the junction box.

[0054] The positioning hole 6 is semi-circular, circular or oval.

[0055] The positioning holes can be set in different shapes for easy selection. Setting them as semi-circular or oval serves as an anti-fooling function for assembly.

[0056] Regarding the content disclosed in this case, the following points need to be explained:

[0057] (1) The attached drawings of the embodiments disclosed in this case only relate to the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design.

[0058] (2) Without conflict, the embodiments disclosed in this case and the features in the embodiments can be combined with each other to obtain new embodiments.

[0059] The above is only the specific implementation manner disclosed in this case, but the protection scope of this disclosure is not limited thereto. The protection scope disclosed in this case shall be subject to the protection scope of the claims.

Claims

1. The module diode plastic package structure includes a chip, characterized in that: It also includes a metal base, jumper wires and plastic package. The negative electrode at the bottom of the chip is connected to the metal base, and the positive electrode at the top of the chip is connected to the jumper. The metal base is provided with a first busbar hole and a second busbar hole on both sides of the jumper. The plastic package is used to cover the chip, jumper, busbar hole 2 and part of the metal base. The top surface of the plastic package body is provided with a placement hole, and the jumper is located in the placement hole. The plastic sealing body is provided with a circular hole which is in communication with the converging belt hole.

2. The module diode plastic packaging structure according to claim 1, characterized in that: The jumper is rectangular.

3. The module diode plastic package structure according to claim 1 or 2, characterized in that: The jumper wire is a copper jumper wire.

4. The module diode plastic packaging structure according to claim 1, characterized in that: The metal base is made of copper or a copper-aluminum composite plate.

5. The module diode plastic packaging structure according to claim 1, characterized in that: The metal base is in the shape of a rectangular parallelepiped, and the length of the metal base is 25-50 mm and the width is 10-20 mm.

6. The module diode plastic packaging structure according to claim 1, characterized in that: Positioning holes are respectively arranged around the metal base.

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