Universal semiconductor water-cooling heat dissipation device

Abstract

The utility model discloses a universal semiconductor water-cooling heat dissipation device, which comprises a circuit board and a chip arranged on the front surface of the circuit board, the circuit board is provided with a heat dissipation through hole, the back surface of the circuit board is provided with a heat conduction plate for heat conduction, and the front surface of the heat conduction plate is provided with a heat conduction block which passes through the heat dissipation through hole and is attached to the back surface of the chip. A semiconductor chilling plate is attached to the back face of the heat conduction plate, the front face of the semiconductor chilling plate is a cold face, the back face of the semiconductor chilling plate is a hot face, a water cooling head is attached to the back face of the semiconductor chilling plate, and the water cooling head is connected with a circulating water cooling system. The LED lamp has the advantages of being high in heat dissipation performance and heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a general-purpose semiconductor water-cooled heat dissipation device. Background Technique

[0002] As an advanced display technology, high-brightness laser projection devices usually have the characteristics of high power and high heat. Among these devices, one of the key components of the projection system is the DMD (Digital Micromirror Device) chip, which needs to withstand high heat from the light source. However, due to the limitations of chip technology, the DMD chip has a specific junction temperature range, which means that effective heat dissipation control is required in the application environment.

[0003] Traditional heat dissipation methods, such as ordinary air-cooled heat dissipation and ordinary water-cooled heat dissipation, often perform poorly when faced with the extremely high heat generated by the DMD chip. These traditional methods are difficult to meet the requirements of high-brightness laser projection devices for heat dissipation efficiency and stability. Therefore, a more effective heat dissipation control scheme is urgently needed to solve this problem. The utility model is made based on this situation. Content of the Utility Model

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a general-purpose semiconductor water-cooled heat dissipation device with high heat dissipation performance and efficiency.

[0005] The utility model is realized by the following technical solutions:

[0006] To solve the above technical problems, the utility model provides a general-purpose semiconductor water-cooled heat dissipation device, including a circuit board and a chip arranged on the front of the circuit board. The circuit board is provided with heat dissipation through holes, and a heat conduction plate for heat conduction is arranged on the back of the circuit board. A heat conduction block passing through the heat dissipation through hole and fitting with the back of the chip is arranged on the front of the heat conduction plate. A semiconductor refrigeration sheet is fitted and installed on the back of the heat conduction plate. The front of the semiconductor refrigeration sheet is the cold surface and the back is the hot surface, and a water-cooled head is fitted and installed on the back of the semiconductor refrigeration sheet. The water-cooled head is connected with a circulating water-cooling system.

[0007] To further solve the technical problems to be solved by the utility model, in a general-purpose semiconductor water-cooled heat dissipation device provided by the utility model, a fixed bracket is arranged on the back of the circuit board. The fixed bracket and the water-cooled head are connected by fasteners, and a gasket is arranged between the fixed bracket and the circuit board.

[0008] To further solve the technical problems to be solved by the utility model, in a general-purpose semiconductor water-cooled heat dissipation device provided by the utility model, a heat insulation pad is arranged between the fixed bracket and the heat conduction plate. The middle of the heat insulation pad is provided with a first through hole corresponding to the position of the heat dissipation through hole, and heat insulation fins located between the side of the heat conduction block and the heat dissipation through hole.

[0009] To further solve the technical problems to be solved by the present utility model, in a general-purpose semiconductor water-cooled heat dissipation device provided by the present utility model, a heat insulation plate is provided between the fixed bracket and the water-cooled head. A second through hole for embedding a heat conduction plate and a semiconductor refrigeration chip is provided in the middle of the heat insulation plate, and the cross-sectional dimension of the water-cooled head is larger than that of the second through hole so that the periphery of the water-cooled head presses on the periphery of the second through hole.

[0010] To further solve the technical problems to be solved by the present utility model, in a general-purpose semiconductor water-cooled heat dissipation device provided by the present utility model, a ring of limiting steps is provided on one side of the second through hole close to the circuit board, and the edge of the heat conduction plate cooperates with the limiting steps.

[0011] To further solve the technical problems to be solved by the present utility model, in a general-purpose semiconductor water-cooled heat dissipation device provided by the present utility model, a temperature sensing element is provided on the heat conduction plate, and the temperature sensing element is electrically connected to the control system of the semiconductor refrigeration chip.

