Frequency conversion module based on three-dimensional integration

Abstract

The utility model provides a frequency conversion module based on three-dimensional integration, the frequency conversion module based on three-dimensional integration comprises a PCB substrate, a bare chip, a surface layer component, an embedded component and a connecting through hole, the PCB substrate comprises a first PCB substrate, a second PCB substrate and a third PCB substrate, the lower surface of the second PCB substrate is provided with a groove, and the lower surface of the third PCB substrate is provided with a groove. The third PCB substrate is used for wrapping the embedded component welded and connected with the first PCB substrate, the bare chip and the surface layer component are welded on the upper surface of the third PCB substrate, and the connecting through holes are used for realizing signal interconnection of the first PCB substrate, the second PCB substrate and the third PCB substrate. According to the frequency conversion module, the bare chip, the surface layer components and the embedded components used for welding and the PCB substrate are integrated into one small module in a three-dimensional stacking mode, so that the use area is reduced, the purchase cost is saved, the three-dimensional integration degree of the frequency conversion module is improved, the circuit layout is more convenient, and the production efficiency is improved. Therefore, the design and test convenience of the control system is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a frequency conversion module based on three-dimensional integration. Background Art

[0002] At present, the frequency conversion circuit module in a general control system includes various chips installed on the same substrate. Since different chips are arranged flat on the substrate, the planar area of the substrate is much larger than the area of a single chip, resulting in a relatively large layout space. Conventional die-based three-dimensional packaging can only perform wire bonding on one plane and cannot perform three-dimensional stacking. In particular, resistors, capacitors, inductors, and filters in some low-frequency band applications (below 1 GHz) are difficult to be integrated into the three-dimensional packaging through chips and can only be placed outside the three-dimensional packaging, which brings great inconvenience to the circuit layout and leads to low three-dimensional integration. Therefore, how to improve the three-dimensional integration of the frequency conversion module to make the circuit layout more convenient is a technical difficulty that urgently needs to be solved in the industry. Summary of the Utility Model

[0003] An embodiment of the utility model provides a frequency conversion module based on three-dimensional integration to solve the problem that the prior art cannot improve the three-dimensional integration of the frequency conversion module.

[0004] To solve the above technical problem, an embodiment of the utility model provides a frequency conversion module based on three-dimensional integration. The frequency conversion module based on three-dimensional integration includes a PCB substrate, a bare chip, surface components, buried components, and connection vias. The PCB substrate includes a first PCB substrate, a second PCB substrate, and a third PCB substrate. A groove is provided on the lower surface of the second PCB substrate, and the groove is used to cover the buried components welded to the first PCB substrate. The bare chip and the surface components are welded to the upper surface of the third PCB substrate, and the connection vias are used to enable signal interconnection among the first PCB substrate, the second PCB substrate, and the third PCB substrate.

[0005] Optionally, a plurality of pads for external connection are further provided on the lower surface of the PCB substrate.

[0006] Optionally, the connection vias include a first connection via, a second connection via, and a third connection via. The first connection via is used to realize signal interconnection between the first PCB substrate and the second PCB substrate. The second connection via is used to realize signal interconnection between the first PCB substrate and the third PCB substrate. The third connection via is used to realize signal interconnection between the second PCB substrate and the third PCB substrate.

[0007] Optionally, a layer of copper plating is coated on the surfaces of the first connection via, the second connection via, and the third connection via.

[0008] Optionally, the bare chip is connected to the third PCB substrate by wire bonding.

[0009] Optionally, the bare chip is a digital bare chip or a radio frequency bare chip.

[0010] Optionally, the length and width dimensions of the groove are 0.2 mm larger than the length and width dimensions of the buried component, and the depth of the groove is 0.2 mm larger than the thickness of the buried component.

[0011] Optionally, both the surface component and the buried component include a resistor device, an inductor device, and a capacitor device.

[0012] Optionally, the first PCB substrate, the second PCB substrate, and the third PCB substrate are subjected to a lamination process by high-temperature lamination.

[0013] Optionally, the three-dimensional integration-based frequency conversion module further includes a plastic encapsulant covering the upper surface of the PCB substrate, and the height and area of the plastic encapsulant are used to encapsulate all the bare chips and the surface components to achieve plastic encapsulation protection.

