Electronic endoscope module and soft medical endoscope

Abstract

The utility model relates to the field of advanced packaging, and provides an electronic endoscope module and a soft medical endoscope. The electronic endoscope module comprises an image sensor, at least two light-emitting pieces, a first glass substrate, a second glass substrate and a glass cover plate, wherein the first glass substrate, the second glass substrate and the glass cover plate are sequentially connected in a stacked mode. A plurality of metal columns are arranged on the first glass substrate; a mounting opening is formed in the second glass substrate, and a plurality of metal columns are arranged on the second glass substrate around the mounting opening; the image sensor is arranged in the mounting opening and is electrically connected with the metal column; the at least two light-emitting parts are arranged around the image sensor, and each light-emitting part is electrically connected with the corresponding metal column; a blind hole is formed in the face, close to the second glass substrate, of the glass cover plate. Each light-emitting part and the corresponding image sensor are located in the corresponding blind hole. In the assembling process of the electronic endoscope module, the height difference between the light-emitting part and the image sensor is easy to control, and therefore better illumination efficiency is obtained.

Description

Technical Field

[0001] The utility model relates to the field of advanced packaging technology, and in particular, to an electronic endoscope module and a flexible medical endoscope. Background Art

[0002] In recent years, with the rapid development of electronic chip technology, photosensitive chips have gradually become smaller, and the chips can be small enough to be placed at the front end of the endoscope, which has initiated the development of electronic endoscopes. At the same time, it has replaced the previous fiber optic light source design that was prone to breakage. Tiny CCD or CMOS chips are used and placed at the front end of the endoscope diameter to directly capture images. The images are transmitted to the back end via a signal transmission line, and the image signals are converted into a standard video format for circuit processing and provided to the display for imaging.

[0003] The existing endoscope light source emission technology uses optical fibers for light guiding, transmitting the rear light source to the front end to provide the lighting function required by the CIS camera sensor. This optical fiber material is prone to breakage, has a very high cost, and cannot achieve disposable development. The key to the development of disposable endoscopes is to effectively reduce the cost of disposable end equipment while maintaining high-quality imaging technology.

[0004] Most of the existing endoscope optical modules use printed circuit boards (PCBs) or flexible printed circuit boards (FPCs). After welding the image sensor CIS (CMOS Image Sensor), light-emitting diodes (LEDs) light sources, and electrical signal transmission lines onto the board, they are bent to the designed angle and then fixed. This method has the following defects: 1. There is a maximum limit to the bending angle of the FPC, and the heights of the LED and CIS cannot be adjusted, making it difficult to obtain optimized optical parameters. Moreover, light-shielding protection must be provided for the CIS to prevent stray light from entering the camera sensor and generating poor images; 2. The fixing method is prone to deviation between the heights of the CMOS and LED from the design due to the characteristics of the adhesive material, which easily causes stray light to enter the sensor or shadows to appear in the image when the LED light enters the image sensor due to insufficient height.

[0005] The existing endoscope module usually forms grooves by designing holes in the substrate to place the CIS and LED. The grooving process with different step height differences has a high complexity, and it is not easy to ensure the flatness. Eventually, a filling adhesive material must be used for potting. Because the material needs to be heated and cured, the solder joints of the CIS and LED are prone to residual thermal stress due to different thermal expansion coefficients between the materials after cooling, resulting in reliability failure, and the change in the height of the adhesive material easily affects the transmittance of the LED light source.

[0006] In view of this, the present utility model is specifically proposed. Content of the Utility Model

[0007] The object of the present utility model is to provide an electronic endoscope module and a flexible medical endoscope, aiming to improve at least one problem mentioned in the background art.

