Buffering mechanism for die

Abstract

The utility model discloses a buffer mechanism for a mould, which relates to the technical field of moulds and comprises a device base, a support frame is arranged on one side of the top end of the device base, a connecting plate is arranged at the front end of the support frame, and guide frames are arranged on two sides of the connecting plate. And a connecting base is arranged at the top end of the device base at the bottom end of the guide frame. According to the buffering mechanism for the die, in the downward stamping process of the upper die, the upper die conducts extrusion buffering through the first contact blocks on the two sides and the displacement blocks on the inner side of the connecting base, the displacement blocks clamp the second contact blocks under extrusion buffering of the first contact blocks, and therefore after stamping of the upper die is finished, the second contact blocks are clamped by the displacement blocks; and in the resetting process of the displacement block, an ejection block at the top of the second contact block makes contact with a first protruding block at the bottom end of the movable plate, so that the movable plate is ejected out of the inner side of the lower mold, and demolding of the mold and the stamping material is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of buffer mechanisms for molds, and specifically relates to a buffer mechanism for molds. Background Technique

[0002] A stamping die is a special process equipment that processes materials into parts during cold stamping processing, called a cold stamping die. Stamping refers to applying pressure to materials using a die installed on a press at room temperature to cause separation or plastic deformation, thereby obtaining the required parts. Since a large impact will be generated during stamping, in order to prevent the die from being damaged due to the impact force and reaction force, a buffer mechanism needs to be installed between the upper die and the lower die to increase the service life of the device.

[0003] For example, patent number CN202322874998.5 discloses a buffer mechanism for a die stamping device, including a bottom plate. The four sides of the top of the bottom plate are bolted with piston rods, and the top of the piston rod is bolted with a piston block. The surface of the piston rod is slidably sleeved with a sleeve. The top of the inner cavity of the sleeve is bolted with a first spring, and the bottom of the first spring is bolted with the top of the piston block. Through slots are opened on the four sides of the upper part of the sleeve, and air nozzles are bolted on the outer sides of the through slots. The top of the sleeve is bolted with a placement plate, a stamping die is arranged on the top of the placement plate, and a fixing plate is bolted on the inner side of the top of the placement plate. By setting the structure of the sleeve, piston rod and piston block in cooperation with the first spring through the characteristic of its own force deformation, and in cooperation with the through slots and air nozzles, the utility model has the function of enhancing the continuous buffering effect. Through the method of sucking air and squeezing, it can effectively buffer the continuous downward force of the sleeve on the surface of the piston rod, avoiding the problem that the buffer mechanism used in the existing die stamping device has a poor buffering effect on continuous reciprocating stamping, and greatly improving the practicability of the device;

[0004] After the stamping of the buffer mechanism in the die stamping device in this patent is completed, there is still some remaining force that can be utilized during the reset process of the buffer mechanism. And due to the excessive punching force of the die stamping device, the remaining stamping materials in the stamping device get stuck in the stamping die, which is not convenient for falling off. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a buffer mechanism for molds, which solves the problems that after the stamping of the buffer mechanism of the die stamping device is completed, there is still some remaining force that can be utilized during the reset process of the buffer mechanism, and due to the excessive punching force of the die stamping device, the remaining stamping materials in the stamping device get stuck in the stamping die, which is not convenient for falling off.

[0006] To achieve the above object, the utility model is realized by the following technical solutions: A buffer mechanism for a mold, including a device base. On one side of the top end of the device base, there is a support frame. At the front end of the support frame, there is a connecting plate. On both sides of the connecting plate, there are guide frames. At the bottom end of the guide frames, there is a connecting base located on the top end of the device base. Inside the connecting base, there is a displacement block. Below the connecting plate and inside the inner walls of the guide frames, there are an upper mold and a lower mold in sequence. The lower mold is located at the bottom end of the upper mold. At the bottom end of the inner wall of the lower mold, there is a movable plate. On both sides of the upper mold, there are first contact blocks. Below the first contact blocks and inside the connecting base, there is a displacement block. In front of the displacement block and inside the lower mold, there is a through groove. On one side of the inner wall of the through groove, there is a guide seat. At the top end of the guide seat, there is a second contact block. Above the second contact block and at the bottom end of the movable plate, there is a first convex block. On both sides of the first convex block and at the top end of the second contact block, there are a top block and a second convex block respectively. Behind the second convex block and at the top end of the inner wall of the lower mold, there is a clamping switch.

