Printed circuit board (PCB) of formation clamp

Abstract

The utility model belongs to the technical field of batteries, and particularly relates to a PCB (printed circuit board) of a formation clamp, which comprises a substrate, a first conducting layer and a second conducting layer, the first conducting layer and the second conducting layer are arranged on the substrate side by side along the length direction of the substrate, an insulating part is arranged on the first conducting layer and / or the second conducting layer, and the insulating part is arranged on the first conducting layer and / or the second conducting layer. The insulating part extends along the length direction of the substrate; therefore, when the battery cell is placed or removed from the formation clamp, the insulating part can separate the positive and negative tabs of the battery cell from the positive and negative electrodes of the PCB, so that the positive and negative tabs of the battery cell are prevented from mistakenly touching the positive and negative electrodes of the PCB, namely the positive and negative tabs of the battery cell are prevented from being simultaneously contacted with the first conductive layer or the second conductive layer; or the first conductive layer and the second conductive layer are prevented from simultaneously contacting with one of positive and negative tabs of the battery cell, so that the short circuit of the battery cell is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of batteries, and particularly relates to a PCB board of a formation fixture. Background Art

[0002] A PCB (Printed Circuit Board), whose Chinese name is printed circuit board and also known as printed wiring board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board.

[0003] During the battery formation process, when the battery cell is placed or removed from the formation fixture, the positive and negative electrode tabs of the battery cell are prone to miscontact with the positive and negative electrodes of the PCB board of the formation fixture, thus triggering a short-circuit risk. Especially when the positive and negative electrode tabs of the battery cell are designed to be wide and the distance between them is narrow, this short-circuit risk will increase significantly. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a PCB board of a formation fixture in view of the deficiencies of the prior art, and solve the technical problem that when the battery cell is placed or removed from the formation fixture in the prior art, the positive and negative electrode tabs of the battery cell are prone to miscontact with the positive and negative electrodes of the PCB board in the formation fixture, thus triggering a short-circuit risk.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The PCB board of the formation fixture includes a substrate, a first conductive layer and a second conductive layer. Along the length direction of the substrate, the first conductive layer and the second conductive layer are arranged side by side on the substrate, and an insulating member is arranged on the first conductive layer and / or the second conductive layer, and the insulating member extends along the length direction of the substrate.

[0007] Preferably, a groove is arranged on the first conductive layer and / or the second conductive layer, the bottom of the groove extends to the substrate, the insulating member is arranged in the groove, and the insulating member partially protrudes from the surface of the first conductive layer and / or the second conductive layer.

[0008] Preferably, the insulating member is an elastic member;

[0009] Or, an elastic member is arranged at the bottom of the insulating member;

[0010] Wherein, when the elastic member is in a compressed state, the upper surface of the insulating member is flush with the upper surface of the first conductive layer and / or the upper surface of the second conductive layer.

[0011] Preferably, when the insulating member is disposed on the first conductive layer, the length of the insulating member is greater than or equal to the length of the first conductive layer;

[0012] When the insulating member is disposed on the second conductive layer, the length of the insulating member is greater than or equal to the length of the second conductive layer;

[0013] When the insulating member is disposed on the first conductive layer and the second conductive layer, the insulating member includes a first insulating portion and a second insulating portion, the first insulating portion is located on the first conductive layer, and the second insulating portion is located on the second conductive layer;

[0014] The first insulating part and the second insulating part are an integrally formed structure or a split structure.

[0015] Preferably, along the length direction of the substrate, the edge of the upper surface of the insulating member is configured to be rounded, and the radius of the rounded corner is 4-6 mm.

[0016] Preferably, the insulating member is polyetheretherketone, glass fiber cloth or epoxy resin.

[0017] Preferably, the distance between the first conductive layer and the second conductive layer is 1-5 mm.

[0018] Preferably, the length of the first conductive layer is shorter than the length of the second conductive layer.

[0019] Preferably, the first conductive layer includes a plurality of first gold fingers spaced apart along the length direction of the substrate, and the second conductive layer includes a plurality of second gold fingers spaced apart along the length direction of the substrate.

