High TG circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to a high-TG circuit board, which adopts the technical scheme that the high-TG circuit board comprises a substrate and mounting holes, the mounting holes are formed in four corners of the upper surface of the substrate; reinforcing sleeves are embedded in the portions, above and below the mounting hole, of the base plate respectively. The reinforcing sleeves installed on the upper face and the lower face of the base plate do not make contact with each other. According to the utility model, the problem that the circuit board is damaged when the circuit board is fixedly installed through the hole is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and specifically relates to a high-TG circuit board. Background Art

[0002] A high-TG circuit board refers to a PCB board with a high glass transition temperature (TG). Such a board has better stability and reliability in a high-temperature environment and is an important parameter in multi-layer PCB circuit boards. According to existing information, a high TG value usually refers to a board with a TG value above 150 °C. Compared with ordinary FR-4 boards, high-TG boards have higher heat resistance, moisture resistance, chemical corrosion resistance, and better dimensional stability.

[0003] However, a substrate with a high TG value may be more rigid and brittle than a substrate with a low TG value, which may affect the production efficiency of the PCB. In particular, the substrate is easily damaged during the drilling process of the substrate, and when the circuit board is installed, the pressure on the opening position of the substrate is relatively large, and it is easy to crack. For this reason, a high-TG circuit board is proposed to solve the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide a high-TG circuit board, which has the advantage of protecting the opening position of the circuit board, and solves the problem of circuit board damage caused by fixed installation through the opening.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A high-TG circuit board includes a substrate, and copper plates are respectively covered on the upper and lower surfaces of the substrate. It also includes mounting holes;

[0006] The mounting holes are opened at the four corners of the upper surface of the substrate;

[0007] Wherein, reinforcement sleeves are respectively embedded and installed on the substrate above and below the mounting holes;

[0008] Wherein, the reinforcement sleeves installed on the upper and lower surfaces of the substrate do not contact each other.

[0009] When using a high-TG circuit board in this technical solution, a high-TG material is used to manufacture the substrate. Copper plates are respectively coated on the upper and lower surfaces of the substrate to achieve the conductive function of the circuit. Mounting holes are opened at the four corners of the upper surface of the substrate, and these mounting holes will be used to install the reinforcement sleeves later. Reinforcement sleeves are respectively embedded in the substrate above and below the mounting holes. Anti-slip ridges are fixedly installed in an annular array at the top of the reinforcement sleeves to increase the stability during installation and prevent sliding. The substrate is designed with a rectangular structure, and steps are respectively opened on the outer sides of the upper and lower surfaces. The depth of the steps matches the thickness of the copper plates, ensuring that the angle between the steps and the middle of the substrate is ninety degrees, which helps to improve the structural stability of the substrate after installing the copper plates. Reserved holes are respectively opened at the four corners of the upper surface of the copper plates. The size and position of these reserved holes match the height and position of the top of the reinforcement sleeve exposed from the substrate. The inner diameter size of the reserved holes matches the outer diameter size of the top of the reinforcement sleeve, ensuring that the reinforcement sleeve can be correctly installed in the reserved holes. Electronic components are installed on the copper plates according to the design requirements and fixed by methods such as welding. The circuit board is installed into the final product, and the stability of the circuit board during installation and use is ensured by using the reinforcement sleeves and anti-slip ridges.

[0010] Preferably, the substrate is designed with a rectangular structure, and steps are respectively opened on the outer sides of the upper and lower surfaces of the substrate.

[0011] The rectangular structure provides better mechanical stability, which helps to maintain the shape and size of the circuit board during installation and use.

[0012] Standardization: The rectangular design is easy to standardize, facilitating mass production and automated assembly.

[0013] Preferably, the depth of the steps matches the thickness of the copper plates, and the angle between the steps and the middle of the substrate is ninety degrees.

[0014] The depth of the steps matching the thickness of the copper plates ensures a tight fit between the reinforcement sleeve and the copper plate, improving the overall structural stability.

