Clip device and sheet inserting machine

Abstract

The utility model discloses a cartridge holder device and a sheet inserting machine, the cartridge holder device has a first direction, a second direction and a third direction which are intersected, and the cartridge holder device comprises two side plates, a back plate, a bottom plate and a supporting rod; the two side plates are arranged at intervals in the first direction. The back plate is arranged between the two side plates and is respectively connected with the two side plates; the bottom plate is arranged on the same side of the two side plates and the back plate in the second direction, and the bottom plate is connected with the two side plates. A containing space is defined by the bottom plate, the back plate and the two side plates. A sliding groove is formed in the side, away from the containing space, of the bottom plate and used for being matched with the sliding rail so that the clip device can move in the third direction. The supporting rod is connected with the two side plates and located on the side, away from the containing space, of the back plate so that the end, away from the bottom plate, of the back plate can incline relative to the second direction. The clip device drives the silicon wafer to move forwards as a whole, so that the silicon wafer is prevented from inclining, and the possibility of silicon wafer fragmentation is reduced while wafer feeding is ensured.

Description

Technical Field

[0001] The present application belongs to the technical field of silicon wafer production, and specifically relates to a clip device and a wafer inserting machine. Background Art

[0002] In the manufacturing process of photovoltaic silicon wafers, silicon wafer cleaning is a key link in the entire silicon wafer production process and plays an important role. After the silicon wafer is debonded, it needs to be transferred to the inserter through a clip device, and then separated piece by piece by the inserter and inserted into a basket for cleaning. However, the existing clip device usually sets a backplane on the back of the silicon wafer to push the silicon wafer forward for loading and inserting, but the backplane has a high degree of freedom, which can easily cause the tilt angle or even the tilt direction to change during the loading and inserting process of the silicon wafer, resulting in the inability to load and insert the wafer normally, or even the silicon wafer breaking. Utility Model Content

[0003] Purpose of the utility model: The embodiment of the present application provides a clip device, which aims to solve the problem that the existing clip device may cause abnormal loading and insertion of the wafer or even silicon wafer breakage due to the excessive freedom of the back plate when loading and inserting the wafer. Another purpose of the embodiment of the present application is to provide a wafer inserting machine.

[0004] Technical solution: A clip device according to an embodiment of the present application has a first direction and a second direction intersecting each other, including:

[0005] Two side panels are spaced apart along the first direction;

[0006] A back plate, disposed between the two side plates and rotatably connected to the two side plates respectively;

[0007] a bottom plate, arranged on the same side of the two side plates and the back plate along the second direction, and the bottom plate is connected to the two side plates respectively; the bottom plate, the back plate and the two side plates enclose an accommodating space; a slide groove is arranged on a side of the bottom plate away from the accommodating space, and the slide groove is used to cooperate with the slide rail to enable the clip device to move along the third direction;

[0008] A support rod is connected to the two side plates respectively, and the support rod is located on a side of the back plate away from the accommodating space, so that an end of the back plate away from the bottom plate is inclined relative to the second direction.

[0009] In some embodiments, the side panel is provided with a first through hole, and a fixing buckle is provided on a side of the back panel facing the side panel, the fixing buckle is connected to the side panel, and the fixing buckle can be rotatably passed through the first through hole.

[0010] In some embodiments, a limiting and adjusting groove is provided on a side of the side plate facing away from the back plate. The limiting and adjusting groove has a bottom wall, and the first through hole penetrates through the bottom wall and communicates with the limiting and adjusting groove. The fixing buckle includes a connecting portion and a limiting portion. The connecting portion is connected to the limiting portion, and one end of the connecting portion away from the limiting portion is connected to the back plate. The connecting portion is rotatably inserted through the first through hole, and the limiting portion is rotatably arranged in the limiting and adjusting groove.

[0011] In some embodiments, the limiting and adjusting groove is an oval groove extending along the third direction. The dimension of the limiting and adjusting groove along the second direction is greater than the width dimension of the limiting portion, and the dimension of the limiting and adjusting groove along the second direction is less than the length dimension of the limiting portion.

[0012] In some embodiments, along the second direction, the support rod has a first orthographic projection on the bottom plate, and the fixing buckle has a second orthographic projection on the bottom plate. The first orthographic projection is located on a side of the second orthographic projection away from the accommodation space.

[0013] In some embodiments, along the second direction, the support rod is located on a side of the first through hole away from the bottom plate, and one end of the back plate away from the bottom plate is inclined away from the accommodation space relative to the second direction.

[0014] In some embodiments, the angle at which one end of the back plate away from the bottom plate is inclined away from the accommodation space relative to the second direction is α°, satisfying: 0 < α ≤ 15.

[0015] In some embodiments, the side plate has a first opening window. The first opening window penetrates through the side plate along the first direction and communicates with the accommodation space. Along the first direction, at least a part of the orthographic projection of the back plate on the side plate is located within the first opening window.