[0020] Preferably, it also includes a first insulating layer and a second insulating layer, the first insulating layer and the second insulating layer are both arranged on the substrate, the first insulating layer, the first conductive layer and the second conductive layer are located on the same side, and the first insulating layer is arranged around the first conductive layer and the second conductive layer, and the second insulating layer is arranged on the side of the substrate away from the first conductive layer and the second conductive layer.

[0021] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0022] The PCB board of the formation fixture of the embodiment of the utility model is used in combination with a substrate, a first conductive layer and a second conductive layer. The first conductive layer and the second conductive layer are arranged on the substrate along the length direction of the substrate. By arranging an insulating member on the first conductive layer and / or the second conductive layer, the insulating member extends along the length direction of the substrate, so that when the battery cell is placed or removed from the formation fixture, the insulating member can effectively separate the positive and negative pole ears of the battery cell from contacting the positive and negative electrodes of the PCB board, thereby avoiding the positive and negative pole ears of the battery cell from accidentally touching the positive and negative electrodes of the PCB board, that is, avoiding the positive and negative pole ears of the battery cell from contacting the first conductive layer or the second conductive layer at the same time, or avoiding the first conductive layer and the second conductive layer from contacting one of the positive and negative pole ears of the battery cell at the same time, thereby avoiding a short circuit of the battery cell.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 This is one of the structural schematic diagrams of the utility model.

[0026] Figure 2 for Figure 1 Schematic diagram of the enlarged structure at M in the middle.

[0027] Figure 3 This is one of the partial cross-sectional structural schematic diagrams of the utility model.

[0028] Figure 4 This is the second schematic diagram of the partial cross-sectional structure of the utility model.

[0029] Figure 5 This is the third schematic diagram of the partial cross-sectional structure of the utility model.

[0030] Figure 6 This is the second structural schematic diagram of the present utility model.

[0031] Figure 7 This is the third structural diagram of the present utility model.

[0032] Figure 8 This is the fourth structural diagram of the present utility model.

[0033] Figure 9This is the fifth structural schematic diagram of the present utility model.

[0034] Figure 10 This is the sixth structural schematic diagram of the present utility model.

[0035] Figure 11 This is the seventh structural schematic diagram of the present utility model.

[0036] Among them, the description of the reference numerals is as follows:

[0037] 100, PCB board;

[0038] 10, substrate;

[0039] 20, first conductive layer; 21, first gold finger;

[0040] 30, second conductive layer; 31, second gold finger;

[0041] 40, insulating member; 41, first insulating portion; 42, second insulating portion; 43, rounded corner;

[0042] 50, groove;

[0043] 60, elastic member;

[0044] 70, first insulating layer;

[0045] 80, second insulating layer;

[0046] A, length direction of the substrate; p, length of the insulating member; n, length of the first conductive layer; h, length of the second conductive layer. Detailed implementation manners

[0047] As used in the specification and claims, certain terms are used to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in names as a way to distinguish components, but use the difference in functions of components as the criterion for distinction. As mentioned throughout the specification and claims, "comprising" is an open-ended term and should be interpreted as "including but not limited to". "Substantially" means within an acceptable error range, and those skilled in the art can solve technical problems within a certain error range and basically achieve the technical effect.

[0048] In addition, terms such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0049] In a utility model, unless otherwise clearly specified and defined, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0050] The following will combine with the attached Figures 1 to 11 The technical solutions in the embodiments of the present utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0051] Battery formation is an important link in the battery manufacturing process, mainly involving the process of charging the battery with a small current. Its main purpose is to form a protective film, namely the SEI (solid electrolyte interface) film, on the surfaces of the positive and negative electrodes. The quality of this film directly affects the performance and lifespan of the battery.