[0015] The precise step design helps to fix the reinforcement sleeve and prevent sliding or displacement during installation.

[0016] Preferably, reserved holes are respectively opened at the four corners of the upper surface of the copper plates, and the thickness of the copper plates matches the height of the top of the reinforcement sleeve exposed from the substrate.

[0017] The size of the reserved holes matches the size of the top of the reinforcement sleeve, ensuring that the reinforcement sleeve can be accurately installed in the predetermined position.

[0018] By matching the height of the reserved holes and the reinforcement sleeve, the connection strength between the circuit board and the reinforcement sleeve can be enhanced.

[0019] Preferably, the inner diameter of the reserved hole matches the outer diameter of the top of the reinforcement sleeve, and the position where the reserved hole is opened matches the position where the installation hole is opened.

[0020] Ensuring that the positions of the reserved hole and the installation hole are consistent helps improve the installation accuracy and the overall alignment of the circuit board.

[0021] The consistent hole position design simplifies the assembly process and reduces the errors and time during assembly.

[0022] Preferably, anti-slip ridges are fixedly installed in a circular array on the top of the reinforcement sleeve.

[0023] The anti-slip ridges increase the friction on the top of the reinforcement sleeve, which helps prevent the circuit board from sliding during installation or use.

[0024] The anti-slip ridges in a circular array can provide a better feel, making it more convenient to manually install or adjust the circuit board.

[0025] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0026] By setting installation holes in the present utility model, the installation holes are opened at the four corners of the upper surface of the substrate. Reinforcement sleeves are respectively embedded and installed on the substrates above and below the installation holes, and the reinforcement sleeves installed on the upper and lower surfaces of the substrate do not contact each other. The reinforcement sleeves are embedded in the installation holes, providing additional mechanical support for the opening positions of the substrate, reducing damage caused by external impact or pressure. During the installation and use of the circuit board, the reinforcement sleeves can prevent the hole walls of the installation holes from being deformed by shear force or tensile force. The presence of the reinforcement sleeves makes the installation holes more stable, helps reduce errors during installation, and ensures the flatness and alignment of the circuit board. Since the reinforcement sleeves do not contact the copper plates on the upper and lower surfaces of the substrate, it is possible to avoid short circuits caused by metal contact at the installation holes. The reinforcement sleeves can have better heat conductivity than the substrate, which helps conduct heat from the copper plates and improve the heat dissipation efficiency of the circuit board. The use of the reinforcement sleeves can extend the service life of the circuit board. Especially in application environments where frequent plugging and unplugging or mechanical vibration occur, the reinforcement sleeves can be designed with an appearance that coordinates with the overall style of the circuit board, enhancing the overall aesthetics of the product. The standardized design of the reinforcement sleeves makes the maintenance and upgrade of the circuit board more convenient, and circuit board components can be quickly replaced or repaired. During multiple installation and disassembly processes, the reinforcement sleeves can prevent the installation holes from expanding due to wear and maintain the dimensional accuracy of the installation holes. The reinforcement sleeves provide additional protection, enabling the circuit board to adapt to more complex or harsh environmental conditions, such as high temperature, high humidity, or chemical corrosion environments, achieving the effect of protecting the opening positions of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is the front view structural schematic diagram of the present utility model;

[0028] Figure 2 It is a schematic cross-sectional structure diagram of the present utility model;

[0029] Figure 3 of the present utility model Figure 2 Schematic diagram of the enlarged structure at the position;

[0030] Figure 4 It is a schematic cross-sectional structure diagram of the reinforcement sleeve of the present utility model;

[0031] Figure 5 It is a schematic diagram of the copper plate structure of the present utility model.

