Novel photovoltaic heat dissipation module

Abstract

A novel photovoltaic heat dissipation module relates to the technical field of semiconductor power devices. Comprising a chip and further comprises a metal base, a first jumper wire and a second jumper wire, the negative electrode of the bottom of the chip is connected with the metal base, the positive electrode of the top of the chip is connected with the first jumper wire, the first jumper wire and the second jumper wire are connected with a copper-clad ceramic plate, and the bottom of the copper-clad ceramic plate is made of insulating ceramic and used for being connected with the metal base; the top is made of metal copper and is used for connecting the jumper wire I and the jumper wire II; a first bus bar hole and a second bus bar hole are formed in the metal base, the copper-clad ceramic plate is rectangular, the second bus bar hole is located in the copper-clad ceramic plate, and the first bus bar hole, the first jumper wire, the second bus bar hole and the second jumper wire are sequentially arranged. The module is different from a conventional positive and negative electrode symmetrical module, is convenient to process, and is reliable in heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor power devices, in particular to a novel photovoltaic heat dissipation module. Background Art

[0002] At present, the positive and negative poles of the diode module in the photovoltaic junction box are basically symmetrically designed (such as the patent with the application number 202223342922.X and the name of "a photovoltaic junction box with efficient heat dissipation"). During actual application and testing, it is found that the heat dissipation tasks borne by the positive and negative poles are not the same. Affected by the chip structure and jumper welding, first, the negative pole of the chip is directly welded to the negative heat dissipation copper sheet for heat dissipation. There is a non-welded structure at the terminal on the positive pole structure of the chip. The weldable area of the chip also needs to be connected to the positive pole of the heat sink through copper jumper bumps with about 50% of the weldable area. The connection channels between the positive pole of the heat sink and the heat source are attenuated layer by layer. The sizes of the actual positive and negative heat sinks are basically the same, but the positive heat sink "does nothing", and the negative pole undertakes the main heat dissipation task. Therefore, this product structure is not the optimal heat dissipation structure for heat dissipation.

[0003] Therefore, it is urgent to improve the heat dissipation capacity of the photovoltaic module, which is the problem faced at present. Summary of the Utility Model

[0004] The utility model aims at the above problems and provides a novel photovoltaic heat dissipation module with a simple structure, convenient heat dissipation, and improved reliability.

[0005] The technical solution of the utility model is as follows: The novel photovoltaic heat dissipation module includes a chip, and also includes a metal base, jumper one, and jumper two.

[0006] The negative pole at the bottom of the chip is connected to the metal base, the positive pole at the top of the chip is connected to jumper one, and jumper one and jumper two are respectively connected to the copper-clad ceramic plate.

[0007] The bottom of the copper-clad ceramic plate is an insulating ceramic for connecting to the metal base; the top is metal copper for connecting to jumper one and jumper two.

[0008] The metal base is provided with a bus bar hole one and a bus bar hole two. The copper-clad ceramic plate is rectangular, and the bus bar hole two is located inside the copper-clad ceramic plate.

[0009] The bus bar hole one, jumper one, bus bar hole two, and jumper two are arranged in sequence.

[0010] It also includes a plastic package body, which is used to cover the chip, part of the metal base, jumper one, the copper-clad ceramic plate, and part of jumper two.

[0011] The plastic package body is provided with a through-hole in the shape of a loop that penetrates the bus bar hole two.

[0012] Both the first jumper and the second jumper are copper jumpers.

[0013] The metal base is made of copper or copper-aluminum composite plate.

[0014] The first jumper is provided with a stepped hole with a larger upper part and a smaller lower part at one end for connecting the chip.

[0015] Two connecting feet are arranged on the inner side of the second jumper, and the connecting feet are used for connecting the copper-clad ceramic plate.

[0016] In the working process of the present utility model, an integral metal base is connected to the negative electrode of the chip. The bottom of the copper-clad ceramic plate is connected to the metal base through insulating ceramics, and the copper-clad surfaces are respectively connected to the first jumper and the second jumper. In this way, the positive and negative electrodes of the chip can be insulated. The metal base is used as the main heat dissipation channel, solving the problem of small heat dissipation of the negative electrode in the conventional module and improving the overall heat dissipation capacity of the module.

[0017] The present utility model is different from the conventional positive and negative electrode symmetric modules, which is convenient for processing and has reliable heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required in the description of the specific embodiments or the prior art. In the drawings, each part is not necessarily drawn according to the actual proportion.

[0019] Figure 1 is a schematic structural diagram of the present utility model,

[0020] Figure 2 is a three-dimensional structural schematic Figure 1 ,

[0021] Figure 3 is a three-dimensional structural schematic Figure 2 ,

[0022] In the figure, 1 is the metal base, 2 is the chip,

[0023] 31 is the first jumper, 310 is the stepped hole, 32 is the second jumper, 320 is the connecting foot,

[0024] 4 is the plastic package, 40 is the return hole,

[0025] 51 is the first bus bar hole, 52 is the second bus bar hole,

[0026] 6 is the copper-clad ceramic plate, 7 is the positioning hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0028] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0029] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0030] As shown in the present utility model Figures 1-3 a novel photovoltaic heat dissipation module includes a chip 2, and also includes a metal base 1, a jumper 31 and a jumper 32.

[0031] The negative electrode at the bottom of the chip 2 is connected to the metal base 1, the positive electrode at the top of the chip 2 is connected to the jumper 31, and the jumper 31 and the jumper 32 are respectively connected to the copper-clad ceramic plate 6.

[0032] The bottom of the copper-clad ceramic plate 6 is an insulating ceramic for connecting to the metal base; the top is metal copper for connecting to the jumper 31 and the jumper 32.

