Air-cooled radiator

Abstract

The utility model relates to an air-cooled radiator which is provided with a top cover, a fan, an upper cover and a bottom cover. The top cover is a plate body and is provided with an air opening which penetrates through the top cover. The fan is arranged on the top cover and corresponds to the air opening. The upper cover is attached to the top cover in a sealed mode and is provided with an upper cover groove body, a plurality of penetrating holes and a plurality of heat dissipation structures. An opening of the upper cover groove faces the top cover, and the penetrating hole penetrates through the side wall of the upper cover. The air opening, the upper cover groove body and the penetrating hole are communicated with one another. The heat dissipation structure extends from the bottom surface of the upper cover groove body to the top cover. The bottom cover is attached to the upper cover in a sealed mode and is provided with a bottom cover groove body and working fluid. An opening of the bottom cover groove body faces the upper cover, and the working fluid is arranged in the bottom cover groove body. Therefore, the upper cover can directly carry out air cooling type heat dissipation, heat conduction paste is not needed to be used for bonding the bottom cover, and heat resistance is reduced.

Description

Technical Field

[0001] The utility model relates to a radiator, in particular to an air-cooled radiator. Background Art

[0002] In modern society, semiconductor components are used in various devices in life. To meet people's needs, high-power electronic components have gradually become the mainstream, such as those applied to electric vehicles, high-speed railways, or frequency conversion devices, etc. However, while pursuing speed, high-power electronic components generate a large amount of heat. Therefore, when installing high-power electronic components, a corresponding heat dissipation device is often required to avoid heat accumulation in the high-power electronic components and affect their operation.

[0003] Common air-cooled heat dissipation devices mostly use a substrate with high thermal conductivity efficiency to be arranged on high-power electronic components. Multiple copper columns or fins are arranged on the substrate to increase the contact area with the surrounding environment, and then heat is taken away from the copper columns or fins by blowing air through the multiple copper columns or fins with a fan to complete heat dissipation.

[0004] In order to quickly dissipate the large amount of heat generated by high-power electronic components in a concentrated manner, the substrate is now mostly changed to a heat pipe. The internal space of the heat pipe can accommodate a working fluid. When the working fluid in the heat pipe undergoes a phase change due to the heat of the high-power electronic components, a large amount of heat is taken away, and then heat is taken away from the heat pipe by blowing air through multiple copper columns or fins with a fan to complete heat dissipation.

[0005] If you want to combine the heat pipe with the substrate, thermal grease is mostly set on the heat dissipation surface of the heat pipe, and the substrate is set on the thermal grease. However, the thermal grease still generates a thermal resistance between the heat pipe and the substrate, thereby affecting the heat dissipation of the heat pipe and the substrate.

[0006] In view of this, proposing a better improvement scheme is an urgent problem to be solved in this industry. Summary of the Utility Model

[0007] The utility model provides an air-cooled radiator, which is used to solve the problem that when the heat pipe is combined with the substrate, thermal grease is used for bonding, but the thermal grease still generates a thermal resistance between the heat pipe and the substrate, thereby affecting the heat dissipation of the heat pipe and the substrate.

[0008] To achieve the above object, the air-cooled radiator proposed by the utility model has:

[0009] An upper cover, which has:

[0010] An upper cover groove body, which has an opening;

[0011] Multiple perforations that penetrate through the side wall of the upper cover and communicate with the internal space of the upper cover groove; multiple heat dissipation structures that extend from the bottom surface of the upper cover groove towards the opening of the upper cover groove;

[0012] A fan that is disposed at the opening of the upper cover, and air can flow into the internal space of the upper cover groove through the fan;

[0013] A bottom cover that is hermetically attached to the upper cover and has:

[0014] A bottom cover groove with an opening facing the upper cover;

[0015] A working fluid that is disposed in the bottom cover groove.

[0016] The air-cooled radiator as described above, wherein each of the multiple heat dissipation structures is a cylinder and is evenly dispersed in the upper cover groove.

[0017] The air-cooled radiator as described above, wherein each of the multiple heat dissipation structures is a fin, and each fin is parallel to each other.

[0018] The air-cooled radiator as described above, which has a top cover that is a plate body and has:

[0019] An air vent that penetrates through the top cover; the fan is disposed on the top cover and corresponds to the air vent.

[0020] The air-cooled radiator as described above, wherein the bottom cover further has multiple support columns that extend from the bottom surface of the bottom cover groove towards the upper cover and are attached to the upper cover.

[0021] The air-cooled radiator as described above, wherein the bottom cover further has a channel that penetrates through one of the side walls of the bottom cover and is used for evacuating the internal space of the bottom cover groove.

