Lora wireless glass breakage monitoring sensor

Abstract

The utility model discloses a Lora wireless glass breakage monitoring sensor, which comprises a lithium battery module, a wireless Lora module, an MEMS microphone signal acquisition module, a vibration switch sensor module, an MCU module, a local alarm state module and a self-checking module, and combines two technologies of audio analysis and vibration detection. The broken glass detector can distinguish glass breaking characteristic sound, carries out waveform analysis on audio signals received by the microphone, compares the audio signals with a memory database, and outputs an alarm signal only when a high-frequency sound signal sent when the glass is broken and vibration caused by knocking the glass are detected at the same time. The sensor is not provided with an external power supply, adopts a battery power supply Lora wireless communication technology, communicates with a power transformation and distribution auxiliary control system, and can realize rapid networking. Related operation parameters of all the glass breakage monitoring sensors and the current state of the glass window can be checked on a system platform.

Description

Technical Field

[0001] The utility model relates to the field of glass breakage detection sensors, in particular to a Lora wireless glass breakage monitoring sensor. Background Technique

[0002] A glass breakage detector is a security device widely used in substations, distribution rooms, shopping malls, factories and other places. It can timely sense the breakage of windows and glass doors, send out alarm signals, and upload the alarm information to the monitoring platform, playing an effective deterrent role.

[0003] The existing glass breakage detectors mainly use a single sound monitoring circuit to monitor glass breakage, which is very easy to cause false alarms due to sounds with frequencies similar to that of glass breakage, such as the sound of closing doors, the sound of fans, the sound of bells, etc. Moreover, the existing glass breakage detectors use active power supply and provide alarm information through switch contacts, and the overall deployment is relatively cumbersome, which not only increases the implementation cost but also affects the beauty of the place. Content of the Utility Model

[0004] The purpose of the utility model is to provide a Lora wireless glass breakage monitoring sensor to solve the problems put forward in the above background technique.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0006] A Lora wireless glass breakage monitoring sensor includes a lithium battery module, a wireless Lora module, a MEMS microphone signal acquisition module, a vibration switch sensor module, an MCU module, a local alarm status module, and a self-check module. The MCU module is connected to the MEMS microphone signal acquisition module, the vibration switch sensor module, the local alarm status module, the self-check module, the lithium battery module, and the wireless Lora module. The wireless Lora module is powered by a lithium battery and connected to the MCU module for monitoring alarm information, uploading alarm information, and battery power.

[0007] Further, the MEMS microphone signal acquisition module includes MEMS microphone P1, capacitor C1, capacitor C2, power supply VCC, capacitor C4, resistor R8, resistor R1, resistor R2, capacitor C5, capacitor C6, resistor R4, chip U1A, chip U1B, capacitor C3, resistor PT1, resistor R6, resistor R3, resistor R9, resistor R10, resistor R7, resistor R5. The models of chip U1A and chip UIB are LMV358. The pin 5 of MEMS microphone P1 is connected to the first ends of capacitor C1 and capacitor C2. The pins 2, 3, and 4 of MEMS microphone P1 are connected to the second ends of capacitor C1 and capacitor C2. The first end of capacitor C2 is connected to power supply VCC, and the second end of capacitor C2 is grounded. The pin 1 of MEMS microphone P1 is connected to the first end of capacitor C4. The second end of capacitor C4 is connected to the first end of resistor R8, and the second end of resistor R8 is grounded. The second end of capacitor C4 is connected to the first end of resistor R1. The second end of resistor R1 is connected to the first end of capacitor C5. The second end of capacitor C5 is connected to pin 1 of chip U1A. The second end of resistor R1 is connected to the first end of resistor R2. The second end of resistor R2 is connected to pin 3 of chip U1A. The second end of resistor R2 is connected to the first end of capacitor C6, and the second end of capacitor C6 is grounded. The first end of resistor R4 is grounded. The second end of resistor R4 is connected to pin 2 of chip U1A. The second end of resistor R4 is connected to the first end of resistor PT1. The second end of resistor PT1 is connected to pin 1 of chip U1A. The pin 4 of chip U1A is grounded. The pin 8 of chip U1A is connected to the first end of capacitor C3, and the second end of capacitor C3 is grounded. The pin 1 of chip U1A is connected to the first end of resistor R6, and the second end of resistor R6 is grounded. The pin 1 of chip U1A is connected to the first end of resistor R3. The second end of resistor R3 is connected to pin 5 of chip U1B. The pin 6 of chip U1B is connected to the first end of resistor R10, and the second end of resistor R10 is grounded. The pin 6 of chip U1B is connected to the first end of resistor R9, and the second end of resistor R9 is connected to power supply VCC. The pin 7 of chip U1B is connected to the first end of resistor R7, and the second end of resistor R7 is grounded. The pin 7 of chip U1B is connected to the first end of resistor R5, and the second end of resistor R5 is connected to the MCU module.