[0014] The present utility model provides a three-dimensional integration-based frequency conversion module. The three-dimensional integration-based frequency conversion module includes a PCB substrate, a bare chip, a surface component, a buried component, and a connection through hole. Among them, the PCB substrate includes a first PCB substrate, a second PCB substrate, and a third PCB substrate. A groove is provided on the lower surface of the second PCB substrate for encapsulating the buried component welded to the first PCB substrate. The bare chip and the surface component are welded on the upper surface of the third PCB substrate. The connection through hole is used to enable signal interconnection among the first PCB substrate, the second PCB substrate, and the third PCB. In this application, the bare chip, the surface component used for welding, the buried component, and the PCB substrate are integrated into a small module in a three-dimensional stacking form, which not only reduces the usage area and saves the procurement cost, but also improves the three-dimensional integration degree of the frequency conversion module, making the circuit layout more convenient, thereby ensuring the convenience of the control system design and testing. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments of the present utility model will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1It is a schematic structural diagram of a frequency conversion module based on three-dimensional integration in an embodiment of the present utility model.

[0017] The reference numerals are as follows:

[0018] PCB substrate 1, bare die 2, surface-mounted components 3, buried components 4, connection vias 5, pads 6, encapsulant 7, first PCB substrate 11, second PCB substrate 12, third PCB substrate 13, first connection via 51, second connection via 52, third connection via 53. Specific embodiments

[0019] In order to make the technical problems, technical solutions and beneficial effects solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0020] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0021] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection", "communication" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0022] Please refer to Figure 1Describe a three-dimensional integrated frequency conversion module according to an embodiment of the present utility model. The three-dimensional integrated frequency conversion module includes a PCB substrate 1, a bare chip 2, surface components 3, buried components 4, and connection vias 5. Among them, the PCB substrate 1 includes a first PCB substrate 11, a second PCB substrate 12, and a third PCB substrate 13. A groove is provided on the lower surface of the second PCB substrate 12, and the groove is used to wrap the buried component 4 welded to the first PCB substrate 11. The bare chip 2 and the surface components 3 are welded on the upper surface of the third PCB substrate 13. The connection vias 5 are used to enable signal interconnection among the first PCB substrate 11, the second PCB substrate 12, and the third PCB substrate 13.

[0023] In the embodiment of the present disclosure, as Figure 1 shown, taking the packaging substrate of the frequency conversion module, the PCB substrate 1 is a multi-layer board, and the multi-layer boards are obtained by using the PCB lamination and copper paste sintering process. A three-dimensional integrated frequency conversion module is formed by the PCB substrate 1, the bare chip 2, the surface components 3, the buried components 4, and the connection vias 5. The PCB substrate 1 is formed by machine cutting. Through the wiring on the upper and lower surfaces of the PCB substrate 1, circuit interconnection or functional pin merging among the bare chip 2, the surface components 3, the buried components 4, and the connection vias 5 is realized, ensuring the integration between devices. Among them, the PCB substrate 1 includes a first PCB substrate 11, a second PCB substrate 12, and a third PCB substrate 13. Then, the buried component 4 is welded to the corresponding first PCB substrate 11 by reflow soldering, and a groove is provided on the lower surface of the second PCB substrate 12, so that the groove wraps the buried component 4 welded to the first PCB substrate 11. The second PCB substrate 12 is solid, so it is necessary to open a slot at the corresponding position of the buried component 4 to enable lamination, otherwise the device will be damaged. It is necessary to make the groove in the second PCB substrate 12 completely wrap the buried component 4 to achieve the purpose of three-dimensional integration. Then, the bare chip 2 and the surface components 3 are welded on the upper surface of the third PCB substrate 13, and connection vias 5 are provided inside the module. The connection vias 5 are formed by mechanical drilling, and the connection vias 5 are used to enable signal interconnection among the first PCB substrate 11, the second PCB substrate 12, and the third PCB substrate 13. By integrating the bare chip 2, the surface components 3 used for welding, the buried components 4, and the PCB substrate 1 into a small module in the form of three-dimensional stacking, the present application not only reduces the usage area, saves the procurement cost, but also improves the three-dimensional integration degree of the frequency conversion module, making the circuit layout more convenient, thus ensuring the convenience of the control system design and testing.

[0024] In this embodiment, a plurality of pads 6 for external connection are further provided on the lower surface of the PCB substrate 1.

[0025] In this embodiment, a plurality of pads 6 for external connection are provided on the lower surface of the first PCB substrate 11 in the PCB substrate 1. Since there are many wires connecting to the external pads on the first PCB substrate 11, the purpose of setting the pads is to enable signals to flow externally. By using the reflow soldering method to solder the solder balls, a signal loop is formed to complete the encapsulation.