[0032] In the figure: 1. Copper plate; 2. Reinforcement sleeve; 3. Mounting hole; 4. Substrate; 5. Step; 6. Anti-slip rib; 7. Reserved hole. Specific implementation mode

[0033] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model. Embodiment

[0034] As Figures 1 to 5 shown, an embodiment provided by the present utility model: a high-TG circuit board, including a substrate 4, with copper plates 1 respectively covered on the upper and lower surfaces of the substrate 4, and further including a mounting hole 3;

[0035] Specifically, by setting the mounting holes 3 at the four corners of the upper surface of the substrate 4, reinforcing sleeves 2 are respectively embedded and installed on the substrate 4 above and below the mounting holes 3, and the reinforcing sleeves 2 installed on the upper and lower surfaces of the substrate 4 do not contact each other. The reinforcing sleeves 2 are embedded in the mounting holes 3, providing additional mechanical support for the opening positions of the substrate 4, reducing damage caused by external impact or pressure. During the installation and use of the circuit board, the reinforcing sleeves 2 can prevent the hole walls of the mounting holes 3 from deforming due to shear force or tensile force. The presence of the reinforcing sleeves 2 makes the mounting holes 3 more stable, helping to reduce errors during installation, ensuring the flatness and alignment of the circuit board. Since the reinforcing sleeves 2 do not contact the copper plates 1 on the upper and lower surfaces of the substrate 4, it is possible to avoid short circuits caused by metal contact at the mounting holes 3. The reinforcing sleeves 2 can have better thermal conductivity than the substrate 4, helping to conduct heat from the copper plates 1 and improving the heat dissipation efficiency of the circuit board. The use of the reinforcing sleeves 2 can extend the service life of the circuit board. Especially in application environments where frequent plugging and unplugging or mechanical vibration are required, the reinforcing sleeves 2 can be designed with an appearance that coordinates with the overall style of the circuit board, enhancing the overall aesthetics of the product. The standardized design of the reinforcing sleeves 2 makes the maintenance and upgrade of the circuit board more convenient, and circuit board components can be quickly replaced or repaired. During multiple installation and disassembly processes, the reinforcing sleeves 2 can prevent the mounting holes 3 from expanding due to wear and maintain the dimensional accuracy of the mounting holes 3. The reinforcing sleeves 2 provide additional protection, enabling the circuit board to adapt to more complex or harsh environmental conditions, such as high temperature, high humidity, or chemical corrosion environments, achieving the effect of protecting the opening positions of the circuit board.

[0036] Further, the substrate 4 is designed with a rectangular structure, and steps 5 are respectively provided on the outer sides of the upper and lower surfaces of the substrate 4.

[0037] The rectangular structure provides better mechanical stability, helping to maintain the shape and size of the circuit board during installation and use.

[0038] Standardization: The rectangular design is easy to standardize, facilitating mass production and automated assembly.

[0039] Further, the depth of the step 5 matches the thickness of the copper plate 1, and the angle between the step 5 and the middle of the substrate 4 is ninety degrees.

[0040] The depth of the step 5 matching the thickness of the copper plate 1 ensures a tight fit between the reinforcing sleeve 2 and the copper plate 1, improving the stability of the overall structure.

[0041] The precise design of the step 5 helps to fix the reinforcing sleeve 2, preventing it from sliding or shifting during installation.

[0042] Further, reserved holes 7 are respectively provided at the four corners of the upper surface of the copper plate 1, and the thickness of the copper plate 1 matches the height of the top of the reinforcing sleeve 2 exposed from the substrate 4.

[0043] The size of the reserved hole 7 matches the size of the top of the reinforcement sleeve 2, ensuring that the reinforcement sleeve 2 can be accurately installed in the predetermined position.

[0044] By matching the heights of the reserved hole 7 and the reinforcement sleeve 2, the connection strength between the circuit board and the reinforcement sleeve 2 can be enhanced.

[0045] Furthermore, the inner diameter size of the reserved hole 7 matches the outer diameter size of the top of the reinforcement sleeve 2, and the opening position of the reserved hole 7 matches the opening position of the mounting hole 3.