[0008] In the above technical solution, the MEMS microphone collects the sound waves generated by glass breakage, filters out high-frequency interference through a filter, amplifies the signal, and after the amplified signal passes through a comparator, a high level is output to trigger the microcontroller to wake up the microcontroller. At the same time, the amplified audio signal collected is separately introduced to the microcontroller I / O port by an amplifier.

[0009] Further, the vibration switch sensor module includes a vibration sensor P3, a resistor R13, a resistor R15, a capacitor C13, and a power supply VCC. The pin 2 of the vibration sensor P3 is connected to the first end of the resistor R13. The second end of the resistor R13 is connected to the power supply VCC. The pin 1 of the vibration sensor P3 is connected to the first end of the resistor R15. The second end of the resistor R15 is grounded. The pin 1 of the vibration sensor P3 is connected to the first end of the capacitor C13. The second end of the capacitor C13 is grounded. The pin 1 of the vibration sensor P3 is connected to the MCU module.

[0010] In the above technical solution, the vibration switch sensor collects the vibration signal of glass breakage and outputs a high level to trigger the wake-up of the single-chip microcomputer.

[0011] Further, the self-check module includes a resistor R21, a power supply VCC, a capacitor C18, and a button K1. The first end of the resistor R21 is connected to the power supply VCC. The second end of the resistor R21, the first end of the capacitor C18, and the first end of the button K1 are connected to the MCU module. The second end of the capacitor C18 is grounded. The second end of the button K1 is grounded. The local alarm status module includes a local buzzer alarm and an indicator light alarm. The local buzzer alarm includes a resistor R14, a power supply VCC5, an electric bell BP1, a resistor R17, a triode Q1, a capacitor C10, and a polarized capacitor E1. The model of the triode Q1 is SS8550-Y1. The first end of the resistor R14 is connected to the power supply VCC5. The second end of the resistor R14 is connected to the first end of the capacitor C10. The second end of the capacitor C10 is connected to the digital ground. The second end of the resistor R14 is connected to the first end of the polarized capacitor E1. The second end of the polarized capacitor E1 is connected to the digital ground. The second end of the resistor R14 is connected to the first end of the electric bell BP1. The second end of the electric bell BP1 is connected to the collector of the triode Q1. The emitter of the triode Q1 is connected to the digital ground. The base of the triode Q1 is connected to the second end of the resistor R17. The first end of the resistor R17 is connected to the MCU module. The indicator light alarm includes a resistor R16 and a light-emitting diode D1. The first end of the resistor R16 is connected to the first end of the light-emitting diode D1. The second end of the resistor R16 is grounded. The second end of the light-emitting diode D1 is connected to the MCU module.

[0012] In the above technical solution, after pressing the button K1, the sensor can be self-checked to test and verify whether the alarm information is uploaded wirelessly normally and whether the local buzzer and indicator light alarms are normal.

[0013] Further, the lithium battery module includes a battery interface P2, a resistor R11, a power supply VCC, and a resistor R12. The first end of the resistor R11 is connected to the power supply VCC. The second end of the resistor R11 and the second end of the resistor R12 are connected to the MCU module. The first end of the resistor R12 is grounded. For the battery interface P2, the pin 1 and pin 2 of the battery interface P2 are connected to the wireless Lora module. The wireless Lora module includes a communication module U3, a capacitor C17, and a radio frequency connector SMA_EDGE. The model of the communication module U3 is M_GD. The pin 1 of the communication module U3 is connected to the pin 1 of the battery interface P2 in the lithium battery module. The pin 2 of the communication module U3 is connected to the pin 2 of the battery interface P2 in the lithium battery module. The pin 6 of the communication module U3 is connected to the MCU module. The pin 7 of the communication module U3 is connected to the MCU module. The pin 18 of the communication module U3 is grounded. The pin 17 of the communication module U3 is connected to the first end of the capacitor C17. The second end of the capacitor C17 is connected to the first end of the radio frequency connector SMA_EDGE. The second end of the radio frequency connector SMA_EDGE is grounded. The pin 16 of the communication module U3 is grounded.

[0014] In the above technical solution, the lithium battery powers the wireless Lora module, and the sensor can upload the alarm information and battery power through the wireless Lora module when it detects the alarm information.

