Electroplating mechanism for preparing composite electroplated layer and solar cell

Abstract

The utility model provides an electroplating mechanism for preparing a composite electroplated layer and a solar cell, at least one electroplating area, at least one electroplating interruption area and a carrying device are sequentially arranged along the moving direction of an object to be electroplated, and the electroplating areas and the electroplating interruption areas are sequentially arranged at intervals. And the to-be-electroplated object in the electroplating area is conveyed to the electroplating interruption area, the to-be-electroplated object is electroplated in the electroplating area, the electroplating interruption procedure is carried out in the electroplating interruption area after electroplating, and the electroplating liquid is prevented from making contact with the electroplated to-be-electroplated object. The electroplating mechanism has the beneficial effects of reducing or avoiding the internal stress aggregation of electroplated metal continuous deposition stack atoms, improving the binding force between the whole metal grid line and the cell when the electroplating mechanism is used for preparing the metal grid line of the solar cell, reducing the contact resistance between the metal grid line and the cell, reducing the shading area, and improving the production efficiency. The photoelectric conversion efficiency of the cell is improved, and the production cost of the whole cell is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of solar cell manufacturing, in particular to an electroplating mechanism for preparing a composite electroplating layer and a solar cell. Background Art

[0002] At present, metal is usually used as a conductive electrode in the process of solar cells to output electricity. Therefore, metallization is an important process step in the manufacture of solar cells. The currently widely used method of forming metal electrodes by high-temperature sintering of screen-printed metal paste has long been mass-produced. However, with the continuous development of battery raw materials and battery processes, the mainstream screen-printed silver paste has become a heavy burden on the entire battery cost due to the rising cost of expensive silver paste.

[0003] In order to further reduce the cost of solar cells, the use of cheaper copper electroplating methods to achieve cost reduction is the best way to make metal electrodes for solar cells. Among the electroplating methods popular in the PCB and semiconductor industries, the design of electroplating mechanisms includes hanging plating, vertical plating and horizontal plating. The above electroplating methods are still used in solar cell technology to overcome the problems of copper metal deposition uniformity, yield, mass production efficiency, etc., especially the contact resistance, adhesion and reliability of metal electrodes and batteries. In order to solve these electroplating technology problems, it is necessary to design a new electroplating mechanism that can prepare composite electroplating layers. Utility Model Content

[0004] In view of the above problems, the utility model provides an electroplating mechanism for preparing a composite electroplating layer and a solar cell to solve the above or other former problems existing in the prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: an electroplating mechanism for preparing a composite electroplating layer, wherein at least one electroplating area, at least one electroplating interruption area and a carrying device are sequentially arranged along the moving direction of the object to be electroplated, and the multiple electroplating areas and the electroplating interruption areas are sequentially arranged at intervals. The object to be electroplated in the electroplating area is transported to the electroplating interruption area through the carrying device, and the object to be electroplated is electroplated in the electroplating area. After the electroplating, the electroplating interruption process is performed in the electroplating interruption area to block the contact between the plating solution and the object to be electroplated after the electroplating.

[0006] Furthermore, the electroplating area includes a plating liquid containing device, a plating liquid supply device connected to the plating liquid containing device, and a plating current supply device. The plating liquid supply device supplies plating liquid to the plating liquid containing device. The plating current supply device is arranged in the plating liquid containing device. The plating current supply device interacts with the plating liquid to electroplate the object to be plated in the plating liquid.

[0007] Furthermore, the electroplating liquid supply device includes a electroplating liquid storage device and an electroplating liquid conveying device connected to each other, and the electroplating liquid in the electroplating liquid storage device is transported to the electroplating liquid containing device through the electroplating liquid conveying device.

[0008] Furthermore, the electroplating liquid conveying device includes a conveying power device, a connecting pipe and a spraying device. The connecting pipe is respectively connected to the electroplating liquid storage device and the spraying device. The conveying power device is arranged on the connecting pipe, and the spraying device is arranged in the electroplating liquid containing device. Under the action of the conveying power device, the electroplating liquid flows out from the spraying device through the connecting pipe to supply the electroplating liquid.