[0016] In some embodiments, the magazine device further includes a plurality of lifting portions. The lifting portions are connected to a side of the side plate facing away from the accommodation space, and the lifting portions are arranged on a side of the first opening window facing away from the bottom plate. Each side plate is connected to at least two of the lifting portions.

[0017] In some embodiments, the lifting portion has a positioning notch, and the opening direction of the positioning notch faces the bottom plate.

[0018] In some embodiments, the side plate is provided with a second through hole, and the support rod is detachably inserted through the second through holes of the two side plates.

[0019] In some embodiments, the bottom plate is provided with a second opening window, and the second opening window penetrates the bottom plate along the second direction and communicates with the accommodating space.

[0020] In some embodiments, two sliding grooves are provided on one side of the bottom plate facing away from the accommodating space, and the two sliding grooves are arranged on both sides of the second opening window at intervals along the first direction.

[0021] In some embodiments, a supporting portion is provided between the side plate and the bottom plate. The supporting portion is respectively connected to the bottom plate and the side plate. An inclined surface is arranged on one side of the supporting portion facing away from the bottom plate, and the inclined surface inclines towards the direction close to the bottom plate along the direction in which the side plate is away from the accommodating space; the supporting portions connected to the two side plates are arranged on both sides of the second opening window at intervals along the first direction.

[0022] Correspondingly, a wafer inserter according to an embodiment of the present application includes a cartridge device as described in any one of the foregoing embodiments.

[0023] Beneficial effects: Compared with the prior art, a cartridge device according to an embodiment of the present application has intersecting first and second directions, and includes two side plates, a back plate, a bottom plate and a support rod; the two side plates are arranged at intervals along the first direction; the back plate is arranged between the two side plates and is respectively connected to the two side plates; the bottom plate is arranged on the same side of the two side plates and the back plate along the second direction, and the bottom plate is respectively connected to the two side plates; an accommodating space is formed by the bottom plate, the back plate and the two side plates; a sliding groove is provided on one side of the bottom plate facing away from the accommodating space, and the cartridge device can slide on an external slide rail along the direction of the back plate towards the accommodating space by means of the sliding groove; the support rods are respectively connected to the two side plates, and the support rods are located on one side of the back plate facing away from the accommodating space, so that one end of the back plate away from the bottom plate is inclined relative to the second direction. By arranging the back plate to be rotatably connected to the two side plates, the present application can realize the inclination of the back plate in the direction away from the accommodating space, and then cooperate with the support rod to support the back plate, so as to maintain the inclination angle of the back plate, and thus use the inclined back plate to support the stacked silicon wafers. The present application further cooperates with the sliding groove on the bottom plate, and slides on the external slide rail through the sliding groove. At this time, the entire cartridge device is pushed to move to convey the silicon wafers forward. At this time, the relative positions of the silicon wafers in the accommodating space can be kept fixed, effectively avoiding the movement and inclination of the silicon wafers, and further effectively ensuring the wafer loading and inserting effect and reducing the possibility of silicon wafer breakage.

[0024] Correspondingly, a wafer inserter according to an embodiment of the present application includes a cartridge device as described in any one of the foregoing embodiments. It can be understood that the wafer inserter according to the embodiment of the present application includes all the technical features and technical effects of the foregoing cartridge device, which will not be elaborated here. Description of the Drawings

[0025] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0026] Figure 1 is the overall structural schematic diagram of a magazine device according to an embodiment of the present application;

[0027] Figure 2 is the overall structural schematic diagram of a magazine device from another angle according to an embodiment of the present application;

[0028] Figure 3 is the front view of a magazine device according to an embodiment of the present application;

[0029] Figure 4 is Figure 3 the enlarged view of part A in

[0030] Figure 5 is the top view of a magazine device according to an embodiment of the present application;

[0031] Figure 6 is the right view of a magazine device according to an embodiment of the present application;

[0032] Figure 7 is the overall structural schematic diagram of a magazine device from another angle according to an embodiment of the present application;

[0033] Figure 8 is the bottom view of a magazine device according to an embodiment of the present application.

[0034] Reference numerals: 1, side plate; 11, first through hole; 12, limit adjustment groove; 121, bottom wall; 13, first opening; 14, second through hole; 2, back plate; 3, bottom plate; 32, second opening; 33, sliding groove; 4, support rod; 5, fixing buckle; 51, connecting portion; 52, limiting portion; 6, lifting portion; 61, positioning notch; 7, supporting portion; 71, inclined surface; 8, accommodating space; 9, feeding opening; X, first direction; Y, second direction; Z, third direction. Detailed implementation manners

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0036] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality of" means two or more, and "at least one" means one, two or more, unless otherwise specifically defined. In the description of the present application, "vertical" means completely vertical at 90° or almost completely vertical. For example, within the range of an included angle of 80° to 100°, it is considered vertical. Similarly, "parallel" means completely parallel or almost completely parallel. For example, within the range of 10° of complete parallelism, it is considered parallel.