[0015] Further, the MCU module includes a single-chip microcomputer U2 and an interface SWD1. The model of the single-chip microcomputer U2 is STM32L151C8T6. The interface SWD1 includes a resistor R19 and a resistor R20. The pin 4 of the interface SWD1 is connected to the power supply VCC of the single-chip microcomputer U2. The pin 4 of the interface SWD1 is connected to the first end of the resistor R19. The second end of the resistor R19 is connected to the pin 3 of the interface SWD1. The pin 3 of the interface SWD1 is connected to the pin 34 of the single-chip microcomputer U2. The pin 2 of the interface SWD1 is connected to the pin 37 of the single-chip microcomputer U2. The pin 1 of the interface SWD1 is grounded. The pin 1 of the interface SWD1 is connected to the first end of the resistor R20. The second end of the resistor R20 is connected to the pin 2 of the interface SWD1. The single-chip microcomputer U2 includes a capacitor C8, a capacitor C9, a crystal oscillator Y1, a capacitor C12, a capacitor C14, a crystal oscillator Y2, a resistor R18, a capacitor C15, a capacitor C7, a capacitor C11, a capacitor C16, and a power supply VCC. The pin 3 of the single-chip microcomputer U2 is connected to the first end of the capacitor C8. The second end of the capacitor C8 is grounded. The pin 3 of the single-chip microcomputer U2 is connected to the first end of the crystal oscillator Y1. The second end of the crystal oscillator is connected to the pin 4 of the single-chip microcomputer U2. The pin 4 of the single-chip microcomputer U2 is connected to the first end of the capacitor C9. The second end of the capacitor C9 is grounded. The pin 5 of the single-chip microcomputer U2 is connected to the first end of the capacitor C12. The second end of the capacitor C12 is grounded. The pin 5 of the single-chip microcomputer U2 is connected to the first end of the crystal oscillator Y2. The second end of the crystal oscillator Y2 is connected to the pin 6 of the single-chip microcomputer U2. The first end of the capacitor C14 is connected to the pin 6 of the single-chip microcomputer U2. The second end of the C14 is grounded. The pin 7 of the single-chip microcomputer U2 is connected to the first end of the resistor R18. The second end of the resistor R18 is connected to the power supply VCC. The pin 8 of the single-chip microcomputer U2 is grounded. The pin 9 of the single-chip microcomputer U2 is connected to the power supply VCC. The first end of the capacitor C15 is connected to the pin 9 of the single-chip microcomputer U2. The second end of the capacitor C15 is grounded. The pin 11 of the single-chip microcomputer U2 is connected to the self-check module. The pin 12 of the single-chip microcomputer U2 is connected to the resistor R17 of the local buzzer alarm in the local alarm status module. The pin 20 of the single-chip microcomputer U2 is grounded. The pin 23 of the single-chip microcomputer U2 is grounded. The pin 24 of the single-chip microcomputer U2 is connected to the power supply VCC. The first end of the capacitor C16 is connected to the power supply VCC. The second end of the capacitor C16 is grounded. The pin 36 of the single-chip microcomputer U2 is connected to the power supply VCC. The first end of the capacitor C11 is connected to the power supply VCC. The second end of the capacitor C11 is grounded. The pin 35 of the single-chip microcomputer U2 is grounded. The pin 34 of the single-chip microcomputer U2 is connected to the pin 3 of the interface SWD1. The pin 33 of the single-chip microcomputer U2 is connected to the light-emitting diode D1 in the local indicator alarm. The pin 31 of the single-chip microcomputer U2 is connected to the pin 6 of the communication module U3 in the wireless Lora module.Pin 30 of the single-chip microcomputer U2 is connected to pin 7 of the communication module U3 in the wireless Lora module. Pin 28 of the single-chip microcomputer U2 is connected to resistors R11 and R12 in the lithium battery module. Pin 26 of the single-chip microcomputer U2 is connected to pin 1 of the vibration sensor P3 in the vibration switch sensor module. Pin 25 of the single-chip microcomputer U2 is connected to resistor R5 in the MEMS microphone signal acquisition module. Pin 48 of the single-chip microcomputer U2 is connected to the power supply VCC. The first end of the capacitor C7 is connected to the power supply VCC, and the second end of the capacitor C7 is grounded. Pin 47 of the single-chip microcomputer U2 is grounded. Pin 44 of the single-chip microcomputer U2 is grounded. Pin 37 of the single-chip microcomputer U2 is connected to pin 2 of the interface SWD1.,

[0016] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows: The present utility model combines two technologies of audio analysis and vibration detection. Only when the high-frequency sound signal emitted when the glass is broken and the vibration caused by knocking on the glass are detected simultaneously, an alarm signal is output. Moreover, the glass break detector can distinguish the characteristic sound of glass breaking. It analyzes the audio signal received by the microphone through waveform analysis and compares it with the in-memory database to determine whether to send an alarm signal, which can reduce false alarms and improve the accuracy of alarm; The present utility model has no external power supply and adopts battery-powered Lora wireless communication technology. The product is convenient for on-site deployment, can reduce construction costs, raw material costs such as cable wire troughs, has a high cost performance, and is aesthetically pleasing for on-site deployment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. They are used together with the embodiments of the present utility model to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0018] Figure 1 It is a schematic diagram of the system architecture of a Lora wireless glass break monitoring sensor;

[0019] Figure 2 It is a diagram of the MEMS microphone signal acquisition module of a Lora wireless glass break monitoring sensor;

[0020] Figure 3 It is a diagram of the vibration switch sensor module of a Lora wireless glass break monitoring sensor;