[0009] Furthermore, it also includes a temperature control device, a stirring device and a liquid medicine reflux treatment device which are respectively connected to the plating liquid containing device. When the plating liquid is configured, the stirring device stirs the plating liquid in the plating liquid containing device and controls the temperature of the plating liquid through the temperature control device, and the liquid medicine reflux treatment device treats the refluxed plating liquid.

[0010] Furthermore, the electroplating current supply device comprises a power source and an anode component and a cathode component connected to the power source, and the object to be electroplated is connected to the cathode component.

[0011] Furthermore, the electroplating interruption area is provided with an electroplating blocking device, and the electroplating blocking device is arranged between adjacent anode components and cathode components and is located on both sides of the object to be electroplated.

[0012] Furthermore, the electroplating blocking device is a flow blocking device, and the material of the flow blocking device includes but is not limited to PU, PP, POE, PET or rubber.

[0013] Furthermore, the electroplating blocking device is an air blowing device, which includes an air knife, and the gas blown out by the air knife is air or an inert gas.

[0014] A solar cell comprises a grid line of the solar cell prepared by using the electroplating mechanism for preparing a composite electroplating layer as described above, wherein the grid line on at least one side of the solar cell has a plurality of layered structures, and the plurality of layered structures are sequentially arranged along the substrate of the solar cell to the outside.

[0015] Due to the adoption of the above technical scheme, the electroplating mechanism has multiple electroplating areas and multiple electroplating interruption areas. The object to be electroplated can be electroplated multiple times in different electroplating areas. The electroplating interruption area is set between two adjacent electroplating areas, and the object to be electroplated that has completed one electroplating is interrupted. The contact between the object to be electroplated and the plating solution is blocked, and a multi-layer electroplating layer is formed on the outer side of the object to be electroplated. The electroplated electroplating layer can reduce or avoid stress accumulation within the atoms of the continuously deposited stack of electroplated metal. For the metal grid lines of solar cells prepared by the electroplating mechanism, more effective adhesion and ductility are provided, so that the metal grid lines have a multi-layer electroplating layer structure, which improves the bonding force between the overall metal grid lines and the cell, while reducing the contact resistance between the metal grid lines and the cell, reducing the shading area, improving the photoelectric conversion efficiency of the cell, and reducing the overall production cost of the cell. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of an electroplating mechanism according to an embodiment of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the electroplating area of ​​the electroplating mechanism of one embodiment of the utility model;

[0018] Figure 3 It is a structural schematic diagram of an embodiment of the utility model in which the electroplating interruption zone of the electroplating mechanism has a flow blocking device;

[0019] Figure 4 It is a structural schematic diagram of an embodiment of the utility model in which the electroplating interruption zone of the electroplating mechanism has an air blowing device.

[0020] In the figure:

[0021] 1. Plating area 2. Plating interruption area 3. Plating liquid supply device

[0022] 4. Electroplating current supply device 5. Current blocking device 6. Air blowing device DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments.

[0024] Figure 1 A schematic diagram of the structure of an embodiment of the utility model is shown. The embodiment relates to an electroplating mechanism and a solar cell for preparing a composite electroplating layer. The electroplating method is used to prepare a multi-layer electroplating layer on the solar cell, especially to prepare the metal grid lines of the solar cell, so as to avoid stress accumulation within the stacked atoms of the electroplated metal continuously deposited, provide more effective adhesion and ductility, thereby improving the bonding strength between the overall metal grid lines and the cell, and at the same time reducing the contact resistance between the metal grid lines and the cell.

[0025] An electroplating mechanism for preparing a composite electroplating layer, such as Figure 1 and 2 As shown, it includes at least one plating area 1, at least one plating interruption area 2 and a carrying device which are arranged in sequence along the moving direction of the object to be plated. The plating area 1 and the plating interruption area 2 are arranged in sequence at intervals. The object to be plated is electroplated in the plating area 1, and the object to be plated after the plating is transported to the plating interruption area 2 by the carrying device, and the contact between the plating solution and the object to be plated after the plating is interrupted, so that one plating of the object to be plated is completed and a plating layer is formed. The object to be plated enters multiple plating areas 1 in sequence for multiple plating, so that multiple plating of the object to be plated is realized, and a multi-layer plating layer is formed on the outer side of the object to be plated, and a composite plating layer is prepared.