[0026] In this embodiment, the connection vias 5 include a first connection via 51, a second connection via 52, and a third connection via 53. The first connection via 51 is used to realize the signal interconnection between the first PCB substrate 11 and the second PCB substrate 12, the second connection via 52 is used to realize the signal interconnection between the first PCB substrate 11 and the third PCB substrate 13, and the third connection via 53 is used to realize the signal interconnection between the second PCB substrate 12 and the third PCB substrate 13.

[0027] In this embodiment, the connection vias 5 are also called "Through-Silicon Vias" (TSV). TSV is a high-density packaging technology. The TSV technology realizes the vertical electrical interconnection of silicon vias through the filling of conductive substances such as copper, tungsten, and polysilicon. Among them, the connection vias 5 include a first connection via 51, a second connection via 52, and a third connection via 53. The first connection via 51 is used to achieve the purpose of signal interconnection between the first PCB substrate 11 and the second PCB substrate 12. The second connection via 52 is not only used to achieve the purpose of signal interconnection between the first PCB substrate 11 and the third PCB substrate 13, but also used for grounding. The third connection via 53 is used to achieve the purpose of signal interconnection between the second PCB substrate 11 and the third PCB substrate 13.

[0028] In this embodiment, a layer of copper plating is coated on the surfaces of the first connection via 51, the second connection via 52, and the third connection via 53.

[0029] In this embodiment, the first connection via 51, the second connection via 52, and the third connection via 53 are realized by mechanical drilling, and a layer of copper plating is coated on their surfaces, so as to avoid the short circuit between the metal ground layer of the first PCB substrate 11 and the non-ground network vias in the first connection via 51, the second connection via 52, and the third connection via 53 during the metallization of the first connection via 51, the second connection via 52, and the third connection via 53.

[0030] In this embodiment, the bare chip 2 is connected to the third PCB substrate 13 by wire bonding.

[0031] In this embodiment, the bare chip is a digital bare chip or a radio frequency bare chip.

[0032] In this embodiment, the bare chip 2 is in the product form before packaging. It can be a digital bare chip or a radio frequency bare chip. The bare chip 2 is connected to the third PCB substrate 13 by means of wire bonding, thereby protecting the gold wires from damage. This connection structure is simple, low in cost, and convenient for assembly, so as to be used in high-temperature and high-humidity environments. And finally, it is sealed by potting, with good reliability.

[0033] In this embodiment, the length and width dimensions of the groove are 0.2 mm larger than the length and width dimensions of the buried component, and the depth of the groove is 0.2 mm larger than the thickness of the buried component.

[0034] In this embodiment, the length and width dimensions of the groove are 0.2 mm larger than the length and width dimensions of the buried component, and the depth of the groove is 0.2 mm larger than the thickness of the buried component. During high-temperature pressing, the PCB board will produce a certain amount of overflow glue, so the slot needs to be slightly larger than the size of the buried component. The groove is used to wrap and fix the buried component 4, so that the groove in the second PCB substrate 12 can completely wrap the buried component 4, thereby achieving the purpose of three-dimensional integration.

[0035] In this embodiment, both the surface component 3 and the buried component 4 include resistor devices, inductor devices, and capacitor devices.

[0036] In this embodiment, both the surface component 3 and the buried component 4 include resistor devices, inductor devices, and capacitor devices. For example, the buried component 4 can be an amplifier, which is used to amplify the connected electrical signal to ensure the connection between signals.

[0037] In this embodiment, the first PCB substrate 11, the second PCB substrate 12, and the third PCB substrate 13 are subjected to a pressing process by means of high-temperature pressing.

[0038] In this embodiment, first, the first PCB substrate 11, the second PCB substrate 12, and the third PCB substrate 13 are cut to the required sizes. Then, a mask is used to expose them using an ultraviolet exposure machine, and single-sided etching is used to form electrical traces and via anti-copper areas. After roughening the copper surfaces of the first PCB substrate 11, the second PCB substrate 12, and the third PCB substrate 13, a groove is formed in the second PCB substrate 12 to enclose the buried components 4. Then, the first PCB substrate 11, the second PCB substrate 12, and the third PCB substrate 13 are laminated by high-temperature lamination. Then, a mask is used to expose them using an ultraviolet exposure machine again. After exposure, chemical etching is performed. Then, a drilling tool is used to set connection vias on the multi-layer PCB substrate, so that the first PCB substrate 11 with buried components 4, the second PCB substrate 12 with a groove, and the third PCB substrate 13 with bare chips 2 and surface components 3 are laminated into a whole, thus improving the three-dimensional integration of the frequency conversion module, making the circuit layout more convenient, the whole frequency conversion module small in size, suitable for various narrow working places, sealing the leads inside the frequency conversion module, the leads not being easily affected by moisture, pollutants, etc., with stable connection and no short-circuit failure.