[0021] Figure 4 It is a diagram of the MCU module of a Lora wireless glass break monitoring sensor;

[0022] Figure 5 It is a diagram of the self-check module of a Lora wireless glass break monitoring sensor;

[0023] Figure 6It is a local alarm status module diagram of a LoRa wireless glass breakage monitoring sensor;

[0024] Figure 7 It is a lithium battery module diagram of a LoRa wireless glass breakage monitoring sensor;

[0025] Figure 8 It is a wireless LoRa module diagram of a LoRa wireless glass breakage monitoring sensor. Specific implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0027] Please refer to Figures 1-8 , in the embodiments of the present invention: A LoRa wireless glass breakage monitoring sensor includes a lithium battery module, a wireless LoRa module, a MEMS microphone signal acquisition module, a vibration switch sensor module, an MCU module, a local alarm status module, and a self-check module. The MCU module is connected to the MEMS microphone signal acquisition module, the vibration switch sensor module, the local alarm status module, the self-check module, the lithium battery module, and the wireless LoRa module. The wireless LoRa module is powered by a lithium battery and connected to the MCU module for monitoring alarm information, uploading alarm information, and battery power.

[0028] The MEMS microphone signal acquisition module includes MEMS microphone P1, capacitor C1, capacitor C2, power supply VCC, capacitor C4, resistor R8, resistor R1, resistor R2, capacitor C5, capacitor C6, resistor R4, chip U1A, chip U1B, capacitor C3, resistor PT1, resistor R6, resistor R3, resistor R9, resistor R10, resistor R7, resistor R5. The models of chip U1A and chip U1B are LMV358. The pin 5 of MEMS microphone P1 is connected to the first ends of capacitor C1 and capacitor C2. The pins 2, 3, and 4 of MEMS microphone P1 are connected to the second ends of capacitor C1 and capacitor C2. The first end of capacitor C2 is connected to power supply VCC, and the second end of capacitor C2 is grounded. The pin 1 of MEMS microphone P1 is connected to the first end of capacitor C4. The second end of capacitor C4 is connected to the first end of resistor R8, and the second end of resistor R8 is grounded. The second end of capacitor C4 is connected to the first end of resistor R1. The second end of resistor R1 is connected to the first end of capacitor C5. The second end of capacitor C5 is connected to pin 1 of chip U1A. The second end of resistor R1 is connected to the first end of resistor R2. The second end of resistor R2 is connected to pin 3 of chip U1A. The second end of resistor R2 is connected to the first end of capacitor C6. The second end of capacitor C6 is grounded. The first end of resistor R4 is grounded. The second end of resistor R4 is connected to pin 2 of chip U1A. The second end of resistor R4 is connected to the first end of resistor PT1. The second end of resistor PT1 is connected to pin 1 of chip U1A. The pin 4 of chip U1A is grounded. The pin 8 of chip U1A is connected to the first end of capacitor C3. The second end of capacitor C3 is grounded. The pin 1 of chip U1A is connected to the first end of resistor R6. The second end of resistor R6 is grounded. The pin 1 of chip U1A is connected to the first end of resistor R3. The second end of resistor R3 is connected to pin 5 of chip U1B. The pin 6 of chip U1B is connected to the first end of resistor R10. The second end of resistor R10 is grounded. The pin 6 of chip U1B is connected to the first end of resistor R9. The second end of resistor R9 is connected to power supply VCC. The pin 7 of chip U1B is connected to the first end of resistor R7. The second end of resistor R7 is grounded. The pin 7 of chip U1B is connected to the first end of resistor R5. The second end of resistor R5 is connected to the MCU module.

[0029] The MEMS microphone collects the sound waves generated by glass breakage. After filtering out high-frequency interference through a filter, the signal is amplified. The amplified signal outputs a high level to the single-chip microcomputer through a comparator to trigger the wake-up of the single-chip microcomputer. At the same time, the amplified audio signal collected is separately introduced to the I / O port of the single-chip microcomputer by an amplifier.

[0030] The vibration switch sensor module includes a vibration sensor P3, a resistor R13, a resistor R15, a capacitor C13, and a power supply VCC. The pin 2 of the vibration sensor P3 is connected to the first end of the resistor R13, the second end of the resistor R13 is connected to the power supply VCC, the pin 1 of the vibration sensor P3 is connected to the first end of the resistor R15, the second end of the resistor R15 is grounded, the pin 1 of the vibration sensor P3 is connected to the first end of the capacitor C13, the second end of the capacitor C13 is grounded, and the pin 1 of the vibration sensor P3 is connected to the MCU module.

[0031] The vibration switch sensor collects the vibration signal of glass breakage and outputs a high level to trigger the wake-up of the single-chip microcomputer.