[0052] During the battery formation process, the positive and negative electrode tabs of the battery cell are in corresponding contact with the positive and negative electrodes of the PCB board 100 of the formation fixture, that is, the positive electrode tab of the battery cell is in contact with the positive electrode of the PCB board 100, and the negative electrode tab of the battery cell is in contact with the negative electrode of the PCB board 100 to ensure the charging and discharging of the battery cell. However, the inventor found that the PCB board 100 of the formation fixture is vertically arranged, that is, the positive electrode of the PCB board 100 is above the negative electrode, or the negative electrode of the PCB board 100 is above the positive electrode. And since the battery cell will be placed into the formation fixture from top to bottom or removed from the formation fixture from bottom to top, this makes it easy for the positive and negative electrode tabs of the battery cell to come into miscontact with the positive and negative electrodes of the PCB board 100, thereby triggering a short - circuit risk. Such miscontact may be that the positive and negative electrode tabs of the battery cell simultaneously come into contact with the same polarity of the PCB board 100, or the positive and negative electrodes of the PCB board 100 simultaneously come into contact with one of the positive and negative electrode tabs of the battery cell. Both of these situations may lead to the short - circuit of the battery cell, thereby affecting the safety and performance of the battery.

[0053] In view of this, please refer to Figures 1 to 11 , the PCB board 100 of the formation fixture in the embodiment of the present utility model includes a substrate 10, a first conductive layer 20, and a second conductive layer 30. Along the length direction A of the substrate 10, the first conductive layer 20 and the second conductive layer 30 are arranged side by side on the substrate 10, an insulating member 40 is provided on the first conductive layer 20 and / or the second conductive layer 30, and the insulating member 40 extends along the length direction A of the substrate 10.

[0054] Compared with the prior art, for the PCB board 100 of the formation fixture in the embodiments of the present utility model, through the combined use of the substrate 10, the first conductive layer 20, and the second conductive layer 30, the first conductive layer 20 and the second conductive layer 30 are arranged on the substrate 10 along the length direction A of the substrate 10. By arranging the insulating member 40 on the first conductive layer 20 and / or the second conductive layer 30, and the insulating member 40 extends along the length direction A of the substrate 10, when the battery cell is placed or removed from the formation fixture, the insulating member 40 can effectively separate the positive and negative electrode tabs of the battery cell from the positive and negative electrodes of the PCB board 100, thereby avoiding the accidental contact between the positive and negative electrode tabs of the battery cell and the positive and negative electrodes of the PCB board 100, that is, avoiding the simultaneous contact of the positive and negative electrode tabs of the battery cell with the first conductive layer 20 or the second conductive layer 30, or avoiding the simultaneous contact of the first conductive layer 20 and the second conductive layer 30 with one of the positive and negative electrode tabs of the battery cell, and further avoiding the short circuit of the battery cell.

[0055] Please refer to Figures 1 to 5 , in some embodiments, a groove 50 is provided on the first conductive layer 20 and / or the second conductive layer 30, the bottom of the groove 50 extends to the substrate 10, the insulating member 40 is arranged in the groove 50, and the insulating member 40 partially protrudes from the surface of the first conductive layer 20 and / or the second conductive layer 30. Through the arrangement of the groove 50, the insulating member 40 is arranged in the groove 50 of the first conductive layer 20 and / or the groove 50 of the second conductive layer 30, and the insulating member 40 partially protrudes from the surface of the first conductive layer 20 and / or the second conductive layer 30, which effectively ensures that when the battery cell is placed or removed from the formation fixture, the insulating member 40 can separate the positive and negative electrode tabs of the battery cell from the positive and negative electrodes of the PCB board 100. At the same time, it can also improve the space utilization rate.

