Cutting and grinding integrated equipment for small-specification rectangular rod

Abstract

The utility model discloses cutting and grinding integrated equipment for small-specification rectangular rods, which comprises half-rod cutting equipment and half-rod grinding equipment which are connected with each other, and the half-rod cutting equipment is used for carrying out squaring cutting and half-and-half cutting operation on a silicon rod with a circular section so as to form at least two half rods with rectangular sections; the semi-rod grinding equipment is used for carrying out surface grinding operation and chamfering operation on a semi-rod, so that the integrated operation of multiple procedures such as squaring cutting, half-and-half cutting, surface grinding and chamfering of an original silicon rod with a circular cross section is completed, the equipment is high in overall integration degree and simple in structure, the production efficiency is improved, the cost is saved, and the quality of product machining operation is improved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon workpiece processing, and in particular to an integrated cutting and grinding device for small-sized rectangular bars, a cutting and grinding method for small-sized rectangular bars, a cutting device for small-sized rectangular bars, and a grinding device for small-sized rectangular bars. Background Art

[0002] In order to improve the conversion efficiency of photovoltaic modules, shingled modules have emerged. A shingled module refers to a series connection of multiple solar cells in a front-to-back stacked form, with no gaps between the solar cells and no solder tapes blocking the solar cells. Therefore, more solar cells can be accommodated in the same area of the module, expanding the effective power generation area. In the current related technologies, to obtain silicon wafers for manufacturing shingled modules, silicon rods that can be sliced into silicon wafers need to be fabricated first, and the silicon rods are usually fabricated by re-cutting and grinding the square silicon rods produced in the original process.

[0003] In the related processing techniques for silicon rods, several processes such as square cutting, surface grinding, rounding / chamfering, etc. are involved. Generally, most of the existing silicon rods have a cylindrical structure. The silicon rods are square-cut by a silicon rod square-cutting device, so that the cross-section of the silicon rod after square cutting is quasi-rectangular (including quasi-square), and the overall square-cut silicon rod is quasi-cuboid-shaped (which can also include quasi-cubic-shaped). A quasi-rectangle includes a rectangle with adjacent sides orthogonal or an included angle within a predetermined angle range, a rectangle with rounded corners between adjacent sides, a rectangle with connecting short sides between adjacent sides, etc.

[0004] Taking a single-crystal silicon rod as an example, in some related technologies, the formation process of a single-crystal silicon rod may include: first, using a silicon rod cutting machine to perform a cutting operation on the original long silicon rod to form multiple short silicon rods; after the cutting is completed, using a silicon rod squaring machine to perform a squaring operation on the short silicon rods to form a single-crystal silicon rod with a quasi-rectangular cross-section. Among them, the specific implementation of using a silicon rod cutting machine to perform a cutting operation on the original long silicon rod to form multiple short silicon rods can refer to patent disclosure documents such as CN105856445A, CN105946127A, and CN105196433A, etc. The specific implementation of using a silicon rod squaring machine to perform a squaring operation on the short silicon rods to form a single-crystal silicon rod with a quasi-rectangular cross-section can refer to patent disclosure documents such as CN105818285A, etc. However, the formation process of a single-crystal silicon rod is not limited to the foregoing technologies. In alternative examples, the formation process of a single-crystal silicon rod may further include: first, using a full silicon rod squaring machine to perform a squaring operation on the original long silicon rod to form a long single-crystal silicon rod with a quasi-rectangular cross-section; after the squaring is completed, using a silicon rod cutting machine to perform a cutting operation on the long single-crystal silicon rod after squaring and cutting to form short single-crystal silicon rods. Among them, the specific implementation of using the full silicon rod squaring machine to perform a squaring operation on the original long silicon rod to form a long single-crystal silicon rod with a quasi-rectangular cross-section can refer to patent disclosure documents such as CN106003443A, etc.

[0005] After using a squaring device to perform squaring and cutting on a cylindrical single-crystal silicon rod to form a silicon rod with a quasi-rectangular cross-section, a grinding device can be used to perform operations such as surface grinding, rounding / chamfering on the quasi-rectangular silicon rod. Among them, the specific implementation of the grinding device performing operations such as surface grinding, rounding / chamfering on the quasi-rectangular silicon rod can refer to patent disclosure documents such as CN105835247A, etc.

[0006] With the development of battery technology, the demand for small silicon wafers is increasing, and the demand for thin wafers is also relatively large. The thinner the silicon wafer, the greater the cutting difficulty and the more difficult it is to ensure the cutting quality. For example, in current technologies, slicing operations are performed on large square silicon rods. If the required thickness of the sliced silicon wafers is relatively thin, it will undoubtedly increase the difficulty of slicing the silicon wafers. During the slicing process, the cross-section of the silicon wafers is more likely to be damaged and defective. And for the slicing operations on large square silicon rods, in order to minimize the damage and defects of the silicon wafers as much as possible, the slicing speed has to be controlled, reducing the slicing efficiency. Therefore, the industry has also proposed certain improvements to current technologies. For example, first perform cutting on existing large square silicon rods. For example, cut the large square silicon rod in half to form two smaller square silicon rods, and then perform subsequent processing such as grinding operations and slicing operations on the smaller square silicon rods.

[0007] However, in the prior art, there is no dedicated equipment for the cutting and grinding operations of the original silicon rod. In the existing equipment technology, the operations required for each process operation (such as half-cutting, grinding, etc.) are independently arranged. The corresponding processing equipment is scattered in different production units or production workshops, or distributed in different production areas of multiple production workshops in the same production unit. The transfer of workpieces for different process operations requires handling and allocation. And pre-treatment work may be required before each process operation. In this way, the processes are complicated, the efficiency is low, and it is easy to affect the quality of the silicon rod processing operation. More manpower or transfer equipment is needed, and there are great safety hazards. In addition, there are many flow links between the operation equipment of each process, which increases the risk of workpiece damage during the transfer of workpieces, easily produces unqualified products caused by non-production factors, reduces the product qualification rate and the unreasonable losses brought by the existing processing methods. Summary of the Invention

[0008] In view of the above-mentioned disadvantages of the related art, the purpose of the present application is to provide an integrated cutting and grinding equipment for small-sized rectangular rods, which is used to solve the problems of complex equipment, inconvenient operation, poor cutting quality and low efficiency existing in the existing related technologies.

[0009] To achieve the above purpose and other related purposes, the first aspect of the present application provides an integrated cutting and grinding equipment for small-sized rectangular rods, including: a half-rod cutting device, including a cutting machine base with a cutting processing platform; one or more cutting station groups are provided on the cutting processing platform, and each cutting station group includes a first cutting station and a second cutting station; wherein, a first silicon rod cutting device is configured on the first cutting station, and the first silicon rod cutting device is used for performing a first cutting operation on a silicon rod with a circular cross-section, so that the silicon rod forms two parallel first side cut surfaces; a second silicon rod cutting device is configured on the second cutting station, and the second silicon rod cutting device is used for performing a second cutting operation on the silicon rod with two first side cut surfaces, so that the silicon rod obtains at least two half-rods with a rectangular cross-section and being small-sized rectangular rods after forming two parallel second side cut surfaces and at least one dividing surface located between the two second side cut surfaces, the second side cut surface is perpendicular to the first side cut surface, and the dividing surface is parallel to the second side cut surface; a silicon rod loading and unloading device, arranged on the half-rod cutting device for unloading and loading the half-rod from the half-rod cutting device for grinding, including a silicon rod mounting frame straddling the cutting machine base along the transposition direction, a silicon rod clamp for clamping two end faces of the silicon rod, and a clamp transposition mechanism for driving the silicon rod clamp to move along the transposition direction on the silicon rod mounting frame; and a half-rod grinding device, connected with the silicon rod loading and unloading device, for performing surface grinding operations and chamfering operations on the half-rod loaded by the silicon rod loading and unloading device.

[0010] In summary, the cutting and grinding integrated equipment for small-sized rectangular rods provided by the present application uses an interconnected semi-rod cutting device and a semi-rod grinding device. The semi-rod cutting device is used to perform squaring cutting and half-cutting operations on a silicon rod with a circular cross-section to form at least two semi-rods with a rectangular cross-section. The semi-rod grinding device is used to perform surface grinding and chamfering operations on the semi-rods, thereby completing the integrated operations of multiple processes such as squaring cutting, half-cutting, surface grinding, and chamfering of the original silicon rod with a circular cross-section. The overall integration of the equipment is high, the structure is simple, the production efficiency is improved, the cost is saved, and the quality of the product processing operation is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The specific features involved in the present application are shown in the appended claims. The features and advantages of the invention involved in the present application can be better understood by referring to the exemplary embodiments and the drawings described in detail below. A brief description of the drawings is as follows:

[0012] Figure 1 It shows a schematic structural diagram of the cutting and grinding integrated equipment for small-sized rectangular rods of the present application in an embodiment.

[0013] Figure 2 and Figure 3 It shows Figure 1 a schematic structural diagram of the semi-rod cutting device in

[0014] Figure 4 a schematic structural diagram of the semi-rod cutting device in another embodiment.

[0015] Figure 5 It shows a schematic structural diagram of the first wire cutting unit in the first silicon rod cutting device in an embodiment.

[0016] Figure 6 It shows a schematic structural diagram of the first silicon rod transfer device and the first edge skin anti-cracking device in an embodiment.

[0017] Figure 7 It shows Figure 6 a schematic structural diagram of the edge skin clamp of the first edge skin anti-cracking device in an embodiment.

[0018] Figures 8 to 10 It shows Figure 6 a schematic diagram of the state of clamping the silicon rod by the edge skin anti-cracking device in an embodiment.

[0019] Figure 11 and Figure 12 It shows a schematic structural diagram of the first silicon rod cutting device, the first edge skin anti-cracking device, and the edge skin blanking conveying mechanism in an embodiment.

[0020] Figure 13Shown is a schematic structural view of a second silicon rod cutting device in an embodiment.

[0021] Figure 14 Shown as Figure 1 a schematic structural view of a semi-rod grinding device.

[0022] Figure 15 Shown is a schematic structural view of a first semi-rod clamping device in an embodiment.

[0023] Figure 16 is Figure 14 a schematic structural view of a side skin bearing device and a chamfering device located at a chamfering position in an embodiment. Detailed implementation manners

[0024] The following is a description of the implementation manners of the present application by specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. In view of various deficiencies in the prior art, the applicant has previously proposed a square silicon rod cutting and grinding integrated machine, which integrates a cutting device and a grinding device. The cutting device can perform a cross-cutting operation on a horizontally placed original square silicon rod to form two smaller square silicon rods (semi-rods) up and down. The grinding device can perform a grinding operation on the two square silicon rods (semi-rods) formed after cross-cutting, thereby completing the integrated operation of multi-processes such as the half-cutting and grinding of the original square silicon rod, improving production efficiency and the quality of product processing operations. The specific implementation manners of the above-mentioned grinding device for performing cross-cutting operations and grinding operations on large square silicon rods can refer to patent disclosure documents such as CN115946248A and CN115871115A. However, in the above technical solution, the cutting device is used to perform a cross-cutting operation on the original square silicon rod that has completed the square-cutting operation to form two square silicon rods (semi-rods). The operation of square-cutting the initial silicon rod with a circular cross-section to form an original square silicon rod with a rectangular (or square) cross-section needs to be completed in other silicon rod square-cutting devices.

[0025] In view of this, the present application proposes a cutting and grinding integrated device for small-sized rectangular rods and a semi-rod cutting and grinding method. Among them, the cutting and grinding integrated device for small-sized rectangular rods includes a semi-rod cutting device and a semi-rod grinding device that are connected to each other. The semi-rod cutting device is used to perform square-cutting and half-cutting operations on a silicon rod with a circular cross-section to form at least two semi-rods with a rectangular cross-section. The semi-rod grinding device is used to perform a surface grinding operation and a chamfering operation on the semi-rods, thereby completing the integrated operation of multi-processes such as square-cutting, half-cutting, surface grinding, and chamfering of the original silicon rod with a circular cross-section. The overall integration of the device is high, the structure is simple, the production efficiency is improved, the cost is saved, and the quality of product processing operations is improved.

[0026] In the embodiments disclosed in the present application, to clarify the definition of directions and the operation modes between different structures, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined. The first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other pairwise. The depth extension direction of the cutting and grinding integrated device for small-sized rectangular bars, that is, the length direction when the silicon bar is placed thereon, is defined as the first direction (i.e., the front-back direction or the transfer direction), the width extension direction of the cutting and grinding integrated device for small-sized rectangular bars, that is, the left-right direction, is defined as the second direction (i.e., the left-right direction or the transposition direction), and the vertical direction, that is, the vertical direction, the plumb line direction, the up-down direction, or the lifting direction, is defined as the third direction.

[0027] In the present application, the cutting and grinding integrated device for small-sized rectangular bars can also be referred to as a semi-bar cutting and grinding integrated machine; the small-sized rectangular bar is subjected to squaring cutting and half-cutting operations on a silicon bar with a circular cross-section, so that the silicon bar forms two half-bars with a rectangular cross-section. Therefore, "semi-bar" can also be expressed in other terms, for example, "small-sized rectangular bar", "split bar", "sub-bar", "small silicon bar", "small square bar", and so on.

[0028] The present application discloses a semi-bar cutting and grinding method, including the following steps: performing squaring cutting and half-cutting operations on a silicon bar with a circular cross-section, so that the silicon bar forms at least two half-bars with a rectangular cross-section; performing surface grinding operations and chamfering operations on the half-bars.

[0029] Among them, the step of performing squaring cutting and half-cutting operations on a silicon bar with a circular cross-section, so that the silicon bar forms at least two half-bars with a rectangular cross-section, includes: performing a first cutting operation on the silicon bar with a circular cross-section along the length direction of the silicon bar, so that the silicon bar forms two parallel first side cutting surfaces; performing a second cutting operation on the silicon bar with two first side cutting surfaces along the length direction of the silicon bar, so that the silicon bar obtains at least two half-bars with a rectangular cross-section after forming two parallel second side cutting surfaces and at least one dividing surface between the two second side cutting surfaces. The second side cutting surface is perpendicular to the first side cutting surface, and the dividing surface is parallel to the second side cutting surface.

[0030] The step of performing surface grinding operations and chamfering operations on the half-bars includes: performing surface grinding operations on the two first side surfaces of the half-bars; performing surface grinding operations on the two second side surfaces of the half-bars; performing chamfering operations on the four edge portions of the half-bars.

[0031] The present application further discloses a cutting and grinding integrated device for small-sized rectangular bars, which can complete integrated operations of multiple processes such as squaring cutting, half-cutting, surface grinding, and chamfering on the original silicon bar with a circular cross-section. The following is a detailed description of the cutting and grinding integrated device for small-sized rectangular bars in the present application.

[0032] Please refer to Figure 1 , which shows a schematic structural diagram of the cutting and grinding integrated device for small-sized rectangular bars in the present application in an embodiment. AsFigure 1 As shown, the integrated equipment for cutting and grinding small-sized rectangular rods of the present application includes: a half-rod cutting device 1, a silicon rod loading and unloading device 17 and a half-rod grinding device 2 connected to each other, wherein the half-rod cutting device 1 is used to square and cut silicon rods with circular cross-sections to form at least two half-rods with rectangular cross-sections, and the half-rod grinding device 2 is used to grind and chamfer the half-rods transferred from the silicon rod loading and unloading device 17 in the half-rod cutting device 1.

[0033] See also Figure 2 , displayed as Figure 1 The structural diagram of the half-rod cutting equipment. About the half-rod cutting equipment 1, combined with Figure 1 and Figure 2 The half-rod cutting device 1 comprises: a cutting machine base 11, a first silicon rod transfer device 12, a first silicon rod cutting device 13, a second silicon rod transfer device 14, and a second silicon rod cutting device 15. It should be noted that, in the case of Figure 1 In the embodiment shown in the figure, the first direction, the second direction, and the third direction are arranged as shown in the figure. Specifically, the first direction is Figure 1 The X-axis in the second direction is Figure 1 The Y axis in the third direction is Figure 1 The Z axis in .

[0034] The cutting machine base is the main component of the half-rod cutting equipment and is used to provide a processing platform. In practical applications, the cutting machine base is large in size and weight to provide a large mounting surface and a firm overall stability. It should be understood that the cutting machine base can be used as a base for different structures or components that perform processing operations in the half-rod cutting equipment, and the specific structure of the cutting machine base can be changed based on different functional requirements or structural requirements. In some examples, the cutting machine base includes a fixed structure or a limiting structure such as a base, a column, a frame, etc. for receiving different components in the half-rod cutting equipment, which are all the cutting machine bases of the present application.

[0035] Meanwhile, in some examples, the cutting machine base may be an integrated base, and in some examples, the cutting machine base may include a plurality of independent bases.

[0036] The cutting machine base has a cutting processing platform, which can be divided into multiple functional areas according to the specific operation content of the silicon rod processing operation. In some embodiments, the cutting processing platform is provided with one or more cutting station groups, each of which includes a first cutting station and a second cutting station arranged in parallel. Figure 1 and Figure 2In the embodiment shown, the cutting processing platform is provided with a cutting station group, which includes a first cutting station and a second cutting station arranged in parallel along the second direction, wherein each cutting station includes a loading and unloading area and a cutting area, that is, the first cutting station includes a first loading and unloading area and a first cutting area, and the second cutting station includes a second loading and unloading area and a second cutting area. However, this is not limited to this, please refer to Figure 4 , which is a schematic diagram of the structure of the half-rod cutting device in another embodiment. Figure 4 In the embodiment shown, the cutting processing platform of the half-rod cutting device is provided with two cutting station groups, wherein each cutting station group includes a first cutting station and a second cutting station arranged in parallel along the second direction. Figure 1 and Figure 2 In the embodiment shown, or in the Figure 4 In the illustrated embodiment, a first silicon rod transfer device 12 and a first silicon rod cutting device 13 are arranged corresponding to the first cutting station, and a second silicon rod transfer device 14 and a second silicon rod cutting device 15 are arranged corresponding to the second cutting station.

[0037] The first cutting station includes a first loading and unloading area and a first cutting area. The first cutting station is equipped with a first silicon rod transfer device, which is used to carry a silicon rod with a circular cross section and transfer it between the first loading and unloading area and the first cutting area along a transfer direction. The first silicon rod cutting device is arranged in the first cutting area. The first silicon rod cutting device is provided with at least one first cutting wire saw, which is located in a vertical plane and arranged along the vertical direction or arranged at an angle to the vertical direction. The first silicon rod cutting device and the first silicon rod transfer device are relatively moved along the transfer direction so that the silicon rod with a circular cross section is first cut by at least one first cutting wire saw, so that the silicon rod forms two parallel first side cut surfaces. The vertical plane is composed of the first direction and the third direction.

[0038] The first silicon rod transfer device is used to carry the silicon rod and transfer it between the first loading and unloading area and the first cutting area of ​​the first cutting station along the transfer direction, wherein the silicon rod (circular in cross section) is placed horizontally on the first silicon rod transfer device and the axis of the silicon rod is consistent with the transfer direction, and the transfer direction is consistent with the first direction. In some embodiments, the first silicon rod transfer device may include: a first transfer channel, a first carrying platform, and a first transfer drive mechanism.

[0039] The first transfer channel is arranged along the transfer direction. In some implementations, the first transfer channel includes a first transfer guide rail. The length of the first transfer channel in the transfer direction is greater than the length of the silicon rod to be cut.

[0040] The first bearing platform is disposed on the first transfer channel for bearing the silicon rod. After being borne by the first bearing platform, the silicon rod is in a horizontal position, that is, the axis line of the silicon rod is consistent with the transfer direction (i.e., the first direction).

[0041] The first transfer driving mechanism is used to drive the first bearing platform and the silicon rod borne thereon to move along the transfer direction on the first transfer channel.

[0042] In some embodiments, the first bearing platform includes at least two first bearing members spaced along the transfer direction.

[0043] In some embodiments, the first bearing member includes: a first bearing bracket and a first bearing structure. Wherein, the first bearing bracket is disposed on the first transfer guide rail of the first transfer channel, and the first bearing structure is used to bear the silicon rod to be cut and contacts the arc surface of the silicon rod to be cut.

[0044] In some implementation manners, please refer to Figure 6 , which shows a schematic structural diagram including the first silicon rod transfer device. As Figure 6 shown, the whole of the first bearing member 121 is a Y-shaped bearing structure. The first bearing member can adopt a Y-shaped bearing structure. The bottom of the Y-shaped bearing structure serves as the bearing bracket, and the upper bifurcated part of the Y-shaped bearing structure serves as the first bearing structure, wherein the inner inclined surface of the upper bifurcated part contacts the arc surface of the silicon rod to be cut. Wherein, the top of the upper bifurcated part of the Y-shaped bearing structure can also have a certain width. When using the Y-shaped bearing structure to bear the silicon rod to be cut placed horizontally, the upper bifurcated part (i.e., the V-shaped part) of the Y-shaped bearing structure bears the silicon rod to be cut, and the two inner inclined surfaces of the upper bifurcated part contact the arc surface of the silicon rod to be cut. In this way, the silicon rod to be cut with a circular cross-section can also be centered, that is, the axis line of the silicon rod to be cut corresponds to the center of the upper intersection (i.e., the bottom groove of the V-shaped part).

[0045] As before, the first bearing platform includes at least two first bearing members spaced along the transfer direction, and the bearing surface formed by these first bearing members is adapted to the length of the silicon rod to be borne.

[0046] In some embodiments, the first bearing platform further includes: a first bearing member driving mechanism for driving at least one first bearing member to move along the transfer direction to adjust the bearing distance between the two first bearing members to adapt to silicon rods of different lengths.

[0047] In some embodiments, the first bearing member driving mechanism includes: a first bearing member moving guide rail arranged along the transfer direction; a first bearing member driving unit for driving at least one first bearing member to move along the first bearing member moving guide rail.

[0048] In some embodiments, the first carrier driving unit may include: an adjusting rack disposed along the transfer direction; an adjusting gear associated with the first carrier to be moved, and the adjusting gear meshes with the adjusting rack; an adjusting driving source for driving the adjusting gear to rotate so that the associated first carrier moves along the transfer direction. Wherein, when at least two first carriers in the first carrier platform are to be configured with carrier driving units, the adjusting rack can be shared. For example, when two first carriers are to be configured with the above-mentioned first carrier driving unit, it may include a shared adjusting rack, a first adjusting gear and a first adjusting driving source associated with the first first carrier, and a second adjusting gear and a second adjusting driving source associated with the second first carrier.

[0049] In some embodiments, the first carrier driving unit may include: an adjusting lead screw disposed along the transfer direction and associated with the first carrier; a lead screw driving source for driving the transfer lead screw to rotate so that the associated first carrier moves along the transposition direction. Wherein, when at least two first carriers in the first carrier platform are to be configured with first carrier driving units, the adjusting lead screw can be shared. The shared adjusting lead screw can be, for example, a bidirectional lead screw. When two first carriers are to be configured with the above-mentioned first carrier driving unit, it may include a bidirectional lead screw and a lead screw driving source. The two ends of the bidirectional lead screw are respectively provided with threads and the thread directions are opposite. The two ends of the bidirectional lead screw are respectively associated with two opposite first carriers. In practical applications, the bidirectional lead screw is driven by a lead screw driving source (such as a servo motor) to rotate so that the two associated opposite first carriers move towards each other (the two first carriers approach each other) or away from each other (the two first carriers move away from each other) along the bidirectional lead screw. The first transfer driving mechanism is used to drive the first carrier platform and the silicon rod carried thereon to move along the transfer direction on the first transfer channel.

[0050] In some embodiments, the first transfer driving mechanism includes: a first platform transfer guide rail disposed along the transfer direction; a first transfer driving unit for driving the first carrier platform to move along the first platform transfer guide rail.

[0051] In some embodiments, the first transfer driving unit includes: a transfer rack, a transfer gear, and a gear driving source. The transfer rack is disposed along the transfer direction. The transfer gear is associated with the first carrier platform and meshes with the transfer rack. In some embodiments, the transfer gear is associated with at least two first carriers in the first carrier platform. The transfer gear can be associated with at least two first carriers in the first carrier platform in the following manner: at least two first carriers are united through a connection structure (such as a frame, a connecting plate, a connecting rack, etc.), and the driving gear is disposed on the connection structure. The gear driving source is used to drive the transfer gear to rotate so that the associated first carrier platform moves along the transfer direction. The gear driving source can be, for example, a servo motor.

[0052] In some embodiments, the first transfer driving unit includes a transfer lead screw and a lead screw driving source. The transfer lead screw is arranged along the transfer direction and is associated with the first carrying platform. In some embodiments, the transfer lead screw is associated with at least two first carrying members in the first carrying platform. The transfer lead screw being associated with at least two first carrying members in the first carrying platform can be achieved in the following manner: at least two first carrying members are united through a connection structure (such as a frame, a connecting plate, a connecting rack, etc.), and the transfer lead screw is associated with the connection structure. The lead screw driving source is used to drive the transfer lead screw to rotate so that the associated first carrying platform moves along the transfer direction. The lead screw driving source can be, for example, a servo motor.

[0053] In practical applications, the aforementioned first carrying member driving mechanism and the first transfer driving mechanism overlap in some functions. Therefore, in some embodiments, the function of the first carrying member driving mechanism for driving at least one first carrying member to move along the transfer direction to adjust the carrying distance between the two first carrying members can be completed by the first transfer driving mechanism.

[0054] The first silicon rod cutting device is disposed at the first cutting station and is used to perform a first cutting operation on the silicon rod to be cut at the first cutting area of the first cutting station by the first silicon rod transfer device, so as to cut off the opposite two side skins of the silicon rod with a circular cross-section, so that the silicon rod forms two parallel first side cut surfaces.

[0055] The first silicon rod cutting device includes at least one first wire cutting unit. The first wire cutting unit includes a plurality of first cutting wheels and a first cutting wire. The first cutting wire is sequentially wound around the plurality of first cutting wheels to form at least one first cutting wire saw. At least one first cutting wire saw is located in a vertical plane and is arranged vertically or at an angle to the vertical. By the relative movement of the first wire cutting unit and the first silicon rod transfer device and the silicon rod to be cut carried by it at the first cutting station, the at least one first cutting wire saw performs a first cutting operation on the silicon rod to be cut carried by the first silicon rod transfer device. Among them, the first cutting wire is wound between each first cutting wheel in a closed-loop winding manner. At this time, the first cutting wire can also be called a closed-loop cutting wire.

[0056] In some embodiments, as Figure 1 and Figure 2 (or Figure 4 ) shown, the first silicon rod cutting device 13 includes two first wire cutting units 131 arranged in parallel. Each first wire cutting unit includes a plurality of first cutting wheels and a first cutting wire. The first cutting wire is wound around the plurality of first cutting wheels to form at least one first cutting wire saw. Among them, the first cutting wire saw is arranged vertically or at an angle to the vertical.

[0057] Please refer to Figure 5, showing a schematic structural view of the first wire cutting unit in the first silicon rod cutting device in an embodiment. In the embodiment as Figure 5 shown, the first silicon rod cutting device 13 includes two first wire cutting units 131. The first wire cutting unit 131 includes: a plurality of first cutting wheels 132 and a first cutting wire 134. The first cutting wire 134 is wound around the plurality of first cutting wheels 132 to form at least one first cutting wire saw 135. Among them, the first cutting wire saw 135 is arranged vertically or at an angle to the vertical. In addition, the first silicon rod cutting device 13 may further include a first cutting installation structure 130, and the aforementioned plurality of first cutting wheels 132 are arranged on the first cutting installation structure 130.

[0058] In some embodiments, the plurality of first cutting wheels in the first wire cutting unit are connected to the first cutting installation structure, or the plurality of first cutting wheels are arranged on the first cutting installation structure through brackets, connecting plates, or installation frames. The first cutting installation structure serves as a carrier for associating the plurality of first cutting wheels in the first wire cutting unit with the first cutting frame or the first cutting seat. The specific form of the first cutting installation structure can be a beam body, a plate frame, a bracket, etc., which is not limited in this application.

[0059] In the cutting and grinding integrated device for small-sized rectangular rods of this application, the first cutting wire saw in the first wire cutting unit included in the first silicon rod cutting device is arranged vertically or at an angle to the vertical.

[0060] In the first wire cutting unit, at least one first cutting wire groove for winding the cutting wire is provided in the first cutting wheel. The first cutting wire groove can define the position of the first cutting wire to control the cutting accuracy. Any first cutting wire saw is formed between two relatively arranged first cutting wheels after the first cutting wire is wound around them. The positions of the two first cutting wheels and the positional relationship between the two first cutting wheels can be used to determine the running direction of the first cutting wire saw.