[0032] The self-check module includes a resistor R21, a power supply VCC, a capacitor C18, and a button K1. The first end of the resistor R21 is connected to the power supply VCC, the second end of the resistor R21, the first end of the capacitor C18, and the first end of the button K1 are connected to the MCU module, the second end of the capacitor C18 is grounded, and the second end of the button K1 is grounded. The local alarm status module includes a local buzzer alarm and an indicator light alarm. The local buzzer alarm includes a resistor R14, a power supply VCC5, an electric bell BP1, a resistor R17, a triode Q1, a capacitor C10, and a polarized capacitor E1. The model of the triode Q1 is SS8550-Y1. The first end of the resistor R14 is connected to the power supply VCC5, the second end of the resistor R14 is connected to the first end of the capacitor C10, the second end of the capacitor C10 is connected to the digital ground, the second end of the resistor R14 is connected to the first end of the polarized capacitor E1, the second end of the polarized capacitor E1 is connected to the digital ground, the second end of the resistor R14 is connected to the first end of the electric bell BP1, the second end of the electric bell BP1 is connected to the collector of the triode Q1, the emitter of the triode Q1 is connected to the digital ground, the base of the triode Q1 is connected to the second end of the resistor R17, and the first end of the resistor R17 is connected to the MCU module. The indicator light alarm includes a resistor R16 and a light-emitting diode D1. The first end of the resistor R16 is connected to the first end of the light-emitting diode D1, the second end of the resistor R16 is grounded, and the second end of the light-emitting diode D1 is connected to the MCU module.

[0033] After pressing the button K1, the sensor can be self-checked to test and verify whether the alarm information is uploaded wirelessly normally and whether the local buzzer and indicator light alarms are normal.

[0034] The lithium battery module includes a battery interface P2, a resistor R11, a power supply VCC, and a resistor R12. The first end of the resistor R11 is connected to the power supply VCC, the second end of the resistor R11, the second end of the resistor R12 are connected to the MCU module, the first end of the resistor R12 is grounded, the battery interface P2, the pins of the battery interface P2 and pin 2 are connected to the wireless Lora module. The wireless Lora module includes a communication module U3, a capacitor C17, and a radio frequency connector SMA_EDGE. The model of the communication module U3 is M_GD. Pin 1 of the communication module U3 is connected to pin 1 of the battery interface P2 in the lithium battery module, pin 2 of the communication module U3 is connected to pin 2 of the battery interface P2 in the lithium battery module, pin 6 of the communication module U3 is connected to the MCU module, pin 7 of the communication module U3 is connected to the MCU module, pin 18 of the communication module U3 is grounded, pin 17 of the communication module U3 is connected to the first end of the capacitor C17, the second end of the capacitor C17 is connected to the first end of the radio frequency connector SMA_EDGE, the second end of the radio frequency connector SMA_EDGE is grounded, and pin 16 of the communication module U3 is grounded.

[0035] The lithium battery powers the wireless Lora module, and the sensor can upload the alarm information and battery power through the wireless Lora module when it detects the alarm information.

[0036] The MCU module includes the microcontroller U2 and the interface SWD1. The model of the microcontroller U2 is STM32L151C8T6. The interface SWD1 includes the resistor R19 and the resistor R20. The pin 4 of the interface SWD1 is connected to the power supply VCC of the microcontroller U2. The pin 4 of the interface SWD1 is connected to the first end of the resistor R19. The second end of the resistor R19 is connected to the pin 3 of the interface SWD1. The pin 3 of the interface SWD1 is connected to the pin 34 of the microcontroller U2. The pin 2 of the interface SWD1 is connected to the pin 37 of the microcontroller U2. The pin 1 of the interface SWD1 is grounded. The pin 1 of the interface SWD1 is connected to the first end of the resistor R20. The second end of the resistor R20 is connected to the pin 2 of the interface SWD1. The microcontroller U2 includes the capacitor C8, the capacitor C9, the crystal oscillator Y1, the capacitor C12, the capacitor C14, the crystal oscillator Y2, the resistor R18, the capacitor C15, the capacitor C7, the capacitor C11, the capacitor C16, and the power supply VCC. The pin 3 of the microcontroller U2 is connected to the first end of the capacitor C8. The second end of the capacitor C8 is grounded. The pin 3 of the microcontroller U2 is connected to the first end of the crystal oscillator Y1. The second end of the crystal oscillator is connected to the pin 4 of the microcontroller U2. The pin 4 of the microcontroller U2 is connected to the first end of the capacitor C9. The second end of the capacitor C9 is grounded. The pin 5 of the microcontroller U2 is connected to the first end of the capacitor C12. The second end of the capacitor C12 is grounded. The pin 5 of the microcontroller U2 is connected to the first end of the crystal oscillator Y2. The second end of the crystal oscillator Y2 is connected to the pin 6 of the microcontroller U2. The first end of the capacitor C14 is connected to the pin 6 of the microcontroller U2. The second end of C14 is grounded. The pin 7 of the microcontroller U2 is connected to the first end of the resistor R18. The second end of the resistor R18 is connected to the power supply VCC. The pin 8 of the microcontroller U2 is grounded. The pin 9 of the microcontroller U2 is connected to the power supply VCC. The first end of the capacitor C15 is connected to the pin 9 of the microcontroller U2. The second end of the capacitor C15 is grounded. The pin 11 of the microcontroller U2 is connected to the self-check module. The pin 12 of the microcontroller U2 is connected to the resistor R17 of the local buzzer alarm in the local alarm status module. The pin 20 of the microcontroller U2 is grounded. The pin 23 of the microcontroller U2 is grounded. The pin 24 of the microcontroller U2 is connected to the power supply VCC. The first end of the capacitor C16 is connected to the power supply VCC. The second end of the capacitor C16 is grounded. The pin 36 of the microcontroller U2 is connected to the power supply VCC. The first end of the capacitor C11 is connected to the power supply VCC. The second end of the capacitor C11 is grounded. The pin 35 of the microcontroller U2 is grounded. The pin 34 of the microcontroller U2 is connected to the pin 3 of the interface SWD1. The pin 33 of the microcontroller U2 is connected to the light-emitting diode D1 in the local indicator alarm. The pin 31 of the microcontroller U2 is connected to the pin 6 of the communication module U3 in the wireless Lora module. The pin 30 of the microcontroller U2 is connected to the pin 7 of the communication module U3 in the wireless Lora module. The pin 28 of the microcontroller U2 is connected to the resistor R11 and the resistor R12 in the lithium battery module. The pin 26 of the microcontroller U2 is connected to the pin 1 of the vibration sensor P3 in the vibration switch sensor module.Pin 25 of the single-chip microcomputer U2 is connected to resistor R5 in the MEMS microphone signal acquisition module. Pin 48 of the single-chip microcomputer U2 is connected to the power supply VCC. The first end of capacitor C7 is connected to the power supply VCC, and the second end of capacitor C7 is grounded. Pin 47 of the single-chip microcomputer U2 is grounded. Pin 44 of the single-chip microcomputer U2 is grounded. Pin 37 of the single-chip microcomputer U2 is connected to pin 2 of interface SWD1.,