[0037] It should also be noted that in the drawings of the present application, the arrow marked with X indicates the first direction X, the arrow marked with Y indicates the second direction Y, and the arrow marked with Z indicates the third direction Z. In the embodiment of the present application, the first direction X is the direction in which the two side plates 1 are arranged at intervals, the second direction Y is the direction in which the bottom plate 3 faces the side plate 1, and the third direction Z is the direction in which the back plate 2 faces the accommodation space 8. The introduction of the first direction X, the second direction Y and the third direction Z is to facilitate the description of the structural positional relationship of the components of the magazine device, and thus facilitate the understanding of its structure.

[0038] In the related art, the back plate in the magazine device is set to be movable. At this time, an external force is used to push the back plate to move so as to push the silicon wafer forward to the wafer loading and inserting position, realizing the wafer loading and inserting. However, in this process, due to the excessive degree of freedom of the back plate, when the back plate is pushed forward, extreme situations such as the change of the inclination angle of the back plate or even the direct dumping of the back plate are likely to occur. At this time, it is easy to cause wafer loading and inserting failures and silicon wafer breakage.

[0039] In view of this, the embodiment of the present application provides a magazine device, aiming to solve the above problems.

[0040] Please refer to Figure 1 and Figure 2, A magazine device according to an embodiment of the present application has intersecting first direction X, second direction Y, and third direction Z, and includes two side plates 1, a back plate 2, a bottom plate 3, and a support rod 4; the two side plates 1 are arranged at intervals along the first direction X; the back plate 2 is arranged between the two side plates 1 and is respectively connected to the two side plates 1; the bottom plate 3 is arranged on the same side of the two side plates 1 and the back plate 2 along the second direction Y, and the bottom plate 3 is respectively connected to the two side plates 1; an accommodation space 8 is defined by the bottom plate 3, the back plate 2, and the two side plates 1; a chute 33 is provided on a side of the bottom plate 3 facing away from the accommodation space 8, and the chute 33 is used to cooperate with a slide rail to move the magazine device along the third direction Z.

[0041] In the embodiment of the present application, by setting the back plate 2 to be rotatably connected to the two side plates 1, the back plate 2 can be tilted away from the accommodation space 8, and then the support rod 4 is used to support the back plate 2 to maintain the tilt angle of the back plate 2. In this way, the stacked silicon wafers are supported by the tilted back plate 2. The present application further cooperates with the chute 33 on the bottom plate 3. By sliding the chute 33 on the external slide rail, the entire magazine device is advanced to move forward to convey the silicon wafers. At this time, the relative position of the silicon wafers in the accommodation space 8 can be kept fixed, effectively avoiding the movement and tilt of the silicon wafers, thereby effectively ensuring the wafer loading and insertion effect and reducing the possibility of silicon wafer breakage.

[0042] Specifically, in the embodiment of the present application, the two side plates 1 are arranged at intervals along the first direction X, and the two side plates 1 are connected to the bottom plate 3 along the second direction Y. At the same time, a back plate 2 is also connected between the two side plates 1. In this way, the accommodation space 8 is defined by the back plate 2, the two side plates 1, and the bottom plate 3 to accommodate the silicon wafers. The two side plates 1 are used to limit the silicon wafers from both sides. The silicon wafers are placed between them along the first direction X, and the distance between the two side plates 1 along the first direction X is slightly larger than the size of the silicon wafers. In this way, the silicon wafers can be limited to prevent them from skewing, and at the same time, the silicon wafers can be prevented from being squeezed and damaged. The back plate 2 is used to support the silicon wafers from one side of the silicon wafers. The bottom plate 3 is used to support the side plates 1 and keep the positions of the two side plates 1 fixed. At the same time, the chute 33 provided on the side of the bottom plate 3 facing away from the accommodation space 8 can be matched with an external slide rail (which can be the slide rail of the loading chute). The magazine device is pushed along the third direction Z on the slide rail by an external pushing device from the rear of the magazine device to drive the silicon wafers to move.

[0043] It should be noted that the magazine device has a loading opening 9, which is arranged opposite to the back plate 2 along the third direction Z. When the wafer is being loaded and inserted, the corresponding loading mechanism of the inserter enters the accommodating space 8 from the loading opening 9 and picks up the corresponding wafer. Since the position of the loading mechanism is fixed, therefore, in this application, the magazine device is pushed towards the loading mechanism so that the wafer in the accommodating space 8 approaches the loading mechanism and is picked up by the loading mechanism. Among them, the magazine device cooperates with the loading position slide rail by means of the sliding groove 33 and can slide along the slide rail under the push of an external force, so as to realize pushing the wafer towards the loading mechanism.

