Semiconductor material screening machine

Abstract

The utility model relates to the technical field of semiconductor device processing, in particular to a semiconductor material screening machine. Comprising a bottom plate and an auxiliary mechanism, the auxiliary mechanism comprises a screening disc, a screening net, a vibrator, a protective cover, a first material guiding frame, a second material guiding frame and a supporting device, during machining, semiconductor materials needing to be screened are put into the screening disc, the semiconductor materials are located on the upper side of the screening net at the moment, then the vibrator is started, the screening disc vibrates, and then the screening disc vibrates; then screening of the semiconductor materials can be achieved under cooperation of the screening net, screened iron wires fall to the inner bottom of the screening disc and finally can be guided out to the first material guide frame through a right side discharging opening to be discharged, the semiconductor materials are guided out through the second material guide frame, automatic screening is achieved, and then the problem that in the prior art, due to lack of a special screening machine, screening efficiency is high is solved. The problems that iron wires in semiconductor materials are generally screened out manually, and manual screening is long in time consumption, low in working efficiency, high in labor intensity and not beneficial to mass production are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device processing, in particular to a semiconductor material screening machine. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to perform specific functions. The semiconductor materials of semiconductor devices are silicon, germanium or gallium arsenide. They can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment.

[0003] In the production process of semiconductor devices, each semiconductor device needs to be tinned. The roller used in the surface treatment tinning process of the patch material is smaller than the wire and is not easy to tin. Therefore, a certain proportion of iron wire needs to be filled for auxiliary conductive electroplating. However, after the material is electroplated, due to the lack of a dedicated screening machine in the prior art, the iron wire is usually screened out manually. Manual screening not only takes a long time, has low work efficiency, and is labor-intensive, which is not conducive to mass production. Utility Model Content

[0004] The utility model aims to provide a semiconductor material screening machine, aiming to solve the problem in the prior art that due to the lack of a dedicated screening machine, iron wires in semiconductor materials are usually screened out manually, and manual screening not only takes a long time, has low work efficiency, and is labor-intensive, but is also not conducive to mass production.

[0005] To achieve the above-mentioned purpose, the utility model provides a semiconductor material screening machine, including a bottom plate and an auxiliary mechanism;

[0006] The auxiliary mechanism includes a screening plate, a screening net, a vibrator, a shield, a first material guide rack, a second material guide rack and a supporting device. The inner bottom of the screening plate has an inclined material guide portion. The screening net is fixedly connected to the screening plate and is located inside the screening plate. The vibrator is fixedly connected to the screening plate and is located at the bottom of the screening plate. The shield is fixedly connected to the screening plate and is located outside the vibrator. The first material guide rack is fixedly connected to the screening plate and is located on the right side of the screening plate. The second material guide rack is fixedly connected to the screening plate and is located on the left side of the screening plate. The supporting device is arranged between the bottom plate and the screening plate.

[0007] Wherein, the supporting device includes a connecting rod and a matching component, the connecting rod is fixedly connected to the bottom plate and arranged in a circular array on the bottom plate; the matching component is arranged on the side of the connecting rod close to the screening disc.

[0008] Wherein, the mating component includes a connecting cylinder, a limiting cover and a spring component, the connecting cylinder is fixedly connected to the screening disc and is located at the bottom of the screening disc; the limiting cover is fixedly connected to the connecting cylinder, and is slidably connected to the connecting rod, and is located below the connecting cylinder; the spring component is arranged in the connecting cylinder.

[0009] Wherein, the spring component includes a slide plate and a buffer spring, the slide plate is slidably connected to the connecting cylinder, and is fixedly connected to the connecting rod, and is located in the connecting cylinder; one end of the buffer spring abuts against the connecting cylinder, and the other end of the buffer spring abuts against the slide plate, and the buffer spring is arranged in the connecting cylinder.

