Silicon wafer anti-falling device

Abstract

The utility model discloses a silicon wafer anti-drop device, which belongs to the technical field of silicon wafer anti-drop, and comprises a material frame, side bumping posts and lower bumping posts are arranged in the material frame, a silicon wafer is positioned in the material frame, the side bumping posts are movably arranged on the side surface of the silicon wafer, and the lower bumping posts are movably arranged in the material frame to block the lower part of the silicon wafer; the tray is located below the material frame and connected with the material frame in a clamped mode. The pushing-out part is arranged on the tray, the pushing-out part comprises a pushing plate and a spring, the pushing plate is installed on the tray through the spring, and when the tray is connected with the material frame in a clamped mode, the pushing plate pushes the lower blocking column to the position below a silicon wafer. According to the anti-falling device for the silicon wafer, the silicon wafer is stably protected, the silicon wafer is effectively prevented from falling off, so that the silicon wafer is prevented from being damaged, and the silicon wafer is protected from multiple directions under the matching action of the side bumping post and the lower bumping post.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon chip anti-falling, and particularly relates to a silicon chip anti-falling device. Background Art

[0002] Silicon crystal photovoltaic technology is the most widely used photovoltaic technology at present. Its cells use silicon as the main material and are made of single crystal silicon or polycrystalline silicon. Silicon crystal photovoltaics have the advantages of high efficiency, stability and reliability, but their production cost is high. The materials used in thin-film solar cells mainly include amorphous silicon, copper indium gallium selenide, organic materials, etc., which have the characteristics of light weight, low production cost and strong flexibility, but their efficiency is lower than that of silicon crystal photovoltaics. Polycrystalline silicon photovoltaics use microcrystalline crystals of high-purity silicon, which can be comparable to ordinary silicon crystal cells, but its manufacturing process is more advanced than silicon crystal photovoltaic technology, and silicon crystal rods are a commonly used silicon crystal.

[0003] Silicon wafers are formed after slicing the silicon crystal rod. When the silicon wafers are transported by a material frame, the bottom of the material frame is a hollow structure, and the silicon wafers formed after slicing are very unstable. Therefore, the silicon wafers are prone to falling during transportation, and a single fallen silicon wafer will cause the entire silicon wafer to fall, resulting in serious damage to the silicon wafer. Therefore, a silicon wafer anti-falling device is needed. Utility Model Content

[0004] The utility model overcomes the shortcomings of the prior art and provides a silicon chip anti-falling device to solve the problems existing in the prior art.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a silicon wafer anti-falling device, comprising

[0006] A material frame, wherein the material frame is provided with side blocking columns and a lower blocking column, the silicon wafer is located in the material frame, the side blocking columns are movably provided on the side of the silicon wafer, and the lower blocking columns are movably provided in the material frame to block the bottom of the silicon wafer;

[0007] A tray, the tray is located below the material frame and is engaged with the material frame;

[0008] The pushing part is arranged on the tray, and the pushing part includes a pushing plate and a spring. The pushing plate is installed on the tray through the spring. When the tray is engaged with the material frame, the pushing plate pushes the lower stop column to below the silicon wafer.

[0009] In a preferred embodiment of the utility model, a first guide groove and a second guide groove are provided on the material frame, the end of the side baffle column is located in the first guide groove, and the end of the lower baffle column is located in the second guide groove.

[0010] In a preferred embodiment of the utility model, the first guide groove is an arc groove, the side stop column moves along the arc direction of the first guide groove, the second guide groove is a linear groove, and the lower stop column moves along the length direction of the second guide groove.

[0011] In a preferred embodiment of the utility model, a plurality of guide seats are arranged on the tray, and the guide seats are installed at the corners of the tray to install the tray and the material frame.

[0012] In a preferred embodiment of the utility model, a guiding inclined surface is provided on the guiding seat to guide the tray to be installed into the material frame.

[0013] In a preferred embodiment of the utility model, a plurality of guide shafts are arranged on the tray, the guide shafts penetrate the springs, and the bottoms of the guide shafts are installed on the tray.