[0012] To further solve the technical problems to be solved by the present utility model, in a general-purpose semiconductor water-cooled heat dissipation device provided by the present utility model, a temperature sensing element is provided on the heat conduction plate, and the temperature sensing element is electrically connected to the control system of the semiconductor refrigeration chip, and a avoiding hole for avoiding the temperature sensing element is provided on the heat insulation plate.

[0013] To further solve the technical problems to be solved by the present utility model, in a general-purpose semiconductor water-cooled heat dissipation device provided by the present utility model, the temperature sensing element is a thermistor.

[0014] To further solve the technical problems to be solved by the present utility model, in a general-purpose semiconductor water-cooled heat dissipation device provided by the present utility model, the chip is a DMD chip.

[0015] Compared with the prior art, the present utility model has the following advantages:

[0016] 1. The heat dissipation device of the present utility model combines a semiconductor refrigeration chip with a water-cooled heat dissipation system to form an efficient heat dissipation structure. Through the heat conduction block and the heat conduction plate, the heat generated by the chip is efficiently transferred to the cold surface of the semiconductor refrigeration chip, and then the heat generated by the hot surface is taken away by the circulating water-cooled system, thereby ensuring the stable operation of the chip under high load and extending the service life. The device has strong design adaptability and is widely applicable to various electronic devices with high-efficiency heat dissipation.

[0017] 2. The device is provided with a heat insulation pad, whose structure forms an effective thermal isolation between the fixed bracket and the heat conduction plate, preventing heat from being directly transferred to the fixed bracket and the circuit board. The middle heat insulation fins of the heat insulation pad effectively separate the heat conduction block from the circuit board and the fixed bracket, avoiding heat transfer, protecting the circuit board and the fixed bracket, and ensuring the stability and reliability of the device under high load. In addition, the heat insulation pad fits the heat conduction plate, reducing heat exchange, preventing condensation of water droplets when the semiconductor refrigeration chip works, and avoiding short circuits.

[0018] 3. An insulation board is provided between the fixed bracket and the water-cooled head, effectively cutting off external heat, improving the heat exchange efficiency of the heat conduction plate and the refrigeration performance of the semiconductor refrigeration chip, enabling it to conduct refrigeration centrally, and ensuring that the refrigeration capacity is not affected by the outside. At the same time, the heat conduction plate maintains good heat conduction ability and quickly and effectively transfers the heat generated by the chip.

[0019] 4. The second through hole in the middle of the insulation board provides an embedding space for the heat conduction plate and the semiconductor refrigeration chip, reducing the heat exchange between the two and the external air, thereby reducing the heat interference caused by environmental changes, improving the refrigeration density, and enhancing the refrigeration effect.

[0020] 5. In addition, the insulation board provides buffering during operation, protecting the chip and the semiconductor refrigeration chip from external impacts. When locking the semiconductor refrigeration chip, only the central area of the water-cooled head is in contact with its back surface, and the periphery is pressed tightly on the insulation board, effectively dispersing the locking pressure, reducing the force on the semiconductor refrigeration chip, and protecting it from damage.

[0021] 6. The combination of the insulation board and the heat insulation pad in the present utility model enables the heat conduction plate to more effectively concentrate the heat transferred from the chip and the refrigeration capacity of the semiconductor refrigeration chip, thereby improving the heat dissipation efficiency. Description of the Drawings

[0022] The following further details the specific implementation manners of the present utility model in conjunction with the drawings, where:

[0023] Figure 1 is the three-dimensional structural schematic diagram of the present utility model;

[0024] Figure 2 is the exploded schematic diagram of the present utility model;

[0025] Figure 3 is the cross-sectional schematic diagram of the present utility model. Specific Implementation Manner

[0026] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the present utility model will be further described in detail below in conjunction with the drawings and specific implementation manners.

[0027] Such as Figures 1 to 3A general-purpose semiconductor water-cooled heat dissipation device as shown is designed to provide an efficient heat dissipation solution for various electronic devices. The device mainly consists of a circuit board 1, a chip 2 arranged on the front of the circuit board 1, a heat conduction plate 3, a heat conduction block 31, a semiconductor refrigeration sheet 4, a water-cooling head 5, etc.

[0028] Specifically, a variety of electronic components are arranged on the front of the circuit board 1, including the chip 2 in this embodiment. The chip 2 is a DMD (Digital Micromirror Device) chip, which is widely used in high-performance electronic devices such as projectors and displays. A large amount of heat is generated when the DMD chip works, so an effective heat dissipation design is crucial. Of course, the heat dissipation device described in this embodiment can not only provide a high-quality heat dissipation solution for the DMD chip, but also be applicable to other types of chips, such as CPUs, GPUs, etc., demonstrating its versatility and applicability.

