Battery equalization structure, battery and energy storage device

By introducing efficient heat dissipation components and thermal conductor structures into the BMS system, the problems of long balance time and poor effect caused by natural cooling are solved, and faster and more efficient battery equalization is achieved.

CN222928688UActive Publication Date: 2025-05-30SVOLT ENERGY TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421508460.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-27
Publication Date
2025-05-30
Estimated Expiration
2034-06-27

AI Technical Summary

Technical Problem

The heat dissipation method of the balanced resistor in the existing BMS system is mainly natural cooling, which causes the plate temperature to drop to a certain temperature to restore the balance capacity, the balance time is long and the balance effect is not good.

Method used

A battery balance structure is designed, including heat dissipation components and thermal conductors. The heat dissipation assembly uses the closed circuit of the evaporator, steam channel, condenser and liquid pipeline to efficiently dissipate heat using the heat exchange medium; the heat conductor is arranged between the heat dissipation assembly and the balance resistor to ensure effective heat transfer.

Benefits of technology

By improving the heat transfer efficiency between the equalization resistor and the heat dissipation component, the temperature rise rate and board temperature are effectively reduced, the equalization current is increased, and the battery equalization capability is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of batteries, in particular to a battery equalization structure, a battery and an energy storage device.The battery equalization structure comprises a heat dissipation assembly and a heat conduction piece, and the heat dissipation assembly is used for conducting heat dissipation on an equalization resistor; the heat conduction piece is arranged between the heat dissipation assembly and the balancing resistor and used for transmitting heat generated by the balancing resistor to the heat dissipation assembly. According to the battery equalization structure, by arranging the heat conduction piece and the heat dissipation assembly, the heat generated by the equalization resistor can be transmitted to the heat dissipation assembly through the heat conduction piece, the heat is taken away through the heat dissipation assembly, the temperature rise rate can be effectively reduced, the plate temperature can be reduced, then the equalization current can be increased, and the battery equalization capability can be improved.
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Description

Technical Field

[0001] The present application relates to the technical field of batteries, and particularly to a battery equalization structure, a battery, and an energy storage device. Background Art

[0002] In electric vehicle applications, lithium-ion batteries are used to provide power sources for in-vehicle auxiliary systems and motors. For the BMS system (Battery Management System) of electric vehicles, the battery equalization function is one of the main functions, and its purpose is to maximize the charging or discharging capacity of the battery pack. By balancing the voltage and current between individual cells, the BMS system can effectively prevent overcharging or over-discharging, thereby avoiding damage to the battery and extending its service life. At the same time, the equalization function of the BMS system also enables the battery pack to always operate at the highest efficiency.

[0003] There are two ways for the BMS system to achieve battery equalization, namely active equalization and passive equalization. The principle of passive equalization technology is to discharge the battery through external circuit elements, so that each battery in the battery module has the same charging capacity as the weakest battery. Active equalization technology is to periodically monitor the voltage and current of each individual cell in the battery pack and transfer energy from the higher-voltage individual cell to the lower-voltage cell when needed.

[0004] The strength of the equalization ability is closely related to the equalization current. After the equalization function is turned on, if the equalization current is too small, the equalization ability will be greatly reduced in the same time; if the equalization current is too large, the equalization ability will be improved, but it will cause the board temperature to rise too fast, affecting the normal operation of other functions. Most of the current heat dissipation methods are natural cooling. After the board temperature drops to a certain temperature, the equalization ability is restored, resulting in a long equalization time and poor equalization effect. Summary of the Utility Model

[0005] The present application provides a battery equalization structure, a battery, and an energy storage device to solve the problem that in the prior art, the heat dissipation of the equalization resistor in the BMS system is mostly natural cooling, and the equalization ability is restored after the board temperature drops to a certain temperature, resulting in a long equalization time and poor equalization effect.