[0039] In one embodiment, the three-dimensional integrated frequency conversion module further includes a plastic encapsulant 7 covering the upper surface of the PCB substrate 1. The height and area of the plastic encapsulant 7 are used to cover all the bare chips 2 and surface components 3 to achieve plastic encapsulation protection.

[0040] In this embodiment, the three-dimensional integrated frequency conversion module further includes a plastic encapsulant 7 covering the upper surface of the PCB substrate 1. The height and area of the plastic encapsulant 7 are used to cover all the bare chips 2 and surface components 3 to achieve plastic encapsulation protection. A dense insulating epoxy potting glue can be used to pot the three-dimensional stacked circuit substrates as a whole, and then the glue is cured according to the glue curing conditions, so that all components, leads, and interconnections are wrapped by the glue and form a whole. During the potting process, the potting height of the glue needs to exactly reach the same level as the lead layer substrate, ensuring that the final internal structure of the circuit is protected by the potting glue without contaminating the leads with the glue. And when choosing the potting glue, it is necessary to choose a variety with a low coefficient of thermal expansion and small internal curing stress as much as possible. Finally, when choosing the glue, the curing temperature and time of the glue cannot be greater than the upper limit that the internal components of the circuit can withstand.

[0041] In this embodiment, the three-dimensional integrated frequency conversion module of the present application forms a frequency conversion module through high-density three-dimensional hybrid integration of a PCB substrate 1, bare chips 2, surface-mounted components 3, and buried components 4. It not only has the functions of chips but also the functions of components, with diverse functions. The planar area of the formed frequency conversion module is greatly reduced, and the design is compact.

[0042] It should be noted that different encapsulant 7 materials can be selected according to different usage scenarios in the embodiments of the present application, and the present application makes no limitations thereto.

[0043] After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily conceive of other embodiments of the present disclosure. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed by the present disclosure. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the following claims.

[0044] It should be understood that the present disclosure is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A frequency conversion module based on three-dimensional integration, characterized in that: The invention comprises a PCB substrate, a bare chip, surface components, embedded components and connecting through holes, wherein the PCB substrate comprises a first PCB substrate, a second PCB substrate and a third PCB substrate, the lower surface of the second PCB substrate is provided with a groove, the groove is used to cover the embedded components welded to the first PCB substrate, the bare chip and the surface components are welded on the upper surface of the third PCB substrate, and the connecting through holes are used to realize signal interconnection among the first PCB substrate, the second PCB substrate and the third PCB.

2. The frequency conversion module based on three-dimensional integration according to claim 1, characterized in that: The lower surface of the PCB substrate is also provided with a plurality of pads for external connection.

3. The frequency conversion module based on three-dimensional integration according to claim 1, characterized in that: The connecting through hole includes a first connecting through hole, a second connecting through hole and a third connecting through hole, the first connecting through hole is used to realize the signal interconnection between the first PCB substrate and the second PCB substrate, the second connecting through hole is used to realize the signal interconnection between the first PCB substrate and the third PCB substrate, and the third connecting through hole is used to realize the signal interconnection between the second PCB substrate and the third PCB substrate.

4. The frequency conversion module based on three-dimensional integration as claimed in claim 3, characterized in that: A layer of copper plating is coated on the surfaces of the first connecting through hole, the second connecting through hole and the third connecting through hole.

5. The frequency conversion module based on three-dimensional integration according to claim 1, characterized in that: The bare chip is connected to the third PCB substrate by gold wire bonding.

6. The frequency conversion module based on three-dimensional integration according to claim 1, characterized in that: The bare chip is a digital bare chip or a radio frequency bare chip.

7. The frequency conversion module based on three-dimensional integration according to claim 1, characterized in that: The length and width of the groove are 0.2 mm larger than the length and width of the embedded component, and the depth of the groove is 0.2 mm larger than the thickness of the embedded component.

8. The frequency conversion module based on three-dimensional integration according to claim 1, characterized in that: The surface components and the embedded components include resistors, inductors and capacitors.

9. The frequency conversion module based on three-dimensional integration according to claim 1, characterized in that: The first PCB substrate, the second PCB substrate and the third PCB substrate are pressed together by high-temperature pressing.

10. The frequency conversion module based on three-dimensional integration according to claim 1, characterized in that: It also includes a plastic sealant covering the upper surface of the PCB substrate, and the height and area of ​​the plastic sealant are used to cover all the bare chips and the surface components to achieve plastic sealing protection.

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