Drying device for SMT patch processing

Abstract

The utility model relates to the related technical field of SMT patch processing, in particular to a drying device for SMT patch processing, which comprises a drying box, a dismounting mechanism is arranged in the drying box, a tray is arranged at one end of the inner wall of the drying box, a mounting pipe is embedded in the inner wall of the bottom of the tray, grooves are symmetrically formed in the two ends of the tray, and the mounting pipe is connected with the mounting pipe. Limiting blocks are symmetrically arranged at the two ends of the tray, a pull ring is arranged on one side of the mounting pipe, a rope is arranged in the mounting pipe, and a spring is arranged at one end of each limiting block. According to the drying device for SMT patch processing, through the arrangement of the dismounting mechanism, when the tray is taken out, a pull ring is pulled firstly, the pull ring drives a rope in a mounting pipe to move, and the rope pulls a limiting block connected with the rope to overcome the elastic force of a spring, so that the limiting block is separated from a limiting groove; therefore, the tray can be pulled out of the sliding groove for cleaning or rapid replacement of the SMT patch.

Description

Technical Field

[0001] The utility model relates to the technical field related to SMT chip mounting processing, in particular to a drying device for SMT chip mounting processing. Background Art

[0002] SMT is called surface mounting or surface mounting technology, which is the most popular technology and process in the current electronic assembly industry. With the rapid development of the electronic industry, the integration of electronic products is getting higher and higher, and the precision and quality requirements of SMT chips are becoming increasingly strict. In the chip mounting process, various soldering aids, adhesives and other materials are often used, and these materials need to be dried after the chip mounting operation to ensure the firmness and reliability of the chip mounting. Therefore, a drying device for SMT chip mounting processing is particularly needed.

[0003] However, the existing drying device for SMT chip mounting processing cannot ensure the uniform distribution of hot air, resulting in inconsistent drying degree of the chips. The previous trays are difficult to disassemble, which is not conducive to cleaning and quickly replacing the chips. The impurities, dirt and residual soldering aids accumulated on the trays affect heat transfer and thus the drying efficiency. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a drying device for SMT chip mounting processing to solve the existing drying device for SMT chip mounting processing mentioned in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A drying device for SMT chip mounting processing, including a drying box, a disassembly mechanism is arranged inside the drying box, an air flow driving mechanism is arranged at the bottom of the drying box, a tray is arranged at one end of the inner wall of the drying box, a mounting pipe is embedded in the bottom inner wall of the tray, grooves are symmetrically arranged at both ends of the tray, limit blocks are symmetrically arranged at both ends of the tray, a pull ring is arranged on one side of the mounting pipe, a wire rope is arranged inside the mounting pipe, and a spring is arranged at one end of the limit block.

[0006] Preferably, a box door is hinged on one side of the drying box, a dryer is arranged through the top of the drying box, and two sliding grooves are arranged at one end of the inner wall of the drying box.

[0007] Preferably, the tray is in a grid shape distributed in a cross shape, and the spring is sleeved on the wire rope.

[0008] Preferably, springs are arranged at both ends of the tray, and limit grooves are arranged at one end of the inner wall of the drying box.

[0009] Preferably, the springs are arranged inside the grooves, and both ends of the tray are slidably connected to the inner wall of the sliding groove.

[0010] Preferably, the air flow driving mechanism includes a fan, and bolts are threadedly connected to the bottom of the drying box.

[0011] Preferably, a protective cover is provided at the bottom of the drying box, and the fan passes through the bottom of the drying box.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] The drying device for SMT chip mounting processing is provided with a disassembly mechanism. By pulling the pull ring, the wire rope inside the mounting tube is driven to move. The wire rope pulls the limiting block connected thereto to overcome the elastic force of the spring, so that the limiting block is disengaged from the limiting groove, enabling the tray to be easily taken out. This facilitates cleaning the impurities, dirt, residual soldering flux, etc. accumulated on the tray. Maintaining the cleanliness of the tray can reduce the obstruction of heat transfer by these pollutants, thereby improving the heat transfer efficiency. When a batch of SMT chips is dried, the tray can be quickly removed and a new batch of chips to be dried can be replaced, reducing the waiting time and achieving continuous and efficient drying operations, thus improving the overall drying efficiency.

