Rapid vacuum heat treatment equipment

Abstract

The utility model relates to rapid vacuum heat treatment equipment which comprises a shell, a glass plate, a reflecting plate, a wafer and a heating lamp tube, the glass plate is arranged above the shell in a sealing manner, so that a vacuum sealing cavity is formed between the glass plate and the shell, and the wafer is arranged in the vacuum sealing cavity; the reflecting plate is arranged above the shell, so that a heating cavity is formed between the reflecting plate and the glass plate, and the heating lamp tube is arranged in the heating cavity; a plurality of grooves are formed in the upper surface of the glass plate; the grooves are additionally formed in the top surface of the glass plate, so that the size of the glass plate is reduced, heat accumulation is reduced, the heat exchange area can be increased during gas purging cooling, the cooling efficiency of the glass plate is improved from two aspects, and the cooling time is shortened from two aspects, in addition, the grooves can be formed to enable the top surface of the glass plate to form a Fresnel lens structure, and the cooling effect is improved. Part of light is changed into parallel light after passing through the glass plate, so that the uniformity of heat radiation received by the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat treatment equipment, and particularly relates to a rapid vacuum heat treatment equipment. Background Art

[0002] In the semiconductor industry, a rapid thermal processing (RTP) equipment is commonly used to heat treat wafers. The equipment uses multiple infrared lamps as heating sources. The multiple lamps are arranged outside the vacuum chamber. The side of the vacuum chamber close to the lamps is sealed with a quartz glass plate to transmit infrared radiation to heat the wafer. When the infrared radiation passes through the quartz plate and enters the vacuum chamber in the form of diffuse reflection, the radiation intensity on the wafer plane is inconsistent. During heating, the surface temperature of the wafer is inconsistent, affecting the yield.

[0003] In addition, since the quartz glass has to withstand the pressure generated in a vacuum, its thickness is relatively thick. After absorbing some thermal radiation, its temperature will rise very high, and at this time, the quartz glass will accumulate a large amount of heat. After a heat treatment process is completed, the furnace door needs to be opened to replace the wafer only after the temperature inside the chamber drops to an appropriate temperature. Due to the relatively large volume of the quartz glass and the large amount of heat accumulated, the temperature drops very slowly. The traditional gas purge cooling method has limited effect on the quartz, resulting in a large amount of time spent on cooling. Waiting for the temperature to drop greatly affects the output. This problem has forced semiconductor manufacturers to purchase more equipment to increase the output. The cooling problem of large-size RTP equipment is a common problem of RTP equipment, and the semiconductor industry and equipment manufacturers have been actively seeking solutions. Summary of the Utility Model

[0004] Based on the above description, the utility model provides a rapid vacuum heat treatment equipment. By adding grooves on the top surface of the glass plate, the volume of the glass plate is reduced, heat accumulation is reduced, and the heat exchange area can be increased during gas purge cooling. From two aspects, the cooling efficiency of the glass plate is increased, the cooling time is reduced, thereby improving the production efficiency of the wafer and increasing the output.

[0005] The technical solution for the utility model to solve the above technical problems is as follows: A rapid vacuum heat treatment equipment includes a housing, a glass plate, a reflector, a wafer, and heating lamps; the glass plate is sealingly arranged above the housing to form a vacuum sealed chamber between the glass plate and the housing, and the wafer is arranged in the vacuum sealed chamber; the reflector is arranged above the housing to form a heating chamber between the reflector and the glass plate, and the heating lamps are arranged in the heating chamber; a plurality of grooves are arranged on the upper surface of the glass plate.

[0006] On the basis of the above technical solution, the utility model can be further improved as follows.

[0007] Furthermore, a Fresnel lens structure is provided on the top surface of the glass plate. The Fresnel lens structure includes a central lens and a plurality of triangular prisms symmetrically arranged on both sides of the central lens. The extending directions of the central lens and the triangular prisms are both parallel to the heating lamp tube. Grooves are formed between the central lens and the triangular prisms and between any two adjacent triangular prisms. The bottom surface of the glass plate is a plane.

[0008] Furthermore, the top surface of the central lens is an arc surface that bulges upward in the center.

[0009] Furthermore, each of the triangular prisms includes a right-angle surface close to the central lens and an inclined surface far from the central lens. The right-angle surfaces are all perpendicular to the plane. The angle between the inclined surface and the plane gradually increases from the middle to both sides.

[0010] Furthermore, a plurality of the heating lamp tubes are arranged in parallel in the heating cavity, and a plurality of the Fresnel lens structures corresponding to the heating lamp tubes one by one are provided on the top surface of the glass plate. The central lens of each Fresnel lens structure is arranged directly below the corresponding heating lamp tube.