[0007] Preferably, a pneumatic driving mechanism is provided at the top end of the connecting plate. The pneumatic driving mechanism includes a cylinder and a pneumatic rod. The bottom end of the pneumatic rod penetrates through the connecting plate and extends to the top end of the upper mold. The connecting plate is connected to the upper mold through the pneumatic driving mechanism.

[0008] Preferably, on one end of the first contact block and inside the guide frame, there is a guide groove. One end of the first contact block extends into the inner side of the guide groove. The bottom end of the guide groove extends into the inner side of the connecting base. The guide groove is connected to the connecting base in a through manner. The opposite surfaces of the first contact block and the displacement block are both inclined surfaces.

[0009] Preferably, at the rear end of the displacement block and inside the connecting base, there is a connecting groove. Inside the inner wall of the connecting groove, there is a spring. The displacement block is movably connected to the connecting base through the spring.

[0010] Preferably, at the rear end of the second contact block and inside the guide seat, there is a return spring. The guide seat and the second contact block are movably connected through the return spring.

[0011] Preferably, the movable plate and the first convex block are of an integral structure. Below the first convex block and at the bottom end of the lower mold, there is a through hole. The end face at the bottom of the first convex block penetrates through the through hole and extends above the second contact block.

[0012] Preferably, behind the second contact block and inside the displacement block, there is a clamping groove. Inside the clamping groove, there is a pneumatic gripper. The pneumatic gripper is electrically connected to the clamping switch.

[0013] Beneficial effects

[0014] The utility model provides a buffer mechanism for a mold. Compared with the prior art, the following beneficial effects are achieved:

[0015] When the upper mold presses downwards, the upper mold squeezes and buffers through the first contact blocks on both sides with the displacement blocks inside the connection base. And under the squeezing and buffering of the first contact blocks, the displacement blocks displace towards the second contact blocks inside the lower mold. When the displacement blocks contact the second contact blocks, the top of the displacement blocks touches the clamping switch, and the clamping switch activates the pneumatic gripper to clamp the second contact blocks by the displacement blocks. Thus, after the upper mold finishes stamping, the displacement blocks reset. During the reset process of the displacement blocks, the top block at the top of the second contact block contacts the first convex block at the bottom end of the movable plate, so that the movable plate is ejected inside the lower mold, facilitating the demolding of the mold and the stamping material. And when the second convex block at one end of the second contact block touches the clamping switch, the clamping of the second contact block by the pneumatic gripper is released, and the displacement blocks and the second contact blocks reset. Description of the Drawings

[0016] Figure 1 is a schematic structural diagram of the whole of the utility model;

[0017] Figure 2 is a schematic structural diagram of the inside of the lower mold of the utility model;

[0018] Figure 3 is a schematic structural diagram of the second contact block of the utility model.

[0019] In the figure: 1, device base; 2, support frame; 3, pneumatic drive mechanism; 4, guide frame; 401, guide groove; 5, connecting plate; 6, upper mold; 7, lower mold; 8, connection base; 9, movable plate; 901, first convex block; 10, first contact block; 11, displacement block; 1101, clamping groove; 12, second contact block; 1201, top block; 1202, second convex block; 13, clamping switch; 14, guide seat. Specific Embodiments

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0021] Please refer to Figures 1-3, the present utility model provides a technical solution: a buffer mechanism for a mold, including a device base 1. On one side of the top of the device base 1, there is a support frame 2. At the front end of the support frame 2, there is a connecting plate 5. On both sides of the connecting plate 5, there are guide frames 4. At the bottom end of the guide frame 4 on the top of the device base 1, there is a connecting base 8. Inside the connecting base 8, there is a displacement block 11. Below the connecting plate 5 and inside the inner wall of the guide frame 4, there are an upper mold 6 and a lower mold 7 in sequence. At the top of the connecting plate 5, there is a pneumatic driving mechanism 3. The pneumatic driving mechanism 3 includes a cylinder and a pneumatic rod. The bottom end of the pneumatic rod penetrates through the connecting plate 5 and extends to the top of the upper mold 6. The connecting plate 5 is connected to the upper mold 6 through the pneumatic driving mechanism 3, so as to facilitate the upper mold 6 to punch the lower mold 7 through the pneumatic driving mechanism 3;