[0029] Heat dissipation through holes 11 are provided on the circuit board 1, and the chip 2 exactly covers the front of the heat dissipation through holes 11. To enhance the heat conduction effect, a heat conduction plate 3 is arranged on the back of the circuit board 1. The material of the heat conduction plate 3 is selected from high thermal conductivity metal materials, such as aluminum or copper, to ensure that heat can be effectively conducted. A heat conduction block 31 is arranged on the front of the heat conduction plate 3, and the heat conduction block 31 passes through the heat dissipation through holes 11 and is closely attached to the back of the chip 2. The heat conduction block 31 is usually integrated with the heat conduction plate 3 to ensure that the heat generated by the chip 2 can be quickly absorbed by the heat conduction block 31 and transferred to the heat conduction plate 3.

[0030] To further improve the heat dissipation performance, a semiconductor refrigeration sheet 4 is attached to the back of the heat conduction plate 3. The semiconductor refrigeration sheet 4 adopts the Peltier effect principle, with its front being the cold surface and the back being the hot surface. During the heat dissipation process, the cold surface will absorb the heat of the heat conduction plate 3, and the heat of the hot surface needs to be dissipated through effective cooling means. For this reason, a water-cooling head 5 is attached to the back of the semiconductor refrigeration sheet 4, and the design of the water-cooling head 5 aims to maximize the heat exchange efficiency.

[0031] The water-cooling head 5 is connected to a circulating water-cooling system. This system usually includes components such as a water pump, water pipes, and a radiator. The water pump plays a role in circulating the water flow in the system to ensure the continuous flow of water, thereby taking away the heat generated by the hot surface. The water flows through the water pipes to the radiator, and the radiator is responsible for dissipating the heat to the environment to ensure the efficient operation of the entire heat dissipation system.

[0032] The heat dissipation device of the present utility model combines the heat dissipation of a semiconductor refrigeration sheet with a water-cooled heat dissipation system to form an efficient heat dissipation structure. Through the heat conduction block 31 and the heat conduction plate 3, the heat generated by the chip 2 is efficiently transferred to the cold surface of the semiconductor refrigeration sheet 4, and then the heat generated on the hot surface is taken away in time through the circulating water-cooled system, thereby ensuring the stable operation of the chip 2 under high load conditions and extending its service life. The design of this heat dissipation device has good adaptability and can be widely applied to various electronic devices that require efficient heat dissipation.

[0033] More specifically, a fixed bracket 6 is provided on the back of the circuit board 1. The fixed bracket 6 and the water-cooled head 5 are connected by fasteners (such as screws), and a gasket 61 is provided between the fixed bracket 6 and the circuit board 1. The gasket 61 mainly plays a buffering role, effectively reducing the mechanical stress caused by thermal expansion or equipment vibration. Of course, if the gasket 61 is made of heat-insulating buffer material, heat insulation can also be achieved.

[0034] More specifically, a heat insulation pad 7 is provided between the fixed bracket 6 and the heat conduction plate 3. This design aims to further optimize the performance of the thermal management system. The main structure of the heat insulation pad 7 is used to form an effective thermal isolation layer between the back of the fixed bracket 6 and the front of the heat conduction plate 3, thereby preventing the heat accumulated on the heat conduction plate 3 from being directly transferred to the fixed bracket 6 and the circuit board 1. Such a design not only helps to protect the fixed bracket 6 from the influence of excessive temperature but also ensures the stability and reliability of the equipment under high load.

[0035] In the middle of the heat insulation pad 7, a first through hole 71 corresponding to the position of the heat dissipation through hole 11 is provided, and the heat conduction block 31 can pass through the first through hole 71.

[0036] Heat insulation fins 72 are also provided in the middle of the heat insulation pad 7 between the side of the heat conduction block 31 and the heat dissipation through hole 11. The main function of the heat insulation fins 72 on the heat insulation pad 7 is to effectively separate the side of the heat conduction block 31 from the circuit board 1 and the fixed bracket 6, thereby preventing the heat generated on the heat conduction block 31 from being transferred to the circuit board 1 and the fixed bracket 6. The heat insulation fins 72 improve the heat insulation effect, ensuring that the heat of the heat conduction block 31 can be smoothly guided to the heat conduction plate 3 without disturbing the temperature state of the circuit board 1 and the fixed bracket 6.