[0022] The air-cooled radiator as described above, wherein the upper cover further has a protrusion that protrudes from the surface of the upper cover close to the bottom cover towards the bottom cover, and the protrusion can be engaged in the bottom cover groove.

[0023] The air-cooled radiator as described above, wherein the upper cover further has a stepped surface that is disposed on the surface of the upper cover close to the top cover, and the top cover can be hermetically attached to the stepped surface so that the upper cover and the top cover can be connected to form a continuous surface.

[0024] The advantages of the present utility model are as follows. A heat pipe structure is formed by the bottom cover and the bottom surface of the upper cover, and the upper cover can directly dissipate heat through air cooling without using thermal paste for bonding, thereby reducing the thermal resistance between the heat pipe and the substrate. In addition, the protruding part of the upper cover can be engaged in the bottom cover groove, and the top cover can be fitted into the upper cover groove without using welding or fitting forms for joining, thereby reducing the installation cost of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a perspective view of the first embodiment of the present utility model;

[0026] Figure 2 is another perspective view of the first embodiment of the present utility model;

[0027] Figure 3 is an exploded view of the first embodiment of the present utility model;

[0028] Figure 4 is another exploded view of the first embodiment of the present utility model;

[0029] Figure 5 is a sectional view of the first embodiment of the present utility model;

[0030] Figure 6 is a sectional view of the first embodiment of the present utility model along Figure 4 section line A-A;

[0031] Figure 7 is a top view of an upper cover of the first embodiment of the present utility model;

[0032] Figure 8 is a top view of an upper cover of the second embodiment of the present utility model;

[0033] Figure 9 is a perspective view of the third embodiment of the present utility model;

[0034] Figure 10 is an exploded view of the third embodiment of the present utility model;

[0035] Figure 11 is a top view of an upper cover of the third embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0036] The following further elaborates on the technical means adopted by the present utility model to achieve the intended utility model purpose in conjunction with the drawings and the preferred embodiments of the present utility model.

[0037] Please refer to Figure 1 and Figure 2。The present utility model provides an air-cooled radiator, which includes a top cover 10, a fan 20, an upper cover 30, and a bottom cover 40.

[0038] Please refer to Figure 3 and Figure 4 。In the first and second embodiments, the top cover 10 is a plate body and has an air vent 11. The air vent 11 penetrates through the top cover 10. The fan 20 is disposed on the top cover 10 and corresponds to the air vent 11. The upper cover 30 and the top cover 10 are hermetically and adhesively attached to each other, and have a stepped surface 31, a protrusion 32, an upper cover groove 33, a plurality of through holes 34, and a plurality of heat dissipation structures 35.

[0039] Please refer to Figure 5 and Figure 6 。The stepped surface 31 is disposed on the side of the upper cover 30 close to the top cover 10, and the top cover 10 can be hermetically attached to the stepped surface 31, so that the upper cover 30 and the top cover 10 can be connected to form a continuous surface. In other words, the top cover 10 can be snapped into the upper cover 30. The protrusion 32 protrudes outward from the side of the upper cover 30 away from the top cover 10. The opening of the upper cover groove 33 faces the top cover 10, and the internal space of the upper cover groove 33 can communicate with the air vent 11 of the top cover 10. The through holes 34 penetrate through the side wall of the upper cover 30 and communicate with the internal space of the upper cover groove 33. Thereby, the air blown out by the fan 20 can pass through the air vent 11 of the top cover 10, pass through the internal space of the upper cover groove 33, and flow out from the through holes 34 of the upper cover 30.

[0040] The heat dissipation structure 35 extends from the bottom surface of the upper cover groove 33 towards the top cover 10. Please refer to Figure 7 。In the first embodiment, each heat dissipation structure 35 is a columnar body and is uniformly distributed in the upper cover groove 33. Please refer to Figure 8 。In the second embodiment, each heat dissipation structure 35A is a fin and is parallel to each other. In other embodiments, the shape of the heat dissipation structure 35 is not limited thereto, as long as the heat dissipation structure 35 can increase the area of the air blown out by the fan 20 in contact with the upper cover 30. In the first and second embodiments, the materials of the heat dissipation structures 35 and 35A include copper and aluminum alloy. In other embodiments, the material of the heat dissipation structure 35 is not limited thereto.