[0022] The lower mold 7 is located at the bottom of the upper mold 6. On both sides of the upper mold 6, there are first contact blocks 10. At one end of the first contact block 10, there is a guide groove 401 inside the guide frame 4. One end of the first contact block 10 extends into the inside of the guide groove 401. The bottom end of the guide groove 401 extends into the inside of the connecting base 8. The guide groove 401 is connected to the connecting base 8 in a through manner. Below the first contact block 10 and inside the connecting base 8, there is a displacement block 11. The opposite surfaces of the first contact block 10 and the displacement block 11 are both inclined surfaces. At the rear end of the displacement block 11 and inside the connecting base 8, there is a connecting groove. Inside the inner wall of the connecting groove, there is a spring. The displacement block 11 is movably connected to the connecting base 8 through the spring. Thus, during the process of the upper mold 6 punching downward, the upper mold 6 is buffered by being squeezed with the displacement block 11 through the first contact blocks 10 on both sides;

[0023] A through groove is provided inside the lower die 7 in front of the displacement block 11. A guide seat 14 is provided on one side of the inner wall of the through groove. A second contact block 12 is provided at the top of the guide seat 14. A return spring is provided inside the guide seat 14 at the rear end of the second contact block 12. The guide seat 14 and the second contact block 12 are movably connected by the return spring. An activity plate 9 is provided at the bottom end of the inner wall of the lower die 7. A first convex block 901 is provided at the bottom end of the activity plate 9 above the second contact block 12. The activity plate 9 and the first convex block 901 are of an integral structure. A through hole is provided at the bottom end of the lower die 7 below the first convex block 901. The end face at the bottom of the first convex block 901 penetrates through the through hole and extends above the second contact block 12. A top block 1201 and a second convex block 1202 are respectively provided at the top of the second contact block 12 on both sides of the first convex block 901. A clamping switch 13 is provided at the top end of the inner wall of the lower die 7 behind the second convex block 1202. A clamping groove 1101 is provided inside the displacement block 11 behind the second contact block 12. A pneumatic gripper is provided inside the clamping groove 1101. The pneumatic gripper is electrically connected to the clamping switch 13. Further, under the extrusion and buffering of the first contact block 10 by the displacement block 11, the displacement block 11 displaces towards the second contact block 12 inside the lower die 7. When the displacement block 11 contacts the second contact block 12, the top of the displacement block 11 touches the clamping switch 13, and the clamping switch 13 activates the pneumatic gripper to enable the displacement block 11 to clamp the second contact block 12. Thus, after the upper die 6 finishes stamping, the displacement block 11 is reset. During the reset process of the displacement block 11, the top block 1201 at the top of the second contact block 12 contacts the first convex block 901 at the bottom end of the activity plate 9, so that the activity plate 9 is pushed out inside the lower die 7, facilitating the demoulding of the die and the stamping material. When the second convex block 1202 at one end of the second contact block 12 touches the clamping switch 13, the clamping of the second contact block 12 by the pneumatic gripper is released, and the displacement block 11 and the second contact block 12 are reset.

[0024] During operation, place the stamping material into the lower die 7, turn on the power supply, start the device, and use the pneumatic drive mechanism 3 to make the upper die 6 stamp on the lower die 7. During the downward stamping process of the upper die 6, the upper die 6 squeezes and buffers with the displacement blocks 11 inside the connecting base 8 through the first contact blocks 10 on both sides. And under the squeezing and buffering of the first contact blocks 10, the displacement blocks 11 displace towards the second contact blocks 12 inside the lower die 7. When the displacement blocks 11 contact the second contact blocks 12, the tops of the displacement blocks 11 touch the clamping switches 13, and the clamping switches 13 activate the pneumatic jaws to make the displacement blocks 11 clamp the second contact blocks 12. Thus, after the upper die 6 finishes stamping, the displacement blocks 11 reset. During the reset process of the displacement blocks 11, the top blocks 1201 at the tops of the second contact blocks 12 contact the first convex blocks 901 at the bottom ends of the movable plates 9, so that the movable plates 9 are pushed out inside the lower die 7, facilitating the demoulding of the die and the stamping material. And when the second convex blocks 1202 at one ends of the second contact blocks 12 touch the clamping switches 13, the clamping of the second contact blocks 12 by the pneumatic jaws is released, and the displacement blocks 11 and the second contact blocks 12 reset.