[0010] Wherein, the auxiliary mechanism also includes a bracket and a conveyor, the bracket is arranged on the ground at both sides of the bottom plate; the conveyor is fixed on the bracket and is respectively located below the discharge ports of the first material guide rack and the second material guide rack.

[0011] The utility model discloses a semiconductor material screening machine, wherein the bottom plate is used for fixing the equipment and supporting the installation of the working components, the inside of the screening plate is provided with an inclined material guide part, the screening net is installed in the screening plate, the screen holes of the screening net are rectangular through holes arranged neatly, the width of the screen holes will be smaller than the width of the semiconductor patch material, but larger than the width of the filler wire, so as to facilitate screening, the vibrator is installed at the bottom of the screening plate, the shield is installed at the bottom of the screening plate, the first material guide frame is installed at the right side of the screening plate, the second material guide frame is installed at the left side of the screening plate, the supporting device is arranged between the bottom plate and the screening plate, so as to realize the support and vibration assistance of the screening plate, and the materials to be screened during processing The semiconductor material is put into the screening plate, and at this time the semiconductor material is on the upper side of the screening net. Then, the vibrator is turned on to make the screening plate vibrate. Then, with the cooperation of the screening net, the semiconductor material can be screened. The screened iron wire falls to the bottom of the screening plate, and can finally be discharged through the right discharge port to the first material guide rack. The semiconductor material is discharged through the second material guide rack to achieve automatic screening, thereby solving the problem in the prior art that due to the lack of a dedicated screening machine, the iron wire in the semiconductor material is usually screened out manually. Manual screening not only takes a long time, has low work efficiency, and high labor intensity, but is also not conducive to mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0013] Figure 1 It is a schematic diagram of the overall structure of the semiconductor material screening machine of the first embodiment of the utility model.

[0014] Figure 2 It is a cross-sectional view of the screening disc of the first embodiment of the utility model.

[0015] Figure 3 It is a schematic diagram of the overall structure of a semiconductor material screening machine according to the second embodiment of the utility model.

[0016] In the figure: 101-bottom plate, 102-screening disc, 103-screening net, 104-vibrator, 105-shield, 106-first material guide rack, 107-second material guide rack, 108-connecting rod, 109-connecting cylinder, 110-limiting cover, 111-slide plate, 112-buffer spring, 113-inclined material guide part, 201-bracket, 202-conveyor. DETAILED DESCRIPTION

[0017] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0018] Embodiment 1:

[0019] like Figure 1 and Figure 2 As shown, Figure 1 This is the overall structural diagram of the semiconductor material screening machine. Figure 2 It is a cross-sectional view of the screening disc 102. The utility model provides a semiconductor material screening machine: including a bottom plate 101 and an auxiliary mechanism, the auxiliary mechanism includes a screening disc 102, a screening net 103, a vibrator 104, a shield 105, a first material guide frame 106, a second material guide frame 107 and a supporting device, the supporting device includes a connecting rod 108 and a matching component, the matching component includes a connecting cylinder 109, a limit cover 110 and a spring component, the spring component includes a slide plate 111 and a buffer spring 112. The above scheme can solve the problem that in the prior art, due to the lack of a dedicated screening machine, the iron wire in the semiconductor material is usually screened out manually, and the manual screening not only takes a long time, has low work efficiency, and is labor-intensive, which is not conducive to mass production. It can be understood that the above scheme can improve the efficiency of semiconductor material screening and is conducive to mass production and processing.

[0020] In this embodiment, mounting holes are provided on the bottom plate 101 to facilitate the fixing of the equipment.