[0041] Please refer to Figure 3 , Figure 5 and Figure 6。The bottom cover 40 is hermetically attached to the upper cover 30 and has a bottom cover groove 41, a plurality of support columns 42, a working fluid, and a channel 43. The opening of the bottom cover groove 41 faces the upper cover 30, and in the first and second embodiments, the protruding portion 32 of the upper cover 30 can be engaged in the bottom cover groove 41. The support columns 42 extend from the bottom surface of the bottom cover groove 41 towards the upper cover 30 and are attached to the bottom surface of the upper cover 30. In the first and second embodiments, the support columns 42 are attached to the protruding portion 32 of the upper cover 30. The working fluid is disposed in the bottom cover groove 41. The channel 43 penetrates through one side wall of the bottom cover 40 and is used to evacuate the internal space of the bottom cover groove 41, so that the bottom cover groove 41 can be in a vacuum state. In other embodiments, a capillary structure such as a sintered copper mesh or copper pillars can also be laid on the bottom surface of the bottom cover groove 41 to facilitate the condensation of the working fluid, thereby increasing the heat dissipation efficiency of the bottom cover 40.

[0042] Please refer to Figures 9 to 11 。The technical features of the third embodiment of the present invention are similar to those of the first embodiment, except that in the third embodiment, the present invention does not have the top cover 10, but directly disposes the fan 20A at the opening of the upper cover groove 33. Specifically, the upper cover 30 has a plurality of screw holes 36, the screw holes 36 are disposed in the upper cover groove 33, and the fan 20A is screwed on the upper cover 30. In other embodiments, the joining manner of the fan 20A and the upper cover 30 is not limited to this.

[0043] The bottom cover 40 of the present invention can be disposed on the surface of a high-power electronic component. The heat generated after the high-power electronic component operates will be transferred from the bottom surface of the bottom cover 40 to the working fluid in the bottom cover groove 41, causing the working fluid to vaporize from liquid to gas. During this process, heat energy will be absorbed and the bottom cover groove 41 will be filled. When the vaporized working fluid contacts the colder bottom of the upper cover 30, it will release heat and condense back to the liquid state for recycling. The heat released during condensation will be transferred through the bottom surface of the upper cover 30 to the heat dissipation structure 35, and finally will be cooled by the air passing through the heat dissipation structure 35, completing the heat dissipation process of the high-power electronic component.

[0044] The advantages of the present invention are that a heat pipe structure is formed by the bottom cover 40 and the bottom surface of the upper cover 30, and the upper cover 30 can directly perform air-cooled heat dissipation without using thermal paste for bonding, reducing the thermal resistance between the heat pipe and the substrate. In addition, the protruding portion 32 of the upper cover 30 can be engaged in the bottom cover groove 41, and the top cover 10 can be fitted into the upper cover groove 33 without using welding or fitting forms for joining, thereby reducing the installation cost of the present invention.

[0045] The above are only the preferred embodiments of the present utility model, and do not impose any form of limitation on the present utility model. Although the present utility model has been disclosed above with the preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can, within the scope of the technical solution of the present utility model, make some changes or modifications to the above-disclosed technical content to obtain equivalent embodiments with equivalent changes. However, as long as the content does not depart from the technical solution of the present utility model, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. An air-cooled radiator, characterized in that: have: A cover having: An upper cover tank body having an opening; A plurality of through holes, which penetrate the side wall of the upper cover and communicate with the inner space of the upper cover tank body; A plurality of heat dissipation structures extending from the bottom surface of the upper cover tank body to the opening of the upper cover tank body; A fan is disposed at the opening of the upper cover, and air can flow into the inner space of the upper cover tank through the fan; A bottom cover is sealed to the upper cover and has: A bottom cover groove, the opening of which faces the upper cover; A working fluid is disposed in the bottom cover tank.

2. The air-cooled radiator according to claim 1, characterized in that: Each of the plurality of heat dissipation structures is a column and is evenly dispersed in the upper cover tank.

3. The air-cooled radiator according to claim 1, characterized in that: Each of the heat dissipation structures is a fin, and each of the fins is parallel to each other.

4. The air-cooled radiator according to any one of claims 1 to 3, characterized in that: A top cover is provided, which is a plate body and has: An air outlet passes through the top cover; the fan is arranged on the top cover and corresponds to the air outlet.

5. The air-cooled radiator according to any one of claims 1 to 3, characterized in that: The bottom cover further has a plurality of support columns extending from the bottom surface of the bottom cover groove toward the upper cover and being attached to the upper cover.

6. The air-cooled radiator according to any one of claims 1 to 3, characterized in that: The bottom cover further has a channel which penetrates through one of the side walls of the bottom cover and is used for exhausting air from the inner space of the bottom cover tank.

7. The air-cooled radiator according to any one of claims 1 to 3, characterized in that: The upper cover further has a protrusion which protrudes from a surface of the upper cover close to the bottom cover toward the bottom cover, and the protrusion can be engaged in the bottom cover groove.

8. The air-cooled radiator according to claim 4, characterized in that: The upper cover further has a step surface, which is arranged on a side of the upper cover close to the top cover, and the top cover can be sealed and attached to the step surface, so that the upper cover and the top cover can be connected to form a continuous surface.

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