[0025] Meanwhile, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

Claims

1. A mold buffer mechanism, comprising a device base (1), characterized in that: A support frame (2) is provided on one side of the top of the device base (1), a connecting plate (5) is provided at the front end of the support frame (2), guide frames (4) are provided on both sides of the connecting plate (5), a connecting base (8) is provided at the bottom end of the guide frame (4) at the top of the device base (1), a displacement block (11) is provided on the inner side of the connecting base (8), an upper mold (6) and a lower mold (7) are provided in sequence on the inner wall of the guide frame (4) below the connecting plate (5), the lower mold (7) is located at the bottom end of the upper mold (6), a movable plate (9) is provided at the bottom end of the inner wall of the lower mold (7), first contact blocks (10) are provided on both sides of the upper mold (6), and the first contact blocks (11) are provided on the inner side of the connecting base (8). A displacement block (11) is provided below a contact block (10) and located on the inner side of a connecting base (8); a through slot is provided in front of the displacement block (11) and located on the inner side of a lower mold (7); a guide seat (14) is provided on one side of an inner wall of the through slot; a second contact block (12) is provided at the top end of the guide seat (14); a first protrusion (901) is provided above the second contact block (12) and located at the bottom end of a movable plate (9); a top block (1201) and a second protrusion (1202) are provided on both sides of the first protrusion (901) and located at the top end of the second contact block (12); a clamping switch (13) is provided at the rear end of the inner wall of the lower mold (7) and located behind the second protrusion (1202).

2. A mold buffer mechanism according to claim 1, characterized in that: A pneumatic drive mechanism (3) is provided at the top end of the connecting plate (5), and the pneumatic drive mechanism (3) comprises a cylinder and a gas rod, the bottom end of the gas rod passes through the connecting plate (5) and extends to the top end of the upper mold (6), and the connecting plate (5) is connected to the upper mold (6) via the pneumatic drive mechanism (3).

3. A mold buffer mechanism according to claim 1, characterized in that: One end of the first contact block (10) is located on the inner side of the guide frame (4) and is provided with a guide groove (401); one end of the first contact block (10) extends to the inner side of the guide groove (401); the bottom end of the guide groove (401) extends to the inner side of the connecting base (8); the guide groove (401) is connected to the connecting base (8); and the opposing surfaces of the first contact block (10) and the displacement block (11) are both inclined surfaces.

4. A mold buffer mechanism according to claim 3, characterized in that: The rear end of the displacement block (11) is located on the inner side of the connection base (8) and is provided with a connection groove, the inner wall of the connection groove is provided with a spring, and the displacement block (11) is movably connected to the connection base (8) via the spring.

5. A mold buffer mechanism according to claim 1, characterized in that: A return spring is provided on the inner side of the guide seat (14) at the rear end of the second contact block (12); the guide seat (14) and the second contact block (12) are movably connected via the return spring.

6. A mold buffer mechanism according to claim 1, characterized in that: The movable plate (9) and the first protrusion (901) are an integral structure, a through hole is provided at the bottom end of the lower mold (7) below the first protrusion (901), and the end surface of the bottom of the first protrusion (901) passes through the through hole and extends to the top of the second contact block (12).

7. A mold buffer mechanism according to claim 5, characterized in that: A clamping groove (1101) is provided on the inner side of the displacement block (11) behind the second contact block (12), and a pneumatic clamping claw is provided on the inner side of the clamping groove (1101), and the pneumatic clamping claw is electrically connected to the clamping switch (13).

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