[0037] The working principle of the present utility model is as follows: The MEMS microphone collects the sound waves generated by glass breaking. After filtering out high-frequency interference through a filter, the signal is amplified. The amplified signal outputs a high level to the single-chip microcomputer through a comparator to trigger the wake-up of the single-chip microcomputer. At the same time, the collected and amplified audio signal is separately introduced to the I / O port of the single-chip microcomputer by an amplifier. The vibration switch sensor collects the vibration signal of glass breaking and outputs a high level to trigger the wake-up of the single-chip microcomputer. The single-chip microcomputer simultaneously collects the vibration and audio signals with a certain amplitude, and only when the waveform characteristics recognized by the AD acquisition are correct will it send out an alarm signal. The device is powered by a lithium battery. The single-chip microcomputer is usually in a sleep state, and only when the microphone sensor and the vibration sensor collect signals will it trigger the wake-up of the single-chip microcomputer. And after detecting the alarm signal, the alarm information and the battery power are uploaded through the wireless Lora module. When the button K1 is pressed, it can be tested to verify whether the wireless upload of the alarm information is normal and whether the local buzzer and indicator alarm are normal.,

[0038] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.,

[0039] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.,

Claims

1. A Lora wireless glass breakage monitoring sensor, characterized in that: The sensor includes a lithium battery module, a wireless Lora module, a MEMS microphone signal acquisition module, a vibration switch sensor module, an MCU module, a local alarm status module, and a self-test module. The MCU module is connected to the MEMS microphone signal acquisition module, the vibration switch sensor module, the local alarm status module, the self-test module, the lithium battery module, and the wireless Lora module. The wireless Lora module is powered by a lithium battery and connected to the MCU module for monitoring alarm information and uploading alarm information and battery power.