[0008] The present utility model is implemented as follows:

[0009] In a first aspect, the present utility model provides an electronic endoscope module in a form of stacked packaging of glass substrates, including an image sensor, at least two light-emitting elements, and a first glass substrate, a second glass substrate, and a glass cover plate that are stacked and connected in sequence;

[0010] A plurality of first metal posts and a plurality of second metal posts surrounding the plurality of first metal posts are provided on the first glass substrate, and each first metal post and each second metal post penetrate through the first glass substrate;

[0011] An installation opening is formed on the second glass substrate, and a plurality of third metal posts are arranged around the installation opening on the second glass substrate. The installation opening and each third metal post penetrate through the second glass substrate, and the plurality of third metal posts are arranged in one-to-one correspondence with the plurality of second metal posts, and each third metal post is electrically connected to the corresponding second metal post;

[0012] The image sensor is disposed in the installation opening, and the image sensor is electrically connected to the plurality of first metal posts, and the image sensor realizes electrical conduction through the plurality of first metal posts;

[0013] At least two light-emitting elements are arranged around the image sensor, which is located on the side of the second glass substrate away from the first glass substrate, and their arrangement mode corresponds to the plurality of third metal posts. Each light-emitting element is electrically connected to the corresponding third metal post, and electrical conduction of each light-emitting element is realized through the second metal posts and the third metal posts;

[0014] Blind holes are formed on the surface of the glass cover plate close to the second glass substrate, and each light-emitting element and the image sensor are located in the blind holes;

[0015] The materials of the first glass substrate, the second glass substrate, and the glass cover plate are wafer-level glass.

[0016] In an optional embodiment, the surface of the light-emitting element away from the first glass substrate is surface A, and the surface of the image sensor away from the first glass substrate is surface B. The distance from surface B to the first glass substrate is greater than the distance from surface A to the first glass substrate, and the difference between the two distances is 500 - 600 microns.

[0017] In an optional embodiment, the thickness of the first glass substrate is 300 - 400 microns;

[0018] The thickness of the second glass substrate is 1300 - 1500 microns;

[0019] The thickness of the glass cover plate is 500 - 600 microns.

[0020] In an alternative embodiment, at least two light-emitting components are symmetrically arranged around the image sensor.

[0021] In an alternative embodiment, the shape of the mounting opening is square;

[0022] In an alternative embodiment, the light-emitting component is an LED;

[0023] In an alternative embodiment, the number of light-emitting components is 2;

[0024] In an alternative embodiment, the diameter of the first metal pillar is 50 to 100 micrometers, the diameter of the second metal pillar is 50 to 100 micrometers, and the diameter of the third metal pillar is 100 to 150 micrometers;

[0025] In an alternative embodiment, the first metal pillar and the second metal pillar are perpendicular to the first glass substrate; the third metal pillar is perpendicular to the second glass substrate.

[0026] In an alternative embodiment, the material of the first metal pillar, and / or the second metal pillar, and / or the third metal pillar is copper.

[0027] In an alternative embodiment, the total thickness of the electronic endoscope module is 2,600 to 3,000 micrometers.

[0028] In a second aspect, an embodiment of the present invention provides a method for manufacturing an electronic endoscope module in a glass substrate stacked package form, including:

[0029] Forming a plurality of first metal pillars and a plurality of second metal pillars on a glass substrate to obtain a first glass substrate;

[0030] Forming a mounting opening and a plurality of third metal pillars on a glass substrate to obtain a second glass substrate;

[0031] Forming blind holes on a glass substrate to obtain a glass cover plate;

[0032] Performing W2W wafer hybrid bonding or D2W chip bonding wafer on the first glass substrate and the second glass substrate, so that the first glass substrate and the second glass substrate are combined into one body, and electrically connecting the third metal pillar and the corresponding second metal pillar;

[0033] Placing the image sensor in the mounting opening, and electrically connecting the image sensor to the plurality of second metal pillars;

[0034] Placing each light-emitting component on a side of the second glass substrate away from the first glass substrate, and soldering each light-emitting component to the corresponding third metal pillar;

[0035] Cover the glass cover plate on the first glass substrate, place the image sensor and each light-emitting component in the blind hole, and perform W2W wafer hybrid bonding or D2W chip TCB bonding on the glass cover plate and the second glass substrate.

[0036] In an alternative embodiment, the method for forming the first metal pillar, and / or the second metal pillar, and / or the third metal pillar includes:

[0037] First, perform laser modification and wet etching to form a through hole;

[0038] Then, fill the hole with a metal material to form a metal pillar.

[0039] In a third aspect, an embodiment of the present invention provides a flexible medical endoscope, including the electronic endoscope module provided by the embodiment of the present invention or the electronic endoscope module prepared by the preparation method provided by the embodiment of the present invention.

