Processing device for etching sub-wavelength periodic stripes by adopting nanosecond laser

Abstract

The utility model discloses a processing device adopting nanosecond laser to etch sub-wavelength periodic stripes, which comprises a working table, a processing groove is arranged in the middle of the top end of the working table, the top end of the working table is fixedly connected with a fixing frame, an adjusting mechanism is arranged at the bottom end of one side of the fixing frame, and the adjusting mechanism is arranged on the working table. A moving mechanism is arranged in the top end of the fixing frame, and a nanosecond laser is arranged at the bottom end of the moving mechanism. The moving mechanism is arranged at the top end of the nanosecond laser, the nanosecond laser can be driven by the moving mechanism to be adjusted to the position and the distance between the nanosecond laser and a machined part in the machining groove, and meanwhile the adjusting mechanism is arranged on one side of the ultrasonic transmitter so that the installation height of the ultrasonic transmitter on one side of the fixing frame can be freely adjusted. Therefore, the uniformity of pulse energy distribution of the ultrasonic transmitter is ensured, and the etching fineness is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of nano processing, in particular to a processing device for etching sub-wavelength periodic stripes by using nanosecond laser. Background Technique

[0002] The processing device for etching sub-wavelength periodic stripes by using nanosecond laser is a high-precision and high-efficiency nano processing device. The device mainly consists of a nanosecond laser, a processing tank, an ultrasonic emitter and a precision adjustment mechanism. The nanosecond laser emits laser pulses with high energy density for etching the surface of the material. The processing tank is used to place the material to be processed to ensure the accurate focusing of the laser beam. The ultrasonic emitter emits ultrasonic waves to assist the laser etching process, improving the processing precision and efficiency. The adjustment mechanism allows the operator to adjust the position and parameters of the laser according to the processing requirements. This processing device can precisely control the laser etching process, prepare materials with sub-wavelength periodic stripe structures, and provide strong technical support for the manufacture of micro-nano devices.

[0003] In the processing device for etching sub-wavelength periodic stripes by using nanosecond laser disclosed in the Chinese utility model patent application publication specification CN217071157U, an ultrasonic emitter is arranged on one side of the processing tank. When ultrasonic waves propagate in the liquid, their sound pressure causes periodic changes in the liquid molecules, prompting the refractive index of the liquid to also change periodically, forming a density wave. At this time, if parallel monochromatic light passes through this liquid with alternating density along the direction perpendicular to the propagation direction of the ultrasonic waves, it will be diffracted, and thus a relatively complete stripe structure can be etched. However, the overall flexibility of the processing device is low and it cannot be quickly adjusted according to the actual processing situation, thus affecting the convenience of using the processing device. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a processing device for etching sub-wavelength periodic stripes by using nanosecond laser to solve the problems put forward in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A processing device for etching sub-wavelength periodic stripes by using nanosecond laser, including a workbench, a processing tank is arranged at the middle position of the top end of the workbench, a fixing frame is fixedly connected to the top end of the workbench, an adjustment mechanism is arranged at the bottom end of one side of the fixing frame, a moving mechanism is arranged inside the top end of the fixing frame, a nanosecond laser is arranged at the bottom end of the moving mechanism, and a dust-proof mechanism is arranged outside the nanosecond laser.

[0006] Preferably, the adjusting mechanism includes positioning holes evenly arranged at equal intervals on one side of the fixed frame. A fixed arm is arranged outside the fixed frame. A bolt is threadedly connected inside one side of the fixed arm. One side of the bolt is fixedly connected to a movable disk. One side of the movable disk is fixedly connected to a positioning rod whose exterior is inserted into the positioning hole. An ultrasonic transmitter is installed on one side of the fixed arm.

[0007] Preferably, the moving mechanism includes a servo motor installed on one side of the top end inside the fixed frame. A threaded rod is installed at the output shaft end of the servo motor. Threaded blocks are threadedly connected to both sides of the exterior of the threaded rod. The bottom end of the threaded block is fixedly connected to a connecting plate.

[0008] Preferably, electric push rods are installed on both sides of the bottom end of the connecting plate. The bottom end of the electric push rod is fixedly connected to a mounting plate.

[0009] Preferably, the dust-proof mechanism includes card slots arranged at the top ends of both sides of the nanosecond laser. A protective shell is arranged outside the nanosecond laser. At the top ends of both sides inside the protective shell, there are movable connections with card blocks inserted into the card slots.

[0010] Preferably, one side of the card block is fixedly connected to a movable block. One side of the movable block is fixedly connected to a spring.

[0011] Compared with the prior art, the beneficial effects of the present utility model are:

[0012] 1. For this processing device that uses nanosecond laser to etch sub-wavelength periodic stripes, by arranging a moving mechanism at the top of the nanosecond laser, the moving mechanism can drive the nanosecond laser to adjust the position and distance from the workpiece in the processing groove. At the same time, an adjusting mechanism is arranged on one side of the ultrasonic transmitter, which can freely adjust the installation height of the ultrasonic transmitter on one side of the fixed frame, thereby ensuring the uniformity of the pulse energy distribution of the ultrasonic transmitter and improving the fineness of etching.