[0014] The grid-shaped tray with a square distribution allows hot air to circulate. Cooperating with the fan at the bottom to accelerate the circulation of hot air, the hot air is more evenly distributed and fully contacts the chips, greatly shortening the drying time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic side view of the external structure of the present utility model;

[0016] Figure 2 is a schematic exploded sectional view of the disassembly mechanism of the present utility model;

[0017] Figure 3 is a schematic exploded view of the air flow driving mechanism of the present utility model;

[0018] Figure 4 is of the present utility model Figure 2 the enlarged schematic view at A in;

[0019] Figure 5 is of the present utility model Figure 2 the enlarged schematic view at B in;

[0020] Figure 6 is of the present utility model Figure 2 the schematic view of the structure of the mounting tube and the wire rope in;

[0021] In the figure: 1, drying box; 2, box door; 3, dryer; 4, disassembly mechanism; 401, tray; 402, chute; 403, limit groove; 404, installation pipe; 405, groove; 406, limit block; 407, pull ring; 408, wire rope; 409, spring; 5, air flow driving mechanism; 501, fan; 502, bolt; 503, protective cover. Specific implementation mode

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention.

[0023] Embodiment

[0024] As Figure 1 、 2 As shown in FIGS. 1, 2, and 3, it includes a drying box 1. A disassembly mechanism 4 is provided inside the drying box 1. An air flow driving mechanism 5 is provided at the bottom of the drying box 1. One end of the inner wall of the drying box 1 is provided with a tray 401. An installation pipe 404 is embedded in the bottom inner wall of the tray 401. Grooves 405 are symmetrically provided at both ends of the tray 401. Limit blocks 406 are symmetrically provided at both ends of the tray 401. A pull ring 407 is provided on one side of the installation pipe 404. A wire rope 408 is provided inside the installation pipe 404. A spring 409 is provided at one end of the limit block 406.

[0025] It should be noted that in this embodiment, through the setting of the tray 401, the tray 401 is installed in the drying box 1 and is used to place the SMT patches to be dried. The grid-like design with a cross-shaped distribution is conducive to the circulation of hot air inside it, making the patches heat more evenly and improving the drying effect.

[0026] Among them, one end of the spring 409 is welded in the groove 405 on the inner surface of one side of the tray 401. When the tray 401 needs to be taken out, the pull ring 407 is pulled. The pull ring 407 drives the wire rope 408 in the installation pipe 404 to move. The wire rope 408 pulls the limit block 406 connected to it to overcome the elastic force of the spring 409, so that the limit block 406 is disengaged from the limit groove 403.

[0027] As Figure 2 、 4 As shown in FIGS. 5 and 6, it includes a disassembly mechanism 4. The tray 401 is in a grid shape with a cross-shaped distribution. The spring 409 is sleeved on the wire rope 408. Springs 409 are provided at both ends of the tray 401. A limit groove 403 is provided at one end of the inner wall of the drying box 1. The spring 409 is provided inside the groove 405. Both ends of the tray 401 are slidably connected to the inner wall of the chute 402.

[0028] It should be noted that in this embodiment, during the operation of removing the tray 401, since one end of the wire rope 408 passes through the inside of the spring 409, when the wire rope 408 is pulled, the spring 409 can be effectively driven to expand and contract, so that the limit block 406 is disengaged from the limit groove 403.

[0029] Among them, through the arrangement of two groups of wire ropes 408, when the pull ring 407 is pulled, the two groups of wire ropes 408 can be driven to move simultaneously, so that the limit blocks 406 of the tray 401 are disengaged from the limit grooves 403 at the same time, which is convenient for removing the tray 401.