[0026] There are multiple electroplating areas 1 and multiple electroplating interruption areas 2, and the multiple electroplating areas 1 and multiple electroplating interruption areas 2 are arranged in sequence at intervals. There is a plating interruption area 2 between two adjacent electroplating areas 1, and there is a plating area 1 between two adjacent electroplating interruption areas 2, that is, along the direction of movement of the object to be electroplated, the arrangement method is: one electroplating area 1, one electroplating interruption area 2, one electroplating area 1, one electroplating interruption area 2, one electroplating area 1, one electroplating interruption area 2..., and so on, to arrange multiple electroplating areas 1 and multiple electroplating interruption areas 2; or, one electroplating interruption area 2, one electroplating area 1, one electroplating interruption area 2, one electroplating area 1, one electroplating interruption area 2..., and so on, to arrange multiple electroplating areas 1 and multiple electroplating interruption areas 2 to form an overall framework structure of the electroplating mechanism. The number of electroplating areas 1 and electroplating interruption areas 2 is selected according to actual needs, and no specific requirements are made here.

[0027] At both ends of the multiple groups of electroplating areas 1 and the electroplating interruption area 2, there are respectively provided a loading area for the objects to be electroplated and a unloading area for the objects to be electroplated. The loading area for the objects to be electroplated is used for loading the objects to be electroplated, and the unloading area for the objects to be electroplated is used for unloading the objects to be electroplated after electroplating. The loading area for the objects to be electroplated is provided with a loading device for transporting the objects to be electroplated placed in the loading area to the nearest electroplating area 1. The loading device can be a conveyor belt or a manipulator, which can be selected and set according to actual needs; the unloading area for the objects to be electroplated is provided with an unloading device for transporting the objects to be electroplated after electroplating out of the electroplating mechanism to enter the next process. The unloading device can be a conveyor belt or a manipulator, which can be selected and set according to actual needs.

[0028] The above-mentioned electroplating area 1 includes an electroplating liquid containing device, an electroplating liquid supply device 3 connected to the electroplating liquid containing device, and an electroplating current supply device 4. The electroplating liquid supply device 3 supplies the electroplating liquid to the electroplating liquid containing device. The electroplating current supply device 4 is arranged in the electroplating liquid containing device. The electroplating current supply device 4 acts on the electroplating liquid to electroplate the object to be electroplated in the electroplating liquid. The electroplating current supply device 4 contacts or is connected to the object to be electroplated. The electrochemical reaction between the electroplating current supply device 4 and the electroplating liquid realizes electroplating of the object to be electroplated.

[0029] The above-mentioned electroplating liquid containing device is used to contain the electroplating liquid so that the object to be electroplated is located in the electroplating liquid for electroplating. The electroplating liquid containing device is a tank structure with a storage space inside. A cover is provided at the open end to cover the tank and seal the contact between the tank and the cover to ensure the structural stability and sealing of the electroplating liquid containing device, so as to ensure the uniformity and stability of the electroplating liquid located inside. The material of the electroplating liquid containing device is a material with strong corrosion resistance and good conductivity, such as stainless steel, to extend the service life of the electroplating liquid containing device.

[0030] The plating liquid containing device is provided with a temperature control device to control the temperature of the plating liquid in the plating liquid containing device, to ensure that the temperature of the plating liquid is at the temperature required during electroplating, and to avoid affecting the formation and growth of grains during the electroplating process. The temperature control device includes a heating component and a cooling component, which heat and cool the plating liquid in the plating liquid containing device respectively. The heating component can be a heater, and the cooling component can be a heat exchanger or an ice water condenser.

[0031] The plating liquid containing device is also provided with a stirring device to stir the plating liquid in the plating liquid containing device and maintain the uniformity of the plating liquid during the electroplating process, so as to ensure the uniformity and quality of the growth of the grains. The stirring device can be a stirrer, and the stirrer includes a stirring member and a stirring drive device connected to each other. The stirring drive device drives the stirring member to rotate to stir the plating liquid. The stirring member is a stirring paddle, and the stirring drive device is a motor. The stirring member is arranged inside the plating liquid containing device, and the stirring drive device is arranged outside the plating liquid containing device to stir the plating liquid. Alternatively, the stirring device can be a magnetic stirrer, which is a commercially available product and is selected according to actual needs. No specific requirements are made here.