[0061] As Figure 5As shown, in some embodiments, the first cutting mounting structure 130 is an overall rectangular frame. The first cutting unit includes a plurality of first cutting wheels 132, such as four first cutting wheels 132. The four first cutting wheels 132 are respectively disposed near the four corners of the first cutting mounting structure 130, and the wheel surface of each first cutting wheel 132 is located in the vertical plane (the vertical plane is formed by the first direction and the third direction). Among them, two first cutting wheels 132 are in the front (relatively closer to the first loading and unloading area) and are arranged in parallel up and down, and the other two first cutting wheels 132 are in the back (relatively farther from the first loading area) and are arranged in parallel up and down. The first cutting wire 134 is wound around the four first cutting wheels 132 to form at least one first cutting wire saw 135 (for example, a first cutting wire saw 135 is formed between the two first cutting wheels 132 arranged in parallel up and down in the front). The first cutting wire saw 135 is arranged along the third direction (i.e., the vertical direction). In addition, to enable the first cutting wire saw 135 to effectively cut the silicon rod, the first cutting wire saw 135 needs to interfere with the silicon rod in the vertical direction.

[0062] In some embodiments, the first cutting wire is wound around each first cutting wheel in a head-to-tail connection manner to form a circular cutting wire (also referred to as a closed-loop cutting wire). In Figure 2 (or Figure 4 ) and Figure 5 In the embodiments shown, the first cutting wire 134 is wound around a plurality of first cutting wheels 132 in a head-to-tail connection manner to form a circular cutting wire (also referred to as a closed-loop cutting wire).

[0063] The multiple first cutting wheels in the first cutting unit are wound by a circular cutting wire. In this example, the first silicon rod cutting device can omit the wire storage cylinder. The circular cutting wire can be driven by a cutting wire driving device to maintain high-speed operation. At the same time, the circular cutting wire can run in the same running direction during the cutting operation. In this way, the first silicon rod cutting device can achieve high-precision first cutting operations, avoiding problems such as ripples on the cutting surface caused by the running direction change or running speed of the cutting wire in the existing cutting methods; at the same time, the circular cutting wire can effectively reduce the total length of the cutting wire required for the first wire cutting unit and reduce production costs.

[0064] In some embodiments, the cutting wire driving device is a motor, which has a power output shaft and the power output shaft is shaft-connected to the first cutting wheel. In this way, the first cutting wire can be driven by the second cutting wheel around which it is wound to run in the winding direction. Of course, in the specific implementation, the cutting wire driving device can also be other driving sources such as a hydraulic motor, as long as it can drive the first cutting wire to run, and this application is not limited.

[0065] The first wire cutting unit in this application may further include a first idler pulley. The first idler pulley is used to change the direction or guide the first cutting wire, or the first idler pulley can be used to adjust the tension of the first cutting wire. The number of the first idler pulleys can be one or more according to the layout requirements.

[0066] When the first idler pulley realizes the guiding and traction of the first cutting wire, it also serves as a tension pulley for adjusting the tension of the first cutting wire. The tension pulley is used to adjust the tension of the first cutting wire, which can reduce the probability of the first cutting wire breaking and thus reduce the consumption of consumables.

[0067] As Figure 5 shown, in the first wire cutting unit, the first cutting installation structure 130 is an overall rectangular frame. Each first wire cutting unit 131 includes a plurality of first cutting wheels 132 and a plurality of first idler pulleys 133. For example, two first cutting wheels 132 and two first idler pulleys 133 are respectively arranged near the four corners of the first cutting installation structure 130, and the wheel surfaces of the two first cutting wheels 132 and the two first idler pulleys 133 are all located in the vertical plane. Among them, the two first cutting wheels 132 are in the front and arranged in parallel up and down, and the two first idler pulleys 133 are in the back and arranged in parallel up and down. After the first cutting wire 134 winds around the two first cutting wheels 132 and the two first idler pulleys 133, at least one first wire saw 135 is formed (for example, a first wire saw 135 is formed between the two first cutting wheels 132), and at least one first wire saw 135 is arranged vertically.

[0068] As before, the first cutting wire 134 winds around a plurality of first cutting wheels 132 or a plurality of first cutting wheels 132 and a plurality of first idler pulleys 133, and then a first wire saw 135 is formed between the two front first cutting wheels 132. Therefore, to adjust the wire length of the first wire saw 135, the distance between the two first cutting wheels 132 can be adjusted, and the implementation methods include changing the position of at least one of the two first cutting wheels 132.

[0069] The first wire saw is located in the vertical plane and arranged vertically or at an angle to the vertical. The silicon rod to be cut carried by the first silicon rod transfer device at the corresponding first cutting station is placed horizontally (the axis line of the silicon rod to be cut is arranged along the transfer direction). Therefore, to cut the silicon rod to be cut, the length of the first wire saw is adapted to the size of the end face of the silicon rod to be cut. For example, the length of the first wire saw should be greater than or equal to the diameter of the silicon rod to be cut or the chord length at the position where the silicon rod to be cut is to be cut.

[0070] The direction of the first cutting wheel surface has a corresponding relationship with the running direction of the first wire saw for cutting. It should be understood that the first cutting wheel surface is parallel to the plane where any first cutting wire groove in the first cutting wheel is located. To control the cutting accuracy and the stability of the cutting process, the first wire saw for cutting should be located within the plane where the first cutting wire groove for winding the first cutting wire is located. At the same time, during the cutting process, it is necessary to make the force application direction of the silicon rod on the first cutting wire parallel to the cutting wire groove, that is, the cutting wheel surface is parallel to the cutting direction. The cutting direction in the first cutting operation is the axis direction of the silicon rod, that is, the transfer direction (i.e., the first direction X-axis).

[0071] The first silicon rod cutting device includes two first wire cutting units arranged in parallel. Each first wire cutting unit has a first wire saw for cutting. Therefore, the two first wire cutting units form two parallel wire saws for cutting. In the Figure 5 embodiment shown, the first silicon rod cutting device includes two first wire cutting units arranged in parallel along the second direction. Each first wire cutting unit has a first wire saw for cutting. The first wire saw for cutting is arranged vertically. In this way, the two first wire saws for cutting belonging to the two first wire cutting units are both arranged vertically.

[0072] In fact, the first wire saw for cutting can still have other variations. In some embodiments, the first wire saw for cutting is arranged vertically, but not limited thereto. In other embodiments, the position of the first wire saw for cutting can be located within the vertical plane and arranged at an angle with the vertical direction (i.e., the third direction). The vertical plane is formed by the first direction and the third direction. The angle is less than or equal to 10 degrees (≤10°), or the angle is less than or equal to 5 degrees (≤5°), or the angle is less than or equal to 3 degrees (≤3°). That is, the running direction of the first wire saw for cutting can be within the vertical plane with the third direction (i.e., the vertical direction) and form an angle less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°) with the third direction (i.e., the vertical direction). The angle here is not limited to an integer angle and can be any angle within the limited range. For example, 0.09°, 1.3°, 2.5°, 3°, etc. In some embodiments, for the two first cutting wheels arranged vertically to form the first wire saw for cutting, the upper first cutting wheel is in front in the first direction and the lower first cutting wheel is behind in the first direction, and the first wire saw for cutting formed can form a positive angle with the vertical direction. In some embodiments, for the two first cutting wheels arranged vertically to form the first wire saw for cutting, the upper first cutting wheel is behind in the first direction and the lower first cutting wheel is in front in the first direction, and the first wire saw for cutting formed can form a negative angle with the vertical direction. Among them, the angle (including the positive angle and the negative angle) can be changed according to the cutting process requirements and the size specifications of the silicon rod. For example, the angle of the angle is adjusted by changing the position of one or both of the two first cutting wheels arranged vertically related to the first wire saw for cutting.

[0073] In some embodiments, the first wire cutting unit further includes a first tension adjusting mechanism. In wire cutting processing, the magnitude of the cutting wire tension affects the yield and processing accuracy during cutting. The first tension adjusting mechanism performs tension detection and adjusts the tension so that the tension of the first cutting wire reaches a set threshold value and remains constant during cutting or within a certain range allowed with the constant value as the numerical center.

[0074] In an embodiment, the first tension adjusting mechanism is associated with the first idler wheel 133 or the first cutting wheel. When the first idler wheel 133 in the wire cutting unit realizes the guiding and traction of the first cutting wire 134, it simultaneously serves as a tensioning wheel for cutting wire tension adjustment.

[0075] The tensioning wheel is used to adjust the tension of the cutting wire, which can reduce the probability of the cutting wire breaking and thus reduce consumables. In cutting operations, the cutting wire plays a crucial role. However, even the best cutting wire has limited elongation and wear resistance, that is, the cutting wire will gradually become thinner during continuous operation until it is finally broken. Therefore, current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the elongation of the cutting wire during its reciprocating movement, and the use of a tensioning wheel is one implementation means.

[0076] In some embodiments, taking the tensioning wheel as an idler wheel as an example, the tension adjusting mechanism at least includes: a tension sensor, a servo motor, and a lead screw; the tension sensor is disposed on the idler wheel, continuously senses the tension value of the cutting wire on the idler wheel, and issues a drive signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor and is used to start working after receiving the drive signal issued by the tension sensor; one end of the lead screw is connected to the idler wheel, and the other end is connected to the servo motor, and the lead screw pulls the idler wheel to perform a one-way displacement when the servo motor works to adjust the tension of the cutting wire.

[0077] In some embodiments, the tension adjusting mechanism includes: a link assembly and a tension driving unit. The link assembly is associated with the idler wheel serving as the tensioning wheel and the tension driving unit. The link assembly is controlled by the tension driving unit, that is, the link assembly is driven by the tension driving unit to act to drive the idler wheel to generate a position change to adjust the tension of the closed-loop cutting wire.

[0078] Regarding the tension driving unit, in some implementations, the tension driving unit may include a counterweight portion, and the counterweight portion may be associated with the link assembly. For example, taking a certain idler pulley as a tension pulley, when increasing the tension of the closed-loop cutting wire, the counterweight portion is released, the counterweight portion descends, and the link assembly drives the associated tension pulley to move under the action of the gravity of the counterweight portion, thereby expanding the perimeter of the figure enclosed by each cutting wheel and the idler pulley and increasing the tension of the closed-loop cutting wire. When reducing the tension of the closed-loop cutting wire, the counterweight portion is lifted, and the link assembly drives the associated tension pulley to move in the reverse direction under the action of the gravity of the counterweight portion, thereby expanding the perimeter of the figure enclosed by each cutting wheel and the idler pulley and reducing the tension of the closed-loop cutting wire.

[0079] The counterweight portion may include counterweight blocks. Among them, the number of counterweight blocks may vary according to the requirements of closed-loop cutting wire tension adjustment. For example, when increasing the tension of the closed-loop cutting wire, the number of counterweight blocks can be increased, and when reducing the tension of the closed-loop cutting wire, the number of counterweight blocks can be reduced.

[0080] In some embodiments, the counterweight portion may include a locking mechanism for locking the counterweight portion so that the counterweight portion is stationary relative to the cutting installation structure, so as to switch the state between the counterweight portion and the cutting installation structure from an active state to a locked state. In some examples, the locking mechanism may be, for example, a bolt.

[0081] The tension driving unit can still make other changes. For example, in some implementations, the tension driving unit may include a pneumatic cylinder.

[0082] In some embodiments, the first silicon rod cutting device further includes: at least one first distance adjustment mechanism provided in at least one first wire cutting unit for driving a plurality of first cutting wheels in the first wire cutting unit to move in a direction perpendicular to the wheel surface of the cutting wheel. The first silicon rod cutting device can switch the first cutting wire between different cutting grooves of the first cutting wheel based on the distance adjustment mechanism, or adjust the position of the first wire saw to change the cutting position (or processing specification) relative to the silicon rod.

[0083] In some implementations, taking one of the first wire sawing units in the first silicon rod cutting device as an example for illustration, the first wire sawing unit includes a plurality of first cutting wheels and a plurality of first transition wheels. The carrier for carrying the plurality of first cutting wheels and first transition wheels is, for example, a first cutting installation structure. The first distance adjustment mechanism can be used to drive the entire first cutting installation structure to move along the perpendicular direction of the cutting wheel surface. The first transition wheels and the first cutting wheels move together with the first cutting installation structure along the perpendicular direction of the cutting wheel surface (i.e., the transposition direction or the second direction Y-axis). In this state, the plurality of first cutting wheels and first transition wheels are relatively stationary, that is, the positional relationship between the first transition wheels and the first cutting wheels remains unchanged. At this time, the first distance adjustment mechanism is used to adjust the cutting position of at least one first wire saw relative to the silicon rod in at least one first wire sawing unit.

[0084] In some implementations, each first cutting wheel has at least two first cutting wire grooves. Different first cutting wire grooves are parallel to each other and have a cutting offset in the perpendicular direction of the first cutting wheel surface between different first cutting wire grooves. When the first distance adjustment mechanism is used to drive the plurality of first cutting wheels in the first wire sawing unit to move relative to the first cutting installation structure, the groove position of the first cutting wire wound around the first cutting wheel can be changed. In some implementations, the plurality of first cutting wheels in the first wire sawing unit are, for example, connected to a bracket, where the bracket is movably arranged on the first cutting installation structure and is driven by the first distance adjustment mechanism to move along the perpendicular direction of the first cutting wheel surface.

[0085] When at least one first distance adjustment mechanism is used to realize the transformation of the cutting wire groove of the first cutting wire wound around the plurality of first cutting wheels in at least one first wire sawing unit, in the actual scenario, the first cutting wire grooves respectively corresponding to the cutting wire before and after the groove change can be determined in advance. For example, the position where the first cutting wire is located before the groove change is the first cutting wire groove a1, and after the groove change, the first cutting wire is wound around the first cutting wire groove a2. Based on the cutting offset between the first cutting wire groove a1 and the first cutting wire groove a2, the displacement amount of the first distance adjustment mechanism driving the plurality of first cutting wheels in the first wire sawing unit to move is determined, that is, the displacement amount is set as the cutting offset between the first cutting wire groove a1 and the first cutting wire groove a2, which can be used to realize the replacement of the first cutting wire from the first cutting wire groove a1 to the first cutting wire groove a2; it should be noted that the direction in which at least one first distance adjustment mechanism drives the plurality of first cutting wheels in the first wire sawing unit to move along the perpendicular direction of the first cutting wheel surface is the direction from the cutting wire groove a2 to the cutting wire groove a1. After the groove change, the cutting position of the first wire saw in space remains unchanged, so the step of further calibrating the position of the first cutting wheel or other components is omitted, and the silicon rod can be cut according to the preset cutting amount, simplifying the groove change process.

[0086] To further illustrate the implementation manner in which at least one first distance adjustment mechanism realizes the movement of a plurality of first cutting wheels in the first wire cutting unit in a direction perpendicular to the wheel surface of the first cutting wheel, the following embodiments are disclosed in this application. When the number of first wire cutting units in the first silicon rod cutting device is different, the specific form of at least one first distance adjustment mechanism can be correspondingly changed.

[0087] In some embodiments, the first silicon rod cutting device includes a single-wire cutting unit. Here, the single-wire cutting unit is a first wire cutting unit. The first distance adjustment mechanism includes: a lead screw disposed along the orthogonal direction of the wheel surface of the first cutting wheel and threadedly connected to the single-wire cutting unit; a lead screw driving source for driving the lead screw to rotate.

[0088] The single-wire cutting unit in the first silicon rod cutting device includes a plurality of first cutting wheels, and a first cutting wire is wound around the plurality of first cutting wheels to form at least one first cutting wire saw. The lead screw of the first distance adjustment mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the lead screw can be connected to the lead screw driving source and rotated under the drive of the lead screw driving source, and the distal end of the lead screw is threadedly connected to the first single-wire cutting unit. Through the connection manner at both ends of the lead screw, the lead screw can rotate based on the transmission of the lead screw driving source and convert the rotation of the lead screw into an axial displacement through the threaded connection. The axial displacement direction is the setting direction of the lead screw, that is, the orthogonal direction of the cutting wheel surface; by driving the lead screw of the first distance adjustment mechanism to rotate, the displacement of the single-wire cutting unit in the orthogonal direction of the wheel surface of the first cutting wheel can be realized. When the lead screw is driven to rotate in different rotation directions, the first cutting wheels of the single-wire cutting unit can move forward or backward in the orthogonal direction of the wheel surface of the first cutting wheel.

[0089] In some embodiments, the first silicon rod cutting device includes a single-wire cutting unit, where the single-wire cutting unit is a first wire cutting unit. The first distance adjustment mechanism includes: a telescopic member disposed along the orthogonal direction of the first cutting wheel surface and associated with the single-wire cutting unit; a telescopic member driving source for driving the telescopic member to perform telescopic movement along the orthogonal direction of the first cutting wheel surface. Here, the telescopic member can be set as a rod structure and the extending direction of the rod is the orthogonal direction of the first cutting wheel surface. The telescopic member can perform telescopic movement along its extending direction under the drive of the telescopic member driving source. One end of the telescopic member can be connected to the telescopic member driving source, and the telescopic free end is associated with the single-wire cutting unit, that is, it can drive the first cutting wheel of the single-wire cutting unit to move in the orthogonal direction of the first cutting wheel surface under the action of the telescopic member driving source. The telescopic member is, for example, an electric telescopic rod, or a connecting rod connected to a cylinder, and the cylinder can be used as the telescopic member driving source, which is not limited in this application. The way the telescopic rod is associated with the single-wire cutting unit can be a direct connection or an indirect connection. For example, it can be directly connected to the first cutting installation structure of the single-wire cutting unit, or indirectly connected to the first single-wire cutting unit through a support or a bearing. It should be understood that when the telescopic member extends or contracts, it corresponds to the forward or backward movement of the single-wire cutting unit along the orthogonal direction of the first cutting wheel surface.

[0090] Here, in some embodiments, the association can be achieved through one or more of clamping, screwing, bonding, and welding. For example, in the above embodiments, the telescopic rod can be associated with the first wire cutting unit through one or more of clamping, screwing, bonding, and welding. Of course, the implementation manner of the association is not limited thereto, but aims to achieve transmission in the second direction.

[0091] In some embodiments, the first silicon rod cutting device includes a single-wire cutting unit, where the single-wire cutting unit is a wire cutting unit. The first distance adjustment mechanism includes: a rack disposed along the orthogonal direction of the first cutting wheel surface on the first single-wire cutting unit; a transmission gear meshing with the rack; a gear driving source for driving the transmission gear to rotate. The transmission gear rotates under the drive of the gear driving source, and the rack meshing with the transmission gear moves correspondingly along the rack step direction. In this example, through the cooperation of the rack and the transmission gear, the rotational movement driven by the gear driving source can be converted into a linear movement along the rack direction. The rack is disposed along the orthogonal direction of the first cutting wheel surface on the first single-wire cutting unit, so as to drive the first cutting wheel of the single-wire cutting unit to move in the orthogonal direction of the first cutting wheel surface. At the same time, by controlling the switching of the rotation direction of the transmission gear by the gear driving source, the multiple first cutting wheels of the single-wire cutting unit can move forward or backward along the orthogonal direction of the first cutting wheel surface.

[0092] In some embodiments, such as Figure 5As shown in the figure, the first silicon rod cutting device includes two first wire cutting units arranged in parallel and opposite to each other. At least one of the two first wire cutting units can be driven by at least one distance adjusting mechanism to move in the orthogonal direction of the first cutting wheel surface, for adjusting the wire cutting distance between the first wire saws in the two first wire cutting units, or changing the cutting wire groove of the first cutting wire wound around multiple first cutting wheels in a certain first wire cutting unit.

[0093] At least one first distance adjusting mechanism can be set to be connected to a certain first wire cutting unit, or simultaneously associated with two first wire cutting units, to drive multiple first cutting wheels in one or two first wire cutting units connected or associated to move in the orthogonal direction of the first cutting wheel surface.

[0094] In some embodiments, the first distance adjusting mechanism includes: a lead screw, arranged in the orthogonal direction of the first cutting wheel surface and threadedly connected to a certain first wire cutting unit; and a lead screw driving source for driving the lead screw to rotate. The manner in which the multiple first cutting wheels in the first wire cutting unit connected to the lead screw driving source move in the orthogonal direction of the first cutting wheel surface is similar to that in the foregoing embodiments. The first cutting unit driven by the distance adjusting mechanism can be regarded as a single wire cutting unit, which will not be elaborated here. It should be understood that by setting the first distance adjusting mechanism on any first wire cutting unit, the parallel first cutting wire saw distance formed between the two first wire cutting units can be increased and decreased, and the first silicon rod cutting device can cut the silicon rod into different specifications.

[0095] In some embodiments, the first distance adjusting mechanism includes: a telescopic member, arranged in the orthogonal direction of the first cutting wheel surface and associated with a certain first wire cutting unit; a telescopic member driving source for driving the telescopic member to perform telescopic movement in the orthogonal direction of the first cutting wheel surface. Here, the first cutting unit provided with the first distance adjusting mechanism can be regarded as a single wire cutting unit, and the specific implementation manner can refer to the foregoing embodiments, which will not be elaborated here.

[0096] In some embodiments, the first distance adjusting mechanism includes: an adjusting rack, arranged in the orthogonal direction of the first cutting wheel surface and associated with a certain first wire cutting unit; a transmission gear, meshing with the adjusting rack; and a gear driving source for driving the transmission gear to rotate. Through the meshing transmission gear and adjusting rack, the gear driving source can control the adjusting rack to move along the rack direction line, and the first wire cutting unit associated with the adjusting rack can drive multiple first cutting wheels to move in the orthogonal direction of the first cutting wheel surface through the rack.

[0097] In some embodiments, the distance adjusting mechanism includes: a bidirectional lead screw disposed in the orthogonal direction of the first cutting wheel surface and threadedly connected to two first wire cutting units; and a lead screw driving source for driving the lead screw to rotate so that the two first wire cutting units move towards or away from each other in the orthogonal direction of the first cutting wheel surface. In one implementation, the bidirectional lead screw is a double-threaded lead screw, with threads provided at both ends of the bidirectional lead screw and the thread directions being opposite. The lead screw driving source can be disposed at any one end of the bidirectional lead screw to drive the bidirectional lead screw to rotate along the lead screw axis. Through the threads with opposite directions at both ends of the bidirectional lead screw, when the bidirectional lead screw rotates driven by the lead screw driving source, the movements at both ends of the bidirectional lead screw are converted into axial linear movements in opposite directions, where the axis is the orthogonal direction of the first cutting wheel surface where the bidirectional lead screw is disposed. Driven by the lead screw driving source, the multiple first cutting wheels respectively corresponding to the two first wire cutting units can move towards or away from each other.

[0098] In some embodiments, the first distance adjusting mechanism includes a servo motor disposed on at least one first wire cutting unit. In an actual scenario, a servo motor is disposed on at least one first wire cutting unit or each first wire cutting unit of the first silicon rod cutting device, and the servo motor controls the displacement of the corresponding first wire cutting unit in the orthogonal direction of the first cutting wheel surface. The cutting offset amount for groove changing or the adjustment amount for changing the cutting position of the cutting wire that can be pre-determined for the first wire cutting unit drives the multiple first cutting wheels in the first wire cutting unit to move along the orthogonal direction of the first cutting wheel surface with a preset displacement amount through the precise positioning function of the servo motor. For example, in the first silicon rod cutting device, there are two first wire cutting units, and at least one of the two first wire cutting units moves relatively independently along the orthogonal direction of the first cutting wheel surface driven by its corresponding servo motor. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw. It should be understood that the first distance adjusting mechanism is a driving device for driving the multiple first cutting wheels in the first wire cutting unit to move relatively, and the specific form thereof is not limited in this application.

[0099] As described above, in the first silicon rod cutting device, the first cutting wire saws of two first wire cutting units arranged in parallel are arranged vertically or obliquely at an angle to the vertical. The first silicon rod transfer device and the silicon rod carried by it are driven to move along the transfer direction. By the relative movement of the first wire cutting unit and the first silicon rod transfer device along the transfer direction, the first cutting operation is performed on the silicon rod carried by the first silicon rod transfer device by the first cutting wire saws in the two first wire cutting units. The silicon rod to be cut is cut by the first wire cutting unit, so that the silicon rod forms a cutting surface and a skin. That is, when a silicon rod is cut by a cutting wire saw in a first wire cutting unit, a cutting surface can be formed on the silicon rod, and a skin is left after cutting. Therefore, when the first cutting operation is performed on a silicon rod with a circular cross-section by the first cutting wire saws in the two first wire cutting units arranged in parallel in the first silicon rod cutting device, two parallel first side cutting surfaces can be formed on the silicon rod.

[0100] The half-rod cutting device includes a first skin anti-cracking device cooperating with the first silicon rod transfer device, which is used to stabilize the skin when the first silicon rod cutting device performs the first cutting operation on the silicon rod.

[0101] It should be understood that the silicon rod carried by the first silicon rod transfer device is in a horizontal position, that is, the axis line of the silicon rod is consistent with the transfer direction (i.e., the first direction X-axis). Therefore, the skin formed by performing the first cutting operation on the silicon rod by the first silicon rod cutting device is also in a horizontal position.

[0102] In some embodiments, the first skin anti-cracking device includes a clamping support and a skin clamp. Among them, the skin clamp is arranged on the clamping support and is used to clamp the skin.

[0103] The skin clamp includes: a clamp seat, at least a pair of end face chucks, and a chuck driving mechanism.

[0104] At least a pair of end face chucks are arranged opposite to each other along the transfer direction and are used to clamp the two end faces of the silicon rod.

[0105] The first silicon rod transfer device includes a first skin anti-cracking device. The first skin anti-cracking device cooperates with the first silicon rod transfer device and is used to clamp the end face of the silicon rod during the first cutting operation of the silicon rod to prevent cracking.

[0106] In some embodiments, the first skin anti-cracking device includes: a clamping support and a skin clamp. In Figure 5 and Figure 6 In the shown embodiment, the first skin anti-cracking device 16 includes a clamping support 161 and a skin clamp 162.

[0107] In some embodiments, the clamping support of the first skin anti-cracking device is associated with the first bearing platform of the first silicon rod transfer device, that is, the clamping support of the first skin anti-cracking device and the first bearing platform of the first silicon rod transfer device can move forward and backward together.

[0108] The edge skin fixture is provided on the clamping support. In some embodiments, the edge skin fixture includes a clamping seat, at least a pair of end face chucks, and a chuck driving mechanism. In Figure 6 the illustrated embodiment, the edge skin fixture 162 includes a clamping seat 1621, a pair of end face chucks 1622 arranged oppositely along the clamping direction, and a chuck driving mechanism.

[0109] The chuck driving mechanism is used to drive at least one of the at least a pair of end face chucks to move along the clamping direction to adjust the clamping distance between the at least a pair of end face chucks.

[0110] In some embodiments, the chuck driving mechanism includes: a chuck moving guide rail arranged along the clamping direction; a chuck driving unit for driving at least one of the at least a pair of end face chucks to move along the chuck moving guide rail.

[0111] In some embodiments, a chuck moving guide rail may be provided between the first end face chuck and the second end face chuck of the at least a pair of end face chucks. As Figure 6 shown, a moving guiding assembly is provided between the first end face chuck and the second end face chuck of the at least a pair of end face chucks. The moving guiding assembly includes one or more moving guide rods or moving guide beams 1623, and a moving guide rail is provided on the moving guide rods or moving guide beams 1623.

[0112] In some embodiments, the chuck driving unit includes at least one chuck telescopic assembly. As Figure 6As shown, the collet telescopic assembly includes: a collet telescopic rod and a collet telescopic cylinder. The collet telescopic rod is arranged along the clamping direction and is associated with the corresponding end-face collet, and the collet telescopic cylinder is associated with the collet telescopic rod. In some embodiments, the collet driving mechanism is used to drive two end-face collets in a pair of end-face collets to move towards each other or away from each other along the clamping direction. Then, the collet driving mechanism includes a pair of collet telescopic assemblies. Among them, each collet telescopic assembly corresponds to an end-face collet. The collet telescopic rod in the collet telescopic assembly is arranged along the clamping direction and is associated with the corresponding end-face collet, and the collet telescopic cylinder in the collet telescopic assembly is associated with the collet telescopic rod. By using the collet telescopic cylinder in a pair of collet telescopic assemblies to control the corresponding collet telescopic rod to perform a contraction or extension action, the pair of end-face collets can be driven to move towards each other or away from each other along the moving guide rail on the moving guide rod or the moving guide beam. In some embodiments, the collet driving mechanism is used to drive one end-face collet in a pair of end-face collets to move towards or away from the other end-face collet along the clamping direction. Then, the collet driving mechanism includes a collet telescopic assembly corresponding to the end-face collet to be moved. Among them, the collet telescopic rod in the collet telescopic assembly is arranged along the clamping direction and is associated with the corresponding end-face collet, and the collet telescopic cylinder in the collet telescopic assembly is associated with the collet telescopic rod. By using the collet telescopic cylinder in the collet telescopic assembly to control the corresponding collet telescopic rod to perform a contraction or extension action, the corresponding end-face collet can be driven to move along the moving guide rail on the moving guide rod or the moving guide beam towards the other end-face collet or away from the other end-face collet.