[0056] Please refer to Figures 1 to 5 , in some embodiments, the insulating member 40 is an elastic member 60; or, an elastic member 60 is provided at the bottom of the insulating member 40; wherein, when the elastic member 60 is in a compressed state, the upper surface of the insulating member 40 is flush with the upper surface of the first conductive layer 20 and / or the upper surface of the second conductive layer 30. Through the arrangement of the elastic member 60, when the battery cell is charged and discharged, the formation fixture will clamp the battery cell, and the insulating member 40 is subjected to the pressure of the formation fixture. Since the insulating member 40 itself has elasticity or an elastic member 60 is provided at the bottom of the insulating member 40, under the action of the pressure, the insulating member 40 or the elastic member 60 can undergo a certain elastic deformation, and this elastic deformation makes the upper surface of the insulating member 40 flush with the upper surface of the first conductive layer 20 and / or the upper surface of the second conductive layer 30, so as to ensure the contact area between the positive and negative electrode tabs of the battery cell and the positive and negative electrodes of the PCB board 100 during the charging and discharging process of the battery cell, and ensure the stability of the charging and discharging during the formation of the battery cell.

[0057] Please refer to Figures 1 to 2 and Figures 6 to 10 In some embodiments, the insulating member 40 may be disposed on the first conductive layer 20, and the insulating member 40 may also be disposed on the second conductive layer 30. Of course, the insulating member 40 may also be disposed on both the first conductive layer 20 and the second conductive layer 30, that is, insulating members 40 are disposed on both the first conductive layer 20 and the second conductive layer 30.

[0058] Further, when the insulating member 40 is disposed on the first conductive layer 20, the length p of the insulating member 40 is greater than or equal to the length n of the first conductive layer 20. At this time, the first conductive layer 20 is located above the second conductive layer 30. By setting the length p of the insulating member 40, if the length p of the insulating member 40 is less than the length n of the first conductive layer 20, at least one end of the first conductive layer 20 is an exposed area where the insulating member 40 is not provided. When the battery cell is placed or removed from the formation jig, the positive and negative electrode tabs of the battery cell may be accidentally contacted with the positive and negative electrodes of the PCB board 100, that is, the positive and negative electrode tabs of the battery cell are likely to contact this area simultaneously, or one of the positive and negative electrode tabs of the battery cell contacts this area and the second conductive layer 30 simultaneously, thereby causing the battery cell to short-circuit. Therefore, making the length p of the insulating member 40 greater than or equal to the length n of the first conductive layer 20 effectively ensures that the insulating member 40 is provided throughout the entire length range of the first conductive layer 20, thereby avoiding accidental contact between the positive and negative electrode tabs of the battery cell and the positive and negative electrodes of the PCB board 100 when the battery cell is placed or removed from the formation jig, and avoiding short-circuit of the battery cell.

[0059] Similarly, when the insulating member 40 is disposed on the second conductive layer 30, the length p of the insulating member 40 is greater than or equal to the length h of the second conductive layer 30. At this time, the second conductive layer 30 is located above the first conductive layer 20. By setting the length p of the insulating member 40, making the length p of the insulating member 40 greater than or equal to the length h of the second conductive layer 30 effectively ensures that the insulating member 40 is provided throughout the entire length range of the second conductive layer 30, thereby avoiding accidental contact between the positive and negative electrode tabs of the battery cell and the positive and negative electrodes of the PCB board 100 when the battery cell is placed or removed from the formation jig, and avoiding short-circuit of the battery cell.

[0060] When the insulating member 40 is disposed on both the first conductive layer 20 and the second conductive layer 30, the insulating member 40 includes a first insulating portion 41 and a second insulating portion 42. The first insulating portion 41 is located on the first conductive layer 20, and the second insulating portion 42 is located on the second conductive layer 30. By using the first insulating portion 41 and the second insulating portion 42 in cooperation, with the first insulating portion 41 located on the first conductive layer 20 and the second insulating portion 42 located on the second conductive layer 30, it effectively ensures that insulating members 40 are provided on both the first conductive layer 20 and the second conductive layer 30.

[0061] Further, the first insulating portion 41 and the second insulating portion 42 are integrally formed structures, that is, the first insulating portion 41 and the second insulating portion 42 are one component. Alternatively, the first insulating portion 41 and the second insulating portion 42 are separate structures, that is, the first insulating portion 41 and the second insulating portion 42 are two separate components.