[0011] Furthermore, the focus of each Fresnel lens coincides with the corresponding heating lamp tube.

[0012] Furthermore, a plurality of reflectors corresponding to the heating lamp tubes one by one are provided on the reflector. The extending directions of the reflectors are all parallel to the heating lamp tube. Each heating lamp tube is arranged in the corresponding reflector, and the reflector is used to make the infrared light emitted by the heating lamp tube cover the corresponding Fresnel lens structure.

[0013] Furthermore, an air inlet and an air outlet are provided between the housing and the reflector, and a purge air nozzle is provided at the air inlet.

[0014] Compared with the prior art, the technical solution of the present application has the following beneficial technical effects:

[0015] 1. By adding grooves on the top surface of the glass plate, the volume of the glass plate is reduced, heat accumulation is reduced, and the heat exchange area can be increased during gas purge cooling, thereby increasing the cooling efficiency of the glass plate from two aspects, reducing the cooling time, and thus improving the production efficiency of the wafer and increasing the output.

[0016] 2. By setting grooves to form a Fresnel lens structure on the top surface of the glass plate, part of the light becomes parallel light after passing through the glass plate, thereby improving the uniformity of the thermal radiation received by the wafer. Description of the Drawings

[0017] Figure 1Schematic diagram of the structure of a rapid vacuum heat treatment device provided in Embodiment 1 of the present utility model;

[0018] Figure 2 Schematic diagram of the structure of the glass plate in Embodiment 1 of the present utility model;

[0019] Figure 3 Schematic diagram of the structure of a rapid vacuum heat treatment device provided in Embodiment 2 of the present utility model;

[0020] Figure 4 Schematic diagram of the structure of the glass plate in Embodiment 2 of the present utility model;

[0021] Figure 5 is Figure 4 Local enlarged view of part A in

[0022] In the drawings, the list of components represented by each reference numeral is as follows:

[0023] 1. Housing; 11. Vacuum sealing cavity; 2. Glass plate; 21. Fresnel lens structure; 211. Central lens; 212. Triangular prism lens; 22. Plane; 23. Groove; 3. Reflector; 31. Heating cavity; 32. Reflector hood; 4. Wafer; 5. Heating lamp tube; 6. Air inlet; 7. Air outlet; 8. Purge nozzle. Detailed implementation manners

[0024] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present application is thorough and comprehensive.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the description of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0026] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprising", "including" or "having", etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0027] Embodiment 1

[0028] A rapid vacuum heat treatment device, as Figure 1As shown in the figure, it includes a housing 1, a glass plate 2, a reflector 3, a wafer 4, and a heating lamp tube 5. The glass plate 2 is hermetically disposed above the housing 1, forming a vacuum sealing cavity 11 between the glass plate 2 and the housing 1, and the wafer 4 is disposed within the vacuum sealing cavity 11. The reflector 3 is disposed above the housing 1, forming a heating cavity 31 between the reflector 3 and the glass plate 2, and a plurality of heating lamp tubes 5 are disposed in parallel within the heating cavity 31.

[0029] The heating lamp tube 5 emits a large amount of thermal radiation by emitting infrared light. Part of it radiates into the vacuum sealing cavity 11 through the glass plate 2 to heat the wafer 4, and part of the radiation is reflected back by the reflector 3, thereby increasing the heating efficiency.

[0030] An air inlet 6 and an air outlet 7 are further disposed between the housing 1 and the reflector 3, and a purging nozzle 8 is disposed at the air inlet 6. Since the glass plate 2 has to withstand the pressure generated in a vacuum, its thickness will be relatively thick. After absorbing part of the thermal radiation, its temperature will rise very high, and at this time, the glass plate 2 will accumulate a large amount of heat. After a heat treatment process is completed, the upper surface of the glass plate 2 needs to be purged by the purging nozzle 8 to cool down the glass plate 2.

[0031] In this embodiment, a Fresnel lens structure 21 is disposed on the upper surface of the glass plate 2, and the bottom surface of the glass plate 2 is a plane 22.

[0032] Specifically, as Figure 2 shown, the Fresnel lens structure 21 includes a central lens 211 and a plurality of triangular prisms 212 symmetrically disposed on both sides of the central lens 211. The extending directions of the central lens 211 and the triangular prisms 212 are both parallel to the heating lamp tube 5. The top surface of the central lens 211 is an arc surface that bulges upward in the center. Each of the triangular prisms 212 includes a right-angle surface close to the central lens 211 and an inclined surface far from the central lens 211. The right-angle surfaces are all perpendicular to the plane 22. The angle between the inclined surface and the plane 22 gradually increases from the middle to both sides.