[0113] In some embodiments, the chuck driving unit includes: at least a pair of clamping racks, a driving gear, and a gear driving source. The at least a pair of clamping racks are respectively associated with at least a pair of end chucks, that is, the first clamping rack of the at least a pair of clamping racks is arranged along the clamping direction and is associated with the first end chuck of the at least a pair of end chucks, the second clamping rack of the at least a pair of clamping racks is arranged along the clamping direction and is associated with the second end chuck of the at least a pair of end chucks, and the first clamping rack and the second clamping rack of the at least a pair of clamping racks are arranged with their teeth facing each other. The driving gear meshes with the pair of clamping racks, that is, the driving gear is located between the first clamping rack and the second clamping rack of the pair of clamping racks and meshes with the first clamping rack and the second clamping rack respectively. The gear driving source is used to drive the driving gear to rotate so that the at least a pair of meshing clamping racks drive the associated at least a pair of end chucks to move towards or away from each other along the clamping direction, wherein the gear driving source can be, for example, a servo motor, and the output shaft of the servo motor is associated with the driving gear. In practical applications, when the servo motor serving as the gear driving source rotates forward, it drives the associated driving gear to rotate forward, so that the first clamping rack and the second clamping rack meshing with the driving gear move towards each other, that is, the first end chuck associated with the first clamping rack and the second end chuck associated with the second clamping rack move towards each other, reducing the clamping distance between the first end chuck and the second end chuck. When the servo motor serving as the gear driving source rotates reversely, it drives the associated driving gear to rotate reversely, so that the first clamping rack and the second clamping rack meshing with the driving gear move away from each other, that is, the first end chuck associated with the first clamping rack and the second end chuck associated with the second clamping rack move away from each other, increasing the clamping distance between the first end chuck and the second end chuck.

[0114] In some embodiments, the chuck driving unit includes: at least a pair of clamping racks, a linkage gear, and a chuck driving source. At least a pair of clamping racks are respectively associated with at least a pair of end chucks, that is, the first clamping rack in the at least a pair of clamping racks is arranged along the clamping direction and is associated with the first end chuck in the at least a pair of end chucks, the second clamping rack in the at least a pair of clamping racks is arranged along the clamping direction and is associated with the second end chuck in the at least a pair of end chucks, and the first clamping rack and the second clamping rack in the at least a pair of clamping racks are arranged with their teeth facing each other. The linkage gear meshes with the pair of clamping racks, that is, the linkage gear is located between the first clamping rack and the second clamping rack of the pair of clamping racks and meshes with the first clamping rack and the second clamping rack respectively. The chuck driving source is associated with at least a pair of end chucks and is used to cooperate with the at least a pair of clamping racks and the linkage gear to drive the at least a pair of end chucks to move towards each other or away from each other along the clamping direction. Among them, the chuck driving source can be, for example, a telescopic cylinder, and both ends of the telescopic cylinder are respectively connected to the first end chuck and the second end chuck. In practical applications, when the telescopic cylinder serving as the chuck driving source contracts, the contracting cylinder can drive the first clamping rack or the second clamping rack to move. Through the first clamping rack, the second clamping rack, and the linkage gear between the first clamping rack and the second clamping rack, the associated first end chuck and the second end chuck are driven to move towards each other, reducing the clamping distance between the first end chuck and the second end chuck. When the telescopic cylinder serving as the chuck driving source extends, the extending cylinder can drive the first clamping rack or the second clamping rack to move. Through the first clamping rack, the second clamping rack, and the linkage gear between the first clamping rack and the second clamping rack, the associated first end chuck and the second end chuck are driven to move away from each other, increasing the clamping distance between the first end chuck and the second end chuck.

[0115] In some embodiments, the chuck driving unit includes: at least one chuck clamping assembly, and the chuck clamping assembly includes: a clamping screw rod and a screw rod driving source. The clamping screw rod is arranged along the clamping direction and is associated with a corresponding end face chuck, and the screw rod driving source is associated with the clamping screw rod. In some embodiments, the chuck driving mechanism is used to drive two end face chucks in a pair of end face chucks to move towards each other or away from each other along the clamping direction. Then, the chuck driving mechanism includes a pair of chuck clamping assemblies, wherein each chuck clamping assembly corresponds to an end face chuck. The clamping screw rod in the chuck clamping assembly is arranged along the clamping direction and is associated with a corresponding end face chuck, and the screw rod driving source in the chuck clamping assembly is associated with the clamping screw rod. In some embodiments, the chuck driving mechanism is used to drive one end face chuck in a pair of end face chucks to move towards or away from the other end face chuck along the clamping direction. Then, the chuck driving mechanism includes a chuck clamping assembly corresponding to the end face chuck to be moved, wherein the clamping screw rod in the chuck clamping assembly is arranged along the clamping direction and is associated with a corresponding end face chuck, and the screw rod driving source in the chuck clamping assembly is associated with the clamping screw rod. The screw rod driving source can be, for example, a servo motor.

[0116] In some embodiments, the chuck driving unit includes: a bidirectional screw rod and a screw rod driving source. The bidirectional screw rod is arranged along the clamping direction, and threads with opposite directions are respectively provided at both ends of the bidirectional screw rod. Both ends of the bidirectional screw rod are respectively associated with at least a pair of end face chucks, and the screw rod driving source is associated with the bidirectional screw rod. In practical applications, the bidirectional screw rod is driven by the screw rod driving source (such as a servo motor) to rotate so that two relatively associated end face chucks move towards each other or away from each other along the clamping direction.

[0117] At least a pair of end face chucks are arranged oppositely along the clamping direction and are used to correspondingly clamp two end faces of the silicon rod.

[0118] In some embodiments, for any one end face chuck in at least a pair of end face chucks, the end face chuck includes a clamping base body and a side skin pressing member arranged on the clamping base body. The side skin pressing member is used to press the side skin to be cut in the silicon rod.

[0119] The clamping base body serves as the main body of the end face chuck and is used to provide a setting basis for the side skin pressing member. In some embodiments, the clamping base body can be, for example, a clamping substrate, and its size should be adapted to the side skin to be cut, that is, at least part or all of the clamping substrate should cover the side skin to be cut.

[0120] In the end face chuck, the side skin pressing member includes side skin pressing screws arranged on the clamping substrate, and the number of side skin pressing screws can be one or more. In practical applications, the side skin pressing screws are used to press the side skin to be cut, and can ensure that the side skin to be cut in the silicon rod remains stable during the first cutting operation.

[0121] Of course, in some embodiments, in the end face chuck, the edge skin pressing member may also include an edge skin pressing elastic member provided on the clamping base body. For example, in some embodiments, the edge skin pressing elastic member includes an edge skin pressing rod, which is sleeved with a compression spring.

[0122] Thus, when using the first silicon rod cutting device to perform the first cutting operation on the silicon rod, the silicon rod to be cut is carried by the first silicon rod transfer device, and at least one end face chuck in at least a pair of end face chucks is driven by the chuck driving mechanism in the first edge skin anti-chipping device to move along the clamping direction, so that at least a pair of end face chucks clamp the two end faces of the silicon rod. Among them, the edge skin pressing member in the end face chuck presses on the edge skin to be cut in the silicon rod, which can ensure that the edge skin to be cut in the silicon rod remains stable during the first cutting operation, and can avoid phenomena such as edge skin dropping or offset between the edge skin and the silicon rod body when the first wire saw in the first wire cutting unit penetrates through the silicon rod to completely cut it, resulting in chipping.

[0123] In an embodiment, for any one of the at least a pair of end face chucks, the end face chuck includes a silicon rod pressing member, an edge skin pressing member, and an edge skin clamping strengthening member. Among them, the silicon rod pressing member is used to press the main body of the silicon rod, the edge skin pressing member is used to press the edge skin to be cut in the silicon rod, and the edge skin clamping strengthening member is used to apply an additional clamping force to the edge skin. In this application, the silicon rod with a circular cross-section forms a square silicon rod with a quasi-rectangular cross-section after the squaring cutting operation. Among them, the main body of the silicon rod refers to at least the part including the square silicon rod, that is, the main body of the silicon rod is relative to the edge skin, the main body of the silicon rod is the part including the square silicon rod, and the main body of the silicon rod changes in different squaring cutting operations. In the following description, the main body of the silicon rod will be simply referred to as the silicon rod main body.

[0124] Please refer to Figure 7 shown as Figure 6 the structural schematic diagram of the edge skin fixture in an embodiment. In Figure 6 and Figure 7 In the shown embodiment, the end face chuck includes a clamping base body 1624, a silicon rod pressing member 1625 and an edge skin pressing member 1626 provided on the clamping base body 1624, and an edge skin clamping strengthening member 1627 that advances and retreats along the clamping direction relative to the clamping base body 1624.

[0125] The clamping base body 1624 serves as the main body of the end face chuck, providing a setting basis for the silicon rod pressing member 1625, the edge skin pressing member 1626, and the edge skin clamping reinforcement member 1627. In some embodiments, the clamping base body can be, for example, a clamping substrate, and its size should be adapted to the end face of the silicon rod and the edge skin to be cut, that is, at least a part of the clamping substrate should cover the main body of the silicon rod and a part of the edge skin. The clamping substrate should cover a part of the main body of the silicon rod so that the silicon rod pressing member provided thereon can act on the main body of the silicon rod. The clamping substrate should also cover a part of the edge skin so that the edge skin pressing member and the edge skin clamping reinforcement member provided thereon can act on the edge skin.

[0126] In the embodiment as Figure 7 shown, in the end face chuck, the silicon rod pressing member 1625 includes a silicon rod pressing screw provided on the clamping substrate 1624, and the edge skin pressing member 1626 includes an edge skin pressing screw provided on the clamping substrate 1624. The number of silicon rod pressing screws can be one or more, and the number of edge skin pressing screws can be one or more. In practical applications, the silicon rod pressing screw is used to press the main body of the silicon rod, and the edge skin pressing screw is used to press the edge skin to be cut. In the situation where the silicon rod pressing screw presses the main body of the silicon rod and the edge skin pressing screw presses the edge skin to be cut, the relative stability between the main body of the silicon rod and the edge skin can be ensured, and phenomena such as the edge skin falling off or the edge skin shifting relative to the main body of the silicon rod resulting in chipping can be avoided when the cutting wire saw in the wire cutting unit penetrates through the silicon rod to completely cut it.

[0127] It is easy to know that in some cases, the end face of the silicon rod is not an ideal flat surface, and one of the silicon rod pressing member and the edge skin pressing member may not effectively abut against and press the corresponding main body of the silicon rod or the edge skin.

[0128] To enable the silicon rod pressing member and the edge skin pressing member arranged on the clamping base body to adapt to the end face of the silicon rod to achieve an effective pressing effect, in some embodiments, the end face chuck further includes a deflection fine-tuning structure for adjusting the position of the clamping base body. By using the deflection fine-tuning structure, the position of the clamping base body can be locally adjusted, thereby changing the positions of the silicon rod pressing member and the edge skin pressing member arranged on the clamping base body. In the embodiment as Figure 7 shown, the end face chuck further includes a deflection fine-tuning structure for adjusting the clamping substrate 1624. By using the deflection fine-tuning structure, the position of the clamping substrate 1624 can be locally adjusted, thereby changing the positions of the silicon rod pressing screw and the edge skin pressing screw arranged on the clamping substrate 1624.

[0129] In some embodiments, the deflection fine-tuning structure adopts a ball head structure or a similar structure, and the clamping base body is arranged through the ball head structure. As Figure 7As shown in the figure, the clamping substrate 1624 serving as the clamping base body is arranged on the mounting structure through a ball head structure 1629. In this way, the clamping substrate 1624 can be finely adjusted to a certain extent relative to the mounting structure through the ball head structure 1629, changing the positions of the silicon rod pressing screw 1625 and the side skin pressing screw 1626 arranged thereon, so as to adapt to the end face of the silicon rod, even if the end face of the silicon rod is uneven to a certain extent. In some embodiments, the ball head structure is a spherical steel ball, and the spherical steel ball is embedded in a receiving cavity and exposes a small half part in contact with the clamping substrate. In some embodiments, the ball head is a spherical head or a hemispherical head, and the spherical head or the hemispherical head is connected to the clamping substrate through a connecting rod, and the spherical head or the hemispherical head is embedded in a receiving cavity.

[0130] In some embodiments, the deflection fine adjustment structure adopts a hinge structure, and the clamping base body is arranged through the hinge structure. For example, the clamping substrate is associated with the mounting structure through the hinge structure and can deflect relative to the mounting structure to a certain extent.

[0131] In addition, in some embodiments, in the end face chuck, the silicon rod pressing member includes a silicon rod pressing elastic member arranged on the clamping base body, and the side skin pressing member includes a side skin pressing elastic member arranged on the clamping base body. For example, in some embodiments, the silicon rod pressing elastic member includes a silicon rod pressing rod sleeved with a compression spring; the side skin pressing elastic member includes a side skin pressing rod sleeved with a compression spring. In some embodiments, the silicon rod pressing elastic member includes a silicon rod pressing block with a compression spring arranged at the rear end; the side skin pressing elastic member includes a side skin pressing block with a compression spring arranged at the rear end.

[0132] In the end face chuck, a side skin clamping strengthening member is further included, and the side skin clamping strengthening member can advance and retreat relative to the clamping base body along the clamping direction. When the side skin clamping strengthening member advances relative to the clamping base body, the side skin clamping strengthening member can provide a strong clamping force to the corresponding side skin. Generally, the clamping force applied by the side skin clamping strengthening member to the side skin is greater than the top pressure applied by the silicon rod pressing member to the silicon rod main body and the top pressure applied by the side skin pressing member to the side skin.

[0133] In some embodiments, the side skin clamping strengthening member includes a telescopic top rod or a telescopic top block that is controlled to advance and retreat relative to the clamping base body. In Figure 7In the illustrated embodiment, the edge clamping reinforcement member includes a telescopic ejector rod or a telescopic ejector block 1627 and a telescopic drive source 1628, and the telescopic drive source 1628 drives the telescopic ejector rod or the telescopic ejector block 1627 to advance and retreat relative to the clamping substrate 1624. In some embodiments, a through hole is formed in the clamping substrate 1624, the telescopic drive source 1628 and the telescopic ejector rod or the telescopic ejector block 1627 are arranged on the mounting structure, and the telescopic drive source 1628 can drive the telescopic ejector rod or the telescopic ejector block 1627 to extend out of the clamping substrate 1624 and press against the corresponding edge skin, or drive the telescopic ejector rod or the telescopic ejector block 1627 to retract into the clamping substrate 1624. Wherein, the telescopic drive source can be, for example, a telescopic cylinder.

[0134] The end face chuck can still be changed in other embodiments. In some embodiments, the end face chuck includes: a first clamping base body and a second clamping base body. Wherein, a silicon rod pressing member is arranged on the first clamping base body, and an edge skin pressing member and an edge clamping reinforcement member that advances and retreats along the clamping direction relative to the second clamping base body are arranged on the second clamping base body.

[0135] In some embodiments, the first clamping base body can be, for example, a clamping substrate, and its size should be adapted to the end face of the silicon rod body, that is, the first clamping substrate should at least cover a part of the silicon rod body so that the silicon rod pressing member arranged thereon can act on the silicon rod body. The second clamping base body can be, for example, a clamping substrate, and its size should be adapted to the end face of the edge skin to be cut, that is, the first clamping substrate should at least cover a part of the edge skin so that the edge skin pressing member arranged thereon can act on the edge skin.

[0136] In the end face chuck, the silicon rod pressing member includes a silicon rod pressing screw arranged on the first clamping substrate, and the number of the silicon rod pressing screws can be one or more. The edge skin pressing member includes an edge skin pressing screw arranged on the second clamping substrate, and the number of the edge skin pressing screws can be one or more. In practical applications, the silicon rod pressing screw is used to press the silicon rod body, and the edge skin pressing screw is used to press the edge skin to be cut. In the situation where the silicon rod pressing screw presses the silicon rod body and the edge skin pressing screw presses the edge skin to be cut, the relative stability between the silicon rod body and the edge skin can be ensured, and phenomena such as edge skin dropping or offset between the edge skin and the silicon rod body resulting in edge chipping can be avoided when the cutting wire saw in the wire cutting unit penetrates through the silicon rod to completely cut it.

[0137] In addition, in some embodiments, in the end face chuck, the silicon rod pressing member includes a silicon rod pressing elastic member provided on the first clamping base body, and the side skin pressing member includes a side skin pressing elastic member provided on the second clamping base body. For example, in some embodiments, the silicon rod pressing elastic member includes a silicon rod ejector rod sleeved with a compression spring; the side skin pressing elastic member includes a side skin ejector rod sleeved with a compression spring. In some embodiments, the silicon rod pressing elastic member includes a silicon rod pressing block provided with a compression spring at its rear end; the side skin pressing elastic member includes a side skin pressing block provided with a compression spring at its rear end.

[0138] In the end face chuck, there is also included a side skin clamping reinforcement member which can advance and retreat relative to the second clamping base body along the clamping direction. When the side skin clamping reinforcement member advances relative to the second clamping base body, the side skin clamping reinforcement member can provide a strong clamping force to the corresponding side skin. Generally, the clamping force exerted by the side skin clamping reinforcement member on the side skin is greater than the pressing force exerted by the silicon rod pressing member on the silicon rod main body and the pressing force exerted by the side skin pressing member on the side skin.

[0139] In some embodiments, the side skin clamping reinforcement member includes a telescopic ejector rod or a telescopic block that is controlled to advance and retreat relative to the second clamping base body. For example, the side skin clamping reinforcement member includes a telescopic ejector rod or a telescopic block and a telescopic driving source, and the telescopic driving source drives the telescopic ejector rod or the telescopic block to advance and retreat relative to the second clamping substrate. In some embodiments, a through hole is formed on the second clamping substrate, the telescopic driving source and the telescopic ejector rod or the telescopic block are arranged on a mounting structure, and the telescopic driving source can drive the telescopic ejector rod or the telescopic block to extend out of the second clamping substrate and press on the corresponding side skin, or drive the telescopic ejector rod or the telescopic block to retract into the second clamping substrate. Among them, the telescopic driving source can be, for example, a telescopic cylinder.

[0140] Thus, when the first silicon rod cutting device is used to perform the first cutting operation on the silicon rod, the silicon rod to be cut is carried by the first silicon rod transfer device, and at least one end face chuck in at least a pair of end face chucks is driven by the chuck driving mechanism in the first edge skin anti-chipping device to move along the clamping direction, so that at least a pair of end face chucks clamp the two end faces of the silicon rod. Among them, the silicon rod pressing member in the end face chuck presses against the main body of the silicon rod, the edge skin pressing member in the end face chuck presses against the edge skin to be cut in the silicon rod, and the edge skin clamping and strengthening member in the end face chuck is in a contracted state (in the contracted state, the edge skin clamping and strengthening member is recessed in the clamping base body, or protrudes from the clamping base body but the protrusion height relative to the clamping base body is also less than the protrusion heights of the silicon rod pressing member and the edge skin pressing member relative to the clamping base body), so that the edge skin and the silicon rod main body remain relatively stationary, and it is possible to avoid phenomena such as edge skin dropping or edge skin offset from the silicon rod main body resulting in chipping when the cutting wire saw in the wire cutting unit penetrates through the silicon rod to be cut for complete cutting. After the edge skin cutting is completed, the edge skin clamping and strengthening member in the end face chuck is driven to extend relative to the clamping base body and press against the cut edge skin, and the clamping force applied by the edge skin clamping and strengthening member to the edge skin is greater than the pressing force applied by the silicon rod pressing member to the silicon rod main body and the pressing force applied by the edge skin pressing member to the edge skin. At this time, at least a pair of end face chucks can be operated to move the cut edge skin.

[0141] In the present application, the first edge skin anti-chipping device may further include an edge skin fixture advancing and retracting mechanism for driving the edge skin fixture to advance and retract along the advancing and retracting direction.

[0142] In an embodiment where the end face chuck includes a clamping base body and an edge skin pressing member provided on the clamping base body, after the edge skin cutting is completed, the edge skin fixture is driven to retract along the advancing and retracting direction by the edge skin fixture advancing and retracting mechanism, and by using the pressing force applied by the pressing member to the edge skin, the clamped edge skin can be driven to separate from the silicon rod main body.

[0143] In an embodiment where the end face chuck includes a clamping base body, a silicon rod pressing member and an edge skin pressing member provided on the clamping base body, and an edge skin clamping and strengthening member that advances and retracts relative to the clamping base body along the clamping direction, after the edge skin cutting is completed, the edge skin clamping and strengthening member in the end face chuck is driven to extend relative to the clamping base body and press against the cut edge skin. At this time, the edge skin fixture is then driven to retract along the advancing and retracting direction by the edge skin fixture advancing and retracting mechanism, and by using the characteristic that the clamping force applied by the edge skin clamping and strengthening member to the edge skin is greater than the pressing force applied by the silicon rod pressing member to the silicon rod main body and the pressing force applied by the edge skin pressing member to the edge skin, the clamped edge skin can be driven to separate from the silicon rod main body.

[0144] In some embodiments, the edge skin fixture advancing and retracting mechanism includes: a fixture advancing and retracting guide rail arranged along the advancing and retracting direction; an edge skin fixture advancing and retracting unit for driving the edge skin fixture to move along the fixture advancing and retracting guide rail. Figure 6In the illustrated embodiment, the edge skin fixture advancing and retreating mechanism 163 includes: a fixture advancing and retreating guide rail 1631 and an edge skin fixture advancing and retreating unit.

[0145] In some embodiments, the edge skin fixture advancing and retreating unit includes: a clamp seat telescopic rod and a clamp seat telescopic cylinder. The clamp seat telescopic rod is arranged along the advancing and retreating direction and is associated with the clamp seat of the edge skin fixture, and the clamp seat telescopic cylinder is associated with the clamp seat telescopic rod. Figure 6 In the illustrated embodiment, the edge skin fixture advancing and retreating unit includes: a clamp seat telescopic rod 1633 and a clamp seat telescopic cylinder 1635. Among them, the clamp seat telescopic rod 1633 is arranged along the advancing and retreating direction and is associated with the clamp seat 1621 of the edge skin fixture, and the clamp seat telescopic cylinder 1635 can be arranged on an installation structure and is associated with the clamp seat telescopic rod 1633. In some embodiments, the clamp seat telescopic cylinder 1635 drives the clamp seat telescopic rod to extend, driving the edge skin fixture 162 to move towards the first silicon rod transfer device, so that the edge skin fixture 162 can clamp the end face of the silicon rod. In some embodiments, the clamp seat telescopic cylinder 1635 drives the clamp seat telescopic rod to contract, driving the edge skin fixture 162 to move away from the first silicon rod transfer device, so that the edge skin fixture 162 drives the clamped edge skin to withdraw and separate from the silicon rod body.

[0146] In some embodiments, the edge skin fixture advancing and retreating unit includes: the edge skin fixture advancing and retreating mechanism includes: a clamp seat rack, which is arranged along the advancing and retreating direction and is associated with the clamp seat of the edge skin fixture; a clamp seat gear, which meshes with the clamp seat rack; and a gear driving source, which is associated with the clamp seat gear and is used to drive the clamp seat gear to rotate so that the engaged edge skin fixture moves along the advancing and retreating direction. Among them, the gear driving source can be, for example, a servo motor. In practical applications, when the servo motor serving as the gear driving source rotates forward, it drives the associated clamp seat gear to rotate forward, so that the edge skin fixture associated with the clamp seat gear moves towards the silicon rod transfer device on the engaged clamp seat rack, so that the edge skin fixture can clamp the end face of the silicon rod. On the contrary, when the servo motor serving as the gear driving source rotates backward, it drives the associated clamp seat gear to rotate backward, so that the edge skin fixture associated with the clamp seat gear moves away from the silicon rod transfer device on the engaged clamp seat rack, so that the edge skin fixture drives the clamped edge skin to withdraw and separate from the silicon rod body.

[0147] In some embodiments, the edge skin clamp advancing and retracting unit includes: a retracting lead screw and a lead screw driving source. The retracting lead screw is arranged along the advancing and retracting direction and is associated with the clamp seat of the edge skin clamp, and the lead screw driving source is associated with the retracting lead screw. Among them, the lead screw driving source can be, for example, a servo motor. In practical applications, when the servo motor acting as the lead screw driving source rotates forward, it drives the retracting lead screw to rotate forward, so that the edge skin clamp associated with the retracting lead screw moves towards the silicon rod transfer device, enabling the edge skin clamp to clamp the end face of the silicon rod. Conversely, when the servo motor acting as the lead screw driving source rotates reversely, it drives the retracting lead screw to rotate reversely, so that the edge skin clamp associated with the retracting lead screw moves away from the silicon rod transfer device, causing the edge skin clamp to drive the clamped edge skin to withdraw and separate from the silicon rod body.

[0148] In the present application, the first edge skin anti-cracking device may further include a clamp lifting mechanism for driving the edge skin clamp to move up and down vertically. In some embodiments, the edge skin clamp moves up or down vertically through the clamp lifting mechanism to adapt to the size specifications of the silicon rod carried by the silicon rod transfer. For example, if the size of the silicon rod to be cut is relatively large, the edge skin clamp is driven to move up vertically through the clamp lifting mechanism; and if the size of the silicon rod to be cut is relatively small, the edge skin clamp is driven to move down vertically through the clamp lifting mechanism.

[0149] In some embodiments, the clamp lifting mechanism includes: a clamp lifting guide rail and a clamp lifting unit. Among them, the clamp lifting guide rail is arranged vertically. The clamp lifting unit is used to drive the edge skin clamp to move up and down along the clamp lifting guide rail. In Figure 6 the illustrated embodiment, the clamp lifting mechanism 164 includes: a clamp lifting guide rail 1641 and a clamp lifting unit.

[0150] In some embodiments, the edge clamp lifting unit includes: a lifting lead screw and a lead screw driving source. The lifting lead screw is arranged vertically and is associated with the clamp seat of the edge skin clamp, and the lead screw driving source is associated with the lifting lead screw. In Figure 6 the illustrated embodiment, the edge clamp lifting unit includes: a lifting lead screw 1643 and a lead screw driving source. Among them, the lifting lead screw 1643 is arranged vertically and is associated with the installation structure of the clamp seat where the edge skin clamp is provided, and the lead screw driving source is associated with the lifting lead screw 1643. Among them, the lead screw driving source can be, for example, a servo motor. In practical applications, when the servo motor acting as the lead screw driving source rotates forward, it drives the lifting lead screw to rotate forward, so that the edge skin clamp associated with the lifting lead screw moves up. Conversely, when the servo motor acting as the lead screw driving source rotates reversely, it drives the lifting lead screw to rotate reversely, so that the edge skin clamp associated with the lifting lead screw moves down.

[0151] In some embodiments, the fixture lifting unit includes: a lifting rack, a lifting gear, and a gear driving source. Among them, the lifting rack is arranged vertically and is associated with the clamp seat of the side skin fixture. The lifting gear meshes with the lifting rack, and the gear driving source is associated with the lifting gear for driving the lifting gear to rotate so that the engaged side skin fixture moves up and down vertically. Among them, the gear driving source can be, for example, a servo motor. In practical applications, when the servo motor serving as the gear driving source rotates forward, it drives the associated lifting gear to rotate forward, causing the side skin fixture associated with the clamp seat gear to move upward on the engaged clamp seat rack. Conversely, when the servo motor serving as the gear driving source rotates backward, it drives the associated clamp seat gear to rotate backward, causing the side skin fixture associated with the clamp seat gear to move downward on the engaged clamp seat rack.

[0152] Thus, when applying Figure 6 the first side skin anti-cracking device 16 as shown, place the silicon rod horizontally on the silicon rod bearing platform of the silicon rod transfer device; drive the side skin fixture 162 to move up and down vertically by the fixture lifting mechanism 164 in the first side skin anti-cracking device 16 to adjust the position; drive the side skin fixture to move forward in the forward and backward direction and approach the silicon rod by the side skin fixture advancing and retreating mechanism 163 in the first side skin anti-cracking device 16; drive at least one end face chuck in at least a pair of end face chucks to move in the clamping direction by the chuck driving mechanism 162 in the first side skin anti-cracking device 16 until the silicon rod pressing member on the end face chuck presses against the silicon rod main body and the side skin pressing member on the end face chuck presses against the side skin to be cut (specific details can be seen in Figure 8 the state schematic diagram as shown). After that, perform a squaring cutting operation on the silicon rod by the silicon rod cutting device to form a silicon rod main body and side skin (specific details can be seen in Figure 9 the state schematic diagram as shown). After the side skin 101 is cut, drive the side skin clamping reinforcement member in the end face chuck to extend relative to the clamping base body and press against the cut side skin 101. At this time, then drive the side skin fixture 162 to retreat in the forward and backward direction by the side skin fixture advancing and retreating mechanism 163. Utilize the characteristic that the clamping force exerted by the side skin clamping reinforcement member on the side skin is greater than the pressing force exerted by the silicon rod pressing member on the silicon rod main body and the pressing force exerted by the side skin pressing member on the side skin, so as to drive the clamped side skin 101 to disengage from the silicon rod main body (specific details can be seen in Figure 10 the state schematic diagram as shown).

[0153] In the present application, the first side skin anti-cracking device further includes a side skin discharging and conveying mechanism, which is connected to the side skin fixture advancing and retreating mechanism.

