Non-refrigeration packaging detector BGA tube shell output interface
By designing the BGA tube and tube output interface of the non-refrigerated package detector, using ceramic tube and FPC cables, the problems of detector connection reliability and signal interference in the prior art are solved, and efficient and reliable signal output is achieved.
Patent Information
- Application Number
- CN202421724694.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-19
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-07-19
AI Technical Summary
The existing non-cooled infrared focal plane detectors use PGA pins or CLCC gold wires to connect the bottom of the tube shell, which has reliability problems and high costs, and has large interference with each other.
Design a non-refrigeration package detector BGA shell and tube output interface, using ceramic shell and tube, square window, window bracket, chip and FPC cable. The circuit is designed at the bottom of the tube and tube through the BGA array to increase the output PAD number, reduce signal interference, and use FPC cable to replace pins or gold wire connections.
This greatly improves the number of output PADs, avoids mutual interference between signals, improves the reliability and application efficiency of the detector, and reduces production costs.
Smart Images
Figure CN222927491U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of uncooled infrared focal plane detectors, and particularly to an output interface of a BGA package detector for uncooled detectors. Background Art
[0002] With the current wide application of packages in various types of chip packaging, the development of uncooled infrared focal plane detectors in China has been rapid in the past decade or so, and ceramic packaging accounts for a large proportion in this product.
[0003] Currently, the PGA pin method plus socket connection is usually adopted on the bottom surface of the detector. These pins are easy to bend, and there is no buckle to prevent detachment at the intermediate connection part between the detector and the connector, resulting in reliability problems.
[0004] There is also a wire bonding connection method by reserving CLCC that can be wire-bonded on the four sides of the detector. This method has high requirements for equipment, and only equipment operation has high manufacturing costs. Moreover, the gold wire can withstand little pressure and is easy to break, so its reliability is low.
[0005] Since there are many output and test PADs reserved in the design of the uncooled focal plane detector chip, due to the current package size limitations of forms such as PGA and CLCC, the number of pins that can be designed is small. In order to ensure output, routing circuits need to be designed on the bottom substrate of the ceramic package to conduct and interconnect the PADs with the same function. Even some PAD outputs for test monitoring will be cancelled during the mass production stage. At the same time, because the pin form generally uses a socket for connection, there are reliability problems in uncooled applications. Content of the Utility Model
[0006] The main purpose of the utility model is to provide an output interface of a BGA package detector for uncooled detectors, aiming to design the ceramic package for the uncooled infrared focal plane detector in the BGA form, and design a BGA array at the bottom of the package, thereby greatly increasing the number of output PADs, avoiding interconnection between the same output PADs, and reducing mutual interference between signals.
[0007] To achieve the above purpose, the utility model provides an output interface of a BGA package detector for uncooled detectors, including: a ceramic package, a square window, a square window bracket, a chip, and an FPC cable. The chip is arranged inside the ceramic package, the window bracket is arranged on the ceramic package, the window is arranged on the window bracket, and the FPC cable is welded to the circuit pads at the bottom of the ceramic package to form a path.
[0008] A further technical solution of the utility model is that the tail end of the FPC cable is an insertable cable for external connection.
[0009] A further technical solution of the present utility model is that the cross-section of the FPC flexible cable is U-shaped.
[0010] A further technical solution of the present utility model is that the chip is bonded in the ceramic package by glue.
[0011] A further technical solution of the present utility model is that the position on the chip where the bonding wire is led out is electrically connected to the pad on the ceramic package through the bonding wire.
[0012] A further technical solution of the present utility model is that the window is brazed on the window bracket.
[0013] A further technical solution of the present utility model is that the window bracket and the window are eutectically sintered with the ceramic package by means of co-firing in a high-temperature furnace.
[0014] The beneficial effect of the BGA package detector BGA package output interface of the present utility model is:
[0015] Through the above technical solutions, the present utility model includes: a ceramic package, a square window, a square window bracket, a chip and an FPC flexible cable. The chip is arranged in the ceramic package, the window bracket is arranged on the ceramic package, the window is arranged on the window bracket, and the FPC flexible cable is welded to the circuit pad at the bottom of the ceramic package to form a path. The ceramic package for the uncooled focal plane detector is designed in the BGA form, and a BGA array is designed at the bottom of the package. Thus, the number of output PADs is greatly increased, the interconnection between the same output PADs is avoided, and the mutual interference between signals is reduced. Description of the Drawings
[0016] Figure 1 is an exploded structural schematic diagram of a preferred embodiment of the BGA package output interface of the uncooled package detector of the present utility model;
[0017] Figure 2 is a top view of a preferred embodiment of the BGA package output interface of the uncooled package detector of the present utility model;
[0018] Figure 3 is a front view of a preferred embodiment of the BGA package output interface of the uncooled package detector of the present utility model;
[0019] Figure 4 is a cross-sectional view of a preferred embodiment of the BGA package output interface of the uncooled package detector of the present utility model;
[0020] Figure 5 is a bottom view of a preferred embodiment of the BGA package output interface of the uncooled package detector of the present utility model.