[0044] In the specific application of the magazine device according to the embodiment of the present application, the wafers can be sequentially stacked in the accommodating space 8 of the magazine device, and then the magazine is transferred to the water tank. The water tank carrying the magazine device is transmitted to the docking position of the magazine device loading module by means of an automatic transfer cart, and the water tank is loaded onto the magazine water tank loading position. The magazine device places the magazine device in the water tank into the wafer loading position through the gantry truss manipulator structure of the loading module. The magazine device is pushed forward by an external pushing mechanism, and the magazine device drives the wafers therein to move forward until the loading mechanism can smoothly pick up the wafers. After the wafer loading in the magazine device is completed, first move the magazine device backward away from the position of the loading mechanism, and then use the manipulator to grab the magazine device and move it into the water tank.

[0045] It should be noted that along the first direction X, the size of the loading mechanism needs to be smaller than the distance between the two side plates 1, so as to ensure that the loading mechanism can smoothly enter the accommodating space 8 while the magazine device moves forward.

[0046] In addition, in the embodiment of the present application, the back plate 2 can also be inclined towards the side close to the accommodating space 8 relative to the second direction Y. At this time, when the wafers are stacked in the accommodating space 8, the wafers can have a smaller contact area with the back plate 2, which is more convenient for flushing and cleaning the wafers at the end, and improves the cleanliness of the wafers. It should be noted that when the back plate 2 is inclined towards the accommodating space 8 relative to the second direction Y, the support rod 4 is arranged at one end of the back plate 2 close to the bottom plate 3. That is, along the second direction Y, the distance between the support rod 4 and the bottom plate 3 is smaller than the distance between the position where the back plate 2 is connected to the side plate 1 and the bottom plate 3. At this time, the back plate 2 can be pressed from the bottom end of the back plate 2 to realize the inclination of the back plate 2 towards the direction close to the accommodating space 8.

[0047] Please refer to Figure 3 and Figure 4 In some embodiments, the side plate 1 is provided with a first through hole 11, and a fixing buckle 5 is provided on the side of the back plate 2 facing the side plate 1. The fixing buckle 5 is connected to the side plate 1, and the fixing buckle 5 is rotatably inserted through the first through hole 11.

[0048] In the embodiment of the present application, the side plate 1 is connected to the back plate 2 by the first through hole 11 and the fixing buckle 5, so that the back plate 2 can be rotated and tilted at a certain angle. At the same time, the present application uses the fixing buckle 5 to penetrate the first through hole 11, and can use the mutual limitation between the fixing buckle 5 and the hole wall of the first through hole 11 to realize the limited positioning of the back plate 2 between the two side plates 1, and can rotate with the central axis of the fixing buckle 5 as the rotation axis. Of course, the embodiment of the present application is combined with the support rod 4, and the support rod 4 is used to support the side of the back plate 2 away from the accommodating space 8, so as to realize the limited support of the back plate 2, prevent the back plate 2 from excessive rotation and tilt, thereby maintaining the back plate 2 at a relatively fixed tilt angle, which is convenient for silicon wafer stacking and subsequent silicon wafer loading.

[0049] It should be noted that, in the embodiment of the present application, the first through hole 11 passes through the side plate 1 along the first direction X, and the fixing buckle 5 can be cylindrical, so that it can rotate in the first through hole 11, wherein the fixing buckle 5 can be partially inserted in the first through hole 11, and partially pass through the first through hole 11 and be located on the side of the side plate 1 away from the back plate 2. When the fixing buckle 5 passes out of the first through hole 11, it is convenient to connect the fixing buckle 5 with a nut or other fixing structure and then directly lock the fixing buckle 5, so that the back plate 2 maintains the tilt angle at this time without changing.

[0050] Please refer to Figures 1-4 In some embodiments, a limit adjustment groove 12 is provided on the side of the side panel 1 away from the back panel 2, the limit adjustment groove 12 has a bottom wall 121, and the first through hole 11 passes through the bottom wall 121 and is connected to the limit adjustment groove 12; the fixing buckle 5 includes a connecting portion 51 and a limit portion 52, the connecting portion 51 is connected to the limit portion 52, and one end of the connecting portion 51 away from the limit portion 52 is connected to the back panel 2; the connecting portion 51 is rotatably inserted into the first through hole 11, and the limit portion 52 is rotatably arranged in the limit adjustment groove 12.

[0051] In the embodiment of the present application, the connecting portion 51 may be cylindrical, and is inserted into the first through hole 11, so that it can rotate in the first through hole 11. The limit adjustment groove 12 is located on the side of the side plate 1 away from the back plate 2 and is connected to the first through hole 11. The limit adjustment groove 12 is used to accommodate the limit portion 52 and limit the limit portion 52. Thus, the limit portion 52 cooperates with the limit adjustment groove 12 to further limit the rotation angle of the back plate 2.