[0040] The present invention has the following beneficial effects:

[0041] The electronic endoscope module provided by the present invention adopts a glass plate stacking design. The image sensor and the light-emitting components are assembled in the frame formed by the glass substrate through openings. During the assembly process, the height difference between the light-emitting components and the image sensor is easy to control, thereby obtaining better illumination efficiency. At the same time, the production efficiency is improved through mature wafer-level stacking packaging, and the reliability of electrical signal transmission is improved. Description of the Drawings

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0043] Figure 1 It is a cross-sectional view of the electronic endoscope module provided by the embodiment of the present invention;

[0044] Figure 2 It is a schematic structural diagram of the first glass substrate;

[0045] Figure 3 It is a cross-sectional view of the first glass substrate;

[0046] Figure 4 It is a schematic structural diagram of the second glass substrate;

[0047] Figure 5 It is a cross-sectional view of the second glass substrate;

[0048] Figure 6Schematic structural diagram of the glass cover plate;

[0049] Figure 7 Cross-sectional view of the glass cover plate;

[0050] Figure 8 Schematic structural diagram after bonding of the first glass substrate and the second glass substrate.

[0051] Icons: 100 - Electronic endoscope module; 110 - Image sensor; 120 - Light-emitting element; 130 - First glass substrate; 140 - Second glass substrate; 150 - Glass cover plate; 131 - First metal post; 132 - Second metal post; 141 - Mounting opening; 142 - Third metal post; 151 - Blind hole. Detailed implementation manners

[0052] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings herein can be arranged and designed in various different configurations.

[0053] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the scope of protection of the present utility model.

[0054] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0055] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship when the product of the present utility model is normally placed. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0056] In addition, terms such as "horizontal" and "vertical" do not require the components to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0057] In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "arranged", "installed", "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0058] The features and performance of the present invention will be further described in detail below in conjunction with embodiments.

[0059] As Figure 1 shown, an electronic endoscope module 100 in a glass substrate stacked packaging form provided by an embodiment of the present invention includes an image sensor 110, at least two light-emitting components 120, and a first glass substrate 130, a second glass substrate 140, and a glass cover plate 150 that are stacked and connected in sequence.

[0060] As Figure 2 and Figure 3 shown, a plurality of first metal posts 131 and a plurality of second metal posts 132 surrounding the plurality of first metal posts 131 are provided on the first glass substrate 130, and each first metal post 131 and each second metal post 132 penetrate through the first glass substrate 130.

[0061] As Figure 4 and Figure 5 shown, an installation opening 141 is formed on the second glass substrate 140, a plurality of third metal posts 142 are arranged around the installation opening 141 on the second glass substrate 140, the installation opening 141 and each third metal post 142 penetrate through the second glass substrate 140, the plurality of third metal posts 142 are arranged in one-to-one correspondence with the plurality of second metal posts 132, and each third metal post 142 is electrically connected to the corresponding second metal post 132.

[0062] As Figure 1 shown, the image sensor 110 is arranged in the installation opening 141, the image sensor 110 is electrically connected to the plurality of first metal posts 131, and the image sensor 110 realizes electrical conduction through the plurality of first metal posts 131.

[0063] At least two light-emitting components 120 are arranged around the image sensor 110, which is located on the side of the second glass substrate 140 away from the first glass substrate 130, and their arrangement mode corresponds to that of a plurality of third metal posts 142. Each light-emitting component 120 is electrically connected to the corresponding third metal post 142, and the electrical conduction of each light-emitting component 120 is achieved through the second metal posts 132 and the third metal posts 142.

[0064] As Figure 6 and Figure 7 shown, a blind hole 151 is formed on the side of the glass cover plate 150 close to the second glass substrate 140. Each light-emitting component 120 and the image sensor 110 are located in the blind hole 151.

[0065] The materials of the first glass substrate 130, the second glass substrate 140, and the glass cover plate 150 are wafer-level glass.