[0062] It should be noted that when the insulating member 40 is disposed between the first conductive layer 20 and the second conductive layer 30, the length p of the insulating member 40 only needs to be able to prevent the positive and negative electrode tabs of the battery cell from accidentally touching the positive and negative electrodes of the PCB board 100 when the battery cell is placed or removed from the formation fixture.

[0063] Please refer to Figures 1 to 2 , in some embodiments, along the length direction A of the substrate 10, the edge of the upper surface of the insulating member 40 is provided with a rounded corner 43. By providing the rounded corner 43, the surface of the insulating member 40 is effectively made smoother, avoiding the electrode tabs of the battery cell from being scratched when the battery cell is picked up or placed. In addition, since the rounded corner 43 is provided at the edge of the upper surface of the insulating member 40, it can play a guiding role for the positive and negative electrode tabs of the battery cell when the battery cell is picked up or placed.

[0064] Further, the radius of the rounded corner 43 is 4 - 6 mm. For example, the radius of the rounded corner 43 is 4 mm, 4.1 mm, 4.3 mm, 4.6 mm, 4.8 mm, 5 mm, 5.2 mm, 5.5 mm, 5.7 mm, 5.9 mm or 6 mm, but is not limited to the listed values, and other values within the numerical range are equally applicable.

[0065] Preferably, the radius of the rounded corner 43 is 5 mm.

[0066] In some embodiments, the insulating member 40 is polyetheretherketone, fiberglass cloth or epoxy resin.

[0067] Preferably, the insulating member 40 is polyetheretherketone. Since polyetheretherketone has excellent mechanical properties and processability, it can be processed into insulating boards, insulating sheets, etc. of various shapes and sizes to meet different application requirements.

[0068] In some embodiments, in order to optimize the performance of the battery, the electrode tabs of the battery cell are designed to be wider, which can effectively improve the charge and discharge capacity of the battery and reduce the internal resistance of the battery. As the width of the electrode tabs of the battery cell increases, the distance between the positive and negative electrode tabs of the battery cell decreases accordingly. Therefore, the distance between the first conductive layer 20 and the second conductive layer 30 is 1 - 5 mm to ensure that during the formation of the battery, the positive and negative electrode tabs of the battery cell are in corresponding contact with the positive and negative electrodes of the PCB board 100 of the formation fixture, thereby ensuring the formation effect of the battery.

[0069] Preferably, the distance between the first conductive layer 20 and the second conductive layer 30 is 1 to 3 mm. For example, the distance between the first conductive layer 20 and the second conductive layer 30 is 1 mm, 1.1 mm, 1.4 mm, 1.5 mm, 1.8 mm, 2 mm, 2.2 mm, 2.5 mm, 2.6 mm, 2.9 mm or 3 mm, but is not limited to the listed values, and other values within the numerical range are equally applicable.

[0070] Please refer to Figure 1 、 Figures 6 to 8 , in some embodiments, the length n of the first conductive layer 20 is less than the length h of the second conductive layer 30. Effectively enabling the PCB board 100 to adapt to different formats of battery cells and improving the utilization rate of the PCB board 100.

[0071] Please refer to Figures 1 to 11 , in some embodiments, the first conductive layer 20 includes a plurality of first gold fingers 21 spaced along the length direction A of the substrate 10, and the second conductive layer 30 includes a plurality of second gold fingers 31 spaced along the length direction A of the substrate 10.

[0072] It can be understood that the polarities of the first conductive layer 20 and the second conductive layer 30 are opposite, that is, when the first conductive layer 20 is the positive electrode, the second conductive layer 30 is the negative electrode; when the first conductive layer 20 is the negative electrode, the second conductive layer 30 is the positive electrode.

[0073] In some embodiments, the PCB board 100 of the formation fixture according to the embodiment of the present invention further includes a first insulating layer 70 and a second insulating layer 80. The first insulating layer 70 and the second insulating layer 80 are both disposed on the substrate 10. The first insulating layer 70, the first conductive layer 20 and the second conductive layer 30 are located on the same side, and the first insulating layer 70 surrounds the first conductive layer 20 and the second conductive layer 30. The second insulating layer 80 is disposed on the side of the substrate 10 away from the first conductive layer 20 and the second conductive layer 30. By the combined use of the first insulating layer 70 and the second insulating layer 80, the first insulating layer 70 and the second insulating layer 80 can form an insulating protective layer on the PCB board 100, effectively preventing short circuits between components and improving the electrical performance and reliability of the PCB board 100 of the formation fixture.