[0052] It should be noted that, in the embodiment of the present application, the outer diameter of the limit adjustment groove 12 is larger than the outer diameter of the first through hole 11, so that the limit adjustment groove 12 and the first through hole 11 cooperate to form a stepped groove. At the same time, the length dimension of the limit portion 52 is larger than the maximum dimension of the connecting portion 51, so that the fixing buckle 5 forms a T-shaped structure. In this way, the fixing buckle 5 cooperates with the first through hole 11 and the limit adjustment groove 12. After the fixing buckle 5 rotates with the back plate 2, the cooperation between the fixing buckle 5 and the side plate 1 can be used to fix the position of the back plate 2 along the first direction X, and prevent the back plate 2 from moving in the first direction X.

[0053] As Figure 4 shown, in some embodiments, the limit adjustment groove 12 is an oval groove extending along the direction of the back plate 2 towards the accommodation space 8. The dimension of the limit adjustment groove 12 along the second direction Y is larger than the width dimension of the limit portion 52, and the width dimension of the limit adjustment groove 12 along the second direction Y is smaller than the length dimension of the limit portion 52.

[0054] In the embodiment of the present application, the limit adjustment groove 12 is an oval groove. At this time, the length dimension of the limit adjustment groove 12 is larger than the width dimension. The width dimension of the limit adjustment groove 12 is larger than the width dimension of the limit portion 52, so that the limit portion 52 can rotate in the limit adjustment groove 12. The width dimension of the limit adjustment groove 12 is smaller than the length dimension of the limit portion 52, so that after the limit portion 52 rotates a certain angle, it is interfered and braked by the groove wall of the limit adjustment groove 12, thereby preventing the limit portion 52 from continuing to rotate, so as to limit the rotation angle of the back plate 2.

[0055] Through the setting of the cooperation between the limit portion 52 and the limit adjustment groove 12 in the present application, the further positioning and limiting of the back plate 2 can be realized, and the back plate 2 can be further prevented from tilting excessively. Among them, when the support rod 4 accidentally falls off, the positioning of the tilt angle of the back plate 2 can also be realized only by means of the setting of the cooperation between the limit portion 52 and the limit adjustment groove 12.

[0056] It should be noted that the first through hole 11 in the embodiment of the present application can be an oblong hole, and the length extension direction of the first through hole 11 is the same as the length extension direction of the limit adjustment groove 12. The limit portion 52 can be strip-shaped, and the length of the limit portion 52 is smaller than the length of the first through hole 11. When the back plate 2 is connected to the side plate 1, the limit portion 52 can be directly passed through the first through hole 11. Since the fixing buckle 5 is fixedly connected to the back plate 2, when the back plate 2 rotates, the fixing buckle 5 rotates, and then the limit portion 52 also rotates. In this way, an angle difference can occur between the limit portion 52 and the first through hole 11, that is, the limit portion 52 rotates and deviates from the first through hole 11, so that the positive projection of the second limit portion on the side plate 1 along the first direction X is located on the bottom wall 121. At this time, the bottom wall 121 limits the limit portion 52, which can prevent the back plate 2 from moving in the first direction X. The relative positional relationship between the limit portion 52, the first through hole 11 and the bottom wall 121 is specifically asFigure 4 as shown

[0057] Please refer to Figure 3 In some embodiments, along the second direction Y, the support rod 4 has a first orthographic projection on the bottom plate 3, and the fixing buckle 5 has a second orthographic projection on the bottom plate 3. The first orthographic projection is located on the side of the second orthographic projection away from the accommodation space 8.

[0058] In the embodiments of the present application, since the first orthographic projection is located on the side of the second orthographic projection away from the accommodation space 8, at this time, it can be determined that the connection line between the first through hole 11 and the fixing point of the support rod 4 on the side plate 1 is inclined in the direction away from the accommodation space 8. Therefore, correspondingly, when the back plate 2 contacts the support rod 4, the back plate 2 is also inclined in the direction away from the accommodation space 8. At this time, it can be ensured that the back plate 2 has a certain inclination angle.

[0059] It should be noted that, with the fixed position of the support rod 4 unchanged, the larger the outer diameter of the support rod 4, the smaller the inclination angle of the corresponding support rod 4. Therefore, the inclination angle of the back plate 2 can be adjusted by adjusting the support rods 4 with different outer diameters.

[0060] Please refer to in combination with Figures 1-3 In some embodiments, the side plate 1 has a first opening 13. The first opening 13 penetrates the side plate 1 along the first direction X and communicates with the accommodation space 8; along the first direction X, the orthographic projection of the back plate 2 on the side plate 1 is at least partially located within the first opening 13.