[0014] The utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0015] 1. The silicon wafer anti-falling device of the utility model realizes stable protection of silicon wafers, effectively prevents silicon wafers from falling, thereby preventing silicon wafers from being damaged. With the cooperation of the side blocking column and the lower blocking column, the protection treatment of silicon wafers is realized from multiple directions;

[0016] 2. The existence of the first guide groove and the second guide groove can respectively guide and adjust the positions of the side blocking pillars and the lower blocking pillars, thereby being suitable for the protection treatment of silicon wafers of different specifications and enhancing the versatility of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0018] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the utility model;

[0019] Figure 2 It is a side view of a preferred embodiment of the utility model;

[0020] Figure 3 It is a partial structural schematic diagram of a preferred embodiment of the utility model;

[0021] Figure 4 for Figure 3 Enlarged view of part A in the middle;

[0022] In the figure: 10, material frame; 101, first guide groove; 102, second guide groove; 11, side stop column; 12, lower stop column; 20, tray; 30, ejection part; 31, push plate; 32, spring; 40, guide seat; 41, guide slope; 50, guide shaft. DETAILED DESCRIPTION

[0023] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0024] The present embodiment discloses a silicon wafer anti-falling device, which realizes stable protection for silicon wafers, effectively prevents silicon wafers from falling, thereby preventing silicon wafers from being damaged. With the cooperation of the side blocking column 11 and the lower blocking column 12, protection of silicon wafers is realized from multiple directions.

[0025] Combination Figures 1 to 4 As shown, the silicon wafer anti-falling device of this embodiment includes a material frame 10, a tray 20 and a push-out portion 30. The material frame 10 contains silicon wafers to be transported, the tray 20 is located below the material frame 10 and can be snap-connected with the material frame 10, and the push-out portion 30 can cooperate with the tray 20 to protect the silicon wafers in the material frame 10.

[0026] In this embodiment, side blocking columns 11 and lower blocking columns 12 are provided in the material frame 10. The silicon wafer is located in the material frame 10. The side blocking columns 11 are movably provided on the sides of the silicon wafer. The lower blocking columns 12 are movably provided in the material frame 10 to block the bottom of the silicon wafer. The side blocking columns 11 and the lower blocking columns 12 of this embodiment can be adjusted in position to adapt to silicon wafers of different specifications and achieve blocking and preventing the silicon wafer from falling off.

[0027] Specifically, the material frame 10 of this embodiment is provided with a first guide groove 101 and a second guide groove 102, the end of the side stop column 11 is located in the first guide groove 101, and the end of the lower stop column 12 is located in the second guide groove 102. The first guide groove 101 is an arc groove, and the side stop column 11 moves along the arc direction of the first guide groove 101. The second guide groove 102 is a linear groove, and the lower stop column 12 moves along the length direction of the second guide groove 102. The side stop column 11 can change its position in the first guide groove 101, and the lower stop column 12 can change its position in the second guide groove 102, so as to realize the protection operation of the silicon wafer.

[0028] Combination Figure 1 , Figure 3 as well as Figure 4As shown, the push-out portion 30 of the present embodiment is arranged on the tray 20, and the push-out portion 30 includes a push plate 31 and a spring 32. The push plate 31 is installed on the tray 20 through the spring 32. When the tray 20 is engaged with the material frame 10, the push plate 31 pushes the lower blocking column 12 to the bottom of the silicon wafer. During the engagement process between the tray 20 and the material frame 10, the tray 20 and the material frame 10 move toward each other. After the push plate 31 contacts the lower blocking column 12, it pushes the lower blocking column 12 to move in the second guide groove 102, so that the lower blocking column 12 reaches the protection position, realizes the lower protection of the silicon wafer to prevent the silicon wafer from falling, and the spring 32 can realize the elastic support of the lower blocking column 12 through the push plate 31, so as to ensure that the lower blocking column 12 is in the blocking position, thereby ensuring the blocking protection of the lower part of the silicon wafer.