[0066] The electronic endoscope module 100 provided by the embodiment of the present utility model is designed with a glass plate stack. The image sensor 110 and the light-emitting components 120 are assembled in a frame formed by glass substrates through openings. During the assembly process, high-precision alignment requirements can be achieved through the wafer-level glass-to-glass metal thermocompression bonding technology. The height difference between the light-emitting components 120 and the image sensor 110 is easy to control, so as to obtain better lighting efficiency. At the same time, the production efficiency can be improved through the mature wafer-level stacking packaging, and the reliability of the electrical signal transmission can be improved.

[0067] Optionally, the side of the light-emitting component 120 away from the first glass substrate 130 is the A surface, and the side of the image sensor 110 away from the first glass substrate 130 is the B surface. The distance from the B surface to the first glass substrate 130 is greater than the distance from the A surface to the first glass substrate 130, and the difference H between the two distances is 500-600 microns.

[0068] When H is within the above range, the uniformity of the light source emission can be improved and the scattered light can be avoided from entering the CIS sensor to form a poor image.

[0069] Optionally, the thickness L 1 of the first glass substrate 130 is 300-400 microns; the thickness L 2 of the second glass substrate 140 is 1300-1500 microns; the thickness L 3 of the glass cover plate 150 is 500-600 microns.

[0070] Optionally, the total thickness of the electronic endoscope module 100 is 2600-3000 microns.

[0071] Optionally, to ensure uniform light reception of the image sensor 110, at least two light-emitting components 120 are symmetrically arranged around the image sensor 110.

[0072] Optionally, at least two light-emitting elements 120 can be specifically, for example, 2, 3, or 4, etc. The specific number is determined according to the usage requirements. In the structure shown in the figure, the number of light-emitting elements 120 is 2.

[0073] Optionally, the light-emitting element 120 is an LED; the image sensor 110 is a CIS image sensor 110. It should be noted that the selection of the above light-emitting element 120 and image sensor 110 is only one implementation manner of the present utility model. In other implementation manners of the present utility model, the light-emitting element 120 can also be an LD, an OLED, etc., and the image sensor 110 can also be a CCD, etc.

[0074] Optionally, to save the installation space and ensure that the electronic endoscope module 100 is small enough, the shape of the installation opening 141 matches the image sensor 110. For example, when a CIS sensor is selected, most of it is a wafer-level manufacturing process and is a square chip design. Therefore, in order to cooperate with the shape of the CIS sensor, the installation opening 141 is set to be square.

[0075] Optionally, the diameter R of the first metal post 131 1 is 50 to 100 microns, and the diameter R of the second metal post 132 2 is 50 to 100 microns, and the diameter R of the third metal post 142 3 is 100 to 150 microns.

[0076] Optionally, the material of the first metal post 131, and / or the second metal post 132, and / or the third metal post 142 is copper.

[0077] Optionally, the first metal post 131 and the second metal post 132 are perpendicular to the first glass substrate 130; the third metal post 142 is perpendicular to the second glass substrate 140. The perpendicular metal posts serve as power and signal transmission lines.

[0078] The preparation method of the electronic endoscope module 100 in the form of glass substrate stacked packaging provided by the embodiment of the present utility model includes:

[0079] S1. As shown in Figure 2 and Figure 3 , a plurality of first metal posts 131 and a plurality of second metal posts 132 are formed on the glass substrate to obtain the first glass substrate 130.

[0080] This step specifically includes:

[0081] Laser modification and wet etching are performed on the glass substrate to form glass through holes (TGV); then the holes are filled with a metal material to form metal posts (the first metal posts 131 and the second metal posts 132).

[0082] Optionally, the method of filling the holes with a metal material can be double-sided electroplating. Generally, copper can be selected as the metal material.

[0083] It should be noted that both the TGV via process and the hole filling process are existing technologies, and the foregoing content is only a brief description, so there is no need to elaborate further here.

[0084] S2, as Figure 4 and Figure 5 shown, an installation opening 141 and a plurality of third metal posts 142 are formed on the glass substrate to obtain a second glass substrate 140.

[0085] This step specifically includes:

[0086] Laser modification and wet etching are performed on the glass substrate to form the installation opening 141 and glass vias (TGVs), and then the holes are filled with a metal material to form metal posts (third metal posts 142).

[0087] S3, as Figure 6 and Figure 7 shown, blind holes 151 are formed on the glass substrate to obtain a glass cover plate 150.