[0061] In the embodiments of the present application, by providing the first opening 13, it is possible to enable the cleaning water to smoothly enter the accommodation space 8 through the first opening 13 and contact the silicon wafers. At the same time, when the magazine device enters the loading position, the first opening 13 provides a water spraying space for the nozzles at this station, and the water continuously sprayed from the first opening 13 is used to slice a plurality of silicon wafers stacked along the third direction Z, facilitating the pick-up mechanism to pick up each silicon wafer.

[0062] It should be noted that the orthographic projection of the back plate 2 on the side plate 1 is at least partially located within the first opening 13, so that it can be ensured that as the magazine device moves, the nozzles can be arranged opposite to each silicon wafer in turn along the first direction X. In this way, the water sprayed from the first opening 13 can clean and slice each silicon wafer in the accommodation space 8, realizing the smooth loading of all silicon wafers.

[0063] Please refer to in combination with Figures 1-3 and Figures 5-7 In some embodiments, the magazine device further includes a plurality of lifting parts 6. The lifting parts 6 are connected to the side of the side plate 1 away from the accommodation space 8, and the lifting parts 6 are arranged on the side of the first opening 13 away from the bottom plate 3. Each side plate 1 is connected to at least two lifting parts 6.

[0064] In the embodiment of the present application, by providing a lifting part 6 on the side of the side plate 1 facing away from the accommodating space 8, it is possible to grab the magazine device by means of an external manipulator, realize the automatic transfer of the magazine device, reduce manual operation, and effectively improve the efficiency of loading and inserting wafers. At the same time, each side plate 1 is connected to at least two lifting parts 6, so each magazine device has at least four grabbing points for the manipulator to grab, which can ensure the stable grabbing of the manipulator and ensure that the wafers will not accidentally tilt and break.

[0065] Further, please refer to Figures 1-3 and Figure 7 , in some embodiments, the lifting part 6 has a positioning notch 61, and the opening direction of the positioning notch 61 faces the bottom plate 3.

[0066] In the embodiment of the present application, the setting of the positioning notch 61 is more conducive to the grabbing and positioning of the manipulator, avoiding the relative displacement and sliding of the position between the clamping jaw part of the manipulator and the lifting part 6, and can effectively ensure the grabbing effect and grabbing stability.

[0067] Please refer to Figures 1-3 , in some embodiments, the side plate 1 is provided with a second through hole 14, and the support rod 4 is detachably passed through the second through holes 14 of the two side plates 1.

[0068] In the embodiment of the present application, by providing the support rod 4 to be detachably passed through the second through hole 14, further, the inner diameter of the second through hole 14 can be set to be larger than the outer diameter of the support rod 4, so as to facilitate the quick disassembly and assembly of the support rod 4, and different support rods 4 with different outer diameters can be replaced according to the inclination angle requirement of the back plate 2, or a sleeve can be detachably sleeved on the middle part of the support rod 4, so as to also increase the maximum outer diameter of the support rod 4, and then adjust the inclination angle of the back plate 2.

[0069] It should be noted that there can be many second through holes 14 in the embodiment of the present application. According to different inclination angles of the back plate 2, second through holes 14 at different positions can be set. At this time, the inclination angle of the back plate 2 is adjusted by adjusting the fixed position of the support rod 4. Specifically, when the back plate 2 tilts away from the accommodating space 8 in the direction away from the second direction Y, the support rod 4 is located on the side of the end of the back plate 2 away from the bottom plate 3 and away from the accommodating space 8; when the back plate 2 tilts towards the accommodating space 8 in the direction close to the second direction Y, the support rod 4 is located on the side of the end of the back plate 2 close to the bottom plate 3 and away from the accommodating space 8.

[0070] Please refer to Figure 1 , Figure 5 , Figure 7 and Figure 8 , in some embodiments, the bottom plate 3 is provided with a second opening 32, and the second opening 32 penetrates the bottom plate 3 along the second direction Y and communicates with the accommodating space 8.

[0071] In the embodiment of the present application, a second opening 32 is provided on the bottom plate 3, which can enable the cleaning water to enter the accommodating space 8 from the second opening 32 to clean the bottom of the silicon wafer, facilitate slicing, and also facilitate the water in the accommodating space 8 to flow out quickly from the second opening 32 when the magazine device is grabbed.

[0072] Please continue to refer to Figure 1 、 Figure 5 、 Figure 7 and Figure 8 In some embodiments, two sliding grooves 33 are provided on the side of the bottom plate 3 facing away from the accommodating space 8, and the two sliding grooves 33 are arranged at intervals along the first direction X on both sides of the second opening 32.

[0073] In the embodiment of the present application, by cooperating the two sliding grooves 33 with the slide rail, the magazine device is supported on the slide rail, and the second opening 32 is suspended. At this time, it is convenient for water to flow more smoothly through the second opening 32.