[0154] In some embodiments, the side skin discharging and conveying mechanism may include a side skin bearing structure and a conveying driving mechanism. As Figure 5 shown, the side skin discharging mechanism device may include a side skin bearing structure 167 and a conveying driving mechanism 168.

[0155] The edge skin bearing structure 167 is used to bear the edge skin. Previously, the edge skin clamped by the edge skin clamp is withdrawn along the advancing and retreating direction by using the edge skin clamp advancing and retreating mechanism to drive the edge skin to separate from the silicon rod main body. After that, the chuck driving mechanism in the edge skin clamp drives the chuck to move to release the clamped edge skin and make it fall on the edge skin bearing structure. In some embodiments, the edge skin bearing structure can be, for example, an edge skin placement groove. The edge skin placement groove can be, for example, in a U-shaped structure.

[0156] In some embodiments, the conveying driving mechanism is used to drive the edge skin bearing structure to move in the transfer direction to move between the first loading and unloading position and the first cutting position. In the embodiment as Figure 5 shown, the edge skin feeding mechanism device includes two edge skin bearing structures 167 and a conveying driving mechanism 168. The conveying driving mechanism 168 is associated with the two edge skin bearing structures 167 and is used to drive the two edge skin bearing structures 167 to move between the first loading and unloading position and the first cutting position. In some embodiments, the conveying driving mechanism 168 can be, for example, a chain conveying mechanism. Of course, in the edge skin feeding conveying mechanism, a conveying driving mechanism can be configured for each edge skin bearing device, and the corresponding edge skin bearing structure is driven by the conveying driving mechanism. Taking the conveying driving mechanism as a chain conveying mechanism as an example, it includes an endless chain, a chain driving source, and a connecting member. Among them, the endless chain is a closed-loop chain, which is wound around a plurality of movable gears to form a preset shape, for example, an inverted triangle, a rectangle, or a trapezoid, etc. The edge skin bearing structure is associated with the endless chain through the connecting member. The chain driving source can be, for example, a servo motor, and the servo motor is associated with one of the movable gears. For example, the output shaft of the servo motor is connected to the gear shaft of the movable gear. When the endless chain is driven to operate by the servo motor, the edge skin bearing structure and the edge skin it bears can be driven to move in the transfer direction through the connecting member. In practical applications, the servo motor works to drive the associated movable gear to rotate forward (or backward). The forwardly rotating (or backwardly rotating) movable gear drives the engaged endless chain to move forward (or backward). The forwardly moving (or backwardly moving) endless chain can drive the edge skin bearing structure to move from the first loading and unloading position to the first cutting position through the connecting member; conversely, the servo motor works to drive the associated movable gear to rotate backward (or forward). The backwardly rotating (or forwardly rotating) movable gear drives the engaged endless chain to move backward (or forward). The backwardly moving (or forwardly moving) endless chain can drive the edge skin bearing structure and the edge skin it bears to move from the first cutting position to the first loading and unloading position through the connecting member.

[0157] In some embodiments, a conveying drive mechanism is configured to convey the edge skin on the edge skin bearing structure. In some embodiments, the conveying drive mechanism is a chain conveying mechanism or a belt drive mechanism. Taking the chain conveying mechanism as an example of the conveying drive mechanism, it includes an endless chain, a chain drive source, and a pushing member. The endless chain is a closed-loop chain that is wound around a plurality of movable gears to form a preset shape, such as an inverted triangle, a rectangle, or a trapezoid. The chain drive source may be, for example, a servo motor, which is associated with one of the movable gears. For example, the output shaft of the servo motor is connected to the gear shaft of the movable gear. The pushing member may be fixedly disposed on the endless chain. When the endless chain is driven by the servo motor to rotate, the pushing member will interfere with the edge skin carried by the edge skin bearing structure and push the edge skin. In practical applications, the servo motor operates to drive the associated movable gear to rotate forward. The forward-rotating movable gear drives the engaged endless chain to move forward. The pushing member on the forward-moving endless chain will contact the edge skin and push the edge skin to move relative to the edge skin bearing structure until unloading. The pushing member may be, for example, a lever or a protrusion.

[0158] In the present application, the edge skin discharging and conveying mechanism further includes an edge skin flipping mechanism for driving the edge skin bearing structure to flip. Each edge skin bearing structure is provided with an edge skin flipping mechanism, and the edge skin flipping mechanism can be used to drive the corresponding edge skin bearing structure and the edge skin carried thereon to flip. In some embodiments, please refer to Figure 11 and Figure 12 , in the embodiments shown in Figure 11 and Figure 12 , the edge skin flipping mechanism includes a pivot shaft and a telescopic assembly. The telescopic assembly includes a telescopic rod 1691 and a telescopic cylinder 1692. The edge skin bearing structure 167 is pivotally mounted through the pivot shaft. One end of the telescopic rod 1691 is associated with the corresponding edge skin bearing structure 167, and the other end of the telescopic rod 1691 is associated with the telescopic cylinder 1692. In practical applications, the telescopic cylinder 1692 drives the telescopic rod 1691 to contract, and the telescopic rod 1691 pulls the edge skin bearing structure 167 to flip vertically through the pivot shaft and be vertically arranged. The telescopic cylinder 1692 drives the telescopic rod 1691 to extend, and the telescopic rod 1691 pushes the edge skin bearing structure 167 to flip away from the vertical through the pivot shaft and be horizontally or obliquely arranged, so that the edge skin carried by the edge skin bearing structure 167 is horizontally or obliquely arranged, which is beneficial to subsequent unloading of the edge skin.

[0159] When performing the first cutting operation on a silicon rod using the first silicon rod cutting device in the cutting and grinding integrated device for small-sized rectangular rods of the present application, the silicon rod to be cut is placed horizontally on the first silicon rod transfer device located at the first loading and unloading position; the first silicon rod carrying device and the silicon rod it carries are driven to move along the transfer direction from the first loading and unloading position to the first cutting position. The side skin clamp advancing and retreating mechanism drives the side skin clamp to advance along the advancing and retreating direction to the silicon rod, and the side skin clamp of the first side skin anti-cracking device is driven to clamp the silicon rod to be cut. At this time, the two first cutting wire saws arranged in parallel in the first silicon rod cutting device are located between the front side skin clamp and the silicon rod; the first silicon rod transfer device is driven to carry the silicon rod and advance towards the first cutting position along the transfer direction. The first silicon rod cutting device and the first silicon rod transfer device move relative to each other along the transfer direction so that the two first cutting wire saws arranged in parallel in the first silicon rod cutting device perform the first cutting operation on the silicon rod with a circular cross-section, so that two parallel first side cut surfaces are formed after the two side skins of the silicon rod are cut off; using the side skin clamp advancing and retreating mechanism in the first side skin anti-cracking device, that is, the side skin clamp advancing and retreating mechanism drives the side skin clamp to retreat along the advancing and retreating direction, and the side skin clamped by the side skin clamp can be withdrawn along the advancing and retreating direction to drive the clamped side skin to separate from the silicon rod body; the side skin clamp and the side skin it holds are driven to descend by the clamp lifting mechanism, releasing the side skin clamp, and the side skin is released onto the side skin carrying structure. The side skin carrying structure is driven to move along the transfer direction from the first cutting position to the first loading and unloading position by the conveying driving mechanism, and the side skin carrying structure and the side skin it carries are driven to flip by the side skin flipping mechanism to unload the flipped side skin; the first silicon rod carrying device and the silicon rod body it carries are driven to move along the transfer direction from the first cutting position to the first loading and unloading position to complete the first cutting operation of the silicon rod.

[0160] The second cutting station includes a second loading and unloading position and a second cutting position. A second silicon rod transfer device is configured on the second cutting station. The second silicon rod transfer device is used to carry the silicon rod with two first side cut surfaces and move between the second loading and unloading position and the second cutting position along the transfer direction. The second silicon rod cutting device is arranged at the second cutting position. The second silicon rod cutting device is provided with at least one second cutting wire saw and at least one third cutting wire saw. The at least one second cutting wire saw and the at least one third cutting wire saw are located in a vertical plane and arranged vertically or arranged at an angle to the vertical. The second silicon rod cutting device and the second silicon rod transfer device move relative to each other along the transfer direction so that the second cutting wire saw and the third cutting wire saw perform the second cutting operation on the silicon rod with two first side cut surfaces to obtain at least two half rods with a rectangular cross-section.

[0161] The second silicon rod transfer device is used to carry the silicon rod along the transfer direction between the second loading / unloading position and the second cutting position of the second cutting station. Among them, the silicon rod (with two first side cutting surfaces) is placed horizontally on the second silicon rod transfer device, and the axis line of the silicon rod is consistent with the transfer direction, and the transfer direction is consistent with the first direction.

[0162] In some embodiments, the second silicon rod transfer device may include: a second transfer channel, a second bearing platform, and a second transfer driving mechanism. Among them, the second transfer channel is arranged along the transfer direction. In some implementation manners, the second transfer channel includes a second transfer guide rail. The length of the second transfer channel in the transfer direction is greater than the length of the silicon rod to be cut. The second bearing platform is arranged on the second transfer channel and is used to bear the silicon rod. After being borne by the second bearing platform, the silicon rod is horizontal, that is, the axis line of the silicon rod is consistent with the transfer direction (that is, the first direction). The second transfer driving mechanism is used to drive the second bearing platform and the silicon rod borne by it to move along the transfer direction on the second transfer channel.

[0163] In some embodiments, the second bearing platform is erected on the second transfer guide rail of the second transfer channel. The second bearing platform is used to bear the silicon rod and is in contact with the first side cutting surface of the silicon rod. The second transfer driving mechanism is used to drive the second bearing platform and the silicon rod borne by it to move along the transfer direction on the second transfer channel.

[0164] In some embodiments, the second transfer driving mechanism includes: a second platform transfer guide rail arranged along the transfer direction; a second transfer driving unit for driving the second bearing platform to move along the second platform transfer guide rail.

[0165] In an implementation manner, the second transfer driving unit includes: a transfer tooth rail, a transfer gear, and a gear driving source. The transfer tooth rail is arranged along the transfer direction. The transfer gear is associated with the second bearing platform and meshes with the transfer tooth rail. The gear driving source is used to drive the transfer gear to rotate so that the associated second bearing platform moves along the transfer direction. The gear driving source can be, for example, a servo motor.

[0166] In some implementation manners, the second transfer driving unit includes: a transfer lead screw and a lead screw driving source. The transfer lead screw is arranged along the transfer direction and is associated with the second bearing platform. The lead screw driving source is used to drive the transfer lead screw to rotate so that the associated second bearing platform moves along the transfer direction. The lead screw driving source can be, for example, a servo motor.

[0167] The second silicon rod cutting device is arranged at the second cutting station and is used to perform a second cutting operation on the silicon rod at the second cutting position of the second cutting station by the second silicon rod transfer device, so that after the silicon rod forms two parallel second side cutting surfaces and at least one cutting surface between the two second side cutting surfaces, at least two half rods with a rectangular cross section are obtained.

[0168] The second silicon rod cutting device includes at least one second wire cutting unit. The second wire cutting unit includes a plurality of second cutting wheels and a second cutting wire. The second cutting wire is sequentially wound around the plurality of second cutting wheels to form at least one second cutting wire saw. By relatively moving the second wire cutting unit and the second silicon rod transfer device and the silicon rod carried by it at the second cutting station, the silicon rod carried by the second silicon rod transfer device is subjected to a second cutting operation by at least one second cutting wire saw. Among them, in some embodiments, the second cutting wire is wound between each second cutting wheel in a closed-loop winding manner. At this time, the second cutting wire can also be called a closed-loop cutting wire.

[0169] As Figure 1 shown, the second silicon rod cutting device 15 includes two second wire cutting units 151 arranged in parallel. Each second wire cutting unit includes: a plurality of second cutting wheels and a second cutting wire. The second cutting wire is wound around the plurality of second cutting wheels to form at least one second cutting wire saw. Among them, the second cutting wire saw is arranged vertically or at an angle to the vertical.

[0170] Please refer to Figure 13 , which shows a schematic structural diagram of the second silicon rod cutting device in an embodiment. In the embodiment as Figure 13 shown, the second silicon rod cutting device 15 includes two second wire cutting units 151. The second wire cutting unit 151 includes: a plurality of second cutting wheels 152 and a second cutting wire 154. The second cutting wire is wound around the plurality of second cutting wheels 152 to form at least one second cutting wire saw 155. Among them, the second cutting wire saw 155 is arranged vertically or at an angle to the vertical. In addition, the second wire cutting unit 151 may further include a second cutting installation structure 150, and the foregoing plurality of second cutting wheels 152 are arranged on the second cutting installation structure 150.

[0171] In some embodiments, the plurality of second cutting wheels in the second wire cutting unit are connected to the second cutting installation structure, or the plurality of second cutting wheels are arranged on the second cutting installation structure through brackets, connecting plates, or mounting frames. The second cutting installation structure serves as a carrier for associating the plurality of second cutting wheels in the second wire cutting unit with the second cutting frame or the second cutting seat. The specific form of the second cutting installation structure may be a beam body, a plate frame, a bracket, etc., which is not limited in this application.

[0172] In the cutting and grinding integrated equipment for small-sized rectangular rods of the present application, the second cutting wire saw in the second wire cutting unit included in the second silicon rod cutting device is arranged vertically or at an angle to the vertical.

[0173] In the second wire cutting unit, at least one second wire cutting groove for winding a cutting wire is provided in the second cutting wheel. The second wire cutting groove can define the position of the second cutting wire to control the cutting precision. Any second wire saw is formed between two relatively arranged second cutting wheels after the second cutting wire is wound around them. The positions of the two second cutting wheels and the positional relationship between the two second cutting wheels can be used to determine the running direction of the second wire saw.

[0174] As Figure 13 shown, in some embodiments, the second cutting installation structure 150 is an overall rectangular frame. The second cutting unit includes a plurality of second cutting wheels 152, for example, four second cutting wheels 152. The four second cutting wheels 152 are respectively arranged near the four corners of the second cutting installation structure 150, and the wheel surface of each second cutting wheel 152 is located in the vertical plane (the vertical plane is formed by the first direction and the third direction). Among them, two second cutting wheels 152 are in the front (relatively closer to the second loading and unloading area) and are arranged in parallel up and down, and the other two second cutting wheels 152 are in the back (relatively farther from the second loading area) and are arranged in parallel up and down. After the second cutting wire 154 is wound around these four second cutting wheels 152, at least one second wire saw 155 is formed (for example, a second wire saw 155 is formed between the two second cutting wheels 152 arranged in parallel up and down in the front). The second wire saw 155 is arranged along the third direction (i.e., the vertical direction). In addition, to enable the second wire saw 155 to effectively cut the silicon rod, the second wire saw 155 needs to interfere with the silicon rod in the vertical direction.

[0175] In some embodiments, the second cutting wire is wound around each second cutting wheel in a head-to-tail connection manner to form a looped cutting wire (also referred to as a closed-loop cutting wire). In Figure 13 the shown embodiment, the second cutting wire 154 is wound around a plurality of second cutting wheels 152 in a head-to-tail connection manner to form a looped cutting wire (also referred to as a closed-loop cutting wire).

[0176] The plurality of second cutting wheels in the second cutting unit are wound by a looped cutting wire. In this example, the second silicon rod cutting device can omit the wire storage cylinder. The looped cutting wire can be driven by a cutting wire driving device to maintain high-speed operation. At the same time, the looped cutting wire can run in the same running direction during the cutting operation. In this way, the second silicon rod cutting device can achieve high-precision second cutting operations, avoiding problems such as ripples on the cutting surface caused by the running direction change or running speed of the cutting wire in the existing cutting methods; at the same time, the looped cutting wire can effectively reduce the total length of the cutting wire required for the second wire cutting unit and reduce production costs.

[0177] In some embodiments, the cutting wire driving device is a motor, which has a power output shaft and the power output shaft is shaft-connected to the second cutting wheel. In this way, the second cutting wire can be driven by the wound second cutting wheel to run in the winding direction. Of course, in specific implementation manners, the cutting wire driving device can also be other driving sources such as a hydraulic motor, as long as it can drive the second cutting wire to run, and this application does not make any restrictions.

[0178] The second wire cutting unit in this application may further include a second idler wheel, which is used to reverse or guide the second cutting wire, or the second idler wheel can be used to adjust the tension of the second cutting wire. The number of second idler wheels can be one or more according to the layout requirements.

[0179] When the second idler wheel realizes the guiding and traction of the second cutting wire, it also serves as a tensioning wheel for adjusting the tension of the second cutting wire. The tensioning wheel is used to adjust the tension of the second cutting wire, which can reduce the probability of the second cutting wire breaking and reduce the consumables.

[0180] As Figure 13 shown, in the second wire cutting unit, the second cutting installation structure 150 is an overall rectangular frame. Each second wire cutting unit 151 includes a plurality of second cutting wheels 152 and a plurality of second idler wheels 153. For example, there are two second cutting wheels 152 and two second idler wheels 153, which are respectively arranged near the four corners of the second cutting installation structure 150, and the wheel surfaces of the two second cutting wheels 152 and the two second idler wheels 153 are all located in the vertical plane. Among them, the two second cutting wheels 152 are in the front and are arranged in parallel up and down, and the two second idler wheels 153 are in the back and are arranged in parallel up and down. The second cutting wire 154 forms at least one second cutting wire saw 155 after winding around the two second cutting wheels 152 and the two second idler wheels 153 (for example, a second cutting wire saw 155 is formed between the two second cutting wheels 152), and at least one second cutting wire saw 155 is arranged vertically.

[0181] As mentioned above, the second cutting wire 154 forms a second cutting wire saw 155 between the two front second cutting wheels 152 after winding around a plurality of second cutting wheels 152 or a plurality of second cutting wheels 152 and a plurality of second idler wheels 153. Therefore, to adjust the wire length of the second cutting wire saw 155, the distance between the two second cutting wheels 152 can be adjusted, and the implementation methods include changing the position of at least one of the two second cutting wheels 152.

[0182] The second wire saw for cutting is located in a vertical plane and is arranged vertically or at an angle to the vertical. The silicon rod carried by the second silicon rod transfer device at the corresponding second cutting station is placed horizontally (the axis line of the silicon rod is arranged along the transfer direction). Therefore, to achieve the cutting of the silicon rod, the length of the second wire saw for cutting is adapted to the size of the end face of the silicon rod. For example, the length of the second wire saw for cutting should be greater than or equal to the diameter of the silicon rod or the chord length at the position where the silicon rod is to be cut.

[0183] The direction of the surface of the second cutting wheel has a corresponding relationship with the running direction of the second wire saw for cutting. It should be understood that the surface of the second cutting wheel is parallel to the plane where any second cutting wire groove in the second cutting wheel is located. To control the cutting accuracy and the stability of the cutting process, the second wire saw for cutting should be located in the plane where the second cutting wire groove for winding the second cutting wire is located. At the same time, during the cutting process, it is necessary to make the force application direction of the silicon rod on the second cutting wire parallel to the cutting wire groove, that is, the surface of the cutting wheel is parallel to the cutting direction. The cutting direction in the second cutting operation is the axis line direction of the silicon rod, that is, the transfer direction (i.e., the first direction X-axis).

[0184] The second silicon rod cutting device includes two second wire cutting units arranged in parallel. Each second wire cutting unit has a second wire saw for cutting. Therefore, the two second wire cutting units form two parallel wire saws for cutting. In Figure 13 In the shown embodiment, the second silicon rod cutting device includes two second wire cutting units arranged in parallel along the second direction. Each second wire cutting unit has a second wire saw for cutting, and the second wire saw for cutting is arranged vertically. In this way, the two second wire saws for cutting belonging to the two second wire cutting units are both arranged vertically.

[0185] In fact, the second wire saw may still have other variations. In some embodiments, the second wire saw is arranged vertically, but this is not limiting. In other embodiments, the position of the second wire saw may be within the vertical plane and arranged at an angle with respect to the vertical (i.e., the third direction). The vertical plane is formed by the first direction and the third direction, and the angle is less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°). That is, the running direction of the second wire saw may be within the vertical plane with the third direction (i.e., the vertical) and form an angle less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°) with the third direction (i.e., the vertical). The angle here is not limited to an integer angle and can be any angle within the limited range. For example, 0.09°, 1.3°, 2.5°, 3°, etc. In some embodiments, among the two second cutting wheels arranged up and down to form the second wire saw, the upper second cutting wheel is in front in the first direction and the lower second cutting wheel is behind in the first direction, and the formed second wire saw may form a positive angle with the vertical. In some embodiments, among the two second cutting wheels arranged up and down to form the second wire saw, the upper second cutting wheel is behind in the first direction and the lower second cutting wheel is in front in the first direction, and the formed second wire saw may form a negative angle with the vertical. Among them, the angle (including the positive angle and the negative angle) can be changed according to the cutting process requirements and the size specifications of the silicon rod. For example, the angle of the angle is adjusted by changing the position of one or both of the two second cutting wheels arranged up and down related to the second wire saw.

[0186] In some embodiments, the second wire cutting unit further includes a second tension adjusting mechanism. In wire cutting processing, the magnitude of the cutting wire tension affects the yield and processing accuracy during cutting. The second tension adjusting mechanism performs tension detection and adjusts the tension so that the tension of the second cutting wire reaches a set certain threshold value and remains constant during cutting or within a certain range allowed with the constant value as the numerical center. In some embodiments, the second tension adjusting mechanism is associated with the second idler wheel 153 or the second cutting wheel. When the second idler wheel 153 in the wire cutting unit realizes the guiding and traction of the second cutting wire 154, it simultaneously serves as a tensioning wheel for cutting wire tension adjustment.

[0187] The tensioning wheel is used to adjust the tension of the cutting wire, which can reduce the probability of the cutting wire breaking and thus reduce consumables. In the cutting operation, the role of the cutting wire is crucial. However, even the best cutting wire has limited elongation and wear resistance. That is to say, the cutting wire will gradually become thinner during continuous operation until it is finally broken. Therefore, current wire cutting equipment generally designs a cutting wire tension compensation mechanism to make up for the elongation of the cutting wire during its round-trip movement. Using a tensioning wheel is one implementation means.

[0188] In some embodiments, taking the idler pulley as an example of the intermediate pulley, the tension adjusting mechanism at least includes: a tension sensor, a servo motor, and a lead screw; the tension sensor is disposed on the intermediate pulley, continuously senses the tension value of the cutting wire on the intermediate pulley, and issues a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor and is configured to start working after receiving the driving signal issued by the tension sensor; one end of the lead screw is connected to the intermediate pulley, and the other end is connected to the servo motor, and the intermediate pulley is pulled to perform a one-way displacement when the servo motor works, so as to adjust the tension of the cutting wire.

[0189] In some embodiments, the tension adjusting mechanism includes: a link assembly and a tension driving unit, the link assembly is associated with the intermediate pulley serving as an idler pulley and the tension driving unit, and the link assembly is controlled by the tension driving unit, that is, the link assembly is driven by the tension driving unit to act so as to drive the intermediate pulley to generate a position change to adjust the tension of the closed-loop cutting wire.

[0190] Regarding the tension driving unit, in some implementation manners, the tension driving unit may include a counterweight portion, and the counterweight portion may be associated with the link assembly. For example, taking a certain intermediate pulley as an idler pulley as an example, when it is necessary to increase the tension of the closed-loop cutting wire, the counterweight portion is released, the counterweight portion descends, and the link assembly drives the associated idler pulley to move under the action of the gravity of the counterweight portion, so as to increase the perimeter of the figure formed by each cutting wheel and the intermediate pulley and increase the tension of the closed-loop cutting wire. When it is necessary to reduce the tension of the closed-loop cutting wire, the counterweight portion is lifted, and the link assembly drives the associated idler pulley to move in the reverse direction under the action of the gravity of the counterweight portion, so as to increase the perimeter of the figure formed by each cutting wheel and the intermediate pulley and reduce the tension of the closed-loop cutting wire.

[0191] The counterweight portion may include counterweight blocks, wherein the number of counterweight blocks may vary according to the requirements of adjusting the tension of the closed-loop cutting wire. For example, when increasing the tension of the closed-loop cutting wire, the number of counterweight blocks may be increased, and when reducing the tension of the closed-loop cutting wire, the number of counterweight blocks may be reduced.

[0192] In some embodiments, the counterweight portion may include a locking mechanism for locking the counterweight portion so that the counterweight portion is stationary relative to the cutting installation structure, so as to switch the state between the counterweight portion and the cutting installation structure from a movable state to a locked state. In some examples, the locking mechanism may be, for example, a bolt.

[0193] The tension driving unit may still be subject to other changes. For example, in some implementation manners, the tension driving unit may include a pneumatic cylinder.

[0194] In some embodiments, the second silicon rod cutting device further includes: at least one second distance adjusting mechanism disposed on at least one second wire cutting unit for driving a plurality of second cutting wheels in the second wire cutting unit to move in a direction perpendicular to the wheel surface of the cutting wheel. The second silicon rod cutting device can switch the second cutting wire between different cutting grooves of the second cutting wheel based on the distance adjusting mechanism, or adjust the position of the second wire cutting saw to change the cutting position (or processing specification) relative to the silicon rod.

[0195] In some implementation manners, taking one second wire cutting unit in the second silicon rod cutting device as an example for illustration, the second wire cutting unit includes a plurality of second cutting wheels and a plurality of second transition wheels. The carrier for carrying the plurality of second cutting wheels and the second transition wheels is, for example, a second cutting installation structure. The second distance adjusting mechanism can be used to drive the entire second cutting installation structure to move in a direction perpendicular to the wheel surface of the cutting wheel. The second transition wheels and the second cutting wheels move together with the second cutting installation structure in a direction perpendicular to the wheel surface of the second cutting wheel (i.e., the transposition direction or the second direction Y-axis). In this state, the plurality of second cutting wheels and the second transition wheels are relatively stationary, that is, the positional relationship between the second transition wheels and the second cutting wheels remains unchanged. At this time, the second distance adjusting mechanism is used to adjust the cutting position of at least one second wire cutting saw in at least one second wire cutting unit relative to the silicon rod.

[0196] In some implementation manners, each second cutting wheel has at least two second cutting wire grooves. Different second cutting wire grooves are parallel to each other and have a cutting offset in the direction perpendicular to the wheel surface of the second cutting wheel between different second cutting wire grooves. When the second distance adjusting mechanism is used to drive a plurality of second cutting wheels in the second wire cutting unit to move relative to the second cutting installation structure, the groove position of the second cutting wire wound around the second cutting wheel can be changed. In some implementation manners, for example, the plurality of second cutting wheels in the second wire cutting unit can be connected to a bracket, where the bracket is movably arranged on the second cutting installation structure and is driven by the second distance adjusting mechanism to move in a direction perpendicular to the wheel surface of the second cutting wheel.

[0197] When at least one second distance adjustment mechanism is used to realize the transformation that the second cutting wire winds around the cutting wire grooves of multiple second cutting wheels in at least one second wire cutting unit, in an actual scenario, the second cutting wire grooves respectively corresponding to the cutting wire before and after the groove change can be determined in advance. For example, the position where the second cutting wire is located before the groove change is the second cutting wire groove a1, and after the groove change, the second cutting wire winds around the second cutting wire groove a2. Based on the cutting offset between the second cutting wire groove a1 and the second cutting wire groove a2, the displacement amount of the second distance adjustment mechanism driving the multiple second cutting wheels in the second wire cutting unit to move is determined, that is, the displacement amount is set as the cutting offset between the second cutting wire groove a1 and the second cutting wire groove a2, which can be used to realize the replacement of the second cutting wire from the second cutting wire groove a1 to the second cutting wire groove a2. It should be noted that the direction in which at least one second distance adjustment mechanism drives the multiple second cutting wheels in the second wire cutting unit to move along the perpendicular direction of the second cutting wheel surface is the direction from the cutting wire groove a2 to the cutting wire groove a1. After the groove change, the cutting position of the second cutting wire saw in space remains unchanged, so the step of further calibrating the positions of the second cutting wheels or other components is omitted, and the silicon rod can be cut according to the preset cutting amount, simplifying the groove change process.

[0198] To further illustrate the implementation manner of at least one second distance adjustment mechanism to realize the movement of multiple second cutting wheels in the second wire cutting unit along the direction perpendicular to the second cutting wheel surface, the following embodiments are disclosed in this application. When the number of second wire cutting units in the second silicon rod cutting device is different, the specific form of at least one second distance adjustment mechanism can be changed accordingly.

[0199] In some embodiments, the second silicon rod cutting device includes a single-wire cutting unit. Here, the single-wire cutting unit is a second wire cutting unit. The second distance adjustment mechanism includes: a lead screw, which is arranged along the orthogonal direction of the second cutting wheel surface and is threadedly connected to the single-wire cutting unit; a lead screw driving source, which is used to drive the lead screw to rotate.

