Electromagnetic shielding packaging structure and system-level packaging module

Abstract

The utility model provides an electromagnetic shielding packaging structure and a system-level packaging module, and relates to the technical field of chip packaging, the electromagnetic shielding packaging structure comprises a substrate, a plastic packaging layer, a metal shielding layer, a plurality of chips and a plurality of electromagnetic shielding columns, one side surface of the substrate is provided with a first grounding pad; the plurality of chips are respectively pasted on the plurality of pasting areas; the plastic packaging layer is arranged on the substrate; the plurality of electromagnetic shielding columns are arranged in the plastic packaging layer; the metal shielding layer covers the plastic package layer; the width of the electromagnetic shielding column is gradually increased in the direction away from the first grounding bonding pad. Compared with the prior art, the electromagnetic shielding column with the large upper part and the small lower part is adopted, electromagnetic shielding is realized in cooperation with the grounding bonding pad and the metal shielding layer, a groove with the large upper part and the small lower part can be formed during grooving, and the problem of laser penetration caused by traditional laser trepanning is effectively solved. And the flowability of metal sputtering liquid flowing from the top to the bottom is also improved, the filling property of the groove is ensured, and the electromagnetic shielding effect is further ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and in particular to an electromagnetic shielding packaging structure and a system-level packaging module. Background Art

[0002] The inventors have found that with the rapid development of the semiconductor industry, SIP module structures are widely used in the semiconductor industry. The main advantages of SIP modules are high-density integration, small package product size, superior product performance, and fast signal transmission frequency. Semiconductor devices cause high-intensity electromagnetic radiation at high frequencies or short waves. As electronic products are used in high-frequency signals in the communication field, products are required to have a partitioned electromagnetic shielding structure to prevent electromagnetic interference between various chips and components.

[0003] The existing electromagnetic shielding packaging structure usually uses laser drilling to make grooves on the plastic package, and the grooves are straight groove structures, which can easily cause penetration problems and damage the wiring structure on the pad or substrate. At the same time, it is difficult to completely fill the grooves when the metal columns are subsequently formed, resulting in poor electromagnetic shielding effect. Utility Model Content

[0004] The purpose of the utility model is to provide an electromagnetic shielding packaging structure and a system-level packaging module, which can avoid the problem of slot penetration, thereby avoiding damage to the pad or substrate during slotting, and can ensure the filling of the groove, thereby ensuring the electromagnetic shielding effect.

[0005] The embodiment of the utility model is achieved as follows:

[0006] In a first aspect, the utility model provides an electromagnetic shielding packaging structure, comprising:

[0007] A substrate, wherein a plurality of mounting areas are arranged on one side surface of the substrate, a first grounding pad is arranged between adjacent mounting areas, and a second grounding pad is arranged on the other side surface of the substrate, and the second grounding pad is electrically connected to the first grounding pad;

[0008] A plurality of chips, wherein the plurality of chips are mounted on the plurality of mounting areas respectively and are electrically connected to the substrate, and the plurality of chips are spaced apart from the first ground pad;

[0009] A plastic encapsulation layer, which is disposed on the substrate and covers the plurality of chips and the first ground pad;

[0010] A plurality of electromagnetic shielding columns are disposed in the encapsulation layer, arranged side by side between two adjacent chips, and the plurality of electromagnetic shielding columns are provided in one-to-one correspondence with the plurality of first ground pads. One end of each electromagnetic shielding column is connected to the first ground pad, and the other end is exposed outside the encapsulation layer;

[0011] A metal shielding layer covers the outside of the encapsulation layer and is connected to the electromagnetic shielding columns;

[0012] Wherein, the width of the electromagnetic shielding column gradually increases in a direction away from the first ground pad.

[0013] In an alternative embodiment, conductive columns are provided in the substrate, and the first ground pad and the second ground pad are respectively connected to two ends of the conductive column.

[0014] In an alternative embodiment, the plurality of electromagnetic shielding columns are arranged in two columns between two adjacent chips, and the two columns of electromagnetic shielding columns are arranged in a staggered manner.

[0015] In an alternative embodiment, the distance between two adjacent electromagnetic shielding columns in the same column is less than or equal to the diameter of the electromagnetic shielding column.