[0013] 2. For this processing device that uses nanosecond laser to etch sub-wavelength periodic stripes, by arranging a protective shell on the nanosecond laser, when the card blocks on both sides inside the protective shell are inserted into the card slots on the nanosecond laser, the protective shell can be sleeved outside the nanosecond laser. At this time, the protective shell helps prevent dust and dirt from accumulating on the surface or inside of the laser, affecting the performance and stability of the laser. By pulling down the protective shell, the card block can be forced to be pulled out from the card slot on the nanosecond laser, completing the quick removal of the protective shell. The operation is simple and convenient, ensuring the safety and stability of the subsequent use of the nanosecond laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0015] Figure 2 This is the front view structural schematic diagram of the present utility model;

[0016] Figure 3 For the present utility model Figure 2 The enlarged structural schematic diagram at position A in it;

[0017] Figure 4 This is the top view structural schematic diagram of the ultrasonic transmitter of the present utility model.

[0018] In the figure: 1, workbench; 2, processing groove; 3, fixing frame; 301, positioning hole; 4, adjusting mechanism; 5, fixing arm; 501, bolt; 502, movable disk; 503, positioning rod; 6, ultrasonic transmitter; 7, moving mechanism; 701, servo motor; 702, threaded rod; 703, threaded block; 704, connecting plate; 705, electric push rod; 706, mounting plate; 8, nanosecond laser; 801, card slot; 9, dust-proof mechanism; 901, protective shell; 902, clamping block; 903, movable block; 904, spring. Specific embodiments

[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0020] Please refer to Figures 1-4 , the present utility model provides two technical solutions:

[0021] Embodiment 1

[0022] A processing device for etching sub-wavelength periodic stripes by using a nanosecond laser, comprising a workbench 1, a processing groove 2 is arranged at the middle position of the top end of the workbench 1, a fixing frame 3 is fixedly connected to the top end of the workbench 1, an adjusting mechanism 4 is arranged at the bottom end of one side of the fixing frame 3, a moving mechanism 7 is arranged inside the top end of the fixing frame 3, a nanosecond laser 8 is arranged at the bottom end of the moving mechanism 7, a dust-proof mechanism 9 is arranged outside the nanosecond laser 8, the processing groove 2 is located below the nanosecond laser 8 and is used to accommodate the material to be processed. The design of the processing groove takes into account the irradiation range and processing accuracy of the laser.

[0023] The adjustment mechanism 4 includes positioning holes 301 evenly arranged at equal distances on one side of the fixed frame 3. An outer part of the fixed frame 3 is provided with a fixed arm 5. An internal thread on one side of the fixed arm 5 is connected with a bolt 501. One side of the bolt 501 is fixedly connected with a movable disk 502. One side of the movable disk 502 is fixedly connected with a positioning rod 503 whose outer part is inserted into the positioning hole 301. An ultrasonic transmitter 6 is installed on one side of the fixed arm 5. When the bolt 501 on the fixed arm 5 is rotated, the bolt 501 can drive the positioning rod 503 through the movable disk 502 to insert into the positioning hole 301 on the fixed frame 3. At this time, the ultrasonic transmitter 6 can be installed on one side of the ultrasonic transmitter 6. The ultrasonic transmitter 6 is arranged on one side of the processing groove 2, and the ultrasonic wave it emits is perpendicular to the parallel monochromatic light beam emitted by the nanosecond laser 8. When the ultrasonic wave propagates in the liquid, it will cause periodic changes in the liquid molecules, thereby affecting the refractive index of the liquid and forming a density wave. When the parallel monochromatic light passes through this liquid with alternating density, diffraction will occur, thereby assisting in etching a relatively complete stripe structure.

[0024] The moving mechanism 7 includes a servo motor 701 installed on one side of the inner top end of the fixed frame 3. An output shaft end of the servo motor 701 is installed with a threaded rod 702. Threaded blocks 703 are threadedly connected to both sides of the outer part of the threaded rod 702. A bottom end of the threaded block 703 is fixedly connected with a connecting plate 704. When the servo motor 701 is started, it can drive the threaded rod 702 to rotate. At this time, the threaded blocks 703 on both sides of the outer part of the threaded rod 702 can drive the nanosecond laser 8 below through the connecting plate 704 to move horizontally.

[0025] On both sides of the bottom end of the connecting plate 704, electric push rods 705 are installed. A bottom end of the electric push rod 705 is fixedly connected with a mounting plate 706. When the electric push rod 705 is started, it can push the mounting plate 706 to adjust the distance between the nanosecond laser 8 and the workpiece in the processing groove 2.