[0006] On the one hand, the present application provides a battery equalization structure, including:

[0007] A heat dissipation component for dissipating heat from the equalization resistor;

[0008] A heat conducting member disposed between the heat dissipation component and the equalization resistor for transferring the heat generated by the equalization resistor to the heat dissipation component.

[0009] In a possible design, the heat dissipation component includes:

[0010] An evaporator for absorbing the heat of the balancing resistor;

[0011] A steam channel having a first end and a second end, the first end being in communication with the outlet of the evaporator;

[0012] A condenser, the inlet of the condenser being in communication with the second end;

[0013] A liquid pipeline having a third end and a fourth end, the third end being in communication with the outlet of the condenser, and the fourth end being in communication with the inlet of the evaporator;

[0014] A heat exchange medium for flowing from the evaporator through the steam channel to the condenser by vaporization and flowing from the condenser through the liquid pipeline to the evaporator by liquefaction.

[0015] In a possible design, a compensation chamber is further included, the compensation chamber is arranged between the evaporator and the liquid pipeline, and the compensation chamber is connected to the evaporator through a capillary tube.

[0016] In a possible design, a water absorption layer is provided on the side of the heat conducting member close to the heat dissipation assembly.

[0017] In a possible design, a heat insulation member is further included, the heat insulation member is arranged between the heat conducting member and the circuit board, and is used to prevent the heat of the heat conducting member from being transferred to the circuit board.

[0018] In a possible design, the heat insulation member includes:

[0019] A main body part;

[0020] A first protruding part, which is arranged on the side of the main body part close to the heat conducting member and is in contact with the heat conducting member, forming a first heat dissipation gap;

[0021] A second protruding part, which is arranged on the side of the main body part close to the circuit board and is in contact with the circuit board, forming a second heat dissipation gap.

[0022] In a possible design, a vacuum heat insulation cavity is formed in the main body part.

[0023] In a possible design, the heat conducting member includes a silica gel heat conducting pad;

[0024] And / or, the water absorption layer includes absorbent cotton;

[0025] And / or, the heat insulation member includes a rubber heat insulation pad.

[0026] On the other hand, the present application also provides a battery, including the battery balancing structure described above.

[0027] In yet another aspect, the present application also provides an energy storage device, including the battery described above.

[0028] The beneficial effects of the present application are as follows:

[0029] The battery equalization structure of the present application can transfer the heat generated by the equalization resistor to the heat dissipation component through the heat conducting component by setting the heat conducting component and the heat dissipation component. The heat dissipation component takes away the heat, which can effectively reduce the temperature rise rate and the board temperature, and further increase the equalization current and improve the equalization ability.

[0030] The battery provided by the present application includes all the above advantages of the battery equalization structure because it includes the battery equalization structure of the present application.

[0031] The energy storage device provided by the present application includes all the above advantages of the battery because it includes the battery of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0033] Figure 1 A schematic structural diagram of the battery equalization structure provided for an embodiment of the present application;

[0034] Figure 2 Another schematic structural diagram of the battery equalization structure provided for an embodiment of the present application;

[0035] Figure 3 Still another schematic structural diagram of the battery equalization structure provided for an embodiment of the present application;

[0036] Figure 4 A schematic structural diagram of the heat dissipation component of the battery equalization structure provided for an embodiment of the present application.

[0037] Reference Numerals:

[0038] 100, heat dissipation component; 110, evaporator; 120, steam channel; 130, condenser; 140, liquid pipeline; 150, compensation chamber; 160, capillary; 200, heat conducting component; 300, water absorption layer; 400, heat insulation component; 410, body part; 420, first protruding part; 430, first heat dissipation gap; 440, second protruding part; 450, second heat dissipation gap; 460, vacuum heat insulation cavity; 500, equalization resistor; 600, circuit board. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] The technical solutions of the present application will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0040] The strength of the battery equalization ability is related to the equalization current. After the equalization function is turned on, if the equalization current is too small, the equalization ability will be greatly reduced within the same time; if the equalization current is too large, the equalization ability will be improved, but it will cause the board temperature to rise too fast, affecting the normal operation of other functions. Most of the current heat dissipation methods are natural cooling, that is, the equalization ability is restored after the board temperature drops to a certain temperature, resulting in an increase in the equalization time and poor equalization effect.