[0016] In an alternative embodiment, the plurality of electromagnetic shielding columns are all in a conical column shape, and the encapsulation layer is coated around the electromagnetic shielding columns.

[0017] In an alternative embodiment, the plurality of electromagnetic shielding columns are all in a conical tube shape, and the encapsulation layer is coated around the electromagnetic shielding columns and filled inside the electromagnetic shielding columns.

[0018] In an alternative embodiment, the plurality of electromagnetic shielding columns include a first shielding column and a second shielding column, the first shielding column and the second shielding column are alternately arranged, the first shielding column is in a conical column shape, and the second shielding column is in a conical tube shape.

[0019] In an alternative embodiment, the width of the first ground pad is the same as the width of the electromagnetic shielding column.

[0020] In an alternative embodiment, the first ground pad is in a ring shape and is correspondingly joined to the electromagnetic shielding column.

[0021] In a second aspect, the present utility model provides a system-in-package module, including a circuit board and the electromagnetic shielding package structure according to any one of the foregoing embodiments, and the substrate is attached to the circuit board.

[0022] The beneficial effects of the embodiments of the present utility model are:

[0023] The electromagnetic shielding package structure provided by the present utility model has multiple mounting areas provided on one side surface of the substrate. A first ground pad is provided between adjacent mounting areas. A second ground pad is provided on the other side surface of the substrate. The second ground pad is electrically connected to the first ground pad to achieve external grounding. Multiple chips are respectively mounted on the multiple mounting areas and electrically connected to the substrate. The multiple chips are spaced apart from the first ground pad. Then, a plastic encapsulation layer is provided on the substrate. The plastic encapsulation layer covers the multiple chips and the first ground pad to play a protective role. Multiple electromagnetic shielding columns are formed in the plastic encapsulation layer. The multiple electromagnetic shielding columns are arranged between adjacent two chips. The multiple electromagnetic shielding columns are provided in one-to-one correspondence with the multiple ground pads. One end of each electromagnetic shielding column is connected to the first ground pad, and the other end is exposed outside the plastic encapsulation layer. Finally, a metal shielding layer is covered outside the plastic encapsulation layer and connected to the electromagnetic shielding columns. Among them, the width of the electromagnetic shielding column gradually increases in the direction away from the first ground pad. Compared with the prior art, the electromagnetic shielding columns with a larger upper part and a smaller lower part are adopted in the embodiment of the present utility model, and electromagnetic shielding is achieved in cooperation with the ground pads and the metal shielding layer. When grooving, a groove with a larger upper part and a smaller lower part can be opened, effectively solving the problem of laser penetration caused by traditional laser hole opening. The energy at the top is high and the energy at the bottom is low, avoiding breakdown of the ground pad. Then electroplating is carried out, which also improves the fluidity of the metal sputtering liquid flowing from the top to the bottom, ensures the filling property, avoids the occurrence of a hollow phenomenon, and further ensures the electromagnetic shielding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 FIG. 1 is a schematic structural diagram of the electromagnetic shielding package structure provided by the embodiment of the present utility model from a first perspective;

[0026] Figure 2 FIG. 2 is a schematic structural diagram of the electromagnetic shielding package structure provided by the embodiment of the present utility model from a second perspective;

[0027] Figure 3 FIG. 3 is a schematic structural diagram of another electromagnetic shielding package structure provided by the embodiment of the present utility model from a first perspective;

[0028] Figure 4 FIG. 4 is a schematic structural diagram of another electromagnetic shielding package structure provided by the embodiment of the present utility model from a second perspective;

[0029] Figure 5Schematic diagram of another electromagnetic shielding package structure provided by an embodiment of the present utility model;

[0030] Figure 6 is Figure 1 Schematic diagram of the mounting structure between the substrate and the chip in

[0031] Icon:

[0032] 100 - Electromagnetic shielding package structure; 110 - Substrate; 111 - First ground pad; 113 - Second ground pad; 115 - Conductive post; 120 - Encapsulation layer; 121 - Groove; 130 - Metal shielding layer; 140 - Chip; 150 - Electromagnetic shielding post; 151 - First shielding post; 153 - Second shielding post. Specific embodiments

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the protection scope of the present utility model.