[0026] Embodiment 2

[0027] The main difference from Embodiment 1 is that:

[0028] A processing device for etching sub-wavelength periodic stripes using a nanosecond laser. The dust-proof mechanism 9 includes card slots 801 provided at the top ends on both sides of the nanosecond laser 8. The nanosecond laser 8 is used to emit nanosecond-level laser pulses. With its high energy density and short pulse width, the nanosecond laser can achieve sub-wavelength-level fine processing.

[0029] The outside of the nanosecond laser 8 is provided with a protective shell 901. At the top ends on both sides inside the protective shell 901, there are movably connected clamping blocks 902 inserted into the clamping slots 801. One side of the clamping block 902 is fixedly connected with a movable block 903, and one side of the movable block 903 is fixedly connected with a spring 904. When the clamping block 902 inside the protective shell 901 is stressed, the spring 904 can be compressed through the movable block 903. At this time, the clamping block 902 can be retracted into the inside of the protective shell 901. When the stress on the clamping block 902 is removed, due to the reaction force of the compressed spring 904, the clamping block 902 can be pushed out of the inside of the protective shell 901 through the movable block 903. At the same time, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0030] When the embodiment of the present application is in use: The coated optical glass is placed in the processing tank 2, and the position of the nanosecond laser 8 is adjusted through the moving mechanism 7 while the parameters of the nanosecond laser 8 are adjusted. The nanosecond laser 8 emits a laser beam to etch the silicon oxide film on the surface of the optical glass. During the etching process, laser irradiation causes the ionization of the material, generating a large number of free electrons, making the intermediate material exhibit metallic characteristics. As the laser energy is continuously input, the material temperature rises, resulting in high-pressure melting, and the molten material expands to release pressure. Subsequently, the temperature drops to a certain value to form a porous material. The scattering effect of the particle structure on the incident light changes the wave vector of the light wave, leading to the formation of surface plasmons and TM waves. The combined action of these two waves forms Coulomb explosion to ablate a groove structure perpendicular to the polarization direction. At the same time, during the etching process, the ultrasonic waves emitted by the ultrasonic transmitter 6 interact with the laser beam emitted by the nanosecond laser 8, affecting the propagation and energy distribution of the laser on the material surface, and helping to etch a relatively complete stripe structure.

[0031] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only the preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A processing device for etching sub-wavelength periodic stripes using nanosecond laser, comprising a workbench (1), characterized in that: A processing groove (2) is arranged in the middle of the top of the workbench (1); a fixing frame (3) is fixedly connected to the top of the workbench (1); an adjusting mechanism (4) is arranged at the bottom of one side of the fixing frame (3); a moving mechanism (7) is arranged inside the top of the fixing frame (3); a nanosecond laser (8) is arranged at the bottom of the moving mechanism (7); and a dustproof mechanism (9) is arranged outside the nanosecond laser (8).

2. The processing device for etching sub-wavelength periodic stripes using nanosecond laser according to claim 1, characterized in that: The adjustment mechanism (4) comprises positioning holes (301) uniformly arranged at equal distances on one side of the fixing frame (3); a fixing arm (5) is arranged outside the fixing frame (3); a bolt (501) is connected to the internal thread of one side of the fixing arm (5); a movable disk (502) is fixedly connected to one side of the bolt (501); a positioning rod (503) is fixedly connected to the outside of the movable disk (502) and is inserted into the positioning hole (301); and an ultrasonic transmitter (6) is installed on one side of the fixing arm (5).

3. The processing device for etching sub-wavelength periodic stripes using nanosecond laser according to claim 1, characterized in that: The moving mechanism (7) comprises a servo motor (701) installed on one side of the top end of the fixed frame (3); a threaded rod (702) is installed on the output shaft end of the servo motor (701); threaded blocks (703) are threadedly connected on both sides of the outside of the threaded rod (702); and a connecting plate (704) is fixedly connected to the bottom end of the threaded block (703).

4. The processing device for etching sub-wavelength periodic stripes using nanosecond laser according to claim 3, characterized in that: Electric push rods (705) are installed on both sides of the bottom end of the connecting plate (704), and the bottom end of the electric push rod (705) is fixedly connected to a mounting plate (706).

5. The processing device for etching sub-wavelength periodic stripes using nanosecond laser according to claim 1, characterized in that: The dustproof mechanism (9) comprises card slots (801) arranged at the top ends of both sides of the nanosecond laser (8); a protective shell (901) is arranged outside the nanosecond laser (8); and card blocks (902) are movably connected at the top ends of both sides of the protective shell (901) and are plugged into the card slots (801).

6. The processing device for etching sub-wavelength periodic stripes using nanosecond laser according to claim 5, characterized in that: One side of the clamping block (902) is fixedly connected to a movable block (903), and one side of the movable block (903) is fixedly connected to a spring (904).

Images