[0046] Ensuring that the positions of the reserved hole 7 and the mounting hole 3 are consistent helps improve the installation accuracy and the overall alignment of the circuit board.

[0047] The consistent hole position design simplifies the assembly process and reduces the errors and time during assembly.

[0048] Furthermore, anti-slip ridges 6 are fixedly installed in a circular array on the top of the reinforcement sleeve 2.

[0049] The anti-slip ridges 6 increase the friction on the top of the reinforcement sleeve 2, helping to prevent the circuit board from sliding during installation or use.

[0050] The anti-slip ridges 6 in a circular array can provide a better feel, making it more convenient to manually install or adjust the circuit board.

[0051] When the utility model is in use, a substrate 4 is made of high-TG material, and copper plates 1 are respectively covered on the upper and lower surfaces of the substrate 4 to achieve the conductive function of the circuit. Mounting holes 3 are opened at the four corners of the upper surface of the substrate 4, and these mounting holes 3 will be used for subsequent installation of the reinforcement sleeve 2. The reinforcement sleeve 2 is respectively embedded on the substrate 4 above and below the mounting holes 3. Anti-slip ridges 6 are fixedly installed in a circular array on the top of the reinforcement sleeve 2 to increase the stability during installation and prevent sliding. The substrate 4 is designed with a rectangular structure, and steps 5 are respectively opened on the outer sides of the upper and lower surfaces. The depth of the steps 5 matches the thickness of the copper plate 1, ensuring that the angle between the step 5 and the middle of the substrate 4 is ninety degrees, which helps improve the structural stability after the copper plate 1 is installed on the substrate 4. Reserved holes 7 are respectively opened at the four corners of the upper surface of the copper plate 1. The size and position of these reserved holes 7 match the height and position of the top of the reinforcement sleeve 2 exposed from the substrate 4. The inner diameter size of the reserved hole 7 matches the outer diameter size of the top of the reinforcement sleeve 2, ensuring that the reinforcement sleeve 2 can be correctly installed in the reserved hole 7. Electronic components are installed on the copper plate 1 according to the design requirements and fixed by methods such as soldering. The circuit board is installed into the final product, and the reinforcement sleeve 2 and the anti-slip ridges 6 are used to ensure the stability of the circuit board during installation and use.

[0052] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-described exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A high TG circuit board, comprising a substrate (4), wherein the upper and lower surfaces of the substrate (4) are respectively covered with copper plates (1), characterized in that: Also includes: Mounting holes (3) are formed at four corners of the upper surface of the base plate (4); Wherein, reinforcement sleeves (2) are respectively embedded and installed on the upper and lower substrates (4) of the installation hole (3); The reinforcement sleeves (2) installed on the upper and lower surfaces of the base plate (4) do not contact each other.

2. A high TG circuit board according to claim 1, characterized in that: The base plate (4) adopts a rectangular structure design, and steps (5) are respectively provided on the outer sides of the upper and lower surfaces of the base plate (4).

3. A high TG circuit board according to claim 2, characterized in that: The depth of the step (5) matches the thickness of the copper plate (1), and the angle between the step (5) and the base plate (4) is ninety degrees.

4. A high TG circuit board according to claim 1, characterized in that: Reserved holes (7) are respectively provided at the four corners of the upper surface of the copper plate (1), and the thickness of the copper plate (1) matches the height of the top of the reinforcement sleeve (2) exposed from the base plate (4).

5. A high TG circuit board according to claim 4, characterized in that: The inner diameter of the reserved hole (7) matches the outer diameter of the top of the reinforcement sleeve (2), and the opening position of the reserved hole (7) matches the opening position of the installation hole (3).

6. A high TG circuit board according to claim 1, characterized in that: The top of the reinforcement sleeve (2) is fixedly provided with anti-slip ridges (6) in the form of a ring array.

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