[0035] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0036] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed when in use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0037] In addition, terms such as "horizontal" and "vertical" do not require the components to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0038] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations. Specific embodiments

[0040] Please refer to Figure 1 and Figure 2 , an electromagnetic shielding package structure 100 is provided in an embodiment of the present invention, which can avoid the problem of slot penetration, thereby avoiding damage to the pads or the substrate 110 during slotting, and can ensure the filling property during electroplating after slotting, and further ensure the electromagnetic shielding effect.

[0041] The electromagnetic shielding package structure 100 provided in this embodiment includes a substrate 110, a plastic encapsulation layer 120, a metal shielding layer 130, a plurality of chips 140, and a plurality of electromagnetic shielding columns 150. A plurality of mounting areas are provided on one side surface of the substrate 110, and a first ground pad 111 is provided between adjacent mounting areas. A second ground pad 113 is provided on the other side surface of the substrate 110, and the second ground pad 113 is electrically connected to the first ground pad 111; a plurality of chips 140 are respectively mounted on the plurality of mounting areas and are electrically connected to the substrate 110, and the plurality of chips 140 are spaced apart from the first ground pad 111; the plastic encapsulation layer 120 is provided on the substrate 110 and covers the plurality of chips 140 and the first ground pad 111; a plurality of electromagnetic shielding columns 150 are provided in the plastic encapsulation layer 120 and are arranged between adjacent two chips 140, and the plurality of electromagnetic shielding columns 150 are arranged in one-to-one correspondence with the plurality of first ground pads 111. One end of each electromagnetic shielding column 150 is connected to the first ground pad 111, and the other end is exposed outside the plastic encapsulation layer 120; the metal shielding layer 130 covers the outside of the plastic encapsulation layer 120 and is connected to the electromagnetic shielding columns 150; wherein, the width of the electromagnetic shielding column 150 gradually increases in the direction away from the first ground pad 111.

[0042] It should be noted that in actual preparation, the preparation of the substrate 110 can be completed in advance. The front surface of the substrate 110 is divided into multiple mounting areas, and a first ground pad 111 is arranged between the mounting areas. The first ground pad 111 is electrically connected to the second ground pad 113 on the back surface. The second ground pad 113 can be connected to an external ground circuit. Then, multiple chips 140 are correspondingly mounted in the multiple mounting areas, and then a plastic encapsulation layer 120 is formed. Then, a groove 121 with a larger upper part and a smaller lower part is formed by grooving on the plastic encapsulation layer 120, and the first ground pad 111 is exposed. Then, an electromagnetic shielding column 150 is formed by electroplating. The electromagnetic shielding column 150 also has a structure with a larger upper part and a smaller lower part. Finally, a metal shielding layer 130 is formed by sputtering metal. The metal shielding layer 130 is in contact with the electromagnetic shielding column 150 to achieve electromagnetic shielding. Since a groove 121 with a larger upper part and a smaller lower part can be formed during grooving, the problem of laser penetration caused by traditional laser drilling is effectively solved. The energy at the top is high and the energy at the bottom is low, avoiding breakdown of the ground pad. Then, electroplating is carried out, which also improves the fluidity of the metal sputtering liquid flowing from the top to the bottom, ensures the filling property, avoids the occurrence of a hollow phenomenon, and further ensures the electromagnetic shielding effect.

[0043] It is worth noting that in this embodiment, the substrate 110 can be made of materials such as polypropylene, silicon carbide, ceramic, copper foil, etc., and wiring is completed inside. There can be multiple chips 140 on the substrate 110. At the same time, an electromagnetic shielding column 150 is arranged between every two chips 140. In this embodiment, taking two chips 140 as an example, multiple electromagnetic shielding columns 150 are arranged between the two chips 140 for illustration. It should be noted that the multiple chips 140 in this embodiment can be chips 140 with different functions, such as a control chip 140 and a storage chip 140, or other components, such as resistors, inductors, etc. The types of the chips 140 are not specifically limited herein. And, the width of the electromagnetic shielding column 150 mentioned in this embodiment refers to the outer contour width of the electromagnetic shielding column 150. The cross-sectional shape of the electromagnetic shielding column 150 can be circular. Therefore, the width of the electromagnetic shielding column 150 here can refer to its outer diameter.