[0200] The single-wire cutting unit in the second silicon rod cutting device includes multiple second cutting wheels, and the second cutting wire is wound around the multiple second cutting wheels to form at least one second cutting wire saw. The lead screw of the second distance adjustment mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the lead screw can be connected to the lead screw driving source and rotated under the drive of the lead screw driving source. The distal end of the lead screw is threadedly connected to the second single-wire cutting unit. Through the connection method at both ends of the lead screw, the lead screw can rotate based on the transmission of the lead screw driving source and convert the rotation of the lead screw into an axial displacement through the threaded connection. The axial displacement direction is the set direction of the lead screw, that is, the orthogonal direction of the cutting wheel surface. By driving the lead screw to rotate through the lead screw driving source in the second distance adjustment mechanism, the displacement of the single-wire cutting unit in the orthogonal direction of the second cutting wheel surface can be realized. When the lead screw is driven to rotate in different rotation directions, the second cutting wheels of the single-wire cutting unit can move forward or backward in the orthogonal direction of the second cutting wheel surface.

[0201] In some embodiments, the second silicon rod cutting device includes a single-wire cutting unit, where the single-wire cutting unit is a second wire cutting unit. The second distance adjusting mechanism includes: a telescopic member disposed along the orthogonal direction of the second cutting wheel surface and associated with the single-wire cutting unit; a telescopic member driving source for driving the telescopic member to perform telescopic movement along the orthogonal direction of the second cutting wheel surface. Here, the telescopic member can be set as a rod structure and the extending direction of the rod is the orthogonal direction of the second cutting wheel surface. The telescopic member can perform telescopic movement along its extending direction under the drive of the telescopic member driving source. One end of the telescopic member can be connected to the telescopic member driving source, and the telescopic free end is associated with the single-wire cutting unit, that is, it can drive the second cutting wheel of the single-wire cutting unit to move in the orthogonal direction of the second cutting wheel surface under the action of the telescopic member driving source. The telescopic member is, for example, an electric telescopic rod, or a connecting rod connected to a cylinder, and the cylinder can be used as the telescopic member driving source, which is not limited in this application. The way the telescopic rod is associated with the single-wire cutting unit can be a direct connection or an indirect connection. For example, it can be directly connected to the second cutting installation structure of the single-wire cutting unit, or indirectly connected to the second single-wire cutting unit through a support or a bearing. It should be understood that when the telescopic member extends or contracts, it corresponds to the forward or backward movement of the single-wire cutting unit in the orthogonal direction of the second cutting wheel surface.

[0202] In the disclosed embodiments, the association can be achieved by one or more of clamping, screwing, bonding, and welding. For example, in the above embodiments, the telescopic rod can be associated with the second wire cutting unit by one or more of clamping, screwing, bonding, and welding; of course, the implementation manner of the association is not limited thereto, but aims to achieve transmission in the second direction.

[0203] In some embodiments, the second silicon rod cutting device includes a single-wire cutting unit, where the single-wire cutting unit is a wire cutting unit. The second distance adjusting mechanism includes: a rack disposed along the orthogonal direction of the second cutting wheel surface on the second single-wire cutting unit; a transmission gear meshing with the rack; a gear driving source for driving the transmission gear to rotate. The transmission gear rotates under the drive of the gear driving source, and the rack meshing with the transmission gear moves correspondingly along the rack step direction. In this example, through the cooperation of the rack and the transmission gear, the rotational movement driven by the gear driving source can be converted into a linear movement along the rack direction. The rack is disposed along the orthogonal direction of the second cutting wheel surface on the second single-wire cutting unit, and can drive the second cutting wheel of the single-wire cutting unit to move in the orthogonal direction of the second cutting wheel surface. At the same time, by controlling the gear driving source to switch the rotation direction of the transmission gear, the multiple second cutting wheels of the single-wire cutting unit can move forward or backward in the orthogonal direction of the second cutting wheel surface.

[0204] In some embodiments, such as Figure 13As shown, the second silicon rod cutting device includes two second wire cutting units arranged in parallel and opposite to each other. At least one of the two second wire cutting units can be driven by at least one distance adjusting mechanism to move in the orthogonal direction of the second cutting wheel surface, for adjusting the wire cutting distance between the second wire saws in the two second wire cutting units, or changing the cutting wire groove around which the second cutting wire winds around multiple second cutting wheels in a certain second wire cutting unit.

[0205] At least one second distance adjusting mechanism can be set to be connected to a certain second wire cutting unit, or simultaneously associated with two second wire cutting units, so as to drive multiple second cutting wheels in one or two second wire cutting units connected or associated to move in the orthogonal direction of the second cutting wheel surface.

[0206] In an embodiment, the second distance adjusting mechanism includes: a lead screw, arranged in the orthogonal direction of the second cutting wheel surface and threadedly connected to a certain second wire cutting unit; a lead screw driving source, used to drive the lead screw to rotate. The way that multiple second cutting wheels in the second wire cutting unit connected to the lead screw and the lead screw driving source move in the orthogonal direction of the second cutting wheel surface is similar to the foregoing embodiment. The second wire cutting unit driven by the distance adjusting mechanism can be regarded as a single wire cutting unit, and details are not described here. It should be understood that by setting the second distance adjusting mechanism on any second wire cutting unit, the parallel second cutting wire saw distance formed between the two second wire cutting units can be increased and decreased, and the second silicon rod cutting device can cut the silicon rod into different specifications.

[0207] In some embodiments, the second distance adjusting mechanism includes: a telescopic member, arranged in the orthogonal direction of the second cutting wheel surface and associated with a certain second wire cutting unit; a telescopic member driving source, used to drive the telescopic member to perform a telescopic movement in the orthogonal direction of the second cutting wheel surface. Here, the second wire cutting unit provided with the second distance adjusting mechanism can be regarded as a single wire cutting unit, and the specific implementation method can refer to the foregoing embodiment, and details are not described here.

[0208] In some embodiments, the second distance adjusting mechanism includes: an adjusting rack, arranged in the orthogonal direction of the second cutting wheel surface and associated with a certain second wire cutting unit; a transmission gear, meshing with the adjusting rack; a gear driving source, used to drive the transmission gear to rotate. Through the meshing transmission gear and adjusting rack, the gear driving source can control the adjusting rack to move along the rack direction line, and the second wire cutting unit associated with the adjusting rack can drive multiple second cutting wheels to move in the orthogonal direction of the second cutting wheel surface through the rack.

[0209] In some embodiments, the distance adjustment mechanism includes: a bidirectional lead screw disposed in the orthogonal direction of the second cutting wheel surface and threadedly connected to the two second wire cutting units; and a lead screw drive source for driving the lead screw to rotate so that the two second wire cutting units move towards or away from each other in the orthogonal direction of the second cutting wheel surface. In one implementation, the bidirectional lead screw is a double-threaded lead screw, with threads provided at both ends of the bidirectional lead screw and the thread directions being opposite. The lead screw drive source can be disposed at any one end of the bidirectional lead screw to drive the bidirectional lead screw to rotate along the lead screw axis. Through the threads with opposite directions at both ends of the bidirectional lead screw, when the bidirectional lead screw rotates driven by the lead screw drive source, the movements at both ends of the bidirectional lead screw are converted into axial linear movements in opposite directions, and the axial direction is the orthogonal direction of the second cutting wheel surface where the bidirectional lead screw is disposed. Driven by the lead screw drive source, the multiple second cutting wheels respectively corresponding to the two second wire cutting units can move towards or away from each other.

[0210] In some embodiments, the second distance adjustment mechanism includes a servo motor disposed on at least one second wire cutting unit. In an actual scenario, a servo motor is provided on at least one second wire cutting unit or each second wire cutting unit of the second silicon rod cutting device, and the servo motor controls the displacement of the corresponding second wire cutting unit in the orthogonal direction of the second cutting wheel surface. The second wire cutting unit can pre-determine the cutting offset amount for groove changing or the adjustment amount for changing the cutting position of the cutting wire, and drives multiple second cutting wheels in the second wire cutting unit to move along the orthogonal direction of the second cutting wheel surface with a preset displacement amount through the precise positioning function of the servo motor. For example, in the second silicon rod cutting device, there are two second wire cutting units, and at least one of the two second wire cutting units moves relatively independently along the orthogonal direction of the second cutting wheel surface driven by its corresponding servo motor. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw. It should be understood that the second distance adjustment mechanism is a driving device for driving the multiple second cutting wheels in the second wire cutting unit to move relatively, and the specific form thereof is not limited in this application.

[0211] As described above, in the second silicon rod cutting device, the second cutting wire saws of the two second wire cutting units arranged in parallel are disposed vertically or obliquely at an angle to the vertical direction. The second silicon rod transfer device and the silicon rod carried by it are driven to move along the transfer direction. By the relative movement of the second wire cutting unit and the second silicon rod transfer device along the transfer direction, the silicon rod carried by the second silicon rod transfer device is subjected to the second cutting operation by the second cutting wire saws in the two second wire cutting units. Using the second wire cutting unit to cut the silicon rod makes the silicon rod form a cutting surface and a side skin. That is, when a silicon rod is cut by a cutting wire saw in a second wire cutting unit, a cutting surface can be formed on the silicon rod, and a side skin is left after cutting. Therefore, when the silicon rod with a circular cross-section is subjected to the second cutting operation by the second cutting wire saws in the two second wire cutting units arranged in parallel in the second silicon rod cutting device, two parallel second side cutting surfaces can be formed on the silicon rod.

[0212] In addition to the second wire cutting unit, the second silicon rod cutting device further includes at least one third wire cutting unit. Among them, at least one third wire cutting unit is formed with at least one third cutting wire saw. At least one third cutting wire saw is located in the vertical plane and arranged vertically or arranged at an angle to the vertical direction. The silicon rod carried by the second silicon rod carrying device is subjected to a second cutting operation by at least one third cutting wire saw so that at least two half rods with a rectangular cross section are obtained after the silicon rod forms at least one cut surface.

[0213] The third wire cutting unit includes a plurality of third cutting wheels and a third cutting wire. The third cutting wire is sequentially wound around the plurality of third cutting wheels to form at least one third cutting wire saw arranged vertically or arranged at an angle to the vertical direction. The second cutting operation is performed on the silicon rod carried by the second silicon rod transfer device by at least one third cutting wire saw through the relative movement between the third wire cutting unit and the second silicon rod transfer device and the silicon rod carried by it at the second cutting station. Among them, in some embodiments, the third cutting wire is wound between each third cutting wheel in a closed-loop winding manner. At this time, the third cutting wire can also be called a closed-loop cutting wire.

[0214] In some embodiments, as Figure 13 shown, the second silicon rod cutting device 15 includes a third wire cutting unit 156 located between two second wire cutting units 151. The third wire cutting unit includes: a plurality of third cutting wheels and a third cutting wire. The third cutting wire is wound around the plurality of third cutting wheels to form at least one third cutting wire saw. Among them, the third cutting wire saw is arranged vertically or at an angle to the vertical direction.

[0215] As Figure 13 shown, the second silicon rod cutting device 15 includes a third wire cutting unit 156 between two second wire cutting units 151. The third wire cutting unit 156 includes: a plurality of third cutting wheels 157 and a third cutting wire 158. The third cutting wire 158 is wound around the plurality of third cutting wheels 157 to form at least one third cutting wire saw 159. Among them, the third cutting wire saw 159 is arranged vertically or at an angle to the vertical direction. As Figure 13As shown, the second silicon rod cutting device 15 may include two second wire cutting units 151 and a third wire cutting unit 156. Each second wire cutting unit 151 has a second wire saw 155, and each third wire cutting unit 156 has a third wire saw 159. Therefore, the second silicon rod cutting device 15 may include two second wire saws 155 and one third wire saw 159. The two second wire saws 155 and one third wire saw 159 are both arranged vertically or at an angle to the vertical. Among them, the third wire saw 159 is located between the two second wire saws 155 and is centered. The second cutting operation of the silicon rod by the third wire saw 159 can divide the silicon rod into two half rods of the same size. However, this is not limited thereto. In some embodiments, the third wire saw 159 is located between the two second wire saws 155 but not centered. The second cutting operation of the silicon rod by the third wire saw 159 can divide the silicon rod into two half rods of different sizes. In some embodiments, the second silicon rod cutting device includes a third wire cutting unit, and the wire cutting unit includes two or more third wire saws. The two or more third wire saws are parallel to each other and are both arranged vertically or at an angle to the vertical. In some embodiments, the second silicon rod cutting device includes two or more third wire cutting units, and two or more third wire saws in these two or more third wire cutting units are parallel to each other and are both arranged vertically or at an angle to the vertical. The second cutting operation of the silicon rod by two or more third wire saws can divide the silicon rod into three or more half rods of the same size or different sizes. In this application, for the convenience of description, the parts of the silicon rod after cutting are all called half rods. In fact, when the number of third wire saws is two or more, the parts of the silicon rod after cutting are likely to be less than 1 / 2 of the whole silicon rod. Therefore, other terms can also be used for "half rod", such as "small-sized rectangular rod", "divided rod", "sub-rod", "small silicon rod", "small square rod", etc.

[0216] In addition, it should be noted that since the second silicon rod cutting device includes at least one third wire cutting unit, in the second silicon rod transfer device, the second carrying platform is provided with at least one groove corresponding to at least one third wire saw. In Figure 13In the illustrated embodiment, the second silicon rod cutting device 15 includes a third wire cutting unit 156 between two second wire cutting units 151. The third wire cutting unit 156 has a third wire saw 159. Therefore, a wire groove 142 corresponding to the third wire saw 159 is provided on the second carrying platform 141 in the second silicon rod transfer device 14. The wire groove 142 is arranged along the transfer direction (i.e., the first direction), and the width of the wire groove 142 is greater than that of the third wire saw 159 to accommodate the third wire saw 159. In some embodiments, the width of the wire groove is much greater than the wire diameter of the third wire saw (for example, greater than or equal to 5 times or 10 times the wire diameter of the third wire saw) to provide displacement of the third wire saw in the width direction of the wire groove (i.e., the transposition direction or the second direction Y-axis). In some embodiments, the second silicon rod cutting device includes two or more third wire saws (in some embodiments, the second silicon rod cutting device includes a third wire cutting unit, and the wire cutting unit includes two or more third wire saws; or, in some embodiments, the second silicon rod cutting device includes two or more third wire cutting units, and each third wire cutting unit includes at least one third wire saw), then, two or at least two wire grooves corresponding to the two or more third wire saws are provided on the second carrying platform.

[0217] In the embodiment as Figure 13 shown, each third cutting wheel 157 in the third wire cutting unit 156 is coaxially arranged with each second cutting wheel 152 in a certain second wire cutting unit 151 on the side, that is, the third cutting wheel 157 in the third wire cutting unit is coaxially arranged with the corresponding second cutting wheel 152 in a certain second wire cutting unit 151 on the side and is arranged on the second cutting installation structure 150. However, this is not limited thereto. In some embodiments, the third wire cutting unit 156 may include a third cutting installation structure, and the foregoing multiple third cutting wheels 157 may be arranged on the third cutting installation structure.

[0218] In the cutting and grinding integrated device for small-sized rectangular rods of the present application, the third wire saw in the third wire cutting unit included in the second silicon rod cutting device is arranged vertically or at an angle to the vertical direction.

[0219] In the third wire cutting unit, at least one third wire cutting groove for winding the cutting wire is provided in the third cutting wheel. The third wire cutting groove can define the position of the third cutting wire so as to control the cutting accuracy. Any third wire saw is formed between two relatively arranged third cutting wheels after the third cutting wire is wound around the two third cutting wheels. The positions of the two third cutting wheels and the positional relationship between the two third cutting wheels can be used to determine the running direction of the third wire saw.

[0220] As Figure 13As shown, in some embodiments, the third cutting unit includes a plurality of third cutting wheels 157, for example, four third cutting wheels 157. The four third cutting wheels 157 are arranged in a rectangular shape, and the wheel surface of each third cutting wheel 157 is located in the vertical plane (the vertical plane is formed by the first direction and the third direction). Among them, two third cutting wheels 157 are in the front (relatively closer to the second loading and unloading area) and are arranged in parallel up and down, and the other two third cutting wheels 157 are in the back (relatively farther from the second loading area) and are arranged in parallel up and down. After the third cutting wire 158 winds around these four third cutting wheels 157, at least one third cutting wire saw 159 is formed (for example, a third cutting wire saw 159 is formed between the two third cutting wheels 157 arranged in parallel up and down in the front). The third cutting wire saw 159 is arranged along the third direction (i.e., the vertical direction). In addition, to enable the third cutting wire saw 159 to effectively cut the silicon rod, the third cutting wire saw 159 needs to interfere with the silicon rod in the vertical direction.

[0221] In some embodiments, the third cutting wire winds around each third cutting wheel in a head-to-tail connection manner to form a circular cutting wire (also referred to as a closed-loop cutting wire). Figure 13 In the embodiment shown, the third cutting wire 158 winds around a plurality of third cutting wheels 157 in a head-to-tail connection manner to form a circular cutting wire (also referred to as a closed-loop cutting wire).

[0222] The plurality of third cutting wheels in the third cutting unit are wound by a circular cutting wire. In this example, the second silicon rod cutting device can omit the wire storage cylinder. The circular cutting wire can be driven by a cutting wire driving device to maintain high-speed operation. At the same time, the circular cutting wire can run in the same running direction during the cutting operation. In this way, the second silicon rod cutting device can achieve high-precision second cutting operations, avoiding problems such as ripples on the cutting surface caused by the running direction change or running speed of the cutting wire in the existing cutting methods; at the same time, the circular cutting wire can effectively reduce the total length of the cutting wire required for the third wire cutting unit and reduce production costs.

[0223] In some embodiments, the cutting wire driving device is a motor, which has a power output shaft and the power output shaft is shaft-connected to the third cutting wheel. In this way, the third cutting wire can be driven by the wound third cutting wheel to run along the winding direction. Of course, in a specific implementation manner, the cutting wire driving device can also be other driving sources such as a hydraulic motor, as long as it can drive the third cutting wire to run. The present application is not limited. As mentioned above, in some embodiments, each third cutting wheel in the third wire cutting unit is coaxially arranged with each second cutting wheel in a certain adjacent second wire cutting unit. Therefore, each third cutting wheel in the third wire cutting unit can be driven by the cutting wire driving device in the second wire cutting unit, and the corresponding cutting wire driving device for the third wire cutting unit can be omitted.

[0224] The third wire cutting unit in this application may further include a third idler pulley, which is used to reverse or guide the third cutting wire, or the third idler pulley can be used to adjust the tension of the third cutting wire. The number of the third idler pulleys can be one or more according to the layout requirements.

[0225] When the third idler pulley realizes the guiding and traction of the third cutting wire, it also serves as a tension pulley for adjusting the tension of the third cutting wire. The tension pulley is used to adjust the tension of the third cutting wire, which can reduce the probability of the third cutting wire breaking and thus reduce the consumption of materials.

[0226] As Figure 13 shown, for example, in some embodiments, the third wire cutting unit 156 includes a plurality of third cutting wheels 157 and a plurality of third idler pulleys 157'. For example, there are two third cutting wheels 157 and two third idler pulleys 157', and the wheel surfaces of the two third cutting wheels 157 and the two third idler pulleys 157' are all located in the vertical plane. Among them, the two third cutting wheels 157 are in the front and arranged in parallel up and down, and the two third idler pulleys 157' are in the back and arranged in parallel up and down. After the third cutting wire 158 winds around the two third cutting wheels 157 and the two third idler pulleys 157', at least one third cutting wire saw 159 is formed (for example, a third cutting wire saw 159 is formed between the two third cutting wheels 157), and at least one third cutting wire saw 159 is arranged vertically.

[0227] As mentioned above, the third cutting wire 158 winds around a plurality of third cutting wheels 157 or a plurality of third cutting wheels 157 and a plurality of third idler pulleys 157', and then a third cutting wire saw 159 is formed between the two front third cutting wheels 157. Therefore, to adjust the wire length of the third cutting wire saw 159, the distance between the two third cutting wheels 157 can be adjusted, and the implementation methods include changing the position of at least one of the two third cutting wheels 157.

[0228] The third cutting wire saw is arranged vertically or at an angle to the vertical direction, and the silicon rod carried by the second silicon rod transfer device at the corresponding second cutting station is placed horizontally (the axis line of the silicon rod is arranged along the transfer direction). Therefore, to realize the cutting of the silicon rod, the length of the third cutting wire saw is adapted to the size of the end face of the silicon rod. For example, the length of the third cutting wire saw should be greater than or equal to the diameter of the silicon rod or the chord length at the position where the silicon rod is to be cut.

[0229] The direction of the third cutting wheel surface has a corresponding relationship with the running direction of the third wire saw. It should be understood that the third cutting wheel surface is parallel to the plane where any third cutting wire groove in the third cutting wheel is located. To control the cutting accuracy and the stability of the cutting process, the third wire saw should be located within the plane where the third cutting wire groove for winding the third cutting wire is located. At the same time, during the cutting process, it is necessary to make the force application direction of the silicon rod on the third cutting wire parallel to the cutting wire groove, that is, the cutting wheel surface is parallel to the cutting direction. The cutting direction in the second cutting operation is the axis direction of the silicon rod, that is, the transfer direction (i.e., the first direction X-axis).

[0230] The second silicon rod cutting device includes a third wire cutting unit located between two second wire cutting units and arranged in parallel with the two second wire cutting units. The third wire cutting unit has a third wire saw, and the third wire saw is arranged vertically or at an angle to the vertical direction.

[0231] In fact, the third wire saw can still have other variations. In some embodiments, the third wire saw is arranged vertically, but not limited thereto. In other embodiments, the position of the third wire saw can be located within the vertical plane and arranged at an angle to the vertical direction (i.e., the third direction). The vertical plane is formed by the third direction and the third direction, and the angle is less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°). That is, the running direction of the third wire saw can be within the vertical plane with the third direction (i.e., the vertical direction) and form an angle less than or equal to 10 degrees (≤10°), or less than or equal to 5 degrees (≤5°), or less than or equal to 3 degrees (≤3°) with the third direction (i.e., the vertical direction). The angle here is not limited to integer angles and can be any angle within the limited range. For example, 0.09°, 1.3°, 2.5°, 3°, etc. In some embodiments, for the two third cutting wheels arranged vertically to form the third wire saw, the upper third cutting wheel is in front in the first direction and the lower third cutting wheel is behind in the first direction, and the formed third wire saw can form a positive angle with the vertical direction. In some embodiments, for the two third cutting wheels arranged vertically to form the third wire saw, the upper third cutting wheel is behind in the first direction and the lower third cutting wheel is in front in the first direction, and the formed third wire saw can form a negative angle with the vertical direction. Among them, the angle (including the positive angle and the negative angle) can be changed according to the cutting process requirements and the size specifications of the silicon rod. For example, the angle of the angle is adjusted by changing the position of one or both of the two third cutting wheels arranged vertically related to the third wire saw.

[0232] In some embodiments, the third wire cutting unit further includes a third tension adjusting mechanism. In wire cutting machining, the magnitude of the cutting wire tension affects the yield and machining accuracy during cutting. The third tension adjusting mechanism performs tension detection and adjusts the tension so that the tension of the third cutting wire reaches a set certain threshold value and remains constant during cutting or within a certain range allowed with the constant value as the numerical center.

[0233] In some embodiments, the third tension adjusting mechanism is associated with the third idler wheel or the third cutting wheel. When the third idler wheel in the wire cutting unit realizes the guiding and traction of the third cutting wire 158, it simultaneously serves as a tensioning wheel for cutting wire tension adjustment.

[0234] The tensioning wheel is used to adjust the tension of the cutting wire, which can reduce the probability of the cutting wire breaking and thus reduce the consumables. In the cutting operation, the role of the cutting wire is crucial. However, even the best cutting wire has limited elongation and wear resistance, that is, the cutting wire will gradually become thinner during continuous operation until it is finally broken. Therefore, current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the elongation of the cutting wire during its reciprocating movement. Using a tensioning wheel is one implementation means.

[0235] In some embodiments, taking the tensioning wheel as an idler wheel as an example, the tension adjusting mechanism at least includes: a tension sensor, a servo motor, and a lead screw; the tension sensor is disposed on the idler wheel, continuously senses the tension value of the cutting wire on the idler wheel, and issues a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor and is used to start working after receiving the driving signal issued by the tension sensor; one end of the lead screw is connected to the idler wheel, and the other end is connected to the servo motor, and the lead screw pulls the idler wheel to perform a one-way displacement when the servo motor works to adjust the tension of the cutting wire.

[0236] In some embodiments, the tension adjusting mechanism includes: a link assembly and a tension driving unit. The link assembly is associated with the idler wheel serving as the tensioning wheel and the tension driving unit. The link assembly is controlled by the tension driving unit, that is, the link assembly is driven by the tension driving unit to act so as to drive the idler wheel to generate a position change to adjust the tension of the closed-loop cutting wire.

[0237] Regarding the tension driving unit, in some implementations, the tension driving unit may include a counterweight portion, and the counterweight portion may be associated with the link assembly. For example, taking a certain idler pulley as the tension pulley, when increasing the tension of the closed-loop cutting wire, release the counterweight portion, and the counterweight portion descends. Under the action of the gravity of the counterweight portion, the link assembly drives the associated tension pulley to move, thereby expanding the perimeter of the figure formed by each cutting wheel and the idler pulley and increasing the tension of the closed-loop cutting wire. When reducing the tension of the closed-loop cutting wire, lift the counterweight portion. Under the action of the gravity of the counterweight portion, the link assembly drives the associated tension pulley to move in the reverse direction, thereby expanding the perimeter of the figure formed by each cutting wheel and the idler pulley and reducing the tension of the closed-loop cutting wire.

[0238] The counterweight portion may include counterweight blocks. Among them, the number of counterweight blocks may vary according to the requirements of the closed-loop cutting wire tension adjustment. For example, when increasing the tension of the closed-loop cutting wire, the number of counterweight blocks can be increased; when reducing the tension of the closed-loop cutting wire, the number of counterweight blocks can be reduced.

[0239] In some embodiments, the counterweight portion may include a locking mechanism. In some examples, the locking mechanism may be a bolt, for example.

[0240] The tension driving unit can still be otherwise changed. For example, in some implementations, the tension driving unit may include a pneumatic cylinder.

[0241] In some embodiments, the second silicon rod cutting device further includes: at least one third distance adjustment mechanism provided in at least one third wire cutting unit for driving a plurality of third cutting wheels in the third wire cutting unit to move in a direction perpendicular to the cutting wheel surface. The second silicon rod cutting device can switch the third cutting wire between different cutting grooves of the third cutting wheel based on the distance adjustment mechanism, or adjust the position of the third wire cutting saw to change the cutting position (or processing specification) relative to the silicon rod.

[0242] In some implementations, taking one of the third wire cutting units in the second silicon rod cutting device as an example for illustration, the third wire cutting unit includes a plurality of third cutting wheels and a plurality of third idler pulleys. The third distance adjustment mechanism can be used to drive the plurality of third cutting wheels and the plurality of third idler pulleys to move along the perpendicular direction of the cutting wheel surface (i.e., the transposition direction or the second direction Y-axis). In this state, the third cutting wheels and the third idler pulleys are relatively stationary, that is, the positional relationship between the third idler pulley and the third cutting wheel remains unchanged. At this time, the third distance adjustment mechanism is used to adjust the cutting position of at least one third wire cutting saw in the third wire cutting unit relative to the silicon rod.

[0243] Each third cutting wheel has at least two third cutting grooves. Different third cutting grooves are parallel to each other, and there is a cutting offset in the direction perpendicular to the wheel surface of the third cutting wheel between different third cutting grooves. When the third distance adjustment mechanism is used to drive multiple third cutting wheels in the third wire cutting unit to move, the groove position of the third cutting wire wound around the third cutting wheel can be changed.

[0244] When at least one third distance adjustment mechanism is used to realize the transformation of the cutting groove of the third cutting wire wound around multiple third cutting wheels in at least one third wire cutting unit, in the actual scenario, the third cutting grooves corresponding to the cutting wire before and after the groove change can be determined in advance. For example, the position where the third cutting wire is located before the groove change is the third cutting groove a1, and after the groove change, the third cutting wire is wound around the third cutting groove a2. Based on the cutting offset between the third cutting groove a1 and the third cutting groove a2, the displacement of the third distance adjustment mechanism driving multiple third cutting wheels in the third wire cutting unit to move is determined, that is, the displacement is set to the cutting offset between the third cutting groove a1 and the third cutting groove a2, which can be used to realize the replacement of the third cutting wire from the third cutting groove a1 to the third cutting groove a2; it should be noted that the direction of at least one third distance adjustment mechanism driving multiple third cutting wheels in the third wire cutting unit to move in the direction perpendicular to the wheel surface of the third cutting wheel is the direction from the cutting groove a2 to the cutting groove a1. Since the cutting position of the third cutting wire saw in space remains unchanged after the groove change, the step of further calibrating the position of the third cutting wheel or other components is omitted, and the silicon rod can be cut according to the preset cutting amount, which simplifies the groove change process.

[0245] To further illustrate the implementation manner of at least one third distance adjustment mechanism to realize the movement of multiple third cutting wheels in the third wire cutting unit in the direction perpendicular to the wheel surface of the third cutting wheel, the following embodiments are disclosed in this application. When the number of third wire cutting units in the second silicon rod cutting device is different, the specific form of at least one third distance adjustment mechanism can be changed accordingly.