[0074] Please refer to Figures 1-3 、 Figure 6 and Figure 7 In some embodiments, a support portion 7 is provided between the side plate 1 and the bottom plate 3. The support portion 7 is respectively connected to the bottom plate 3 and the side plate 1. An inclined surface 71 is provided on the side of the support portion 7 facing away from the bottom plate 3, and the inclined surface 71 is inclined in the direction of approaching the bottom plate 3 along the direction in which the side plate 1 is away from the accommodating space 8; the support portions 7 connecting the two side plates 1 are arranged at intervals along the first direction X on both sides of the second opening 32.

[0075] In the embodiment of the present application, by providing the support portion 7 connected between the side plate 1 and the bottom plate 3, the side plate 1 can be further supported, thereby increasing the height of the accommodating space 8 along the second direction Y. At the same time, a part of the support portion 7 is located in the accommodating space 8 and can be used to support the silicon wafer, so that there is a gap between the bottom of the silicon wafer and the bottom plate 3, and there is a large distance and space between the bottom of the silicon wafer and the first opening 13. In this way, more cleaning water can flow through the bottom of the silicon wafer, achieving better cleaning of the bottom of the silicon wafer.

[0076] Furthermore, in the embodiment of the present application, an inclined surface 71 is provided on the support portion 7. On the one hand, the inclined surface 71 can avoid the nozzle and provide space for the nozzle to spray water into the first opening 13; at the same time, the nozzle can be inclined by means of the inclined surface 71 to blow water obliquely upward from the bottom wall 121 of the silicon wafer, achieving better cleaning and slicing effects of the silicon wafer. In addition, it is also convenient for the water in the accommodating space 8 to flow out more smoothly by means of the inclined surface 71.

[0077] In some embodiments, the angle at which the end of the back plate 2 away from the bottom plate 3 is inclined in the direction away from the accommodating space 8 with respect to the second direction Y is α°, satisfying: 0 < α ≤ 15.

[0078] In the embodiment of the present application, the inclination angle of the backplane 2 is controlled within 0 < α ≤ 15, which can ensure a high whole-wafer rate when the silicon wafer is blown with water by the nozzle for slicing and loading, and further reduce the possibility of silicon wafer breakage.

[0079] It should be noted that in the embodiment of the present application, the numerical range of α can be any value among 0.1, 0.2, 0.3, 0.4, 0.5, 1, 1.5, 1.8, 2, 2.5, 3, 3.5, 4, 4.5, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 or the range between any two values. The angle measurement can use conventional angle measurement tools such as a protractor to measure the angle between the bottom plate 3 and the backplane 2, and then the inclination angle α of the backplane 2 relative to the second direction Y can be obtained.

[0080] The following is described with reference to specific embodiments.

[0081]

[0082]

[0083] Combined with the above embodiments, it can be seen that when α satisfies the range of 0 < α ≤ 15, the nozzle blowing water can separate the silicon wafer and make the silicon wafer tilt towards the wafer loading structure for easy wafer loading. At this time, the whole-wafer rate during wafer slicing and loading remains above 98%, effectively ensuring the success rate of wafer loading and reducing the probability of silicon wafer breakage and waste. When α > 15, the inclination angle of the silicon wafer will further increase when blowing water, and at this time, the wafer loading mechanism cannot contact the silicon wafer and silicon wafer fragments will occur, resulting in a decrease in the whole-wafer rate during slicing and loading. When α ≤ 0, the contact area between the silicon wafer and the backplane 2 is small, which can improve the cleaning degree of the silicon wafer when blowing water, but the possibility of silicon wafer fragmentation will also increase, resulting in a decrease in the whole-wafer rate during slicing and loading. Therefore, the inclination angle α of the backplane 2 in the present application is preferably 0 < α ≤ 15.

[0084] Correspondingly, a wafer inserter in the embodiment of the present application includes a cartridge device as described in any one of the foregoing embodiments.

[0085] It can be understood that the wafer inserter in the embodiment of the present application includes all the technical features and technical effects of the foregoing cartridge device, which will not be elaborated here.

[0086] In the embodiment of the present application, a slide rail and a wafer loading mechanism are provided at the loading position of the wafer inserter. The slide rail is used to cooperate with the chute 33 of the cartridge device to realize the sliding of the cartridge device on the slide rail, so that the cartridge device drives the silicon wafer therein to move towards the wafer loading mechanism.