[0044] In this embodiment, a conductive column 115 is arranged inside the substrate 110. The first ground pad 111 and the second ground pad 113 are respectively connected to both ends of the conductive column 115. Specifically, the conductive column 115 can be prepared in advance. The first ground pad 111 and the second ground pad 113 are correspondingly arranged on both side surfaces of the substrate 110, and the electrical connection between the two sides is realized by the conductive column 115 in the middle. The conductive column 115 is independently arranged and can be spaced from the wiring layer in the substrate 110, so as to avoid affecting the wiring structure.

[0045] In this embodiment, multiple electromagnetic shielding columns 150 are arranged in two columns between two adjacent chips 140, and the two columns of electromagnetic shielding columns 150 are arranged in a staggered manner. Specifically, the multiple electromagnetic shielding columns 150 are distributed in two columns in the middle of the encapsulation layer 120 and are located between the two chips 140. The two columns of electromagnetic shielding columns 150 are arranged in a staggered manner, so that the electromagnetic shielding columns 150 are staggered with each other in the connection direction of the two chips 140, and a complete shielding net structure can be formed as much as possible, improving the electromagnetic shielding effect.

[0046] In this embodiment, the distance between two adjacent electromagnetic shielding columns 150 in the same column is less than or equal to the diameter of the electromagnetic shielding column 150. Specifically, the cross-section of the electromagnetic shielding column 150 here is circular, and the distance between two adjacent electromagnetic shielding columns 150 is less than the diameter of the electromagnetic shielding column 150, so that the electromagnetic shielding columns 150 can block each other in the connection direction of the two chips 140, further improving the electromagnetic shielding effect.

[0047] In this embodiment, the multiple electromagnetic shielding columns 150 are all in the shape of a conical column, and the encapsulation layer 120 is coated around the electromagnetic shielding columns 150. Specifically, the groove 121 formed during grooving can be a conical groove, effectively solving the problem of laser penetration caused by traditional laser drilling. The energy is high at the top and low at the bottom, avoiding breakdown of the grounding pad. Then electroplating is carried out, which also improves the fluidity of the metal sputtering liquid flowing from the top to the bottom, ensures the filling property, avoids the appearance of a hollow phenomenon, and further ensures the electromagnetic shielding effect.

[0048] See Figure 3 and Figure 4 In other preferred embodiments of the present utility model, the multiple electromagnetic shielding columns 150 are all in the shape of a conical cylinder, the encapsulation layer 120 is coated around the electromagnetic shielding columns 150 and filled inside the electromagnetic shielding columns 150. Specifically, during grooving, a conical ring groove can be formed, that is, an annular groove 121 is opened, and the encapsulation layer 120 in the middle part is reserved. With this structure, when electroplating to form the electromagnetic shielding columns 150, the metal consumption can be reduced, and the metal layer wraps the encapsulation layer 120.

[0049] See Figure 5 In other preferred embodiments of the present utility model, the multiple electromagnetic shielding columns 150 include a first shielding column 151 and a second shielding column 153, the first shielding column 151 and the second shielding column 153 are arranged alternately, the first shielding column 151 is in the shape of a conical column, and the second shielding column 153 is in the shape of a conical cylinder. Specifically, the electromagnetic shielding columns 150 are arranged alternately with solid conical columns and hollow conical cylinders, which not only ensures the structural strength but also ensures the electromagnetic shielding effect.

[0050] In this embodiment, the width of the first ground pad 111 is the same as the width of the electromagnetic shielding column 150. Specifically, the width of the first ground pad 111 is the same as the outer diameter of the bottom end of the electromagnetic shielding column 150, that is, when grooving, the first ground pad 111 can be exactly exposed, and the electromagnetic shielding column 150 formed after electroplating can completely cover the first ground pad 111, ensuring the electrical connection effect.

[0051] See Figure 6 , in this embodiment, the first ground pad 111 is annular and is correspondingly joined to the electromagnetic shielding column 150. Specifically, the first ground pad 111 can be annular. When grooving, the first ground pad 111 can be exposed, and a part of the encapsulation layer 120 is reserved in the middle, which can improve the bonding force between the encapsulation layer 120 and the first ground pad 111.