[0033] The metal base 1 is provided with a bus bar hole 51 and a bus bar hole 52. The copper-clad ceramic plate is rectangular, and the bus bar hole 52 is located inside the copper-clad ceramic plate.

[0034] The bus bar hole 51, the jumper 31, the bus bar hole 52 and the jumper 32 are arranged in sequence.

[0035] In the operation of the present utility model, an integral metal base is connected to the negative electrode of the chip. The bottom of the copper-clad ceramic plate is connected to the metal base through insulating ceramics. The copper on the surface is respectively connected to jumper one and jumper two. In this way, the positive and negative electrodes of the chip can be insulated. The metal base is used as the main heat dissipation channel, solving the problem of small heat dissipation of the negative electrode in the conventional module and improving the overall heat dissipation capacity of the module.

[0036] The first busbar hole is used for passing through the busbar. The second busbar is connected to the top surface of the metal base; the second busbar hole is used for passing through the busbar and is used to connect jumper two.

[0037] It further includes a plastic package 4, which is used to cover the chip, part of the metal base, jumper one, the copper-clad ceramic plate, and part of jumper two.

[0038] A circular hole 40 penetrating the second busbar hole 52 is provided on the plastic package.

[0039] The plastic package is used to protect the chip. Since the plastic package covers part of jumper two, in this way, the protruding part of jumper two is used to connect the metal busbar.

[0040] The present utility model is provided with a second busbar hole on the metal base, and a circular hole penetrating the second busbar hole is provided on the plastic package. In this way, the busbar is convenient to pass through the second busbar hole and the circular hole and connect to the protruding part of jumper two. When installing the junction box, it is suitable for the occasion where the busbar penetrates from below.

[0041] Both jumper one 31 and jumper two 32 are copper jumpers.

[0042] The metal base 1 is made of copper or a copper-aluminum composite plate.

[0043] It can be selected according to actual processing needs.

[0044] If a copper-aluminum composite plate is used for heat dissipation, the copper on the surface is used for chip soldering, and together with the thick aluminum sheet on the back, it constitutes the main heat dissipation channel, realizing high-speed heat dissipation of the chip.

[0045] One end of the jumper one 31 for connecting the chip is provided with a stepped hole 310 with a larger upper part and a smaller lower part.

[0046] By setting the stepped hole, it is convenient to observe the amount of soldering paste for welding and ensure the connection reliability.

[0047] Two connecting feet 320 are provided on the inner side of the jumper two 32, and the connecting feet are used to connect the copper-clad ceramic plate.

[0048] The connecting feet are bent, which is convenient for connection.

[0049] The metal base 1 is in a cuboid shape, and the length of the metal base is 25 - 50 mm, and the width is 10 - 20 mm.

[0050] In this way, the size of the metal base is consistent with the overall size of the positive and negative heat sinks in the existing module, which facilitates installation.

[0051] Positioning holes 7 are respectively provided around the metal base 1.

[0052] The setting of the positioning holes facilitates the connection of the module in the junction box.

[0053] The positioning holes 7 are semi-circular, circular or elliptical.

[0054] The positioning holes can be set in different shapes for easy selection. The semi-circular or elliptical shape plays a role in preventing incorrect assembly.

[0055] Regarding the content disclosed in this case, the following points need to be explained:

[0056] (1) The accompanying drawings of the embodiments disclosed in this case only relate to the structures involved in the embodiments disclosed in this case, and other structures can refer to the general design;

[0057] (2) Without conflict, the embodiments disclosed in this case and the features in the embodiments can be combined with each other to obtain new embodiments;

[0058] The above is only the specific implementation manner disclosed in this case, but the protection scope of this disclosure is not limited thereto. The protection scope disclosed in this case shall be subject to the protection scope of the claims.

Claims

1. A novel photovoltaic heat dissipation module, including a chip, characterized in that: It also includes a metal base, jumper 1 and jumper 2. The negative electrode at the bottom of the chip is connected to the metal base, the positive electrode at the top of the chip is connected to jumper wire 1, and jumper wire 1 and jumper wire 2 are respectively connected to the copper-clad ceramic board. The bottom of the copper-clad ceramic plate is insulating ceramic, which is used to connect to the metal base; the top is metal copper, which is used to connect jumper wire 1 and jumper wire 2; The metal base is provided with a first conduit hole and a second conduit hole. The copper-clad ceramic plate is rectangular. The second conduit hole is located inside the copper-clad ceramic plate. The first busbar hole, the first jumper wire, the second busbar hole and the second jumper wire are arranged in sequence.

2. The novel photovoltaic heat dissipation module according to claim 1 is characterized in that: It also includes a plastic package, which is used to cover the chip, part of the metal base, the first jumper, the copper-clad ceramic board and part of the second jumper. The plastic sealing body is provided with a circular hole penetrating the second converging belt hole.

3. The novel photovoltaic heat dissipation module according to claim 1 or 2, characterized in that: The jumper wire 1 and the jumper wire 2 are both copper jumpers.

4. The novel photovoltaic heat dissipation module according to claim 3 is characterized in that: The metal base is made of copper or a copper-aluminum composite plate.

5. The novel photovoltaic heat dissipation module according to claim 1 is characterized in that: One end of the jumper wire used for connecting the chip is provided with a stepped hole which is larger at the top and smaller at the bottom.

6. The novel photovoltaic heat dissipation module according to claim 1 is characterized in that: Two connecting pins are arranged on the inner side of the jumper wire 2, and the connecting pins are used to connect the copper-clad ceramic board.

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