[0087] In the above embodiments, the descriptions of the respective embodiments have their own focuses. For parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0088] The above has introduced in detail a magazine device and an inserting machine provided by the embodiments of the present application, and specific examples have been used to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A clip device, characterized in that: Having a first direction (X), a second direction (Y), and a third direction (Z) intersecting each other, including: Two side panels (1) are arranged at intervals along the first direction (X); A back plate (2) is disposed between the two side plates (1) and is rotatably connected to the two side plates (1) respectively; A bottom plate (3) is arranged on the same side of the two side plates (1) and the back plate (2) along the second direction (Y), and the bottom plate (3) is connected to the two side plates (1) respectively; the bottom plate (3), the back plate (2) and the two side plates (1) enclose a receiving space (8); a slide groove (33) is provided on a side of the bottom plate (3) away from the receiving space (8), and the slide groove (33) is used to cooperate with the slide rail to enable the clip device to move along the third direction (Z); A support rod (4) is connected to the two side panels (1) respectively, and the support rod (4) is located on a side of the back panel (2) away from the accommodating space (8), so that an end of the back panel (2) away from the bottom panel (3) is inclined relative to the second direction (Y).

2. The clip device according to claim 1, characterized in that: The side plate (1) is provided with a first through hole (11), and a fixing buckle (5) is provided on a side of the back plate (2) facing the side plate (1), wherein the fixing buckle (5) is connected to the side plate (1), and the fixing buckle (5) is rotatably inserted into the first through hole (11).

3. The clip device according to claim 2, characterized in that: A position limiting adjustment groove (12) is provided on a side of the side plate (1) facing away from the back plate (2), the position limiting adjustment groove (12) having a bottom wall (121), and the first through hole (11) passes through the bottom wall (121) and is in communication with the position limiting adjustment groove (12); The fixing buckle (5) comprises a connecting portion (51) and a limiting portion (52), wherein the connecting portion (51) is connected to the limiting portion (52), and one end of the connecting portion (51) away from the limiting portion (52) is connected to the back plate (2); the connecting portion (51) is rotatably inserted into the first through hole (11), and the limiting portion (52) is rotatably arranged in the limiting adjustment groove (12).

4. The clip device according to claim 3, characterized in that: The limit adjustment groove (12) is an elongated circular groove extending along the third direction (Z), the dimension of the limit adjustment groove (12) along the second direction (Y) is greater than the width dimension of the limit portion (52), and the dimension of the limit adjustment groove (12) along the second direction (Y) is smaller than the length dimension of the limit portion (52).

5. The clip device according to claim 2, characterized in that: Along the second direction (Y), the support rod (4) has a first orthographic projection on the base plate (3), and the fixing buckle (5) has a second orthographic projection on the base plate (3), and the first orthographic projection is located on a side of the second orthographic projection away from the accommodating space (8).

6. The clip device according to claim 5, characterized in that: Along the second direction (Y), the support rod (4) is located on a side of the first through hole (11) away from the bottom plate, and one end of the back plate (2) away from the bottom plate (3) is inclined relative to the second direction (Y) toward a side away from the accommodating space (8).

7. The clip device according to claim 6, characterized in that: The angle at which the back plate (2) is inclined relative to the second direction (Y) in a direction away from the accommodating space (8) is α°, satisfying: 0<α≤15.

8. The clip device according to claim 1, characterized in that: The side panel (1) has a first window (13), the first window (13) passes through the side panel (1) along the first direction (X) and is connected to the accommodating space (8); along the first direction (X), the orthographic projection of the back panel (2) on the side panel (1) is at least partially located in the first window (13).

9. The clip device according to claim 8, characterized in that: The clip device further comprises a plurality of lifting portions (6), wherein the lifting portions (6) are connected to a side of the side plate (1) facing away from the accommodating space (8), and the lifting portions (6) are arranged on a side of the first opening window (13) facing away from the bottom plate (3), and each of the side plates (1) is connected to at least two of the lifting portions (6).

10. The clip device according to claim 9, characterized in that: The lifting portion (6) has a positioning notch (61), and the opening direction of the positioning notch (61) faces the bottom plate (3).

11. The clip device according to claim 2, characterized in that: The side plates (1) are provided with second through holes (14), and the support rods (4) are detachably inserted through the second through holes (14) of the two side plates (1).

12. The clip device according to claim 1, characterized in that: The bottom plate (3) is provided with a second window (32), and the second window (32) penetrates the bottom plate (3) along the second direction (Y) and is in communication with the accommodating space (8).

13. The clip device according to claim 12, characterized in that: Two slide grooves (33) are provided on a side of the bottom plate (3) facing away from the accommodating space (8), and the two slide grooves (33) are arranged on both sides of the second window (32) along the first direction (X).

14. The clip device according to claim 12, characterized in that: A support portion (7) is provided between the side plate (1) and the bottom plate (3), the support portion (7) being connected to the bottom plate (3) and the side plate (1) respectively, an inclined surface (71) being provided on a side of the support portion (7) away from the bottom plate (3), the inclined surface (71) being inclined along a direction of the side plate (1) away from the accommodating space (8) toward a direction close to the bottom plate (3); the support portions (7) connected to the two side plates (1) are arranged at intervals on both sides of the second window (32) along the first direction (X).

15. A chip inserting machine, characterized in that: Comprising a clip device as described in any one of claims 1-14.

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