[0052] When actually fabricating the electromagnetic shielding package structure 100, a substrate 110 of a module can be provided first. The first ground pad 111 is designed in the area that needs to be shielded in zones on the surface of the substrate 110. Then, multiple chips 140 (for example, IC chip 140 one can be a radio frequency chip 140, and IC chip 140 two can be a power amplifier chip 140) can be mounted on the substrate 110. Then, the mounted IC chips 140 are protected by encapsulation material, and the encapsulation material can be a high thermal conductivity encapsulation material, and materials such as epoxy-based resin and silicone-based resin are selected. Again, through the laser opening process, the surface of the encapsulation layer 120 is ground to form a groove 121, and then a metal column is electroplated by electroplating to fill the groove 121 to complete the fabrication of the electromagnetic shielding column 150. Finally, a ball mounting process is performed on the back of the substrate 110 to form solder balls on the back of the substrate 110, and the grounding function is realized through the solder balls of the second ground pad 113. Again, a substrate 110 cutting process is performed to cut the product into single pieces, and then metal sputtering is performed on the surface / side of the product (the surface of the encapsulation layer 120, the four side walls of the product) to form a metal shielding layer 130, and the metal shielding layer 130 is connected to the electromagnetic shielding column 150 to realize the zone electromagnetic shielding function.

[0053] An embodiment of the present utility model further provides a system-in-package module, which includes a circuit board and an electromagnetic shielding package structure 100. The electromagnetic shielding package structure 100 includes a substrate 110, a plastic encapsulation layer 120, a metal shielding layer 130, a plurality of chips 140, and a plurality of electromagnetic shielding columns 150. A plurality of mounting areas are provided on one side surface of the substrate 110, and first ground pads 111 are provided between adjacent mounting areas. A second ground pad 113 is provided on the other side surface of the substrate 110, and the second ground pad 113 is electrically connected to the first ground pad 111. The plurality of chips 140 are respectively mounted on the plurality of mounting areas and are electrically connected to the substrate 110, and the plurality of chips 140 are spaced apart from the first ground pads 111. The plastic encapsulation layer 120 is provided on the substrate 110 and covers the plurality of chips 140 and the first ground pads 111. The plurality of electromagnetic shielding columns 150 are provided in the plastic encapsulation layer 120, are arranged between two adjacent chips 140, and the plurality of electromagnetic shielding columns 150 are provided in one-to-one correspondence with the plurality of first ground pads 111. One end of each electromagnetic shielding column 150 is connected to the first ground pad 111, and the other end is exposed outside the plastic encapsulation layer 120. The metal shielding layer 130 covers the outside of the plastic encapsulation layer 120 and is connected to the electromagnetic shielding columns 150. Wherein, the width of the electromagnetic shielding column 150 gradually increases in the direction away from the first ground pad 111. The substrate 110 is mounted on the circuit board.

[0054] Specifically, a plurality of solder balls are further provided on the side surface of the substrate 110 where the second ground pad 113 is provided. Through the plurality of solder balls, it can be welded and fixed on the circuit board to achieve electrical connection. At the same time, a ground circuit can also be provided on the circuit board, and the ground circuit is connected to the second ground pad 113 through the solder balls.