[0041] To solve the above problems, the following will be combined with Figures 1 - 4 , to describe the battery equalization structure provided in the embodiments of the present application. The battery equalization structure includes a heat dissipation component 100 and a heat conduction member 200. Among them, the heat dissipation component 100 is used to dissipate heat from the equalization resistor 500; the heat conduction member 200 is disposed between the heat dissipation component 100 and the equalization resistor 500, and is used to transfer the heat generated by the equalization resistor 500 to the heat dissipation component 100. In one specific embodiment, the heat conduction member 200 is in a plate shape, and the heat conduction member 200 has a first heat conduction surface and a second heat conduction surface arranged oppositely. The first heat conduction surface is in contact with the equalization resistor 500, and the second heat conduction surface is in contact with the heat dissipation component 100. By making the heat conduction member 200 contact the equalization resistor 500 and the heat dissipation component 100 respectively, the heat transfer efficiency between the equalization resistor 500 and the heat dissipation component 100 can be improved. In one specific embodiment, the heat conduction member 200 is a silicone heat conduction pad. The silicone heat conduction pad has a certain flexibility and can fill the gap between the equalization resistor 500 and the heat dissipation component 100, so that the heat conduction member 200 contacts the equalization resistor 500 and the heat dissipation component 100 respectively, improving the heat transfer efficiency between the equalization resistor 500 and the heat dissipation component 100; at the same time, the silicone heat conduction pad has excellent insulation, and can keep the heat dissipation structure insulated from the equalization resistor 500; in addition, the silicone heat conduction pad can also play a role in shock absorption, etc., and can reduce the collision of the heat dissipation structure on the equalization resistor 500 and the circuit board 600 during the movement process.

[0042] By using the technical solutions of the above embodiments of the present application, by setting the heat conduction member 200 and the heat dissipation component 100, the heat generated by the equalization resistor 500 can be transferred to the heat dissipation component 100 through the heat conduction member 200, and the heat is taken away by the heat dissipation component 100, which can effectively reduce the temperature rise rate, reduce the board temperature, and further increase the equalization current and improve the equalization ability.

[0043] Refer to Figure 4As shown, in some embodiments of the present application, the heat dissipation component 100 includes an evaporator 110, a steam channel 120, a condenser 130, a liquid pipeline 140, and a heat exchange medium. Among them, the evaporator 110 is used to absorb the heat of the balancing resistor 500; the steam channel 120 has a first end and a second end, and the first end is communicated with the outlet of the evaporator 110; the inlet of the condenser 130 is communicated with the second end; the liquid pipeline 140 has a third end and a fourth end, the third end is communicated with the outlet of the condenser 130, and the fourth end is communicated with the inlet of the evaporator 110; thus, the evaporator 110, the steam channel 120, the condenser 130, the liquid pipeline 140, and the evaporator 110 can form a complete closed loop; the heat exchange medium is used to flow from the evaporator 110 through the steam channel 120 to the condenser 130 by vaporization, and flow from the condenser 130 through the liquid pipeline 140 to the evaporator 110 by liquefaction. In one specific embodiment, the evaporator 110 is located above the balancing resistor 500, and both the evaporator 110 and the condenser 130 are made of copper tubes arranged in a spiral shape. The copper tubes have good thermal conductivity to maintain a high heat transfer efficiency. The heat exchange medium is water or other refrigerants. The evaporator 110 is located above the balancing resistor 500. When the balancing resistor 500 releases heat, the refrigerant in the evaporator 110 is heated and vaporized. The vaporization process absorbs heat, thereby absorbing the heat of the balancing resistor 500. The vaporized steam enters the condenser 130 through the steam channel 120. In the condenser 130, the steam is liquefied and releases heat. The liquefied refrigerant flows back to the evaporator 110 through the liquid pipeline 140, thereby forming a closed loop of the evaporator 110, the steam channel 120, the condenser 130, the liquid pipeline 140, and the evaporator 110, realizing the heat dissipation of the balancing resistor 500, increasing the balancing current by reducing the board temperature, and improving the battery balancing ability.