[0021] Explanation of the Reference Numerals in the Drawings:
[0022] Ceramic package 1; window 2; window bracket 3; chip 4; FPC cable 5.
[0023] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. Specific embodiments
[0024] It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0025] The present utility model provides a non-cooled packaged detector BGA package output interface. Drawing on the conventional BGA package design form, the ceramic package for the non-cooled focal plane detector is designed in the BGA form. A BGA array can be designed at the bottom of the package, and the number of output PADs can be greatly increased. Interconnection between the same output PADs is avoided, and mutual interference between signals can be reduced. At the same time, the detector packaged in this form can be directly soldered by reflow soldering in the backend application, improving the mounting efficiency and the application reliability.
[0026] Please refer to Figures 1 to 5 , a preferred embodiment of the non-cooled packaged detector BGA package output interface of the present utility model includes a ceramic package 1, a square window 2, a square window bracket 3, a chip 4, and an FPC cable 5. The chip 4 is disposed inside the ceramic package 1. The window bracket 3 is disposed on the ceramic package 1. The window 2 is disposed on the window bracket 3. The FPC cable 5 is soldered to the circuit pads at the bottom of the ceramic package 1 to form a path.
[0027] In this embodiment, the wiring method of the FPC cable 5 replaces the wiring methods of pins or bonding wires, making the installation method more flexible. The bottom of the non-cooled packaged detector is changed from the original high-temperature brazing to the manual soldering or reflow soldering process of the FPC flexible cable, simplifying the process. In addition, the bottom of the non-cooled packaged detector can make full use of the space for bottom layer wiring, and the number of its output pins can be increased.
[0028] Among them, the tail end of the FPC cable 5 is an insertion-type cable for connection to the outside. The cross-section of the FPC cable 5 is U-shaped.
[0029] The chip 4 is bonded inside the ceramic package 1 with glue.
[0030] The position on the chip 4 where the bonding wire is led is conducted with the pads on the ceramic package 1 through the bonding wire.
[0031] The window 2 is brazed to the window bracket 3.
[0032] The window bracket 3 and the window 2 are eutectically sintered with the ceramic package 1 by means of co-firing in a high-temperature furnace.
[0033] The working principle of the output interface of the BGA package of the uncooled detector of the present utility model is as follows: The ceramic package 1 belongs to the high-temperature co-fired ceramic process. Through the internal circuit, the pads and the BGA balls are correspondingly conducted to the back region of the ceramic package 1, and at the same time, airtightness is achieved. After the back region of the ceramic package 1 has solder joints, it is conducted with the FPC cable 5 through low-temperature welding. The shape and length of the FPC cable 5 can be customized according to needs, releasing the distance limitation of the application end on the back of the detector. At the same time, the FPC cable 5 is convenient and is the mainstream method of transmission connection at present.
[0034] The beneficial effects of the output interface of the BGA package of the uncooled detector of the present utility model are as follows:
[0035] Through the above technical solutions, the present utility model includes: a ceramic package, a square window, a square window bracket, a chip, and an FPC cable. The chip is arranged inside the ceramic package, the window bracket is arranged on the ceramic package, the window is arranged on the window bracket, and the FPC cable is welded to the circuit pads at the bottom of the ceramic package to form a path. The ceramic package for the uncooled focal plane detector is designed in the BGA form, and a BGA array is designed at the bottom of the package, thereby greatly increasing the number of output PADs, avoiding the interconnection between the same output PADs, and reducing the mutual interference between signals.
[0036] The above are only the preferred embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structural or process transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present utility model.
Claims
1. A BGA tube shell output interface of an uncooled packaged detector, characterized in that: Used for a ceramic tube shell, a BGA array is designed at the bottom of the ceramic tube shell, the ceramic tube shell includes a square window, a square window bracket, a chip and an FPC cable, the chip is arranged in the ceramic tube shell, the window bracket is arranged on the ceramic tube shell, the window is arranged on the window bracket, and the FPC cable is welded to the circuit pad at the bottom of the ceramic tube shell to form a passage.
2. The uncooled packaged detector BGA shell output interface according to claim 1, characterized in that: The tail end of the FPC cable is an inserted cable connected to the outside.
3. The BGA tube shell output interface of the uncooled packaged detector according to claim 2, characterized in that: The cross section of the FPC cable is U-shaped.
4. The BGA tube shell output interface of the uncooled packaged detector according to claim 1, characterized in that: The chip is bonded in the ceramic tube shell by glue.
5. The BGA tube shell output interface of the uncooled packaged detector according to claim 4, characterized in that: The position of the bonding wire on the chip is connected to the pad on the ceramic tube shell through the bonding wire.
6. The BGA tube shell output interface of the uncooled packaged detector according to claim 5, characterized in that: The window is brazed on the window bracket.
7. The uncooled packaged detector BGA tube shell output interface according to claim 1, characterized in that: The window bracket and the window are eutectically sintered with the ceramic tube shell by co-firing in a high-temperature furnace.