[0055] In summary, for the electromagnetic shielding package structure 100 and the system-level packaging module provided in this embodiment, a plurality of mounting areas are provided on one side surface of the substrate 110, a first ground pad 111 is provided between adjacent mounting areas, a second ground pad 113 is provided on the other side surface of the substrate 110, and the second ground pad 113 is electrically connected to the first ground pad 111 to achieve external grounding. A plurality of chips 140 are respectively mounted on the plurality of mounting areas and electrically connected to the substrate 110, and the plurality of chips 140 are spaced apart from the first ground pad 111. Then, a plastic encapsulation layer 120 is provided on the substrate 110, and the plastic encapsulation layer 120 covers the plurality of chips 140 and the first ground pad 111 to play a protective role. Then, a plurality of electromagnetic shielding columns 150 are formed in the plastic encapsulation layer 120. The plurality of electromagnetic shielding columns 150 are arranged between two adjacent chips 140, and the plurality of electromagnetic shielding columns 150 are arranged in one-to-one correspondence with the plurality of ground pads. One end of each electromagnetic shielding column 150 is connected to the first ground pad 111, and the other end is exposed outside the plastic encapsulation layer 120. Finally, a metal shielding layer 130 is covered outside the plastic encapsulation layer 120 and connected to the electromagnetic shielding columns 150. Among them, the width of the electromagnetic shielding column 150 gradually increases in the direction away from the first ground pad 111. Compared with the prior art, the electromagnetic shielding column 150 with a larger upper part and a smaller lower part is adopted in the embodiment of the present invention, and electromagnetic shielding is achieved in cooperation with the ground pad and the metal shielding layer 130. Moreover, when grooving, a groove 121 with a larger upper part and a smaller lower part can be opened, effectively solving the problem of laser penetration caused by traditional laser drilling. The energy at the top is high and the energy at the bottom is low, avoiding breakdown of the ground pad. Then electroplating is carried out, which also improves the fluidity of the metal sputtering liquid flowing from the top to the bottom, ensures the filling property, avoids the appearance of a hollow phenomenon, and further ensures the electromagnetic shielding effect.

[0056] The foregoing are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An electromagnetic shielding packaging structure, characterized in that: include: A substrate, wherein a plurality of mounting areas are arranged on one side surface of the substrate, a first grounding pad is arranged between adjacent mounting areas, and a second grounding pad is arranged on the other side surface of the substrate, and the second grounding pad is electrically connected to the first grounding pad; A plurality of chips, wherein the plurality of chips are mounted on the plurality of mounting areas respectively and are electrically connected to the substrate, and the plurality of chips are spaced apart from the first ground pad; A plastic encapsulation layer, which is disposed on the substrate and covers the plurality of chips and the first ground pad; A plurality of electromagnetic shielding columns, wherein the plurality of electromagnetic shielding columns are arranged in the plastic packaging layer and arranged between two adjacent chips, and the plurality of electromagnetic shielding columns are arranged in one-to-one correspondence with the plurality of first grounding pads, and one end of each electromagnetic shielding column is connected to the first grounding pad, and the other end is exposed from the plastic packaging layer; A metal shielding layer, the metal shielding layer covers the outside of the plastic packaging layer and is connected to the electromagnetic shielding column; Wherein, the width of the electromagnetic shielding column gradually increases in a direction away from the first ground pad.

2. The electromagnetic shielding packaging structure according to claim 1, characterized in that: A conductive column is disposed in the substrate, and the first grounding pad and the second grounding pad are respectively connected to two ends of the conductive column.

3. The electromagnetic shielding packaging structure according to claim 2, characterized in that: The plurality of electromagnetic shielding columns are arranged in two rows between two adjacent chips, and the electromagnetic shielding columns in the two rows are staggered.

4. The electromagnetic shielding packaging structure according to claim 3, characterized in that: The distance between two adjacent electromagnetic shielding columns in the same column is less than or equal to the diameter of the electromagnetic shielding columns.

5. The electromagnetic shielding packaging structure according to claim 1, characterized in that: The plurality of electromagnetic shielding columns are all in a conical column shape, and the plastic packaging layer is wrapped around the electromagnetic shielding columns.

6. The electromagnetic shielding packaging structure according to claim 1, characterized in that: The plurality of electromagnetic shielding columns are all in a conical cylindrical shape, and the plastic packaging layer is wrapped around the electromagnetic shielding columns and filled inside the electromagnetic shielding columns.

7. The electromagnetic shielding packaging structure according to claim 1, characterized in that: The plurality of electromagnetic shielding columns include a first shielding column and a second shielding column, the first shielding column and the second shielding column are alternately arranged, the first shielding column is in a tapered column shape, and the second shielding column is in a tapered cylinder shape.

8. The electromagnetic shielding packaging structure according to any one of claims 5 to 7, characterized in that: The width of the first ground pad is the same as the width of the electromagnetic shielding column.

9. The electromagnetic shielding packaging structure according to claim 8, characterized in that: The first grounding pad is ring-shaped and correspondingly connected to the electromagnetic shielding column.

10. A system-level packaging module, characterized in that: It comprises a circuit board and the electromagnetic shielding packaging structure as claimed in any one of claims 1 to 9, wherein the substrate is attached to the circuit board.

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