[0246] In some embodiments, the second silicon rod cutting device includes a single wire cutting unit. Here, the single wire cutting unit is a third wire cutting unit. The third distance adjustment mechanism includes: a lead screw, which is arranged in the orthogonal direction of the wheel surface of the third cutting wheel and is threadedly connected to the single wire cutting unit; a lead screw driving source, which is used to drive the lead screw to rotate.

[0247] The single-wire cutting unit in the second silicon rod cutting device includes a plurality of third cutting wheels, and the third cutting wire is wound around the plurality of third cutting wheels to form at least one third cutting wire saw. The lead screw of the third distance adjustment mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the lead screw can be connected to the lead screw drive source and rotated under the drive of the lead screw drive source. The distal end of the lead screw is threadedly connected to the third single-wire cutting unit. Through the connection method at both ends of the lead screw, the lead screw can rotate based on the transmission of the lead screw drive source and convert the rotation of the lead screw into an axial displacement through the threaded connection. The axial displacement direction is the set direction of the lead screw, that is, the orthogonal direction of the cutting wheel surface; by driving the lead screw to rotate through the lead screw drive source in the third distance adjustment mechanism, the displacement of the single-wire cutting unit in the orthogonal direction of the third cutting wheel surface can be realized. When the lead screw is driven to rotate in different rotation directions, the third cutting wheel of the single-wire cutting unit can move forward or backward in the orthogonal direction of the third cutting wheel surface.

[0248] In some embodiments, the second silicon rod cutting device includes a single-wire cutting unit. Here, the single-wire cutting unit is a third wire cutting unit. The third distance adjustment mechanism includes: a telescopic member, arranged along the orthogonal direction of the third cutting wheel surface and associated with the single-wire cutting unit; a telescopic member drive source for driving the telescopic member to perform telescopic movement along the orthogonal direction of the third cutting wheel surface. Here, the telescopic member can be set as a rod structure, and the extending direction of the rod is the orthogonal direction of the third cutting wheel surface. The telescopic member can perform telescopic movement along its extending direction under the drive of the telescopic member drive source. One end of the telescopic member can be connected to the telescopic member drive source, and the retractable free end is associated with the single-wire cutting unit, so that the third cutting wheel of the single-wire cutting unit can be driven to move in the orthogonal direction of the third cutting wheel surface under the action of the telescopic member drive source. The telescopic member is, for example, an electric telescopic rod, or a connecting rod connected to a cylinder, and the cylinder can be used as the telescopic member drive source, which is not limited in this application. The way the telescopic rod is associated with the single-wire cutting unit can be a direct connection or an indirect connection. For example, it can be directly connected to the third cutting installation structure of the single-wire cutting unit, or indirectly connected to the third single-wire cutting unit through a support or a bearing. It should be understood that when the telescopic member extends or contracts, it corresponds to the forward or backward movement of the single-wire cutting unit in the orthogonal direction of the third cutting wheel surface.

[0249] Here, the association can be realized through one or more of clamping, screwing, bonding, and welding. For example, in the above embodiment, the telescopic rod can be associated with the third wire cutting unit through one or more of clamping, screwing, bonding, and welding; of course, the implementation manner of the association is not limited to this, but aims to achieve the transmission in the second direction.

[0250] In some embodiments, the second silicon rod cutting device includes a single-wire cutting unit, where the single-wire cutting unit is a wire cutting unit. The third distance adjustment mechanism includes: a rack disposed along the orthogonal direction of the third cutting wheel surface in the third single-wire cutting unit; a transmission gear engaged with the rack; and a gear driving source for driving the transmission gear to rotate. The transmission gear rotates under the drive of the gear driving source, and the rack engaged with the transmission gear moves correspondingly along the rack step direction. In this example, through the cooperation of the rack and the transmission gear, the rotational motion driven by the gear driving source can be converted into a linear movement along the rack direction. The rack is disposed along the orthogonal direction of the third cutting wheel surface in the third single-wire cutting unit, and can drive the third cutting wheel of the single-wire cutting unit to move along the orthogonal direction of the third cutting wheel surface. At the same time, by controlling the switching of the rotation direction of the transmission gear by the gear driving source, the multiple third cutting wheels of the single-wire cutting unit can move forward or backward along the orthogonal direction of the third cutting wheel surface.

[0251] In some embodiments, the second silicon rod cutting device includes two third wire cutting units disposed in parallel and opposite to each other, and at least one of the two third wire cutting units can be driven by at least one distance adjustment mechanism to move along the orthogonal direction of the third cutting wheel surface, for adjusting the wire cutting saw spacing between the third wire saws in the two third wire cutting units, or changing the cutting wire grooves around which the third cutting wire winds around the multiple third cutting wheels in a certain third wire cutting unit.

[0252] At least one third distance adjustment mechanism can be set to be connected to a certain third wire cutting unit, or simultaneously associated with two third wire cutting units, to drive the multiple third cutting wheels in one or two third wire cutting units connected or associated to move along the orthogonal direction of the third cutting wheel surface.

[0253] The third distance adjustment mechanism includes: a lead screw disposed along the orthogonal direction of the third cutting wheel surface and threadedly connected to a certain third wire cutting unit; and a lead screw driving source for driving the lead screw to rotate. The manner in which the multiple third cutting wheels in the third wire cutting unit connected to the lead screw and driven by the lead screw driving source move in the orthogonal direction of the third cutting wheel surface is similar to the foregoing embodiments. The third cutting unit driven by the distance adjustment mechanism can be regarded as a single-wire cutting unit, and will not be elaborated here. It should be understood that by setting the third distance adjustment mechanism on any third wire cutting unit, the increase and decrease of the parallel third cutting wire saw spacing formed between the two third wire cutting units can be realized, and the second silicon rod cutting device can cut the silicon rod into different specifications.

[0254] In some embodiments, the third distance adjustment mechanism includes: a telescopic member disposed in the direction orthogonal to the third cutting wheel surface and associated with a certain third wire cutting unit; a telescopic member driving source for driving the telescopic member to perform telescopic movement in the direction orthogonal to the third cutting wheel surface. Here, the third cutting unit provided with the third distance adjustment mechanism can be regarded as a single-wire cutting unit, and the specific implementation manner can refer to the foregoing embodiments, which will not be elaborated herein.

[0255] The third distance adjustment mechanism includes: an adjustment rack disposed in the direction orthogonal to the third cutting wheel surface and associated with a certain third wire cutting unit; a transmission gear meshing with the adjustment rack; a gear driving source for driving the transmission gear to rotate. Through the meshing transmission gear and adjustment rack, the gear driving source can control the adjustment rack to move along the rack direction line, and the third wire cutting unit associated with the adjustment rack can drive a plurality of third cutting wheels to move in the direction orthogonal to the third cutting wheel surface through the rack.

[0256] In some embodiments, the distance adjustment mechanism includes: a bidirectional lead screw disposed in the direction orthogonal to the third cutting wheel surface and threadedly connected to two third wire cutting units; and a lead screw driving source for driving the lead screw to rotate so that the two third wire cutting units move towards or away from each other in the direction orthogonal to the third cutting wheel surface. In one implementation manner, the bidirectional lead screw is a double-threaded lead screw, with threads provided at both ends of the bidirectional lead screw and the thread directions being opposite. The lead screw driving source can be disposed at any one end of the bidirectional lead screw to drive the bidirectional lead screw to rotate along the lead screw axis. Through the threads with opposite directions at both ends of the bidirectional lead screw, when the bidirectional lead screw rotates driven by the lead screw driving source, the movements at both ends of the bidirectional lead screw are converted into axial linear movements in opposite directions, and the axial direction is the direction orthogonal to the third cutting wheel surface where the bidirectional lead screw is disposed. Driven by the lead screw driving source, the multiple third cutting wheels respectively corresponding to the two third wire cutting units can move towards or away from each other.

[0257] In some embodiments, the third distance adjustment mechanism includes a servo motor provided on at least one third wire cutting unit. In an actual scenario, a servo motor is provided on at least one or each third wire cutting unit of the second silicon rod cutting device, and the corresponding third wire cutting unit is controlled by the servo motor to displace in the orthogonal direction of the third cutting wheel surface. The third wire cutting unit can be adjusted by a pre-determined cutting offset for groove changing or an adjustment amount for changing the cutting position of the cutting wire. The servo motor drives multiple third cutting wheels in the third wire cutting unit to move along the orthogonal direction of the third cutting wheel surface with a preset displacement amount through its precise positioning function. For example, there are two third wire cutting units in the second silicon rod cutting device, and at least one of the two third wire cutting units moves relatively independently along the orthogonal direction of the third cutting wheel surface driven by its corresponding servo motor. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw. It should be understood that the third distance adjustment mechanism is a driving device for driving multiple third cutting wheels in the third wire cutting unit to move relatively, and the specific form thereof is not limited in this application.

[0258] As described above, in the second silicon rod cutting device, there is a third wire cutting unit disposed between two second wire cutting units. The third cutting wire saw in the third wire cutting unit is arranged vertically or obliquely at an angle to the vertical direction, driving the second silicon rod transfer device and the silicon rod carried by it to move along the transfer direction. By relatively moving the third wire cutting unit and the second silicon rod transfer device along the transfer direction, the second cutting operation is performed on the silicon rod carried by the second silicon rod transfer device by the third cutting wire saw in the third wire cutting unit, so that the silicon rod can be cut into two half rods after forming a cut surface. In the second silicon rod cutting device, there are two or more third wire cutting units disposed between two second wire cutting units, and the third cutting wire saw in each third wire cutting unit is arranged vertically or obliquely at an angle to the vertical direction. In this way, driving the second silicon rod transfer device and the silicon rod carried by it to move along the transfer direction, by relatively moving two or more third wire cutting units and the second silicon rod transfer device along the transfer direction, the second cutting operation is performed on the silicon rod carried by the second silicon rod transfer device by the third cutting wire saw in two or more third wire cutting units, so that the silicon rod can be cut into three or more half rods with rectangular cross-sections after forming two or more cut surfaces.

[0259] The half rod cutting equipment includes a second side skin anti-cracking device cooperating with the second silicon rod transfer device for stabilizing the side skin when the second silicon rod cutting device performs the second cutting operation on the silicon rod.

[0260] It should be understood that the silicon rod carried by the second silicon rod transfer device is in a horizontal position, that is, the axis line of the silicon rod is consistent with the transfer direction (i.e., the first direction X-axis). Therefore, the side skin formed by performing the second cutting operation on the silicon rod by the second silicon rod cutting device is also in a horizontal position.

[0261] In some embodiments, the second edge skin anti - chipping device includes a clamping support and an edge skin clamp, wherein the edge skin clamp is arranged on the clamping support and is used for clamping the edge skin.

[0262] The edge skin clamp includes: a clamp seat, at least a pair of end face chucks, and a chuck driving mechanism.

[0263] At least a pair of end face chucks are arranged opposite to each other along the transfer direction and are used for clamping two end faces of the silicon rod.

[0264] The second silicon rod transfer device includes a second edge skin anti - chipping device. The second edge skin anti - chipping device cooperates with the second silicon rod transfer device and is used for clamping the end faces of the silicon rod during the second cutting operation of the silicon rod to prevent chipping.

[0265] In this application, the second edge skin anti - chipping device can be the same as the first edge skin anti - chipping device described above. Therefore, for the specific structure and working principle of the second edge skin anti - chipping device, reference can be made to the description of the first edge skin anti - chipping device above, and only a simple description is given here.

[0266] In some embodiments, the second edge skin anti - chipping device includes: a clamping support and an edge skin clamp.

[0267] In some embodiments, the clamping support of the second edge skin anti - chipping device is associated with the second bearing platform of the second silicon rod transfer device, that is, the clamping support of the second edge skin anti - chipping device and the second bearing platform of the second silicon rod transfer device can move forward and backward together.

[0268] The edge skin clamp is arranged on the clamping support. In some embodiments, the edge skin clamp includes a clamp seat, at least a pair of end face chucks, and a chuck driving mechanism.

[0269] The chuck driving mechanism is used to drive at least one end face chuck in at least a pair of end face chucks to move along the clamping direction to adjust the clamping distance between at least a pair of end face chucks.

[0270] In some embodiments, the chuck driving mechanism includes: a chuck moving guide rail arranged along the clamping direction; a chuck driving unit for driving at least one end face chuck in at least a pair of end face chucks to move along the chuck moving guide rail.

[0271] In some embodiments, a chuck moving guide rail can be arranged between the second end face chuck and the second end face chuck in at least a pair of end face chucks.

[0272] In some embodiments, the collet driving unit includes at least one collet telescopic assembly. The collet telescopic assembly includes: a collet telescopic rod and a collet telescopic cylinder. The collet telescopic rod is arranged along the clamping direction and is associated with the corresponding end face collet, and the collet telescopic cylinder is associated with the collet telescopic rod. In some embodiments, the collet driving mechanism is used to drive two end face collets in a pair of end face collets to move towards each other or away from each other along the clamping direction. Then, the collet driving mechanism includes a pair of collet telescopic assemblies. Among them, each collet telescopic assembly corresponds to an end face collet. The collet telescopic rod in the collet telescopic assembly is arranged along the clamping direction and is associated with the corresponding end face collet, and the collet telescopic cylinder in the collet telescopic assembly is associated with the collet telescopic rod. By using the collet telescopic cylinder in a pair of collet telescopic assemblies to control the corresponding collet telescopic rod to perform a contraction or extension action, the pair of end face collets can be driven to move towards each other or away from each other along the moving guide rail on the moving guide rod or the moving guide beam. In some embodiments, the collet driving mechanism is used to drive one end face collet in a pair of end face collets to move towards or away from the other end face collet along the clamping direction. Then, the collet driving mechanism includes a collet telescopic assembly corresponding to the end face collet to be moved. Among them, the collet telescopic rod in the collet telescopic assembly is arranged along the clamping direction and is associated with the corresponding end face collet, and the collet telescopic cylinder in the collet telescopic assembly is associated with the collet telescopic rod. By using the collet telescopic cylinder in the collet telescopic assembly to control the corresponding collet telescopic rod to perform a contraction or extension action, the corresponding end face collet can be driven to move along the moving guide rail on the moving guide rod or the moving guide beam towards the other end face collet or away from the other end face collet.

[0273] In some embodiments, the collet driving unit includes: at least a pair of clamping racks, a driving gear, and a gear driving source.

[0274] In some embodiments, the collet driving unit includes: at least a pair of clamping racks, a linkage gear, and a collet driving source.

[0275] In some embodiments, the collet driving unit includes: at least one collet clamping assembly. The collet clamping assembly includes: a clamping lead screw and a lead screw driving source.

[0276] In some embodiments, the collet driving unit includes: a bidirectional lead screw and a lead screw driving source. Among them, the bidirectional lead screw is arranged along the clamping direction. Threads are respectively provided at both ends of the bidirectional lead screw and the thread directions are opposite. Both ends of the bidirectional lead screw are respectively associated with at least a pair of end face collets, and the lead screw driving source is associated with the bidirectional lead screw.

[0277] At least a pair of end face collets are arranged opposite to each other along the clamping direction and are used to correspondingly clamp two end faces of the silicon rod.

[0278] In some embodiments, for any one of at least a pair of end face chucks, the end face chuck includes a clamping base body and a side skin pressing member disposed on the clamping base body, and the side skin pressing member is used to press the side skin to be cut in the silicon rod.

[0279] In some embodiments, the clamping base body can be, for example, a clamping substrate, and its size should be adapted to the side skin to be cut, that is, at least part or all of the clamping substrate should cover the side skin to be cut.

[0280] In some embodiments, the side skin pressing member includes side skin pressing screws disposed on the clamping substrate, and the number of side skin pressing screws can be one or more. In practical applications, the side skin pressing screws are used to press the side skin to be cut, which can ensure that the side skin to be cut in the silicon rod remains stable during the second cutting operation.

[0281] Of course, in some embodiments, in the end face chuck, the side skin pressing member can also include a side skin pressing elastic member disposed on the clamping base body. For example, in some embodiments, the side skin pressing elastic member includes a side skin pressing rod, which is sleeved with a compression spring.

[0282] In this way, when the second silicon rod cutting device performs the second cutting operation on the silicon rod, the silicon rod is carried by the second silicon rod transfer device, and at least one end face chuck in at least a pair of end face chucks is driven by the chuck driving mechanism in the second side skin anti-burr device to move along the clamping direction, so that at least a pair of end face chucks clamp the two end faces of the silicon rod. Among them, the side skin pressing member in the end face chuck presses on the side skin to be cut in the silicon rod, which can ensure that the side skin to be cut in the silicon rod remains stable during the second cutting operation, and can avoid phenomena such as side skin dropping or the side skin deviating from the silicon rod main body and causing burrs when the second cutting wire saw in the second wire cutting unit penetrates through the silicon rod to completely cut it.

[0283] In some embodiments, for any one of at least a pair of end face chucks, the end face chuck includes a silicon rod pressing member, a side skin pressing member, and a side skin clamping and strengthening member. Among them, the silicon rod pressing member is used to press the main body of the silicon rod, the side skin pressing member is used to press the side skin to be cut in the silicon rod, and the side skin clamping and strengthening member is used to apply an additional clamping force to the side skin. In this application, a silicon rod with a circular cross-section forms a square silicon rod with a quasi-rectangular cross-section after the squaring cutting operation. Among them, the main body of the silicon rod refers to at least the part containing the square silicon rod, that is, the main body of the silicon rod is relative to the side skin, the main body of the silicon rod is the part containing the square silicon rod, and the main body of the silicon rod changes in different squaring cutting operations.

[0284] In some embodiments, the clamping base body can be, for example, a clamping substrate, the size of which should be adapted to the end face of the silicon rod and the edge skin to be cut. That is, the clamping substrate should at least cover part of the silicon rod body and part of the edge skin. The clamping substrate should cover part of the silicon rod body so that the silicon rod pressing member provided thereon can act on the silicon rod body. The clamping substrate should also cover part of the edge skin so that the edge skin pressing member and the edge skin clamping reinforcement member provided thereon can act on the edge skin.

[0285] In some embodiments, the silicon rod pressing member includes a silicon rod pressing screw provided on the clamping substrate, and the edge skin pressing member includes an edge skin pressing screw provided on the clamping substrate. The number of silicon rod pressing screws can be one or more, and the number of edge skin pressing screws can be one or more. In practical applications, the silicon rod pressing screw is used to press the silicon rod body, and the edge skin pressing screw is used to press the edge skin to be cut. In the situation where the silicon rod pressing screw presses the silicon rod body and the edge skin pressing screw presses the edge skin to be cut, it can ensure that the relative stability is maintained between the silicon rod body and the edge skin, and it can avoid phenomena such as the edge skin falling off or the edge skin and the silicon rod body shifting, resulting in chipping when the cutting wire saw in the wire cutting unit penetrates through the silicon rod for complete cutting.

[0286] It is easy to know that in some cases, the end face of the silicon rod is not an ideal flat surface, and it is possible that one of the silicon rod pressing member and the edge skin pressing member cannot effectively abut and press the corresponding silicon rod body or edge skin.

[0287] To enable the silicon rod pressing member and the edge skin pressing member arranged on the clamping base body to adapt to the end face of the silicon rod to achieve an effective pressing effect, the end face chuck further includes a deflection fine-tuning structure for adjusting the position of the clamping base body. The deflection fine-tuning structure can be used to locally adjust the position of the clamping base body, thereby changing the positions of the silicon rod pressing member and the edge skin pressing member arranged on the clamping base body.

[0288] In some embodiments, the deflection fine-tuning structure adopts a ball head structure or a similar structure, and the clamping base body is arranged through the ball head structure. In some embodiments, the ball head or hemispherical head, the ball head or hemispherical head is connected to the clamping substrate through a connecting rod, and the ball head or hemispherical head is embedded in a receiving cavity.

[0289] In some embodiments, the deflection fine-tuning structure adopts a hinge structure, and the clamping base body is arranged through the hinge structure. For example, the clamping substrate is associated with the mounting structure through the hinge structure and can deflect relative to the mounting structure by a certain amplitude.

[0290] In addition, in some embodiments, in the end face chuck, the silicon rod pressing member includes a silicon rod pressing elastic member provided on the clamping base body, and the edge skin pressing member includes an edge skin pressing elastic member provided on the clamping base body. For example, in some embodiments, the silicon rod pressing elastic member includes a silicon rod pressing rod sleeved with a compression spring; the edge skin pressing elastic member includes an edge skin pressing rod sleeved with a compression spring. In some embodiments, the silicon rod pressing elastic member includes a silicon rod pressing block with a compression spring provided at its rear end; the edge skin pressing elastic member includes an edge skin pressing block with a compression spring provided at its rear end.

[0291] In the end face chuck, there is also an edge skin clamping strengthening member, and the edge skin clamping strengthening member can advance and retreat relative to the clamping base body along the clamping direction. When the edge skin clamping strengthening member advances relative to the clamping base body, the edge skin clamping strengthening member can provide a strong clamping force to the corresponding edge skin. Generally, the clamping force applied by the edge skin clamping strengthening member to the edge skin is greater than the pressing force applied by the silicon rod pressing member to the silicon rod main body and the pressing force applied by the edge skin pressing member to the edge skin.

[0292] In some embodiments, the edge skin clamping strengthening member includes a telescopic ejector rod or a telescopic ejector block and a telescopic driving source, and the telescopic ejector rod or the telescopic ejector block is controlled by the telescopic driving source to advance and retreat relative to the clamping base body. In some embodiments, a through hole is provided on the clamping substrate, and the telescopic driving source and the telescopic ejector rod or the telescopic ejector block are arranged on an installation structure. The telescopic driving source can drive the telescopic ejector rod or the telescopic ejector block to extend out of the clamping substrate and press on the corresponding edge skin, or drive the telescopic ejector rod or the telescopic ejector block to retract into the clamping substrate. Among them, the telescopic driving source can be, for example, a telescopic cylinder.

[0293] The end face chuck can still have other variations in other embodiments. In some embodiments, the end face chuck includes: a second clamping base body and a second clamping base body. Among them, a silicon rod pressing member is provided on the second clamping base body, and an edge skin pressing member and an edge skin clamping strengthening member that advances and retreats relative to the second clamping base body along the clamping direction are provided on the second clamping base body.

[0294] In some embodiments, the second clamping base body can be, for example, a clamping substrate, and its size should be adapted to the end face of the silicon rod main body, that is, the second clamping substrate should at least cover part of the silicon rod main body so that the silicon rod pressing member provided thereon can act on the silicon rod main body. The second clamping base body can be, for example, a clamping substrate, and its size should be adapted to the end face of the edge skin to be cut, that is, the second clamping substrate should at least cover part of the edge skin so that the edge skin pressing member provided thereon can act on the edge skin.

[0295] In the end face chuck, the silicon rod pressing member includes a silicon rod pressing screw provided on the second clamping substrate, and the number of the silicon rod pressing screws can be one or more. The edge pressing member includes an edge pressing screw provided on the second clamping substrate, and the number of the edge pressing screws can be one or more. In practical applications, the silicon rod pressing screw is used to press the main body of the silicon rod, and the edge pressing screw is used to press the edge to be cut. In the situation where the silicon rod pressing screw presses the main body of the silicon rod and the edge pressing screw presses the edge to be cut, the relative stability between the main body of the silicon rod and the edge can be ensured, and phenomena such as the edge falling off or the edge shifting relative to the main body of the silicon rod resulting in edge chipping can be avoided when the cutting wire saw in the wire cutting unit penetrates through the silicon rod for complete cutting.

[0296] In addition, in some embodiments, in the end face chuck, the silicon rod pressing member includes a silicon rod pressing elastic member provided on the second clamping base body, and the edge pressing member includes an edge pressing elastic member provided on the second clamping base body. For example, in some embodiments, the silicon rod pressing elastic member includes a silicon rod ejector rod sleeved with a compression spring; the edge pressing elastic member includes an edge ejector rod sleeved with a compression spring. In some embodiments, the silicon rod pressing elastic member includes a silicon rod pressing block with a compression spring provided at the rear end thereof; the edge pressing elastic member includes an edge pressing block with a compression spring provided at the rear end thereof.

[0297] In the end face chuck, an edge clamping strengthening member is further included, and the edge clamping strengthening member can advance and retreat relative to the second clamping base body along the clamping direction. When the edge clamping strengthening member advances relative to the second clamping base body, the edge clamping strengthening member can provide a strong clamping force to the corresponding edge. Generally, the clamping force applied by the edge clamping strengthening member to the edge is greater than the pressing force applied by the silicon rod pressing member to the main body of the silicon rod and the pressing force applied by the edge pressing member to the edge.

[0298] In some embodiments, the edge clamping strengthening member includes a telescopic ejector rod or a telescopic ejecting block that is controlled to advance and retreat relative to the second clamping base body. For example, the edge clamping strengthening member includes a telescopic ejector rod or a telescopic ejecting block and a telescopic driving source, and the telescopic driving source drives the telescopic ejector rod or the telescopic ejecting block to advance and retreat relative to the second clamping substrate. In some embodiments, a through hole is formed on the second clamping substrate, the telescopic driving source and the telescopic ejector rod or the telescopic ejecting block are arranged on a mounting structure, and the telescopic driving source can drive the telescopic ejector rod or the telescopic ejecting block to extend out of the second clamping substrate and press on the corresponding edge, or drive the telescopic ejector rod or the telescopic ejecting block to retract into the second clamping substrate. Among them, the telescopic driving source can be, for example, a telescopic cylinder.

[0299] Thus, when the second silicon rod cutting device is used to perform the second cutting operation on the silicon rod, the silicon rod is carried by the second silicon rod transfer device, and at least one end face chuck in at least a pair of end face chucks is driven by the chuck driving mechanism in the second edge skin anti-chipping device to move along the clamping direction, so that at least a pair of end face chucks clamp the two end faces of the silicon rod. Among them, the silicon rod pressing member in the end face chuck presses against the main body of the silicon rod, the edge skin pressing member in the end face chuck presses against the edge skin to be cut in the silicon rod, and the edge skin clamping and strengthening member in the end face chuck is in a contracted state (in the contracted state, the edge skin clamping and strengthening member is recessed in the clamping base body, or protrudes from the clamping base body but the protruding height relative to the clamping base body is also smaller than the protruding heights of the silicon rod pressing member and the edge skin pressing member relative to the clamping base body), so that the edge skin and the silicon rod main body remain relatively stationary, and phenomena such as edge skin dropping or edge skin offset from the silicon rod main body resulting in chipping can be avoided when the cutting wire saw in the wire cutting unit penetrates through the silicon rod to complete the cutting. After the edge skin cutting is completed, the edge skin clamping and strengthening member in the end face chuck is driven to extend relative to the clamping base body and press against the cut edge skin, and the clamping force applied by the edge skin clamping and strengthening member to the edge skin is greater than the pressing force applied by the silicon rod pressing member to the silicon rod main body and the pressing force applied by the edge skin pressing member to the edge skin. At this time, at least a pair of end face chucks can be operated to move the cut edge skin.

[0300] In the present application, the second edge skin anti-chipping device may further include an edge skin fixture advancing and retreating mechanism for driving the edge skin fixture to advance and retreat along the advancing and retreating direction.

[0301] In an embodiment where the end face chuck includes a clamping base body and an edge skin pressing member provided on the clamping base body, after the edge skin cutting is completed, the edge skin fixture is driven to retreat along the advancing and retreating direction by the edge skin fixture advancing and retreating mechanism, and by using the pressing force applied by the pressing member to the edge skin, the clamped edge skin can be driven to separate from the silicon rod main body.

[0302] In an embodiment where the end face chuck includes a clamping base body, a silicon rod pressing member and an edge skin pressing member provided on the clamping base body, and an edge skin clamping and strengthening member that advances and retreats along the clamping direction relative to the clamping base body, after the edge skin cutting is completed, the edge skin clamping and strengthening member in the end face chuck is driven to extend relative to the clamping base body and press against the cut edge skin. At this time, the edge skin fixture is further driven to retreat along the advancing and retreating direction by the edge skin fixture advancing and retreating mechanism. By using the characteristic that the clamping force applied by the edge skin clamping and strengthening member to the edge skin is greater than the pressing force applied by the silicon rod pressing member to the silicon rod main body and the pressing force applied by the edge skin pressing member to the edge skin, the clamped edge skin can be driven to separate from the silicon rod main body.

[0303] In some embodiments, the edge skin fixture advancing and retreating mechanism includes: a fixture advancing and retreating guide rail arranged along the advancing and retreating direction; an edge skin fixture advancing and retreating unit for driving the edge skin fixture to move along the fixture advancing and retreating guide rail.

[0304] In some embodiments, the edge skin clamp advancing and retracting unit includes: a clamp seat telescopic rod and a clamp seat telescopic cylinder. The clamp seat telescopic rod is arranged along the advancing and retracting direction and is associated with the clamp seat of the edge skin clamp, and the clamp seat telescopic cylinder is associated with the clamp seat telescopic rod.