[0037] In addition, the heat insulation pad 7 is attached to the heat conduction plate 3, which can reduce the heat exchange between the heat conduction plate 3 and the external ambient temperature, prevent the phenomenon of condensed water droplets during the operation of the semiconductor refrigeration sheet 4, and prevent short-circuit defects of the circuit board and the chip 2.

[0038] The design of the heat insulation pad 7 and its heat insulation fins 72 ensure the efficiency and reliability of the heat dissipation system through multiple isolation measures. Thus, under extreme working conditions, it can still effectively maintain the normal working temperature of the chip 2 and avoid performance degradation or equipment damage caused by overheating.

[0039] More specifically, a heat insulation plate 8 is provided between the fixed bracket 6 and the water-cooled head 5. The material of the heat insulation plate 8 is usually selected from materials with excellent heat insulation performance, such as polymer or ceramic composite materials. Through the barrier of the heat insulation plate 8, external heat is effectively cut off, avoiding affecting the heat exchange efficiency of the heat conduction plate 3 and the refrigeration performance of the semiconductor refrigeration chip 4. This design enables the semiconductor refrigeration chip 4 to focus more on refrigeration, ensuring that its refrigeration capacity is not disturbed by external environmental changes. At the same time, the heat conduction plate 3 can maintain its excellent heat conduction ability without being affected by external heat, so as to ensure that the heat generated by the chip 2 can be quickly and efficiently transferred to the semiconductor refrigeration chip 4. This efficient heat transfer mechanism enables the heat generated by the chip 2 to be dissipated in a timely and effective manner, thereby further reducing the working temperature of the chip and improving its performance and stability.

[0040] A specially designed second through hole 82 is provided in the middle of the heat insulation plate 8, aiming to provide an embedding space for the heat conduction plate 3 and the semiconductor refrigeration chip 4. The cross-sectional size of the second through hole 82 is smaller than the cross-sectional size of the water-cooled head 5, so that the periphery of the water-cooled head 5 can be tightly pressed against the periphery of the second through hole 82.

[0041] Correspondingly, the cross-sectional sizes of the heat conduction plate 3 and the semiconductor refrigeration chip 4 are significantly smaller than the cross-sectional size of the second through hole 82, ensuring that the two can be easily embedded and enclosed inside the second through hole 82. Through this design, the heat exchange area between the heat conduction plate 3 and the semiconductor refrigeration chip 4 and the external air is greatly reduced, thereby significantly reducing the heat interference caused by external environmental changes. This isolation measure effectively improves the refrigeration density and enhances the refrigeration effect of the semiconductor refrigeration chip 4, enabling it to exhibit better heat dissipation performance under high load conditions.

[0042] In addition, the heat insulation plate 8 also plays an important buffering role during the entire working process, protecting the chip 2 and the semiconductor refrigeration chip 4 from external impacts and stresses. Specifically, since the semiconductor refrigeration chip 4 is usually made of fragile ceramic materials, there is a risk of deformation and brittle fracture in its fixed position, especially the internal structure is easily damaged during the fixing process. To avoid this situation, when locking the semiconductor refrigeration chip 4, only the central area of the water-cooled head 5 is directly attached to the back of the semiconductor refrigeration chip 4, while the periphery of the water-cooled head 5 is tightly pressed and fixed on the heat insulation plate 8. Such a design effectively disperses the pressure required to lock the semiconductor refrigeration chip 4 to the contact surface between the heat insulation plate 8 and the water-cooled head 5, thereby reducing the locking pressure borne by the semiconductor refrigeration chip 4 and significantly protecting it from damage.

[0043] The second through hole 82 is provided with a circumferential limiting step 83 on the side close to the circuit board 1, and the edge of the heat conduction plate 3 is fitted onto the limiting step 83 from the outside to the inside, thus forming a stable structural system, further ensuring that the heat conduction plate 3 will not be displaced due to thermal expansion or external force during operation.

[0044] In addition, the present utility model combines the use of a heat insulation plate 8 and a heat insulation pad 7, enabling the heat conduction plate 3 to more effectively concentrate and transfer the heat from the chip 2 and the refrigerating capacity of the semiconductor refrigeration sheet 4. This synergistic effect not only improves the overall performance of the heat dissipation system but also ensures that the device can maintain good thermal balance and stability during long-term operation.