[0029] In this embodiment, a plurality of guide seats 40 are provided on the tray 20, and the guide seats 40 are installed at the corners of the tray 20. The tray 20 and the material frame 10 are installed. A guide slope 41 is provided on the guide seat 40 to guide the tray 20 to be installed into the material frame 10. When the tray 20 and the material frame 10 are engaged, the guide slope 41 on the guide seat 40 can guide the movement of the tray 20, so that the tray 20 can be smoothly docked with the material frame 10, thereby pushing the lower blocking column 12 to the bottom of the silicon wafer to protect the silicon wafer.

[0030] Furthermore, a plurality of guide shafts 50 are provided on the tray 20 . The guide shafts 50 penetrate the springs 32 , and the bottoms of the guide shafts 50 are installed on the tray 20 . The existence of the guide shafts 50 can guide the movement of the push plate 31 , so that the push plate 31 can stably push the lower stop column 12 .

[0031] In actual use of the silicon wafer anti-falling device of this embodiment, the silicon wafer is in the material frame 10, and the side blocking columns 11 are used to limit and block the side faces of the silicon wafer. Since there is a risk of the silicon wafer falling, a tray 20 is used to be clamped with the material frame 10. The pushing portion 30 located on the tray 20 can push the lower blocking column 12 to move in the second guide groove 102, so that the lower blocking column 12 reaches under the silicon wafer, and the silicon wafer is blocked and protected by the lower blocking column 12 to prevent the silicon wafer from falling off.

[0032] In summary, the silicon wafer anti-falling device of the present embodiment realizes stable protection for silicon wafers, effectively prevents silicon wafers from falling, thereby preventing silicon wafers from being damaged. With the cooperation of the side blocking column 11 and the lower blocking column 12, protection of silicon wafers is realized from multiple directions, and the existence of the first guide groove 101 and the second guide groove 102 can respectively guide and adjust the positions of the side blocking column 11 and the lower blocking column 12, so that it is suitable for the protection of silicon wafers of different specifications, thereby enhancing the versatility of the device.

[0033] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A silicon wafer anti-falling device, characterized in that: include A material frame (10), wherein a side blocking column (11) and a lower blocking column (12) are arranged in the material frame (10), a silicon wafer is located in the material frame (10), the side blocking column (11) is movably arranged on the side of the silicon wafer, and the lower blocking column (12) is movably arranged in the material frame (10) to block the bottom of the silicon wafer; A tray (20), the tray (20) being located below the material frame (10) and being engaged with the material frame (10); A pushing part (30), the pushing part (30) is arranged on the tray (20), the pushing part (30) comprises a pushing plate (31) and a spring (32), the pushing plate (31) is installed on the tray (20) through the spring (32), when the tray (20) is engaged with the material frame (10), the pushing plate (31) pushes the lower blocking column (12) to below the silicon wafer.

2. The silicon wafer anti-falling device according to claim 1, characterized in that: The material frame (10) is provided with a first guide groove (101) and a second guide groove (102); the end of the side blocking column (11) is located in the first guide groove (101), and the end of the lower blocking column (12) is located in the second guide groove (102).

3. The silicon wafer anti-falling device according to claim 2, characterized in that: The first guide groove (101) is an arcuate groove, the side blocking column (11) moves along the arc direction of the first guide groove (101), the second guide groove (102) is a linear groove, and the lower blocking column (12) moves along the length direction of the second guide groove (102).

4. The silicon wafer anti-falling device according to claim 1, characterized in that: A plurality of guide seats (40) are arranged on the tray (20), and the guide seats (40) are installed at the corners of the tray (20) to install the tray (20) and the material frame (10).

5. The silicon wafer anti-falling device according to claim 4, characterized in that: The guide seat (40) is provided with a guide slope (41) to guide the tray (20) to be installed into the material frame (10).

6. The silicon wafer anti-falling device according to claim 1, characterized in that: A plurality of guide shafts (50) are arranged on the tray (20); the guide shafts (50) penetrate the spring (32) and have their bottoms mounted on the tray (20).

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