[0030] As Figure 3 shown, it includes an air flow driving mechanism 5. The air flow driving mechanism 5 includes a fan 501. The bottom of the drying box 1 is threadedly connected with bolts 502. A protective cover 503 is provided at the bottom of the drying box 1, and the fan 501 passes through the bottom of the drying box 1.

[0031] It should be noted that in this embodiment, through the forced convection generated by the fan 501, the hot air can more fully contact the SMT patch to be dried, reducing the situation of uneven drying.

[0032] Among them, the protective cover 503 prevents the operator from inadvertently touching the blades of the high-speed rotating fan 501, avoiding personal injury.

[0033] The working principle of the present utility model:

[0034] Refer to the attached Figures 1-6 drawings. First, open the installed box door 2, place the SMT patch to be dried on the tray 401 installed in the card slot, and then start the dryer 3. The dryer 3 generates heat to heat the inside of the box. The tray 401 is a grid-shaped distribution in a cross shape, which is beneficial to the flow of hot air and can dry the patches more evenly.

[0035] Subsequently, the fan 501 installed on one side of the bottom of the drying box 1 and semi-embedded is started. One end of the fan 501 is installed inside the protective cover 503. The protective cover 503 is fixed on the surface side of the drying box 1 through the bolts 502, playing a role in protecting the fan 501. The fan 501 rotates to generate air flow, accelerating the circulation of hot air in the drying box 1. Under the action of the fan 501, the hot air can be more evenly distributed inside the drying box 1 and thus fully contact the SMT patches on the tray 401, improving the drying efficiency and uniformity.

[0036] One end of the spring 409 is welded in the groove 405 on one side of the inner surface of the tray 401. When it is necessary to take out the tray 401, pull the pull ring 407. The pull ring 407 drives the cord 408 in the mounting tube 404 to move. The cord 408 pulls the limiting block 406 connected thereto to overcome the elastic force of the spring 409, so that the limiting block 406 is disengaged from the limiting groove 403, and thus the tray 401 can be withdrawn from the chute 402 for cleaning or for rapid replacement of SMT chips.

[0037] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A drying device for SMT patch processing, comprising a drying box (1), characterized in that: A disassembly mechanism (4) is provided inside the drying box (1), an airflow driving mechanism (5) is provided at the bottom of the drying box (1), a tray (401) is provided at one end of the inner wall of the drying box (1), a mounting tube (404) is embedded in the bottom inner wall of the tray (401), grooves (405) are symmetrically provided at both ends of the tray (401), limiting blocks (406) are symmetrically provided at both ends of the tray (401), a pull ring (407) is provided on one side of the mounting tube (404), a string (408) is provided inside the mounting tube (404), and a spring (409) is provided at one end of the limiting block (406).

2. A drying device for SMT patch processing according to claim 1, characterized in that: A door (2) is hinged on one side of the drying box (1), a dryer (3) is provided on the top of the drying box (1), and two slide grooves (402) are provided on one end of the inner wall of the drying box (1).

3. A drying device for SMT patch processing according to claim 1, characterized in that: The tray (401) is in a grid shape with a field-shaped distribution, and the spring (409) is sleeved on the rope (408).

4. The drying device for SMT patch processing according to claim 1, characterized in that: Springs (409) are provided at both ends of the tray (401), and a limiting groove (403) is provided at one end of the inner wall of the drying box (1).

5. The drying device for SMT patch processing according to claim 1, characterized in that: The spring (409) is arranged inside the groove (405), and the two ends of the tray (401) are slidably connected on the inner wall of the slide groove (402).

6. The drying device for SMT patch processing according to claim 1, characterized in that: The airflow driving mechanism (5) comprises a fan (501), and the bottom of the drying box (1) is threadedly connected with a bolt (502).

7. A drying device for SMT patch processing according to claim 6, characterized in that: A protective cover (503) is provided at the bottom of the drying box (1), and the fan (501) is arranged through the bottom of the drying box (1).

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