[0021] Among them, the bottom of the screening plate 102 has an inclined material guide part 113, the screening net 103 is fixedly connected to the screening plate 102 and is located in the screening plate 102, the vibrator 104 is fixedly connected to the screening plate 102 and is located at the bottom of the screening plate 102, the shield 105 is fixedly connected to the screening plate 102 and is located on the outside of the vibrator 104, the first material guide frame 106 is fixedly connected to the screening plate 102 and is located on the right side of the screening plate 102, the second material guide frame 107 is fixedly connected to the screening plate 102 and is located on the left side of the screening plate 102, and the supporting device is arranged between the bottom plate 101 and the screening plate 102. The inclined material guide portion 113 will facilitate the avoidance of the iron wire from accumulating in the center of the bottom of the screening plate 102, and facilitate its discharge from the outlet after movement. The vibrator 104 is installed at the bottom of the screening plate 102 by bolts, and the shield 105 is installed at the bottom of the screening plate 102 by bolts, and is buckled on the outside of the vibrator 104 to protect the vibrator 104. A cable hole is provided on the shield 105. The mounting bracket of the screening net 103 is fixed to the screening plate 102 by bolts, and the sieve holes of the screening net 103 are rectangular through holes arranged neatly. The width of the sieve hole will be smaller than the width of the semiconductor patch material, but larger than the width of the filler wire, so as to facilitate screening. A screening waste outlet is set on the right side of the screening disc 102, and the first material guide frame 106 is installed on the outlet side by bolts. At the same time, a semiconductor material outlet is set on the left side of the screening disc 102, and the bottom of the outlet is coplanar with the top of the screening net 103. The bottom connecting ear of the second guide frame 107 is fixed to the screening disc 102 by bolts. The supporting device is set between the bottom plate 101 and the screening disc 102 to support and assist vibration of the screening disc 102.

[0022] Secondly, the connecting rod 108 is fixedly connected to the bottom plate 101 and arranged in a circular array on the bottom plate 101; the matching assembly is arranged on the side of the connecting rod 108 close to the screening disc 102. The connecting rod 108 has a T-shaped cross section and is mounted on the bottom plate 101 by bolts. The matching assembly is arranged on the side of the connecting rod 108 close to the screening disc 102 for supporting matching and vibration matching.

[0023] Then, the connecting cylinder 109 is fixedly connected to the screening disc 102 and is located at the bottom of the screening disc 102; the limiting cover 110 is fixedly connected to the connecting cylinder 109 and is slidably connected to the connecting rod 108 and is located below the connecting cylinder 109; the spring member is arranged in the connecting cylinder 109. The connecting cylinder 109 has a T-shaped cross section and is mounted on the bottom of the screening disc 102 by bolts. The limiting cover 110 is mounted on the connecting cylinder 109 by bolts and is provided with a through hole. A linear sliding bearing is installed in the through hole to facilitate sliding cooperation with the connecting rod 108. The spring member is arranged in the connecting cylinder 109 to achieve vibration cooperation.

[0024] Finally, the slide plate 111 is slidably connected with the connecting cylinder 109, and is fixedly connected with the connecting rod 108, and is located in the connecting cylinder 109; one end of the buffer spring 112 abuts against the connecting cylinder 109, and the other end of the buffer spring 112 abuts against the slide plate 111, and the buffer spring 112 is arranged in the connecting cylinder 109. The slide plate 111 can slide in the circular sliding cavity in the connecting cylinder 109, and is connected with the connecting rod 108 by bolts, one end of the buffer spring 112 abuts against the connecting cylinder 109, and the other end of the buffer spring 112 abuts against the slide plate 111, when the vibrator 104 is working, the screening disc 102 can vibrate, at this time, the buffer spring 112 will be released and compressed in a reciprocating motion under the cooperation of the connecting cylinder 109, the limit cover 110, the slide plate 111 and the connecting rod 108, so as to improve the vibration effect of the screening disc 102 and the screening efficiency.