[0074] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model.

Claims

1. A PCB board formed into a fixture, characterized in that: The invention comprises a substrate (10), a first conductive layer (20) and a second conductive layer (30); along the length direction (A) of the substrate (10), the first conductive layer (20) and the second conductive layer (30) are arranged in parallel on the substrate (10); an insulating member (40) is arranged on the first conductive layer (20) and / or the second conductive layer (30), and the insulating member (40) extends along the length direction (A) of the substrate (10).

2. The PCB board of the formation fixture as claimed in claim 1, characterized in that: A groove (50) is provided on the first conductive layer (20) and / or the second conductive layer (30), the bottom of the groove (50) extends to the substrate (10), the insulating member (40) is arranged in the groove (50), and the insulating member (40) partially protrudes from the surface of the first conductive layer (20) and / or the second conductive layer (30).

3. The PCB board of the formation fixture as claimed in claim 2, characterized in that: The insulating member (40) is an elastic member (60); Or, an elastic member (60) is provided at the bottom of the insulating member (40); Wherein, when the elastic member (60) is in a compressed state, the upper surface of the insulating member (40) is flush with the upper surface of the first conductive layer (20) and / or the upper surface of the second conductive layer (30).

4. The PCB board of the formation fixture as claimed in claim 1, characterized in that: When the insulating member (40) is disposed on the first conductive layer (20), the length (p) of the insulating member (40) is greater than or equal to the length (n) of the first conductive layer (20); When the insulating member (40) is disposed on the second conductive layer (30), the length (p) of the insulating member (40) is greater than or equal to the length (h) of the second conductive layer (30); When the insulating member (40) is disposed on the first conductive layer (20) and the second conductive layer (30), the insulating member (40) comprises a first insulating portion (41) and a second insulating portion (42), wherein the first insulating portion (41) is located on the first conductive layer (20), and the second insulating portion (42) is located on the second conductive layer (30); Wherein, the first insulating part (41) and the second insulating part (42) are an integrally formed structure or a split structure.

5. The PCB board of the formation fixture according to any one of claims 1 to 4, characterized in that: Along the length direction (A) of the substrate (10), the edge of the upper surface of the insulating member (40) is arranged as a rounded corner (43), and the radius of the rounded corner (43) is 4 to 6 mm.

6. The PCB board of the formation fixture according to any one of claims 1 to 4, characterized in that: The insulating member (40) is polyetheretherketone, glass fiber cloth or epoxy resin.

7. The PCB board of the formation fixture as claimed in claim 1, characterized in that: The distance between the first conductive layer (20) and the second conductive layer (30) is 1 to 5 mm.

8. The PCB board of the formation fixture as claimed in claim 1, characterized in that: The length (n) of the first conductive layer (20) is smaller than the length (h) of the second conductive layer (30).

9. The PCB board of the formation fixture as claimed in claim 1, characterized in that: The first conductive layer (20) comprises a plurality of first gold fingers (21) arranged at intervals along the length direction (A) of the substrate (10), and the second conductive layer (30) comprises a plurality of second gold fingers (31) arranged at intervals along the length direction (A) of the substrate (10).

10. The PCB board of the formation fixture as claimed in claim 1, characterized in that: The invention also comprises a first insulating layer (70) and a second insulating layer (80), wherein the first insulating layer (70) and the second insulating layer (80) are both arranged on the substrate (10), the first insulating layer (70), the first conductive layer (20) and the second conductive layer (30) are located on the same side, and the first insulating layer (70) is arranged around the first conductive layer (20) and the second conductive layer (30), and the second insulating layer (80) is arranged on a side of the substrate (10) away from the first conductive layer (20) and the second conductive layer (30).

Images