[0045] More specifically, a temperature sensing element 9 is provided on the heat conduction plate 3. The main function of the temperature sensing element 9 is to monitor the temperature change of the heat conduction plate 3 in real time to ensure that the entire heat dissipation system can operate in an optimal state. The temperature sensing element 9 is electrically connected to the control system of the semiconductor refrigeration sheet 4 to form a closed-loop feedback control system. Through this system, the temperature sensing element 9 can transmit the real-time temperature data of the heat conduction plate 3 to the control system, enabling the control system to timely adjust the operating state of the semiconductor refrigeration sheet 4 to adapt to the instantaneous temperature requirements. This precise temperature control mechanism can effectively improve the heat dissipation efficiency and ensure that the electronic device will not cause performance degradation or damage due to overheating under high load conditions.

[0046] Furthermore, in order to ensure that the installation of the temperature sensing element 9 on the heat conduction plate 3 does not interfere with the operation of other components, the heat insulation plate 8 is provided with an avoidance hole 84 for avoiding the temperature sensing element 9.

[0047] Preferably, the temperature sensing element 9 specifically adopts a thermistor. A thermistor is a resistor that is extremely sensitive to temperature changes, and its resistance value will change significantly with temperature changes. In practical applications, the thermistor can effectively respond to the temperature change of the heat conduction plate 3 and transmit data to the control system of the semiconductor refrigeration sheet 4, thereby achieving precise temperature regulation and control.

Claims

1. A universal semiconductor water cooling device, characterized in that: The invention comprises a circuit board (1) and a chip (2) arranged on the front side of the circuit board (1); the circuit board (1) is provided with a heat dissipation through hole (11); the back side of the circuit board (1) is provided with a heat conduction plate (3) for heat conduction; the front side of the heat conduction plate (3) is provided with a heat conduction block (31) passing through the heat dissipation through hole (11) and bonded to the back side of the chip (2); the back side of the heat conduction plate (3) is bonded with a semiconductor cooling plate (4); the front side of the semiconductor cooling plate (4) is a cold side and the back side is a hot side; the back side of the semiconductor cooling plate (4) is bonded with a water cooling head (5); the water cooling head (5) is connected to a circulating water cooling system.

2. A universal semiconductor water cooling device according to claim 1, characterized in that: A fixing bracket (6) is provided on the back of the circuit board (1); the fixing bracket (6) and the water cooling head (5) are connected via a fastener; and a gasket (61) is provided between the fixing bracket (6) and the circuit board (1).

3. A universal semiconductor water cooling device according to claim 2, characterized in that: A heat insulating pad (7) is provided between the fixing bracket (6) and the heat conducting plate (3); a first through hole (71) corresponding to the position of the heat dissipation through hole (11) is provided in the middle of the heat insulating pad (7), and a heat insulating fin (72) is located between the side surface of the heat conducting block (31) and the heat dissipation through hole (11).

4. A universal semiconductor water cooling device according to claim 2, characterized in that: A heat insulating plate (8) is provided between the fixed bracket (6) and the water cooling head (5), and a second through hole (82) for embedding the heat conducting plate (3) and the semiconductor cooling plate (4) is provided in the middle of the heat insulating plate (8), and the cross-sectional dimension of the water cooling head (5) is larger than the cross-sectional dimension of the second through hole (82) so that the periphery of the water cooling head (5) is pressed against the periphery of the second through hole (82).

5. A universal semiconductor water cooling device according to claim 4, characterized in that: The second through hole (82) is provided with a circle of limiting steps (83) on a side close to the circuit board (1), and the edge of the heat conducting plate (3) cooperates with the limiting steps (83).

6. A universal semiconductor water cooling device according to claim 1, characterized in that: The heat conducting plate (3) is provided with a temperature sensing element (9), and the temperature sensing element (9) is electrically connected to the control system of the semiconductor refrigeration sheet (4).

7. A universal semiconductor water cooling device according to claim 4, characterized in that: The heat conducting plate (3) is provided with a temperature sensing element (9), the temperature sensing element (9) is electrically connected to the control system of the semiconductor refrigeration plate (4), and the heat insulating plate (8) is provided with an avoidance hole (84) for avoiding the temperature sensing element (9).

8. A universal semiconductor water cooling device according to claim 6 or 7, characterized in that: The temperature sensing element (9) is a thermistor.

9. A universal semiconductor water cooling device according to claim 1, characterized in that: The chip (2) is a DMD chip.

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