2. The Lora wireless glass breakage monitoring sensor according to claim 1 is characterized in that: The MEMS microphone signal acquisition module includes a MEMS microphone P1, a capacitor C1, a capacitor C2, a power supply VCC, a capacitor C4, a resistor R8, a resistor R1, a resistor R2, a capacitor C5, a capacitor C6, a resistor R4, a chip U1A, a chip U1B, a capacitor C3, a resistor PT1, a resistor R6, a resistor R3, a resistor R9, a resistor R10, a resistor R7, and a resistor R5. The model of the chip U1A and the chip UIB is LMV358. The pin 5 of the MEMS microphone P1 is connected to the first end of the capacitor C1 and the first end of the capacitor C2. The pin 2 of the MEMS microphone P1 is connected to the first end of the capacitor C1 and the first end of the capacitor C2. , pin 3, and pin 4 are connected to the second end of capacitor C1 and the second end of capacitor C2, the first end of capacitor C2 is connected to power supply VCC, the second end of capacitor C2 is grounded, pin 1 of MEMS microphone P1 is connected to the first end of capacitor C4, the second end of capacitor C4 is connected to the first end of resistor R8, the second end of resistor R8 is grounded, the second end of capacitor C4 is connected to the first end of resistor R1, the second end of resistor R1 is connected to the first end of capacitor C5, the second end of capacitor C5 is connected to pin 1 of chip U1A, the second end of resistor R1 is connected to the first end of resistor R2, and the second end of capacitor C5 is connected to pin 1 of chip U1A. The second end of the resistor R2 is connected to the pin 3 of the chip U1A, the second end of the resistor R2 is connected to the first end of the capacitor C6, the second end of the capacitor C6 is grounded, the first end of the resistor R4 is grounded, the second end of the resistor R4 is connected to the pin 2 of the chip U1A, the second end of the resistor R4 is connected to the first end of the resistor PT1, the second end of the resistor PT1 is connected to the pin 1 of the chip U1A, the pin 4 of the chip U1A is grounded, the pin 8 of the chip U1A is connected to the first end of the capacitor C3, the second end of the capacitor C3 is grounded, the pin 1 of the chip U1A is connected to the first end of the resistor R6, and the The second end of the resistor R6 is grounded, the pin 1 of the chip U1A is connected to the first end of the resistor R3, the second end of the resistor R3 is connected to the pin 5 of the chip U1B, the pin 6 of the chip U1B is connected to the first end of the resistor R10, the second end of the resistor R10 is grounded, the pin 6 of the chip U1B is connected to the first end of the resistor R9, the second end of the resistor R9 is connected to the power supply VCC, the pin 7 of the chip U1B is connected to the first end of the resistor R7, the second end of the resistor R7 is grounded, the pin 7 of the chip U1B is connected to the first end of the resistor R5, and the second end of the resistor R5 is connected to the MCU module.

3. The Lora wireless glass breakage monitoring sensor according to claim 1 is characterized in that: The vibration switch sensor module includes a vibration sensor P3, a resistor R13, a resistor R15, a capacitor C13, and a power supply VCC. Pin 2 of the vibration sensor P3 is connected to a first end of the resistor R13, a second end of the resistor R13 is connected to a power supply VCC, a pin 1 of the vibration sensor P3 is connected to a first end of the resistor R15, a second end of the resistor R15 is grounded, a pin 1 of the vibration sensor P3 is connected to a first end of the capacitor C13, a second end of the capacitor C13 is grounded, and a pin 1 of the vibration sensor P3 is connected to an MCU module.

4. The Lora wireless glass breakage monitoring sensor according to claim 1 is characterized in that: The self-test module includes a resistor R21, a power supply VCC, a capacitor C18, and a button K1. The first end of the resistor R21 is connected to the power supply VCC, the second end of the resistor R21, the first end of the capacitor C18, and the first end of the button K1 are connected to the MCU module, the second end of the capacitor C18 is grounded, and the second end of the button K1 is grounded.

5. The Lora wireless glass breakage monitoring sensor according to claim 1 is characterized in that: The local alarm status module includes a local buzzer alarm and an indicator light alarm. The local buzzer alarm includes a resistor R14, a power supply VCC5, a bell BP1, a resistor R17, a transistor Q1, a capacitor C10, and a polarized capacitor E1. The model of the transistor Q1 is SS8550-Y1. The first end of the resistor R14 is connected to the power supply VCC5, the second end of the resistor R14 is connected to the first end of the capacitor C10, the second end of the capacitor C10 is connected to the digital ground, the second end of the resistor R14 is connected to the first end of the polarized capacitor E1, and the polarized capacitor E1 is connected to the digital ground. The second end of the resistor R14 is connected to the first end of the bell BP1, the second end of the bell BP1 is connected to the collector of the transistor Q1, the emitter of the transistor Q1 is connected to the digital ground, the base of the transistor Q1 is connected to the second end of the resistor R17, the first end of the resistor R17 is connected to the MCU module, the indicator alarm includes a resistor R16 and a light emitting diode D1, the first end of the resistor R16 is connected to the first end of the light emitting diode D1, the second end of the resistor R16 is grounded, and the second end of the light emitting diode D1 is connected to the MCU module.

6. The Lora wireless glass breakage monitoring sensor according to claim 1 is characterized by: The lithium battery module includes a battery interface P2, a resistor R11, a power supply VCC, and a resistor R12. The first end of the resistor R11 is connected to the power supply VCC, the second end of the resistor R11 and the second end of the resistor R12 are connected to the MCU module, the first end of the resistor R12 is grounded, the battery interface P2, and the pin of the battery interface P2 and pin 2 are connected to the wireless Lora module.