[0025] The utility model is used to solve the problem that in the prior art, due to the lack of a dedicated screening machine, the iron wire in the semiconductor material is usually screened out manually, and the manual screening not only takes a long time, but also has low work efficiency and high labor intensity, which is not conducive to mass production. During processing, the semiconductor material to be screened is first put into the screening plate 102, at which time the semiconductor material is on the upper side of the screening net 103, and then the power of the equipment is turned on, the vibrator 104 is turned on, so that the screening plate 102 vibrates, and then the semiconductor material can be screened with the cooperation of the screening net 103, and the screened iron wire falls to the bottom of the screening plate 102, and finally can be led out to the first guide through the right discharge port. The semiconductor material is discharged from the material rack 106, and is led out through the second material guide rack 107 to realize automatic screening. Furthermore, when the vibrator 104 is working, the screening plate 102 can vibrate. At this time, the buffer spring 112 will release and compress in the reciprocating action of the connection cylinder 109, the limit cover 110, the slide plate 111 and the connecting rod 108, thereby improving the vibration effect of the screening plate 102 and the screening efficiency, thereby solving the problem in the prior art that due to the lack of a dedicated screening machine, the iron wire in the semiconductor material is usually screened out manually, and manual screening not only takes a long time, but also has low work efficiency and high labor intensity, which is not conducive to mass production.

[0026] Embodiment 2:

[0027] like Figure 3 As shown, Figure 3 20 is a schematic diagram of the overall structure of a semiconductor material screening machine. On the basis of the first embodiment, the utility model provides a semiconductor material screening machine, wherein the auxiliary mechanism further includes a bracket 201 and a conveyor 202 .

[0028] The bracket 201 is arranged on the ground at both sides of the bottom plate 101; the conveyor 202 is fixed on the bracket 201 and is respectively located below the discharge ports of the first material guide frame 106 and the second material guide frame 107. The bracket 201 can be directly arranged on the ground at both sides of the bottom plate 101, and the frame of the conveyor 202 is fixed on the bracket 201 by bolts.

[0029] In this embodiment, by further providing the support 201 and the conveyor 202, the screened semiconductor materials and iron wire waste can be automatically conveyed respectively, which is beneficial to reducing the transportation time and will further help improve the processing efficiency.

[0030] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A semiconductor material screening machine, comprising a bottom plate, characterized in that: It also includes auxiliary institutions; The auxiliary mechanism includes a screening plate, a screening net, a vibrator, a shield, a first material guide rack, a second material guide rack and a supporting device. The inner bottom of the screening plate has an inclined material guide portion. The screening net is fixedly connected to the screening plate and is located inside the screening plate. The vibrator is fixedly connected to the screening plate and is located at the bottom of the screening plate. The shield is fixedly connected to the screening plate and is located outside the vibrator. The first material guide rack is fixedly connected to the screening plate and is located on the right side of the screening plate. The second material guide rack is fixedly connected to the screening plate and is located on the left side of the screening plate. The supporting device is arranged between the bottom plate and the screening plate.

2. The semiconductor material screening machine according to claim 1, characterized in that: The supporting device comprises a connecting rod and a matching assembly. The connecting rod is fixedly connected to the bottom plate and arranged in a circular array on the bottom plate. The matching assembly is arranged on a side of the connecting rod close to the screening disc.

3. The semiconductor material screening machine according to claim 2, characterized in that: The mating assembly includes a connecting cylinder, a limiting cover and a spring component. The connecting cylinder is fixedly connected to the screening disc and is located at the bottom of the screening disc; the limiting cover is fixedly connected to the connecting cylinder, slidably connected to the connecting rod, and is located below the connecting cylinder; the spring component is arranged in the connecting cylinder.

4. The semiconductor material screening machine according to claim 3, characterized in that: The spring component includes a slide plate and a buffer spring. The slide plate is slidably connected to the connecting cylinder and fixedly connected to the connecting rod, and is located in the connecting cylinder. One end of the buffer spring abuts against the connecting cylinder, and the other end of the buffer spring abuts against the slide plate. The buffer spring is arranged in the connecting cylinder.

5. The semiconductor material screening machine according to claim 1, characterized in that: The auxiliary mechanism also includes a bracket and a conveyor. The bracket is arranged on the ground at both sides of the bottom plate; the conveyor is fixed on the bracket and is respectively located below the discharge ports of the first material guide rack and the second material guide rack.

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