[0088] This step specifically includes:

[0089] Laser modification and wet etching are performed on the glass substrate to form a square blind hole 151 for accommodating the image sensor 110 and the light emitting element 120, thereby obtaining the glass cover plate 150.

[0090] S4, as Figure 8 shown, the first glass substrate 130 and the second glass substrate 140 are subjected to W2W wafer hybrid bonding or D2W chip bonding to wafers, so that the first glass substrate 130 and the second glass substrate 140 are combined into one body, and the third metal posts 142 and the corresponding second metal posts 132 are electrically connected.

[0091] S5, as Figure 1 shown, the image sensor 110 is disposed in the installation opening 141, so that the image sensor 110 is electrically connected to a plurality of second metal posts 132.

[0092] Taking the first glass substrate 130 as the bearing surface, the image sensor 110 is disposed in the installation opening 141 and adhered to the first glass substrate 130, and the image sensor 110 is welded to the first metal posts 131 by laser heating. Optionally, the image sensor 110 has 4 pins, so correspondingly, the number of the first metal posts 131 is also 4, which are respectively used for connecting the positive power supply, connecting the negative power supply, signal output, and control signal.

[0093] S5, as Figure 1As shown, each light-emitting component 120 is disposed on the side of the second glass substrate 140 away from the first glass substrate 130, and each light-emitting component 120 is welded to the corresponding third metal column 142.

[0094] Taking the second glass substrate 140 as the bearing surface, the light-emitting component 120 is attached to the first glass substrate 130, and the light-emitting component 120 is welded to the corresponding third metal column 142 by laser heating. Optionally, each light-emitting component 120 has 2 pins, so the number of the second metal columns 132 and the third metal columns 142 corresponding to each light-emitting component 120 is 2, which are respectively used to connect the positive electrode and the negative electrode of the power supply.

[0095] S6. As Figure 1 shown, the glass cover plate 150 is covered on the first glass substrate 130, so that the image sensor 110 and each light-emitting component 120 are located in the blind hole 151, and the glass cover plate 150 and the second glass substrate 140 are subjected to W2W wafer hybrid bonding or D2W chip TCB bonding wafers.

[0096] After the bonding in this step, the electronic endoscope module 100 with a total thickness of 2600-3000 microns is obtained. The glass cover plate 150 is used for sealing and protecting the image sensor 110 and the light-emitting component 120, and also has a light-transmitting function.

[0097] The preparation method provided by the present invention utilizes the existing wafer-level glass-to-glass metal thermocompression bonding technology to form high-precision alignment requirements. At the same time, the TGV (Through Glass Via) vertical circuit is used as the power supply and signal transmission route for the image sensor 110 and the light-emitting component 120, which can greatly reduce the transmission loss, and has excellent electrical performance and lower parasitic capacitance. Moreover, the glass composition can be adjusted and the surface treatment can be optimized, which can change the thermal expansion coefficient and mechanical strength of the substrate, improve the metal adhesion, stress control and reliability. In addition, this preparation method utilizes the wafer-level packaging structure, does not need to fill the sealant, does not need to be cured, and has the packaging of the glass cover at the same time, so the process is simplified, the production efficiency is increased, and the cost is reduced.

[0098] The flexible medical endoscope provided by the embodiment of the present invention includes the electronic endoscope module 100 provided by the embodiment of the present invention or the electronic endoscope module 100 prepared by the preparation method provided by the embodiment of the present invention.

[0099] In summary, the electronic endoscope module provided by the present invention has the following characteristics:

[0100] 1. With a glass plate stacking design, an image sensor and a light-emitting component are assembled in a frame formed by a glass substrate through an opening. During the assembly process, high-precision alignment requirements can be achieved through wafer-level glass-to-glass metal thermocompression bonding technology. The height difference between the light-emitting component and the image sensor is easy to control, thereby obtaining better lighting efficiency. At the same time, the production efficiency is improved through mature wafer-level stacking packaging, and the reliability of electrical signal transmission is enhanced.

[0101] 2. During the processing of this structure, no adhesive material is required, which can avoid the deviation of the height between the image sensor and the light-emitting component from the design due to the characteristics of the adhesive material in the prior art, which is likely to cause problems such as stray light entering the image sensor due to insufficient height or shadows in the image when light enters the image sensor.