[0305] In some embodiments, the edge skin clamp advancing and retracting unit includes: The edge skin clamp advancing and retracting mechanism includes: a clamp seat rack, which is arranged along the advancing and retracting direction and is associated with the clamp seat of the edge skin clamp; a clamp seat gear, which meshes with the clamp seat rack; and a gear driving source, which is associated with the clamp seat gear and is used to drive the clamp seat gear to rotate so that the engaged edge skin clamp moves along the advancing and retracting direction. Among them, the gear driving source can be, for example, a servo motor.

[0306] In some embodiments, the edge skin clamp advancing and retracting unit includes: a retracting lead screw and a lead screw driving source. The retracting lead screw is arranged along the advancing and retracting direction and is associated with the clamp seat of the edge skin clamp, and the lead screw driving source is associated with the retracting lead screw. Among them, the lead screw driving source can be, for example, a servo motor.

[0307] In the present application, the second edge skin anti-cracking device may further include a clamp lifting mechanism for driving the edge skin clamp to move up and down vertically. In some embodiments, the edge skin clamp moves up or down vertically through the clamp lifting mechanism to adapt to the size specifications of the silicon rod carried by the silicon rod transfer. For example, if the size of the silicon rod is large, the edge skin clamp is driven to move up vertically through the clamp lifting mechanism, and if the size of the silicon rod is small, the edge skin clamp is driven to move down vertically through the clamp lifting mechanism.

[0308] In some embodiments, the clamp lifting mechanism includes: a clamp lifting guide rail and a clamp lifting unit. Among them, the clamp lifting guide rail is arranged vertically. The clamp lifting unit is used to drive the edge skin clamp to move up and down along the clamp lifting guide rail.

[0309] In some embodiments, the edge clamp lifting unit includes: a lifting lead screw and a lead screw driving source. The lifting lead screw is arranged vertically and is associated with the clamp seat of the edge skin clamp, and the lead screw driving source is associated with the lifting lead screw.

[0310] In some embodiments, the clamp lifting unit includes: a lifting rack, a lifting gear, and a gear driving source. Among them, the lifting rack is arranged vertically and is associated with the clamp seat of the edge skin clamp, the lifting gear meshes with the lifting rack, and the gear driving source is associated with the lifting gear and is used to drive the lifting gear to rotate so that the engaged edge skin clamp moves up and down vertically. Among them, the gear driving source can be, for example, a servo motor.

[0311] Thus, when applying the second side skin anti-cracking device, the silicon rod is horizontally placed on the silicon rod bearing platform of the silicon rod transfer device; the side skin clamp is driven by the clamp lifting mechanism in the second side skin anti-cracking device to move up and down vertically to adjust the position; the side skin clamp is driven by the side skin clamp advancing and retreating mechanism in the second side skin anti-cracking device to advance along the advancing and retreating direction and approach the silicon rod; at least one end face clamp in at least a pair of end face clamps is driven by the chuck driving mechanism in the second side skin anti-cracking device to move along the clamping direction until the silicon rod pressing member on the end face clamp presses against the silicon rod body and the side skin pressing member on the end face clamp presses against the side skin to be cut. Then, the silicon rod cutting device performs a squaring cutting operation on the silicon rod to form the silicon rod body and the side skin. After the side skin cutting is completed, the side skin clamping and strengthening member in the end face clamp is driven to extend relative to the clamping base body and press against the cut side skin. At this time, the side skin clamp is driven by the side skin clamp advancing and retreating mechanism to retreat along the advancing and retreating direction. By virtue of the characteristic that the clamping force applied by the side skin clamping and strengthening member to the side skin is greater than the pressing force applied by the silicon rod pressing member to the silicon rod body and the pressing force applied by the side skin pressing member to the side skin, the clamped side skin can be driven to separate from the silicon rod body.

[0312] In the present application, the second side skin anti-cracking device further includes a side skin discharging and conveying mechanism, which is connected to the side skin clamp advancing and retreating mechanism.

[0313] In some embodiments, the side skin discharging and conveying mechanism may include a side skin bearing structure and a conveying driving mechanism.

[0314] The side skin bearing structure is used to bear the side skin. As described above, the side skin clamped by the side skin clamp is driven to retreat along the advancing and retreating direction by the side skin clamp advancing and retreating mechanism to drive the side skin to separate from the silicon rod body. Then, the chuck driving mechanism in the side skin clamp drives the chuck to move to release the clamped side skin and make it fall on the side skin bearing structure. In some embodiments, the side skin bearing structure may be, for example, a side skin placement groove. The side skin placement groove may be, for example, in a U-shaped structure.

[0315] In some embodiments, the conveying drive mechanism is used to move the drive side skin bearing structure along the transfer direction to move between the second loading and unloading position and the second cutting position. In some embodiments, the conveying drive mechanism can be, for example, a chain conveying mechanism, which includes an endless chain, a chain drive source, and a connecting member. Among them, the endless chain is a closed-loop chain that is wound around a plurality of movable gears to form a preset shape, such as an inverted triangle, a rectangle, or a trapezoid, etc. The side skin bearing structure is associated with the endless chain through the connecting member. The chain drive source can be, for example, a servo motor, and the servo motor is associated with one of the movable gears. For example, the output shaft of the servo motor is connected to the gear shaft of the movable gear. When the endless chain is driven by the servo motor to rotate, the side skin bearing structure and the side skin carried by it can be driven to move in the transfer direction through the connecting member. In practical applications, the servo motor works to drive the associated movable gear to rotate forward (or backward). The forwardly (or backwardly) rotating movable gear drives the engaged endless chain to move forward (or backward). The forwardly (or backwardly) moving endless chain can drive the side skin bearing structure to move from the second loading and unloading position to the second cutting position through the connecting member. Conversely, the servo motor works to drive the associated movable gear to rotate backward (or forward). The backwardly (or forwardly) rotating movable gear drives the engaged endless chain to move backward (or forward). The backwardly (or forwardly) moving endless chain can drive the side skin bearing structure and the side skin carried by it to move from the second cutting position to the second loading and unloading position through the connecting member.

[0316] In the present application, the side skin feeding and conveying mechanism further includes a side skin flipping mechanism for driving the side skin bearing structure to flip. Among them, each side skin bearing structure is configured with a side skin flipping mechanism, and the corresponding side skin bearing mechanism and the side skin carried by it can be driven to flip by using the side skin flipping mechanism. The side skin flipping mechanism includes a pivot shaft and a telescopic assembly. The telescopic assembly includes a telescopic rod and a telescopic cylinder. Among them, the side skin bearing structure is pivotally installed through the pivot shaft. One end of the telescopic rod is associated with the corresponding side skin bearing structure, and the other end of the telescopic rod is associated with the telescopic cylinder. In practical applications, the telescopic cylinder drives the telescopic rod to perform a contraction action, and the telescopic rod pulls the side skin bearing structure to flip vertically through the pivot shaft and be vertically arranged; the telescopic cylinder drives the telescopic rod to perform an extension action, and the telescopic rod pushes the side skin bearing structure to flip away from the vertical through the pivot shaft and be horizontally or obliquely arranged, so that the side skin carried by the side skin bearing structure is horizontally or obliquely arranged, which is beneficial to unloading the side skin subsequently.

[0317] When performing the second cutting operation on the silicon rod using the second silicon rod cutting device in the cutting and grinding integrated device for small-sized rectangular rods of the present application, the silicon rod with two first side cutting surfaces is placed horizontally on the second silicon rod transfer device located at the second loading and unloading position (the first side cutting surface of the silicon rod contacts the second silicon rod transfer device); drive the second silicon rod carrying device and the silicon rod carried by it to transfer from the second loading and unloading position to the second cutting position along the transfer direction, drive the side skin clamp to advance along the advancing and retreating direction to the silicon rod by the side skin clamp advancing and retreating mechanism, and drive the side skin clamp of the second side skin anti-chipping device to clamp the silicon rod. At this time, two second cutting wire saws arranged in parallel and a third cutting wire saw in the middle in the second silicon rod cutting device are located between a previous side skin clamp and the silicon rod; drive the second silicon rod transfer device to carry the silicon rod and advance towards the second cutting position along the transfer direction, and perform the second cutting operation on the silicon rod with a circular cross-section by the relative movement of the second silicon rod cutting device and the second silicon rod transfer device along the transfer direction by the two second cutting wire saws arranged in parallel and the third cutting wire saw in the middle in the second silicon rod cutting device. After using the two second cutting wire saws to cut off the two side skins of the silicon rod, two parallel second side cutting surfaces are formed on the silicon rod, the second side cutting surface is perpendicular to the first side cutting surface, and use a third cutting wire saw to cut the silicon rod to form a cut surface to obtain two half rods, and the cut surface is parallel to the second side cutting surface; use the side skin clamp advancing and retreating mechanism in the second side skin anti-chipping device, that is, drive the side skin clamp to retreat along the advancing and retreating direction by the side skin clamp advancing and retreating mechanism, and the side skin clamped by the side skin clamp can be withdrawn along the advancing and retreating direction to drive the clamped side skin to separate from the silicon rod body; drive the side skin clamp and the side skin held by it to descend through the clamp lifting mechanism, release the side skin clamp, release the side skin to the side skin carrying structure, drive the side skin carrying structure to transfer from the second cutting position to the second loading and unloading position along the transfer direction through the conveying drive mechanism, and drive the side skin carrying structure and the side skin carried by it to flip through the side skin flipping mechanism to unload the flipped side skin; drive the second silicon rod carrying device and the silicon rod body carried by it to transfer from the second cutting position to the second loading and unloading position to complete the second cutting operation of the silicon rod.

[0318] The cutting and grinding integrated device for small-sized rectangular rods of the present application further includes a silicon rod loading and unloading device, which is used to load the silicon rod with a circular cross-section onto the first silicon rod transfer device, unload the silicon rod that has completed the first cutting from the first silicon rod transfer device and load it onto the second silicon rod transfer device, and unload the half rods that have completed the second cutting from the second silicon rod transfer device and load them onto the half rod grinding equipment.

[0319] In some embodiments, the silicon rod loading and unloading device includes: a silicon rod mounting frame, a silicon rod clamp, and a clamp transposition mechanism. Among them, the silicon rod mounting frame straddles the cutting machine base along the transposition direction, the silicon rod clamp is used to clamp the two end faces of the silicon rod, and the clamp transposition mechanism is used to drive the silicon rod clamp to move along the transposition direction to move the silicon rod clamp on the silicon rod mounting frame.

[0320] In the embodiments as shown in Figure 1 and Figure 2 , the half rod cutting device includes a silicon rod loading and unloading device 17, and the silicon rod loading and unloading device 17 includes: a silicon rod mounting frame 171, a silicon rod clamp 172, and a clamp transposition mechanism.

[0321] The silicon rod mounting frame straddles the cutting machine base along the transposition direction. In some embodiments, the silicon rod mounting frame straddles the cutting machine base along the transposition direction, and the transposition direction is consistent with the second direction. The length of the silicon rod mounting frame should be able to cover the entire cutting and processing platform of the cutting machine base. When there are multiple cutting stations arranged along the second direction on the cutting and processing platform, the length of the silicon rod mounting frame should be long enough to cover multiple cutting stations.

[0322] The silicon rod clamp is used to clamp the two end faces of the silicon rod. In some embodiments, the silicon rod clamp includes a clamp mounting frame and a silicon rod clamping member. Please refer to Figure 2 , which shows a schematic structural diagram of the silicon rod clamp in an embodiment. In the embodiments as shown in Figure 1 and Figure 2 , the silicon rod clamp 172 includes a clamp mounting frame 173 and a silicon rod clamping member 174.

[0323] The clamp mounting frame is arranged on the silicon rod mounting frame. The clamp mounting frame is used to set the silicon rod clamping member. Here, the specific structure of the clamp mounting frame can be set in different forms based on the layout requirements of the silicon rod clamping member, such as a beam body, a frame, a plate frame, etc.

[0324] The silicon rod clamping member is arranged on the clamp mounting frame. In some embodiments, the silicon rod clamping member makes a lifting movement relative to the clamp mounting frame through a clamp lifting mechanism.

[0325] The silicon rod clamping member is used to clamp the silicon rod. In some embodiments, the silicon rod clamping member includes: a clamp arm mounting seat, at least a pair of clamp arms, and a clamp arm driving mechanism; the clamp arm mounting seat is arranged on the clamp mounting frame.

[0326] As before, in some embodiments, the silicon rod clamping member makes a lifting movement relative to the clamp mounting frame through a clamp lifting mechanism.

[0327] In some embodiments, the fixture lifting mechanism includes a lifting guide rod and a lifting drive unit. The lifting guide rod is arranged along the lifting direction and is used to set the silicon rod clamping member. Specifically, the lifting guide rod is associated with the clamp arm mounting seat. The lifting drive unit is used to drive the silicon rod clamping member to move up and down along the lifting guide rod. In some implementation manners, the lifting drive unit includes a drive motor and a lead screw assembly arranged along the lifting direction and driven by the drive motor. The drive motor can be arranged at one end of the lead screw assembly and is arranged on the fixture mounting bracket. The lead screw assembly is controlled by the drive motor and is screwed to the clamp arm mounting seat of the silicon rod clamping member. Thus, when the fixture lifting mechanism is used, the drive motor drives the lead screw assembly to rotate forward, and then drives the silicon rod clamping member connected to the lead screw assembly to move upward along the lifting guide rod. Or, the drive motor drives the lead screw assembly to rotate reversely, and then drives the silicon rod clamping member connected to the lead screw assembly to move downward along the lifting guide rod.

[0328] At least one pair of clamp arms are oppositely arranged on the clamp arm mounting seat along the transfer direction and are used to clamp two end faces of the silicon rod. Any one of the at least one pair of clamp arms is provided with a clamping portion for directly contacting and clamping the silicon rod. In some embodiments, the clamp arms extend downward from the clamp arm mounting seat, that is, the bottom of the clamp arm is arranged on the clamp arm seat, and the top of the clamp arm is provided with a clamping portion for contacting and clamping the end face of the silicon rod. In this application, for the silicon rod to be cut, the silicon rod to be cut is a cylindrical structure with a certain length, and its length direction is placed along the transfer direction (i.e., the first direction), and the end faces are the two end faces in the length direction. For the cut half rod, the half rod is a cuboid structure with a certain length (its cross section is rectangular or quasi-rectangular), and its length direction is placed along the transfer direction (i.e., the first direction), and the end faces are the two end faces in the length direction.

[0329] The silicon rod fixture further includes a clamp arm drive mechanism, which can drive at least one of the at least one pair of clamp arms to move along the transfer direction to adjust the clamping distance between a pair of oppositely arranged clamp arms. Thus, the clamping portions of the at least one pair of clamp arms can approach or separate from each other under the action of the clamp arm drive mechanism to perform the clamping or releasing action on the silicon rod.

[0330] In some embodiments, the clamp arm drive mechanism includes a moving guide rail and a clamp arm drive unit. Among them, the moving guide rail is arranged along the transfer direction (i.e., the first direction) and is used to set at least one pair of clamp arms. In some implementation manners, a guide groove structure matching the moving guide rail is arranged at the bottom of at least one of the at least one pair of clamp arms. The clamp arm drive unit is associated with at least one of the at least one pair of clamp arms and is used to drive the associated clamp arm to move along the moving guide rail.

[0331] In some embodiments, the gripper arm driving unit includes: a moving toothed rail disposed on the gripper arm mounting base along the transfer direction; a driving gear disposed on the associated gripper arm and meshing with the moving toothed rail; and a gear driving source for driving the driving gear to rotate so that the associated gripper arm moves along the transfer direction. Among them, the moving toothed rail can adopt the structure of a rack, and the gear driving source can be, for example, a servo motor. In the above embodiments, different implementation manners can be adopted for the moving toothed rail, the driving gear, and the gear driving source in the gripper arm driving unit.

[0332] In some implementation manners, when it is necessary to drive one gripper arm, one gripper arm driving unit can be provided. The gripper arm driving unit includes a moving toothed rail, a driving gear, and a gear driving source. In practical applications, the driving gear is driven by the gear driving source to rotate so that the associated gripper arm moves along the moving toothed rail, for example, moves closer to another gripper arm (reducing the clamping distance between the two gripper arms) or moves away from another gripper arm (increasing the clamping distance between the two gripper arms).

[0333] In some implementation manners, when it is necessary to drive a pair of gripper arms, two gripper arm driving units can be provided. Each gripper arm driving unit includes a moving toothed rail, a driving gear, and a gear driving source. In practical applications, for each gripper arm, the driving gear is driven by the gear driving source to rotate so that the associated gripper arm moves along the moving toothed rail. In this way, by using the two gripper arm driving units to drive their respective corresponding gripper arms to move respectively, the two gripper arms can be driven to move towards each other (the two gripper arms approach each other to reduce the clamping distance between the two gripper arms) or move away from each other (the two gripper arms move away from each other to increase the clamping distance between the two gripper arms).

[0334] In some embodiments, the gripper arm driving unit includes: a moving toothed rail disposed on the associated gripper arm along the transfer direction; a driving gear disposed on the gripper arm mounting base and meshing with the moving toothed rail; and a gear driving source for driving the driving gear to rotate so that the associated gripper arm moves along the transfer direction. Among them, the moving toothed rail can adopt the structure of a rack, and the gear driving source can be, for example, a servo motor. In the above embodiments, different implementation manners can be adopted for the moving toothed rail, the driving gear, and the gear driving source in the gripper arm driving unit.

[0335] In some implementation manners, when it is necessary to drive one gripper arm, one gripper arm driving unit can be provided. The gripper arm driving unit includes a moving toothed rail, a driving gear, and a gear driving source. In practical applications, the driving gear is driven by the gear driving source to rotate so that the associated gripper arm moves along the moving toothed rail, for example, moves closer to another gripper arm (reducing the clamping distance between the two gripper arms) or moves away from another gripper arm (increasing the clamping distance between the two gripper arms).

[0336] In some implementations, when it is necessary to drive a pair of clamping arms, two clamping arm driving units can be provided. Each clamping arm driving unit includes a moving toothed rail, a driving gear, and a gear driving source. In practical applications, for each clamping arm, the driving gear is driven by the gear driving source to rotate so that the associated clamping arm moves along the moving toothed rail. In this way, by using two clamping arm driving units to drive their respective corresponding clamping arms to move, the two clamping arms can be driven to move towards each other (the two clamping arms approach each other to reduce the clamping distance between the two clamping arms) or move away from each other (the two clamping arms move away from each other to increase the clamping distance between the two clamping arms) along the moving toothed rail.

[0337] In some implementations, when it is necessary to drive a pair of clamping arms, a clamping arm driving unit can be provided. The clamping arm driving unit includes two moving toothed rails, a driving gear, and a gear driving source. Among them, each moving toothed rail is associated with the corresponding clamping arm. The driving gear is arranged on the clamping arm mounting seat and is located between the two moving toothed rails and meshes with the two moving toothed rails at the same time. In practical applications, the driving gear is driven by a servo motor to rotate so that the two relatively associated clamping arm mounting seats and their clamping arms move towards each other (the two clamping arms approach each other to reduce the clamping distance between the two clamping arms) or move away from each other (the two clamping arms move away from each other to increase the clamping distance between the two clamping arms) along the moving toothed rails.

[0338] The clamping arm driving unit includes: a moving lead screw arranged along the transfer direction and associated with the corresponding clamping arm; a lead screw driving source for driving the moving lead screw to rotate so that the associated clamping arm moves along the transfer direction. Among them, the lead screw driving source can be, for example, a servo motor. In an embodiment, different implementation manners can be adopted for the moving lead screw and the lead screw driving source in the clamping arm driving unit.

[0339] In some implementations, when it is necessary to drive a clamping arm, a clamping arm driving unit can be provided. The clamping arm driving unit includes a moving lead screw and a lead screw driving source. Among them, the moving lead screw is arranged along the transfer direction and is associated with the corresponding clamping arm. In practical applications, the driving source drives the moving lead screw to rotate so that the associated clamping arm moves along the transfer direction. For example, it moves closer to another clamping arm (reducing the clamping distance between the two clamping arms) or moves away from another clamping arm (increasing the clamping distance between the two clamping arms).

[0340] In some implementations, when it is necessary to drive a pair of clamping arms, two clamping arm driving units can be provided. Each clamping arm driving unit includes a moving lead screw and a lead screw driving source. Among them, each moving lead screw is associated with a corresponding clamping arm. In practical applications, for each clamping arm, the lead screw driving source drives the moving lead screw to rotate so that the associated clamping arm moves along the transfer direction. In this way, by using the two clamping arm driving units to drive their respective corresponding clamping arms to move, the two clamping arms can be driven to move towards each other (the two clamping arms approach each other to reduce the clamping distance between the two clamping arms) or move away from each other (the two clamping arms move away from each other to increase the clamping distance between the two clamping arms) along the moving tooth track.

[0341] When it is necessary to drive a pair of clamping arms, a clamping arm driving unit can be provided. The clamping arm driving unit includes a moving lead screw and a lead screw driving source. Among them, the moving lead screw can be, for example, a bidirectional lead screw. Threads are provided at both ends of the bidirectional lead screw and the thread directions are opposite. Both ends of the bidirectional lead screw are associated with a pair of opposite clamping arms. In practical applications, the lead screw driving source drives the bidirectional lead screw to rotate so that the two associated opposite clamping arms move towards each other (the two clamping arms approach each other to reduce the clamping distance between the two clamping arms) or move away from each other (the two clamping arms move away from each other to increase the clamping distance between the two clamping arms) along the moving tooth track.

[0342] Of course, the clamping arm driving unit can still be changed in other ways. For example, in some embodiments, the clamping arm driving unit can include a telescopic cylinder, and both ends of the telescopic cylinder are associated with a pair of oppositely arranged clamping arms. Or, in some embodiments, the clamping arm driving unit includes a clamping arm telescopic assembly. The clamping arm telescopic assembly includes: a clamping arm telescopic rod and a clamping arm telescopic cylinder. The clamping arm telescopic rod is associated with a corresponding clamping arm, and the clamping head telescopic cylinder is associated with the clamping head telescopic rod.

[0343] In addition, in some embodiments, the clamping arms are of a rotatable structure. For example, the silicon rod clamp further includes a clamping arm rotation mechanism for driving the clamping arms to rotate. In some implementation manners, the clamping arm rotation mechanism is disposed on at least one clamping arm of at least a pair of clamping arms, and a rotatable structure is provided on any clamping portion of at least a pair of clamping arms or the two clamping portions of a pair of clamping arms. Driven by the clamping arm rotation mechanism, the clamping portion of the clamping arm rotates in the axial line direction of the silicon rod, and the clamped silicon rod rotates correspondingly around the axial line of the silicon rod. For example, in some examples, the clamping arm rotation mechanism can be, for example, a rotating motor. Rotatable structures are provided on the clamping portions of the two clamping arms in a pair of clamping arms, and the clamping portions of the two clamping arms or the clamping portion of one of the clamping arms are connected to the output shaft of the rotating motor. For example, the clamping portions of the two clamping arms are respectively connected to a rotating motor, and the clamping portions of the corresponding clamping arms are driven to rotate by the two rotating motors respectively. Or, the clamping portion of one of the clamping arms is connected to the rotating motor, and the clamping portion of the corresponding clamping arm is driven to rotate by the rotating motor, and by using frictional force and through the conduction of the clamped silicon rod, the clamping portion of the other clamping arm is driven to rotate accordingly.

[0344] In some implementation manners, the clamping portions of at least a pair of clamping arms have contact surfaces for clamping a silicon rod or a semi-rod. The contact surface is disposed on a rotatable platform, and the cross-section of the platform can be set as a custom regular geometric figure or an irregular geometric figure.

[0345] In some embodiments, the rotatable platform can be set as an integral body hinged by a hinge device with a locking function and can rotate along the axial line in the transfer direction. The axial line of the rotation axis is connected to the clamping arm rotation mechanism.

[0346] In some embodiments, the clamping portion of the clamping arm can be set as a rotatable frustum, and the circular plane of the frustum contacts the end face of the silicon rod and remains relatively stationary with the end face of the silicon rod after being pressed against the end face of the silicon rod. The clamping portion further includes a locking structure, and the clamping portion is in a locked state when corresponding processing operations (the processing operations can be, for example, cutting, etc.) are performed on the silicon rod. During the switching of the silicon rod, such as the switching of the cutting position, the clamping portion rotates around the center of the frustum under the drive of the clamping arm rotation mechanism.

[0347] In some embodiments, the clamping portion of the clamping arm includes a rotatable frustum and a series of protruding contacts disposed on the frustum, and each contact has a contact plane. The frustum rotates under the drive of the clamping arm rotation mechanism. In an implementation manner of this embodiment, the protruding length of the contact, that is, the position in the transfer direction, can be adjusted, so that during the process of clamping the silicon rod, for a silicon rod with a relatively low flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface is in a pressed state with the end face of the silicon rod. The protruding length is the length in the transfer direction from the circular plane of the frustum to the contact plane of the contact.

[0348] In some embodiments, a pressure sensor is provided at the clamping portion of the silicon rod clamp to adjust the protruding length of the contact based on the detected pressure state. Generally, during the process of clamping the silicon rod, a pair of clamping arms of the silicon rod clamp approach each other along the transfer direction under the drive of the clamping arm drive mechanism until the contact surface of the clamping portion contacts the end surface of the silicon rod to be clamped. When multiple contacts are provided at the clamping portion and the pressure value detected when some contacts contact the end surface of the contacted silicon rod is less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contacts (generally in the direction approaching the end surface of the silicon rod); alternatively, each clamping portion of a pair of clamping arms of the silicon rod clamp is provided as a contact surface. During the process of clamping the silicon rod, the pair of clamping arms are driven by the clamping arm drive mechanism to approach each other towards the end surfaces at both ends of the silicon rod. After the clamping portion contacts the end surface of the silicon rod, the pressure sensor detects the clamping degree of the silicon rod. When the set pressure range is reached, the clamping arm drive mechanism controls the pair of clamping arms to stop moving towards each other.

[0349] The clamping arm rotation mechanism can be provided on one of the pair of clamping arms (the other clamping arm only has a rotation function) to drive the clamping portions of the pair of clamping arms to rotate with the clamped silicon rod or half rod; or the clamping arm rotation mechanism is provided on each of the pair of clamping arms and cooperates to control the two clamping portions of the pair of clamping arms to rotate at the same angle and in the same direction. In some implementation manners, the clamping arm rotation mechanism can include a driving motor.

[0350] When the silicon rod is cut by the silicon rod cutting device, it can be achieved by driving the clamping portion to rotate through the clamping arm rotation mechanism. Generally, when cutting a single crystal silicon rod, the clamping arm rotation mechanism controls the clamping portion to rotate by a certain angle, such as 90°, to cut one side surface or two opposite side surfaces of the silicon rod by using the silicon rod cutting device.

[0351] In the cutting and grinding integrated device for small-sized rectangular rods of the present application, the silicon rod loading and unloading device further includes a centering adjustment mechanism for adjusting the position of the silicon rod so that the axis line of the silicon rod corresponds to a predetermined center line. In Figure 2 (or Figure 4)In the embodiment shown, the centering adjustment mechanism 175 includes at least two clamping components arranged at intervals along the transfer direction. Each clamping component includes two clamping members oppositely arranged on the clamping arm mounting seat along the clamping direction and a telescopic driving unit associated with the two clamping members. The telescopic driving unit is used for the two clamping members to move telescopically relative to the clamping arm mounting seat in the clamping direction. Among them, the clamping direction is perpendicular to the transfer direction and forms a horizontal plane, that is, the clamping direction is the second direction. The clamping member can be, for example, a clamping plate or a clamping strip, and the telescopic driving unit can be, for example, a telescopic cylinder or a servo motor with a lead screw. In practical applications, when the silicon rod needs to be centered before being horizontally placed on the first silicon rod transfer device for the first cutting operation or before being placed on the second silicon rod transfer device for the second cutting operation, at least two clamping components in the centering adjustment mechanism can be operated. That is, the telescopic driving unit in the clamping component drives the two clamping members to move relatively and contract in the clamping direction relative to the clamping arm mounting seat, and clamping the silicon rod between them can complete the centering operation, which is simple and fast.

[0352] The fixture transposition mechanism is used to drive the silicon rod fixture to move along the transposition direction. In some embodiments, the fixture transposition mechanism includes: a fixture transposition guide rail and a fixture transposition driving unit. Among them, the fixture transposition guide rail is arranged on the silicon rod mounting frame along the transposition direction, and the fixture transposition driving unit is associated with the silicon rod fixture and is used to drive the associated silicon rod fixture to move along the fixture transposition guide rail. Among them, the transposition direction is perpendicular to the transfer direction and forms a horizontal plane, that is Figure 1 the second direction Y-axis in

[0353] In some embodiments, the fixture transposition driving unit includes: a transposition tooth rail, a driving gear, and a gear driving source. The transposition tooth rail is arranged along the transposition direction, the driving gear is arranged on the silicon rod fixture and meshes with the transposition tooth rail, and the gear driving source is used to drive the driving gear to rotate so that the associated silicon rod fixture moves along the transposition direction.