7. The Lora wireless glass breakage monitoring sensor according to claim 1 is characterized by: The wireless Lora module includes a communication module U3, a capacitor C17, and a radio frequency connector SMA_EDGE. The model of the communication module U3 is M_GD. Pin 1 of the communication module U3 is connected to pin 1 of the battery interface P2 in the lithium battery module, pin 2 of the communication module U3 is connected to pin 2 of the battery interface P2 in the lithium battery module, pin 6 of the communication module U3 is connected to the MCU module, pin 7 of the communication module U3 is connected to the MCU module, pin 18 of the communication module U3 is grounded, pin 17 of the communication module U3 is connected to the first end of the capacitor C17, the second end of the capacitor C17 is connected to the first end of the radio frequency connector SMA_EDGE, the second end of the radio frequency connector SMA_EDGE is grounded, and pin 16 of the communication module U3 is grounded.

8. The Lora wireless glass breakage monitoring sensor according to claim 1 is characterized by: The MCU module includes a single-chip microcomputer U2 and an interface SWD1. The model of the single-chip microcomputer U2 is STM32L151C8T6. The interface SWD1 includes a resistor R19 and a resistor R20. Pin 4 of the interface SWD1 is connected to the power supply VCC of the single-chip microcomputer U2. Pin 4 of the interface SWD1 is connected to the first end of the resistor R19. The second end of the resistor R19 is connected to pin 3 of the interface SWD1. Pin 3 of the interface SWD1 is connected to pin 34 of the single-chip microcomputer U2. Pin 2 of the interface SWD1 is connected to pin 37 of the single-chip microcomputer U2. Pin 1 of the interface SWD1 is grounded. Pin 1 of the interface SWD1 is connected to the first end of the resistor R20. The second end of the resistor R20 is connected to pin 3 of the interface SWD1. The second end is connected to pin 2 of interface SWD1, and the single-chip computer U2 includes capacitor C8, capacitor C9, crystal oscillator Y1, capacitor C12, capacitor C14, crystal oscillator Y2, resistor R18, capacitor C15, capacitor C7, capacitor C11, capacitor C16, and power supply VCC. Pin 3 of the single-chip computer U2 is connected to the first end of capacitor C8, and the second end of capacitor C8 is grounded. Pin 3 of the single-chip computer U2 is connected to the first end of crystal oscillator Y1, and the second end of the crystal oscillator is connected to pin 4 of the single-chip computer U2. Pin 4 of the single-chip computer U2 is connected to the first end of capacitor C9, and the second end of capacitor C9 is grounded. Pin 5 of the single-chip computer U2 is connected to the first end of capacitor C12, and the second end of capacitor C12 is grounded. Pin 5 of the single-chip microcomputer U2 is connected to the first end of the crystal oscillator Y2, the second end of the crystal oscillator Y2 is connected to pin 6 of the single-chip microcomputer U2, the first end of the capacitor C14 is connected to pin 6 of the single-chip microcomputer U2, the second end of C14 is grounded, the pin 7 of the single-chip microcomputer U2 is connected to the first end of the resistor R18, the second end of the resistor R18 is connected to the power supply VCC, the pin 8 of the single-chip microcomputer U2 is grounded, the pin 9 of the single-chip microcomputer U2 is connected to the power supply VCC, the first end of the capacitor C15 is connected to pin 9 of the single-chip microcomputer U2, the second end of the capacitor C15 is grounded, the pin 11 of the single-chip microcomputer U2 is connected to the self-test module, and the pin 12 of the single-chip microcomputer U2 is connected to the resistor R1 of the local buzzer alarm in the local alarm status module 7. Pin 20 of the single-chip microcomputer U2 is grounded, pin 23 of the single-chip microcomputer U2 is grounded, pin 24 of the single-chip microcomputer U2 is connected to power supply VCC, a first end of the capacitor C16 is connected to power supply VCC, a second end of the capacitor C16 is grounded, pin 36 of the single-chip microcomputer U2 is connected to power supply VCC, a first end of the capacitor C11 is connected to power supply VCC, a second end of the capacitor C11 is grounded, pin 35 of the single-chip microcomputer U2 is grounded, pin 34 of the single-chip microcomputer U2 is connected to pin 3 of interface SWD1, pin 33 of the single-chip microcomputer U2 is connected to light-emitting diode D1 in the local indicator alarm, pin 31 of the single-chip microcomputer U2 is connected to pin 6 of the communication module U3 in the wireless Lora module,Pin 30 of the single-chip microcomputer U2 is connected to pin 7 of the communication module U3 in the wireless Lora module, pin 28 of the single-chip microcomputer U2 is connected to resistors R11 and R12 in the lithium battery module, pin 26 of the single-chip microcomputer U2 is connected to pin 1 of the vibration sensor P3 in the vibration switch sensor module, pin 25 of the single-chip microcomputer U2 is connected to resistor R5 in the MEMS microphone signal acquisition module, pin 48 of the single-chip microcomputer U2 is connected to the power supply VCC, the first end of the capacitor C7 is connected to the power supply VCC, the second end of the capacitor C7 is grounded, pin 47 of the single-chip microcomputer U2 is grounded, pin 44 of the single-chip microcomputer U2 is grounded, and pin 37 of the single-chip microcomputer U2 is connected to pin 2 of the interface SWD1. ,

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