[0044] Referring to Figure 4 As shown, in some embodiments of the present application, the battery balancing structure further includes a compensation chamber 150. The compensation chamber 150 is arranged between the evaporator 110 and the liquid pipeline 140. The refrigerant flowing out of the liquid pipeline 140 is temporarily stored in the compensation chamber 150. The compensation chamber 150 is connected to the evaporator 110 through a capillary 160. In some specific embodiments, the capillary 160 includes multiple tubes with very small inner diameters, generally fine tubes with an inner diameter equal to or less than 1 mm. During refrigeration, under the capillary force of the capillary 160, the liquid refrigerant from the compensation chamber 150 is sucked into the evaporator 110, providing sufficient refrigerant for the evaporator 110 and effectively improving the cooling speed.

[0045] Referring to Figure 1As shown, in some embodiments of the present application, a water-absorbing layer 300 is provided on the side of the heat-conducting member 200 close to the heat-dissipating assembly 100. In some specific embodiments, the water-absorbing layer 300 is absorbent cotton. Specifically, the absorbent cotton is made of polyester fiber, and the absorbent cotton absorbs and stores moisture through the capillary micropores penetrating the fiber surface and inside, thereby preventing the water vapor on the surface of the heat-dissipating assembly 100 from entering the circuit board 600 and burning the circuit board 600.

[0046] Referring to Figure 1 As shown, in some embodiments of the present application, the battery equalization structure further includes a heat-blocking member 400. The heat-blocking member 400 is disposed between the heat-conducting member 200 and the circuit board 600, and the heat-blocking member 400 is used to block the heat transfer of the heat-conducting member 200 to the circuit board 600. In some specific embodiments, the heat-blocking member 400 is a rubber heat-insulating pad, and the rubber heat-insulating pad has poor thermal conductivity, so it can better block the heat of the heat-conducting member 200 from being transferred back to the circuit board 600 below. In some specific embodiments, the thickness of the heat-blocking member 400 is equal to the height of the equalizing resistor 500, so that the heat-blocking member 400 can support the heat-conducting member 200 and the heat-dissipating assembly 100.

[0047] Referring to Figure 2 As shown, in some embodiments of the present application, the heat-blocking member 400 includes a body portion 410, a first protruding portion 420, and a second protruding portion 440. The first protruding portion 420 is disposed on the side of the body portion 410 close to the heat-conducting member 200, the first protruding portion 420 is in contact with the heat-conducting member 200, and the first protruding portion 420 forms a first heat-dissipating gap 430; the second protruding portion 440 is disposed on the side of the body portion 410 close to the circuit board 600, the second protruding portion 440 is in contact with the circuit board 600, and the second protruding portion 440 forms a second heat-dissipating gap 450. Specifically, there are a plurality of first protruding portions 420 protruding from the upper part of the body portion 410, and a first heat-dissipating gap 430 is formed between adjacent first protruding portions 420; there are a plurality of second protruding portions 440 protruding from the lower part of the body portion 410, and a second heat-dissipating gap 450 is formed between adjacent second protruding portions 440; thus arranged, it is beneficial to dissipate the heat of the circuit board 600 from the first heat-dissipating gap 430 and the second heat-dissipating gap 450.

[0048] Referring to Figure 2 As shown, in some embodiments of the present application, a vacuum heat-insulating cavity 460 is formed in the body portion 410, and the vacuum heat-insulating cavity 460 can effectively block the heat of the heat-conducting member 200.