[0033] Grooves 23 are formed between the central lens 211 and the triangular prisms 212, and between any two adjacent triangular prisms 212. In this embodiment, by adding the grooves 23 on the top surface of the glass plate 2, the volume of the glass plate 2 is reduced, heat accumulation is reduced, and the heat exchange area can be increased during gas purging and cooling, increasing the cooling efficiency of the glass plate 2 from two aspects, reducing the cooling time, thereby improving the production efficiency of the wafer 4 and increasing the output.

[0034] In addition, by providing the grooves 23 to form the Fresnel lens structure 21 on the top surface of the glass plate 2, part of the light becomes parallel light after passing through the glass plate 2, which can improve the uniformity of the thermal radiation received by the wafer 4.

[0035] Embodiment Two

[0036] The difference between this embodiment and the first embodiment is that Figure 3 and Figure 4 As shown, a plurality of Fresnel lens structures 21 corresponding to the heating lamp tubes 5 are arranged on the top surface of the glass plate 2. The central lens 211 of each Fresnel lens structure 21 is arranged directly below the corresponding heating lamp tube 5. The focus of each Fresnel lens coincides with the corresponding heating lamp tube 5.

[0037] In addition, a plurality of reflective covers 32 corresponding to the heating lamp tubes 5 are arranged on the reflective plate 3, and the extending direction of the reflective covers 32 is parallel to the heating lamp tubes 5. Each heating lamp tube 5 is arranged in a corresponding reflective cover 32, and the reflective cover 32 is used to make the infrared light emitted by the heating lamp tube 5 cover the corresponding Fresnel lens structure 21.

[0038] In this embodiment, a corresponding Fresnel lens structure 21 is provided for each heating lamp 5 , so that the heat radiation received by the wafer 4 is more uniform, and the temperature of each part of the surface of the wafer 4 is further ensured to be consistent during heating, thereby improving the yield rate of the thermal treatment of the wafer 4 .

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A rapid vacuum heat treatment equipment, characterized in that: It includes a shell, a glass plate, a reflecting plate, a wafer and a heating lamp; the glass plate is sealingly arranged above the shell to form a vacuum sealed cavity between the glass plate and the shell, and the wafer is arranged in the vacuum sealed cavity; the reflecting plate is arranged above the shell to form a heating cavity between the reflecting plate and the glass plate, and the heating lamp is arranged in the heating cavity; the upper surface of the glass plate is provided with a plurality of grooves.

2. A rapid vacuum heat treatment equipment according to claim 1, characterized in that: The top surface of the glass plate is provided with a Fresnel lens structure, and the Fresnel lens structure includes a central lens and a plurality of triangular lenses symmetrically arranged on both sides of the central lens; the extension directions of the central lens and the triangular lenses are parallel to the heating lamp tube; the groove is formed between the central lens and the triangular lens and between any two adjacent triangular lenses; the bottom surface of the glass plate is a plane.

3. A rapid vacuum heat treatment equipment according to claim 2, characterized in that: The top surface of the central lens is a curved surface convexly bulging upward in the center.

4. A rapid vacuum heat treatment equipment according to claim 2, characterized in that: The three-prism lenses all include a right-angled surface close to the central lens and an inclined surface away from the central lens; the right-angled surfaces are all perpendicular to the plane; and the angle between the inclined surface and the plane gradually increases from the middle to both sides.

5. The rapid vacuum heat treatment equipment according to claim 2, characterized in that: A plurality of the heating lamp tubes are arranged in parallel in the heating chamber, and a plurality of the Fresnel lens structures corresponding to the heating lamp tubes are arranged on the top surface of the glass plate; the central lens of each Fresnel lens structure is arranged directly below the corresponding heating lamp tube.

6. A rapid vacuum heat treatment equipment according to claim 5, characterized in that: The focus of each Fresnel lens coincides with the corresponding heating lamp tube.

7. The rapid vacuum heat treatment equipment according to claim 5, characterized in that: The reflective plate is provided with a plurality of reflective covers corresponding to the heating lamp tubes one by one, and the extension direction of the reflective covers is parallel to the heating lamp tubes; each of the heating lamp tubes is arranged in the corresponding reflective cover, and the reflective cover is used to make the infrared light emitted by the heating lamp tube cover the corresponding Fresnel lens structure.

8. The rapid vacuum heat treatment equipment according to claim 1, characterized in that: An air inlet and an air outlet are arranged between the shell and the reflecting plate, and a purge air nozzle is arranged at the air inlet.

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