[0102] 3. This electronic endoscope module uses a light-emitting component to provide light and does not adopt optical fiber light guiding, so its cost is lower; and the replacement cost after the failure of this electronic endoscope module is lower, and high-quality images can still be maintained after replacement.

Claims

1. An electronic endoscope module in a glass substrate stacking package type, characterized in that: It comprises an image sensor (110), at least two light-emitting elements (120), and a first glass substrate (130), a second glass substrate (140), and a glass cover plate (150) which are stacked and connected in sequence; The first glass substrate (130) is provided with a plurality of first metal pillars (131) and a plurality of second metal pillars (132) surrounding the plurality of first metal pillars (131), and each of the first metal pillars (131) and each of the second metal pillars (132) penetrates the first glass substrate (130); The second glass substrate (140) is provided with a mounting opening (141), and a plurality of third metal pillars (142) are arranged on the second glass substrate (140) around the mounting opening (141); the mounting opening (141) and each of the third metal pillars (142) penetrate the second glass substrate (140); the plurality of third metal pillars (142) and the plurality of second metal pillars (132) are arranged in one-to-one correspondence, and each of the third metal pillars (142) is electrically connected to the corresponding second metal pillar (132); The image sensor (110) is disposed in the installation port (141), the image sensor (110) is electrically connected to the plurality of first metal pillars (131), and the image sensor (110) is electrically connected via the plurality of first metal pillars (131); The at least two light-emitting elements (120) are arranged around the image sensor (110), and are located on a side of the second glass substrate (140) away from the first glass substrate (130), and their arrangement corresponds to the plurality of third metal pillars (142), each of the light-emitting elements (120) is electrically connected to the corresponding third metal pillar (142), and electrical conduction of each of the light-emitting elements (120) is achieved through the second metal pillar (132) and the third metal pillar (142); A blind hole (151) is provided on a surface of the glass cover plate (150) close to the second glass substrate (140), and each of the light-emitting elements (120) and the image sensor (110) is located in the blind hole (151); The first glass substrate (130), the second glass substrate (140) and the glass cover plate (150) are made of wafer-level glass.

2. The electronic endoscope module according to claim 1, characterized in that: The side of the light-emitting element (120) away from the first glass substrate (130) is side A, the side of the image sensor (110) away from the first glass substrate (130) is side B, the distance from side B to the first glass substrate (130) is greater than the distance from side A to the first glass substrate (130), and the difference between the two distances is 500 to 600 micrometers.

3. The electronic endoscope module according to claim 1, characterized in that: The thickness of the first glass substrate (130) is 300-400 microns; The thickness of the second glass substrate (140) is 1300-1500 microns; The thickness of the glass cover plate (150) is 500-600 micrometers.

4. The electronic endoscope module according to claim 1, characterized in that: The at least two light-emitting elements (120) are symmetrically arranged around the image sensor (110).

5. The electronic endoscope module according to claim 1, characterized in that: Also includes at least one of the following features (1) to (3): (1) The shape of the mounting opening (141) is a square; (2) The light emitting element (120) is an LED; (3) The number of the light-emitting elements (120) is 2.

6. The electronic endoscope module according to claim 1, characterized in that: The diameter of the first metal column (131) is 50 to 100 microns, the diameter of the second metal column (132) is 50 to 100 microns, and the diameter of the third metal column (142) is 100 to 150 microns.

7. The electronic endoscope module according to claim 1, characterized in that: The first metal column (131) and the second metal column (132) are perpendicular to the first glass substrate (130); and the third metal column (142) is perpendicular to the second glass substrate (140).

8. The electronic endoscope module according to claim 1, characterized in that: The first metal column (131), and / or the second metal column (132), and / or the third metal column (142) are made of copper.

9. The electronic endoscope module according to claim 1, characterized in that: The total thickness of the electronic endoscope module (100) is 2600 to 3000 micrometers.

10. A flexible medical endoscope, characterized in that: It comprises the electronic endoscope module (100) as claimed in any one of claims 1 to 7 or the electronic endoscope module (100) manufactured by the manufacturing method provided in claim 8 or 9.

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