[0049] The working principle of the battery equalization structure of the present application:

[0050] The coolant is pumped into the compensation chamber 150. The evaporator 110 is located in the heat source area of the balancing resistor 500. When the balancing resistor 500 operates, the coolant absorbs heat and evaporates into a gas state, driving air flow into the vapor channel through natural expansion. When the vapor flows into the condenser 130, it condenses into a liquid, and under the action of capillary force, it is sucked into the liquid channel and then returns to the compensation chamber 150 to supply cold liquid to the evaporator 110. In this way, the cycle is repeated without external power. Through the gas-liquid phase change, heat is conducted at high speed, forming a smooth one-way cooling loop. For the phenomenon of too rapid temperature rise during the balancing process, by adding the battery balancing structure of the present application, the heat dissipation capacity of the balancing resistor 500 can be effectively improved, the balancing current can be increased while being smaller, and the balancing ability of the battery can be improved.

[0051] In an embodiment of the present application, a battery is further provided, including the battery balancing structure in the above embodiment.

[0052] It should be noted that since the battery includes the battery balancing structure, it also includes all the above advantages of the battery balancing structure, which will not be elaborated here.

[0053] In an embodiment of the present application, an energy storage device is further provided, including the battery in the above embodiment. Specifically, the energy storage device can be a vehicle, a working machine, etc.

[0054] It should be noted that since the energy storage device includes the battery, it also includes all the above advantages of the battery, which will not be elaborated here.

[0055] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0056] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0057] In this application, unless otherwise clearly stipulated and defined, terms such as "install", "connect", "link", "fix", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0058] In this application, terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0059] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on this application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. A battery balancing structure, characterized in that: include: A heat dissipation component, used for dissipating heat from the balancing resistor; The heat conducting member is arranged between the heat dissipation component and the balancing resistor, and is used for transferring the heat generated by the balancing resistor to the heat dissipation component.

2. The battery balancing structure according to claim 1, characterized in that: The heat dissipation component comprises: an evaporator, used to absorb the heat of the equalizing resistor; a steam passage having a first end and a second end, wherein the first end is in communication with an outlet of the evaporator; a condenser, wherein an inlet of the condenser is in communication with the second end; a liquid pipeline having a third end and a fourth end, wherein the third end is communicated with the outlet of the condenser, and the fourth end is communicated with the inlet of the evaporator; The heat exchange medium is used to flow from the evaporator through the steam channel to the condenser by vaporization, and to flow from the condenser through the liquid pipeline to the evaporator by liquefaction.

3. The battery balancing structure according to claim 2, characterized in that: It also includes a compensation chamber, which is arranged between the evaporator and the liquid pipeline, and the compensation chamber is connected to the evaporator through a capillary tube.

4. The battery balancing structure according to claim 1, characterized in that: A water absorbing layer is arranged on one side of the heat conducting member close to the heat dissipation assembly.

5. The battery balancing structure according to claim 4, characterized in that: A heat-resisting member is also included. The heat-resisting member is arranged between the heat-conducting member and the circuit board and is used to prevent the heat of the heat-conducting member from being transferred to the circuit board.

6. The battery balancing structure according to claim 5, characterized in that: The heat-resistant member comprises: Body part; A first protrusion is arranged on a side of the main body close to the heat conducting member, and is in contact with the heat conducting member to form a first heat dissipation gap; The second protrusion is arranged on a side of the main body close to the circuit board and contacts the circuit board to form a second heat dissipation gap.

7. The battery balancing structure according to claim 6, characterized in that: A vacuum heat-insulating cavity is formed in the main body.

8. The battery balancing structure according to claim 5, characterized in that: The heat conducting member comprises a silicone heat conducting pad; And / or, the water-absorbing layer comprises water-absorbing cotton; And / or, the heat-resistant component includes a rubber insulation pad.

9. A battery, characterized in that: The invention comprises the battery equalization structure according to any one of claims 1 to 8.

10. An energy storage device, characterized in that: A battery comprising the battery of claim 9.