[0354] In such as Figure 1 and Figure 2 (or Figure 4) In the embodiment shown, the jig transposition drive unit includes: a transposition tooth rail, a drive gear, and a gear drive source. The transposition tooth rail is arranged along the transposition direction. The length range of the transposition guide rail in the transposition direction at least covers the positions of each cutting station and the silicon rod cutting device corresponding to the services in the half-rod cutting device, so as to ensure that the silicon rod jig can be transferred to cover each cutting station. The moving tooth rail can adopt the structure of a rack. The drive gear is arranged on the jig mounting frame of the silicon rod jig and meshes with the transposition tooth rail. The gear drive source is arranged on the jig mounting frame of the silicon rod jig and is associated with the drive gear. In practical applications, the gear drive source can be used to drive the drive gear to rotate, so as to drive the silicon rod jig to move along the transposition direction through the transposition tooth rail. For example, when the gear drive source drives the drive gear to rotate forward, through the cooperation of the drive gear and the transposition tooth rail, the associated silicon rod jig is driven to move forward along the transposition direction; when the gear drive source drives the drive gear to rotate reversely, through the cooperation of the drive gear and the transposition tooth rail, the associated silicon rod jig is driven to move backward along the transposition direction.

[0355] Of course, the structure of the jig transposition drive unit can still be changed in other ways. For example, in some embodiments, the jig transposition drive unit may include: a transposition lead screw, which is arranged along the transposition direction and is associated with the jig mounting frame of the silicon rod jig; a lead screw drive source, which is used to drive the transposition lead screw to rotate so that the associated silicon rod jig moves along the transposition direction. In some embodiments, the chain conveying mechanism includes an endless chain and a chain drive source. The endless chain is associated with the jig mounting frame of the silicon rod jig. The endless chain can be, for example, a closed-loop chain, which is wound around a plurality of movable gears to form a preset shape. The chain drive source can be, for example, a servo motor.

[0356] In the present application, the half-rod cutting device includes a side skin unloading device for unloading the cut side skin.

[0357] In some embodiments, the side skin unloading device includes: a side skin mounting frame, a side skin adsorbing member, and an adsorbing member transposition mechanism. Among them, the side skin mounting frame straddles the cutting machine base along the transposition direction. The side skin adsorbing member is used to adsorb the side skin, and the adsorbing member transposition mechanism is used to drive the adsorbing member to move along the transposition direction on the side skin mounting frame.

[0358] In such as Figure 1 and Figure 3 or Figure 4 In the embodiment shown, the half-rod cutting device 1 includes a side skin unloading device 18. The side skin unloading device 18 can be arranged at the loading and unloading area of the cutting processing platform, and is used to unload the cut side skin from the cutting station (the first cutting station or the second cutting station) of the cutting processing platform. Among them, the loading and unloading area is located on the side of the cutting processing platform.

[0359] The side skin unloading device 18 includes: a side skin mounting frame 181, a side skin adsorbing member 182, and an adsorbing member transposition mechanism.

[0360] The side skin mounting frame is arranged across the cutting machine base along the transposition direction. In some embodiments, the side skin mounting frame is arranged across the cutting machine base along the transposition direction, and the transposition direction is consistent with the second direction. The length of the side skin mounting frame should be able to cover the entire cutting and processing platform of the cutting machine base. When there is one or more cutting station groups on the cutting and processing platform, each cutting station group includes a first cutting station and a second cutting station along the second direction, and the length of the side skin mounting frame should be long enough to cover each cutting station.

[0361] The side skin suction attachment is used to adsorb the side skin. In some embodiments, the side skin unloading device includes a suction attachment mounting structure, and a plurality of side skin suction attachments are arranged on the suction attachment mounting structure along the transfer direction (i.e., the length direction of the side skin). The side skin suction attachment includes a suction cup. Among them, the side skin suction attachment makes a lifting movement relative to the side skin mounting frame through a suction attachment lifting mechanism.

[0362] In some embodiments, the suction attachment lifting mechanism includes: a lifting guide rod and a lifting drive unit. The lifting guide rod is arranged along the lifting direction and is used to set the side skin suction attachment. Specifically, the lifting guide rod is associated with the suction attachment mounting structure of the side skin suction attachment. The lifting drive unit is used to drive the side skin suction attachment to make a lifting movement along the lifting guide rod. Among them, the lifting drive unit includes: a drive motor and a lead screw assembly arranged along the lifting direction and driven by the drive motor. The drive motor and the lead screw assembly can be arranged on the suction attachment mounting structure. Among them, the drive motor can be arranged at one end of the lead screw assembly. The lead screw assembly is controlled by the drive motor and is associated with the suction attachment mounting frame of the side skin suction attachment. Thus, when using the side skin lifting mechanism, the drive motor drives the lead screw assembly to rotate forward, and then drives the suction attachment mounting frame and the side skin suction attachment thereon to move upward along the lifting guide rod. Or, the drive motor drives the lead screw assembly to rotate reversely, and then drives the suction attachment mounting frame and the side skin suction attachment thereon to move downward along the lifting guide rod. The suction attachment transposition mechanism is used to drive the side skin suction attachment to move along the transposition direction to switch between multiple cutting stations.

[0363] In some embodiments, the suction attachment transposition mechanism includes: a suction attachment transposition guide rail and a suction attachment transposition drive unit. Among them, the suction attachment transposition guide rail is arranged on the side skin mounting frame along the transposition direction, and the suction attachment transposition drive unit is associated with the side skin suction attachment and is used to drive the associated side skin suction attachment to move along the suction attachment transposition guide rail. Among them, the transposition direction is perpendicular to the transfer direction and forms a horizontal plane, that is Figure 1 the second direction Y-axis in

[0364] In some embodiments, the suction attachment transposition drive unit includes: a transposition tooth rail, a drive gear, and a gear drive source. The transposition tooth rail is arranged along the transposition direction, is arranged on the side skin suction attachment and meshes with the transposition tooth rail, and the gear drive source is used to drive the drive gear to rotate so that the associated side skin suction attachment moves along the transposition direction.

[0365] In the embodiments shown in Figure 1 and Figure 3 (or Figure 4 ), the adsorbent replacement driving unit includes: a replacement toothed rail, a driving gear, and a gear driving source. The replacement toothed rail is arranged along the replacement direction, and the length range of the replacement guide rail in the replacement direction at least covers the positions of the respective cutting stations and the silicon rod cutting device corresponding to the cutting and grinding integration device of the small-sized rectangular rod, so as to ensure that the adsorbent can be transferred to cover each cutting station. The moving toothed rail can adopt the structure of a rack. The driving gear is arranged on the adsorbent mounting frame of the side skin adsorbent and meshes with the replacement toothed rail. The gear driving source is arranged on the adsorbent mounting frame of the side skin adsorbent and is associated with the driving gear. In practical applications, the gear driving source can be used to drive the driving gear to rotate, so as to drive the side skin adsorbent to move along the replacement direction through the replacement toothed rail. For example, when the gear driving source drives the driving gear to rotate forward, through the cooperation of the driving gear and the replacement toothed rail, the associated silicon rod fixture is driven to move forward along the replacement direction; when the gear driving source drives the driving gear to rotate reversely, through the cooperation of the driving gear and the replacement toothed rail, the associated silicon rod fixture is driven to move backward along the replacement direction.

[0366] Of course, the structure of the adsorbent replacement driving unit can still be changed in other ways. For example, in some embodiments, the adsorbent replacement driving unit may include: a replacement lead screw, arranged along the replacement direction and associated with the adsorbent mounting frame of the side skin adsorbent; a lead screw driving source, used to drive the replacement lead screw to rotate so that the associated side skin adsorbent moves along the replacement direction. The chain conveying mechanism includes an endless chain and a chain driving source. The endless chain is associated with the adsorbent mounting frame of the side skin adsorbent. The endless chain can be, for example, a closed-loop chain, which is wound around a plurality of movable gears to form a preset shape. The chain driving source can be, for example, a servo motor.

[0367] In some embodiments, in the half-rod cutting device of the present application, a side skin recycling box or a side skin recycling cart may further be included, and the side skin unloading device 18 is used to unload the side skin into the side skin recycling box or the side skin recycling cart.

[0368] In the half-rod cutting device of the present application, a blanking conveying device may further be included, which is arranged at the unloading position and is used to convey the ground half-rod. In some embodiments, the blanking conveying device can be, for example, a conveyor belt device, including a conveyor belt, which is wound around two relatively front and rear conveying rollers. At least one of the two conveying rollers is axially connected to a blanking driving source, and the blanking driving source can be, for example, a servo motor. In Figure 1 and Figure 2 (or Figure 4 ), the half-rod grinding device further includes a blanking conveying device 179.

[0369] The cutting and grinding integrated equipment for small-sized rectangular rods of the present application further includes a crystal wire detection device. In some embodiments, the crystal wire detection device includes: at least two supporting structures arranged at intervals, the supporting structures having a supporting roller group arranged along the transfer direction for supporting the silicon rod to be cut; a roller driving source for driving each supporting roller in the supporting roller group to rotate so as to drive the silicon rod to be cut to rotate; and a crystal wire detection probe located between at least two supporting structures.

[0370] At least two supporting structures are arranged at intervals along the transfer direction, and each supporting structure has a supporting roller group. Among them, the supporting roller group includes two or more rollers arranged along the transfer direction, and each roller belonging to the same supporting roller group is connected by a rotating shaft arranged along the transfer direction. When using the supporting roller group to support the silicon rod to be cut, the wheel surfaces of the rollers in the supporting roller group are in contact with the silicon rod to be cut. In addition, in this embodiment, at least two supporting structures arranged at intervals along the transfer direction can also be movable, that is, at least one of the at least two supporting structures can move along the transfer direction to adjust the supporting distance between the at least two supporting structures so as to be suitable for supporting silicon rods to be cut of various specifications and sizes.

[0371] The roller driving source is used to drive each supporting roller in the supporting roller group to rotate. Among them, the roller driving source can be, for example, a servo motor, and the servo motor can be associated with at least one supporting roller group through, for example, a chain (group) or a gear group.

[0372] In practical applications, when the silicon rod to be cut with a circular cross-section is placed horizontally on the supporting structure of the crystal wire detection device, the axis line of the silicon rod to be cut is consistent with the transfer direction. After that, the roller driving source can drive each supporting roller in the supporting roller group to rotate, and use the friction between the supporting roller and the silicon rod to be cut to drive the silicon rod to be cut to rotate, so as to complete the crystal wire detection operation.

[0373] When using Figure 1 the half-rod cutting equipment in the cutting and grinding integrated equipment for small-sized rectangular rods in the illustrated embodiment to perform squaring cutting and half-cutting operations, the specific process can be roughly as follows:

[0374] First, place the silicon rod to be cut with a circular cross-section horizontally on the crystal wire detection device, and drive the silicon rod to be cut to rotate by the crystal wire detection device to complete the crystal wire detection operation.

[0375] Next, use the silicon rod loading and unloading device to clamp the silicon rod to be cut from the crystal wire detection device and transfer it to the first silicon rod transfer device corresponding to the first loading and unloading area of the first cutting station. The silicon rod to be cut is placed horizontally and the axis line of the silicon rod is consistent with the transfer direction.

[0376] Next, the edge skin clamp advancing and retracting mechanism drives the edge skin clamp to advance along the advancing and retracting direction to the silicon rod, and drives the edge skin clamp of the edge skin anti-cracking device corresponding to the first silicon rod transfer device to clamp the silicon rod to be cut; drives the first silicon rod transfer device to carry the silicon rod and advance from the first loading and unloading position along the transfer direction towards the first cutting position. Through the relative movement of the first silicon rod cutting device and the first silicon rod transfer device along the transfer direction, the two first cutting wire saws (the first cutting wire saws are arranged vertically or at an angle to the vertical) arranged oppositely in the first silicon rod cutting device perform the first cutting operation on the silicon rod to be cut carried by the first silicon rod transfer device, so that the silicon rod to be cut forms two parallel first side cut surfaces and two edge skins.

[0377] Next, use the edge skin clamp advancing and retracting mechanism in the edge skin anti-cracking device, that is, drive the edge skin clamp to retract along the advancing and retracting direction by the edge skin clamp advancing and retracting mechanism, and the edge skin clamped by the edge skin clamp can be retracted along the advancing and retracting direction to drive the clamped edge skin to separate from the silicon rod body; the chuck driving mechanism in the edge skin clamp drives the chuck to move to release the clamped edge skin and make it fall on the edge skin bearing structure, and drives the edge skin bearing structure to drive the edge skin bearing structure and the edge skin it bears to move from the first cutting position to the first loading and unloading position; use the edge skin flipping mechanism to drive the edge skin bearing structure to flip; use the edge skin unloading device to unload the cut edge skin.

[0378] Next, drive the first silicon rod transfer device to carry the silicon rod after the first cutting operation and retreat along the transfer direction away from the first cutting position to the first loading and unloading position, use the silicon rod loading and unloading device to clamp the silicon rod from the first silicon rod transfer device and move it along the conversion direction to the second cutting station, rotate the silicon rod 90° and then place the silicon rod on the second silicon rod transfer device located at the second loading and unloading position. The silicon rod is placed horizontally and the axis line of the silicon rod is consistent with the transfer direction.

[0379] Next, use the centering adjustment mechanism in the silicon rod loading and unloading device to adjust the position of the silicon rod so that the axis line of the silicon rod corresponds to the predetermined center line.

[0380] Next, the edge clamp advancing and retreating mechanism drives the edge clamp to advance along the advancing and retreating direction to the silicon rod, and drives the edge clamp of the edge anti-cracking device corresponding to the second silicon rod transfer device to clamp the silicon rod; drives the second silicon rod transfer device to carry the silicon rod and advance from the second loading and unloading position along the transfer direction towards the second cutting position. Through the relative movement of the second silicon rod cutting device and the second silicon rod transfer device along the transfer direction, the silicon rod carried by the second silicon rod transfer device is subjected to the second cutting operation by two relatively arranged second cutting wire saws (the second cutting wire saws are arranged vertically or at an angle to the vertical direction) and a third cutting wire saw (the third cutting wire saw is arranged vertically or at an angle to the vertical direction) in the second silicon rod cutting device, so that the silicon rod is cut to obtain at least two half-rods with a rectangular cross-section after forming two parallel second side cutting surfaces and at least one dividing surface between the two second side cutting surfaces.

[0381] Next, utilize the edge clamp advancing and retreating mechanism in the edge anti-cracking device, that is, drive the edge clamp to retreat along the advancing and retreating direction by the edge clamp advancing and retreating mechanism, and the edge clamped by the edge clamp can be retreated along the advancing and retreating direction to drive the clamped edge to separate from the silicon rod body; the chuck driving mechanism in the edge clamp drives the chuck to move to release the clamped edge and make it fall on the edge bearing structure, and drive the edge bearing structure to drive the edge bearing structure and the edge it bears to move from the second cutting position to the second loading and unloading position; utilize the edge flipping mechanism to drive the edge bearing structure to flip; utilize the edge unloading device to unload the cut edge.

[0382] Next, drive the second silicon rod transfer device to carry the two half-rods after the second cutting operation and retreat along the transfer direction away from the first cutting position to the first loading and unloading position, and use the silicon rod loading and unloading device to clamp the half-rods from the second silicon rod transfer device and move along the conversion direction, and load the half-rods into the half-rod grinding equipment.

[0383] Regarding the half-rod grinding equipment, the half-rod grinding equipment 2 of the present application includes: a grinding machine base, a grinding surface device, a chamfering device, and a half-rod transfer device.

[0384] The grinding machine base serves as the main component of the half-rod grinding equipment and is used to provide a processing platform. In practical applications, the volume and weight of the grinding machine base are relatively large to provide a large installation surface and firm overall stability. It should be understood that the grinding machine base can be used as the base for different structural or component parts that perform processing operations in the half-rod grinding equipment, and the specific structure of the grinding machine base can be changed based on different functional requirements or structural requirements. In some examples, the grinding machine base includes fixed structures or limiting structures for receiving different components in the half-rod grinding equipment, such as bases, columns, frames, etc., which are all the grinding machine bases of the present application.

[0385] At the same time, in some examples, the grinding machine base can be an integral base, and in some examples, the grinding machine base can include multiple independent bases.

[0386] The grinding machine base has a grinding processing platform, which can be divided into multiple functional areas according to the specific operation content of the semi-bar grinding operation. For example, in some embodiments, the grinding processing platform includes a surface grinding area and a chamfering area. In some embodiments, the grinding processing platform includes a loading area, a surface grinding area, a chamfering area, and an unloading area. In some embodiments, the grinding processing platform includes a loading and unloading area, a surface grinding area, and a chamfering area. It should be noted that in each example provided in this application, the functional area is defined by the travel path and range of the processing device at the functional area. For example, the surface grinding device of the semi-bar grinding equipment is located at the surface grinding area, and the range of the surface grinding area is the range occupied by the surface grinding device during the surface grinding operation; similarly, the chamfering device of the semi-bar grinding equipment is located at the chamfering area, and the range of the chamfering area is the range occupied by the chamfering device during the chamfering operation. The shape of the grinding processing platform can be determined according to the grinding machine base, or can be jointly determined according to the grinding machine base and the processing requirements of the surface grinding device and the chamfering device.

[0387] In some embodiments, the grinding processing platform is provided with a surface grinding area and a chamfering area. A surface grinding device is provided at the surface grinding area, and the surface grinding device includes at least one surface grinding tool. A chamfering device is provided at the chamfering area, and the chamfering device includes at least one chamfering tool. The surface grinding device is located at the surface grinding area of the grinding processing platform and is used for performing a surface grinding operation on the side surface of the semi-bar located at the surface grinding area. The semi-bar has four side surfaces. Therefore, the surface grinding device is used for performing a surface grinding operation on the four side surfaces of the semi-bar.

[0388] In this application, the semi-bar is placed horizontally at the surface grinding area of the grinding processing platform. To enable the semi-bar to be stably placed at the surface grinding area, the semi-bar grinding equipment of this application includes a first semi-bar clamping device.

[0389] The first semi-bar clamping device is located at the surface grinding area and is used for clamping the end of the semi-bar along the length direction.

[0390] The first semi-bar clamping device is intended to clamp the semi-bar.

[0391] In some embodiments, the first semi-bar clamping device includes: a first bearing mounting seat and a first semi-bar clamp.

[0392] The first bearing mounting seat is located on the grinding machine base. In some embodiments, the first bearing mounting seat is located on the grinding machine base along the first direction and is used for setting the first semi-bar clamp.

[0393] The first half-rod clamp is used to clamp the half-rod. In some embodiments, the first half-rod clamp may include a first clamp base, at least a pair of first clamping members, and a first clamping member driving mechanism. The at least a pair of first clamping members are provided with a first clamping portion and a first clamping portion rotation mechanism. The at least a pair of first clamping members are disposed on opposite sides of the first clamp base and arranged along a first direction. The at least a pair of first clamping members are controlled by the first clamping member driving mechanism to clamp the two end faces of the half-rod, so that the clamped half-rod is horizontally placed along the fi...

Claims

1. An integrated device for cutting and grinding small rectangular bars, characterized in that: include: A half-rod cutting device comprises a cutting machine base with a cutting processing platform; the cutting processing platform is provided with one or more cutting station groups, each cutting station group comprises a first cutting station and a second cutting station; wherein the first cutting station is provided with a first silicon rod cutting device, the first silicon rod cutting device is used to perform a first cutting operation on a silicon rod with a circular cross section, so that the silicon rod forms two parallel first side sections; the second cutting station is provided with a second silicon rod cutting device, the second silicon rod cutting device is used to perform a second cutting operation on the silicon rod with the two first side sections, so that the silicon rod forms two parallel second side sections and at least one dividing section between the two second side sections to obtain at least two half-rods with a rectangular cross section and being small-sized rectangular rods, the second side section is perpendicular to the first side section, and the dividing section is parallel to the second side section; a silicon rod loading and unloading device, arranged on the half-rod cutting device and used for unloading the half-rod from the half-rod cutting device and loading the half-rod for grinding, comprising a silicon rod mounting frame straddling the cutting machine base along a transposition direction, a silicon rod clamp for clamping two end faces of the silicon rod, and a clamp transposition mechanism for driving the silicon rod clamp to move on the silicon rod mounting frame along the transposition direction; as well as The half-rod grinding equipment is connected to the silicon rod loading and unloading device and is used for grinding and chamfering the half-rod loaded by the silicon rod loading and unloading device.

2. The integrated cutting and grinding device according to claim 1, characterized in that: The first cutting station comprises a first loading and unloading position and a first cutting position. The first cutting station is provided with a first silicon rod transfer device. The first silicon rod transfer device is used to carry a silicon rod with a circular cross section and transfer it between the first loading and unloading position and the first cutting position along a transfer direction. The first silicon rod cutting device is arranged at the first cutting position. The first silicon rod cutting device is provided with at least one first cutting wire saw. The at least one first cutting wire saw is located in a vertical plane and arranged along the vertical direction or arranged at an angle to the vertical direction. The first silicon rod cutting device and the first silicon rod transfer device are relatively moved along the transfer direction so that the at least one first cutting wire saw performs a first cutting operation on the silicon rod with a circular cross section; The second cutting station includes a second loading and unloading position and a second cutting position. The second cutting station is equipped with a second silicon rod transferring device. The second silicon rod transferring device is used to carry the silicon rod having two first side cut surfaces and transfer them between the second loading and unloading position and the second cutting position along a transfer direction. The second silicon rod cutting device is arranged in the second cutting position. The second silicon rod cutting device is provided with at least one second cutting wire saw and at least one third cutting wire saw. The at least one second cutting wire saw and the at least one third cutting wire saw are located in a vertical plane and are arranged vertically or at an angle to the vertical. The second silicon rod cutting device and the second silicon rod transferring device are relatively moved along the transfer direction so that the at least one second cutting wire saw and the at least one third cutting wire saw perform a second cutting operation on the silicon rod having two first side cut surfaces.

3. The integrated cutting and grinding device according to claim 2, characterized in that: The half-rod cutting device comprises a first edge skin anti-collapse device matched with the first silicon rod transfer device, and the half-rod cutting device comprises a second edge skin anti-collapse device matched with the second silicon rod transfer device.

4. The integrated cutting and grinding device according to claim 3, characterized in that: The first edge skin anti-collapse device or the second edge skin anti-collapse device includes a clamping support and an edge skin clamp arranged on the clamping support; the edge skin clamp includes a clamping seat, at least a pair of end face clamps arranged opposite to each other along the clamping direction, and a clamp driving mechanism for driving at least one end face clamp of the at least one pair of end face clamps to move along the clamping direction.

5. The integrated cutting and grinding device according to claim 4, characterized in that: The first edge skin anti-collapse device or the second edge skin anti-collapse device includes an edge skin clamp advance and retreat mechanism for driving the edge skin clamp to advance and retreat along the advance and retreat direction; the edge skin clamp advance and retreat mechanism includes a clamp advance and retreat guide rail arranged along the advance and retreat direction; and a edge skin clamp advance and retreat unit for driving the edge skin clamp to move along the clamp advance and retreat guide rail.

6. The integrated cutting and grinding device according to claim 4, characterized in that: The first edge skin anti-collapse device or the second edge skin anti-collapse device comprises a clamp lifting mechanism, and the clamp lifting mechanism comprises: a clamp lifting guide rail arranged vertically; and a clamp lifting unit for driving the edge skin clamp to move up and down along the clamp lifting guide rail.

7. The integrated cutting and grinding device according to claim 3, characterized in that: The first edge skin anti-collapse device or the second edge skin anti-collapse device comprises an edge skin unloading and conveying mechanism, and the edge skin unloading and conveying mechanism comprises an edge skin bearing structure and a conveying drive mechanism, and the edge skin bearing structure is controlled by a edge skin flipping mechanism to flip.

8. The integrated cutting and grinding device according to claim 1, characterized in that: The first silicon rod cutting device includes two first wire cutting units arranged in parallel, each of which is formed with a first cutting wire saw. The second silicon rod cutting device includes two second wire cutting units arranged in parallel, each of which is formed with a second cutting wire saw. The second silicon rod cutting device includes at least one third wire cutting unit located between the two second wire cutting units, and the third wire cutting unit is formed with a third cutting wire saw.

9. The integrated cutting and grinding device according to claim 1, characterized in that: The silicon rod clamp comprises a clamp mounting frame and a silicon rod clamping member arranged on the clamp mounting frame, wherein the silicon rod clamping member comprises a clamp arm mounting seat arranged on the clamp mounting frame, at least one pair of clamp arms arranged on the clamp arm mounting seat opposite to each other along a transfer direction, and a clamp arm driving mechanism for driving at least one clamp arm of the at least one pair of clamp arms to move along the transfer direction to adjust the clamping distance between the at least one pair of clamp arms; The silicon rod clamping piece is lifted and lowered relative to the clamp mounting frame by a clamp lifting mechanism.

10. The integrated cutting and grinding device according to claim 9, characterized in that: The at least one pair of clamp arms comprises a rotating structure; the silicon rod clamp comprises a clamp arm rotating mechanism, and the clamp arm rotating mechanism is arranged on at least one clamp arm of the at least one pair of clamp arms and is used to drive the clamping part of the at least one clamp arm to rotate.

11. The integrated cutting and grinding device according to claim 9, characterized in that: The fixture transposition mechanism includes a fixture transposition guide rail arranged on the silicon rod mounting frame along a transposition direction, and a fixture transposition drive unit associated with the silicon rod fixture for driving the associated silicon rod fixture to move along the fixture transposition guide rail; the transposition direction is perpendicular to the transfer direction and forms a horizontal plane.

12. The integrated cutting and grinding device according to claim 1, characterized in that: The silicon rod loading and unloading device comprises a centering adjustment mechanism for adjusting the position of the silicon rod so that the axis of the silicon rod corresponds to a predetermined center line.

13. The integrated cutting and grinding device according to claim 1, characterized in that: The half-rod grinding equipment includes a grinding machine base with a grinding processing platform, wherein the grinding processing platform is provided with a grinding area and a chamfering area; a grinding device for grinding the side surface of the half-rod located at the grinding area; and a chamfering device for chamfering the edge of the half-rod located at the chamfering area.

14. The integrated cutting and grinding device according to claim 13, characterized in that: The grinding processing platform is provided with a grinding area and a chamfering area. The grinding area is provided with a grinding device, and the grinding device includes at least one grinding tool. The chamfering area is provided with a chamfering device, and the chamfering device includes at least one chamfering tool.

15. The integrated cutting and grinding device according to claim 14, characterized in that: The surface grinding device comprises a surface grinding frame and a surface grinding unit or a pair of surface grinding units arranged opposite to each other movably arranged on the surface grinding frame, and each surface grinding unit has at least one surface grinding tool.

16. The integrated cutting and grinding device according to claim 13, characterized in that: The grinding processing platform is provided with a first type of grinding area, a second type of grinding area and a chamfering area arranged in parallel. The first type of grinding area is provided with a first type of grinding device for grinding a pair of first side surfaces of the half rod, and the first type of grinding device includes at least one first grinding tool. The second type of grinding area is provided with a second type of grinding device for grinding a pair of second side surfaces of the half rod, and the second type of grinding device includes at least one second grinding tool. The chamfering area is provided with a chamfering device, and the chamfering device includes at least one chamfering tool.

17. The integrated cutting and grinding device according to claim 13, characterized in that: The processing platform is provided with two first-type grinding areas, one second-type grinding area and one chamfering area arranged in parallel, wherein any of the first-type grinding areas is provided with a first-type grinding device for grinding a first side surface of a pair of first side surfaces of a half rod, the first-type grinding device includes at least one first grinding tool, the second-type grinding area is provided with a second-type grinding device for grinding a pair of second side surfaces of the half rod, the second-type grinding device includes at least one second grinding tool, and the chamfering area is provided with a chamfering device, the chamfering device includes at least one chamfering tool.

18. The integrated cutting and grinding device according to claim 17, characterized in that: The half-rod grinding equipment includes: a first half-rod clamping device arranged in the first type of grinding surface area for clamping the end of the half-rod along the length direction and exposing a first side surface of the half-rod, and a second half-rod clamping device arranged in the second type of grinding surface area for clamping the end of the half-rod along the length direction and exposing a pair of second side surfaces of the half-rod.

19. The integrated cutting and grinding device according to claim 17, characterized in that: The first type of surface grinding device comprises a first surface grinding frame and at least one first surface grinding unit movably arranged on the first surface grinding frame, and each first surface grinding unit has at least one first surface grinding tool.

20. The integrated cutting and grinding device according to claim 17, characterized in that: A second type of grinding device is provided at the second type of grinding area, the second type of grinding device includes a second grinding frame and at least one pair of second grinding units movably arranged on the second grinding frame and arranged opposite to each other, each grinding unit has at least one second grinding tool; or a pair of second type of grinding devices are provided at the second type of grinding area, the second type of grinding device includes a second grinding frame and at least one second grinding unit movably arranged on the second grinding frame, each second grinding unit has at least one second grinding tool.

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