[0032] The electroplating liquid containing device is also connected to a liquid reflux treatment device, which collects and filters the electroplating liquid flowing out of the electroplating liquid containing device to prevent the refluxed electroplating liquid from polluting the environment, and processes the recovered electroplating liquid so that the recovered electroplating liquid can be used again. The liquid reflux treatment device includes a storage device and a filtering device. The storage device recovers and stores the outflowing electroplating liquid. The storage device can be a box structure or a barrel structure. The filtering device filters the electroplating liquid entering the storage device. The filtering device is a filter net to filter out solid impurities in the electroplating liquid. The storage device and the filtering device are made of acid-resistant and high-temperature-resistant materials, which can be PP material or PVC material, etc.

[0033] The above-mentioned plating liquid supply device 3 includes a plating liquid storage device and a plating liquid conveying device connected to each other. The plating liquid storage device is used to store the plating liquid. The plating liquid is transported to the plating liquid containing device through the plating liquid conveying device for use. The plating liquid storage device can be a box structure or a barrel structure, with a storage space inside, which can store the plating liquid, and is selected according to actual needs. The plating liquid conveying device includes a conveying power device, a connecting pipe and a spraying device. The connecting pipe is connected and communicated with the plating liquid storage device and the spraying device respectively. The conveying power device is arranged on the connecting pipe, and the spraying device is arranged in the plating liquid containing device. Under the action of the conveying power device, the plating liquid flows out from the spraying device through the connecting pipe to supply the plating liquid. The number of the spraying devices is multiple, which are arranged on the inner side surface of the plating liquid containing device relatively arranged. The spraying device is a tubular structure with multiple spray holes. Under the power action of the conveying power device, the plating liquid is sprayed from each spray hole to realize the transportation and replenishment of the plating liquid.

[0034] In some feasible embodiments, the transport power device is preferably a motor.

[0035] like Figure 2 As shown, the above-mentioned electroplating current supply device 4 includes a power supply and an anode component and a cathode component connected to the power supply. The object to be electroplated is connected or in contact with the cathode component. The power supply supplies power to the anode component and the cathode component, controls the potential between the anode component and the cathode component, and realizes electroplating of the object to be electroplated.

[0036] like Figure 3 and 4 As shown, the above-mentioned electroplating interruption area 2 is provided with an electroplating blocking device, and the electroplating blocking device is arranged between adjacent anode components and cathode components and is located on both sides of the object to be electroplated, so as to separate the object to be electroplated from the plating solution after electroplating, interrupting the electroplating process so as to carry out multiple electroplating to form multiple electroplating layers.

[0037] The electroplating blocking device is a flow blocking device 5, which is a rotating roller. The material of the rotating roller includes but is not limited to PU, PP, POE, PET or rubber, which can absorb the solution on the surface of the electroplated object, separate the electroplating solution from the electroplated object, and interrupt the contact between the electroplating solution and the electroplated object. The rotating roller is rotatably installed in the electroplating interruption area 2 through a mounting bracket.

[0038] Or, the electroplating blocking device is a blowing device 6, which blows air to the object to be electroplated after electroplating to dry the solution on the surface of the object to be electroplated after electroplating. The blowing device 6 includes a wind knife, a blowing pipe connected to the wind knife, a blowing power device and a gas storage device. The wind knife is connected to the gas storage device through the blowing pipe. The blowing power device is arranged on the blowing pipe. Under the action of the blowing power device, the gas in the gas storage device enters the wind knife through the blowing pipe and is ejected from the wind knife to purge the object to be electroplated. The wind knife is rotatably installed on the mounting frame through a gear transmission structure, so that the blowing angle of the wind knife can be adjusted to meet the use requirements.

[0039] In some feasible embodiments, the blowing power device is preferably an air pump, and the gas in the gas storage device is air or an inert gas, which is selected according to actual needs.

[0040] The above-mentioned carrying device is a mobile holding device or a fixed holding device. The mobile holding device can be a manipulator installed on a slide, and the fixed holding device is a manipulator installed in the electroplating area 1 or the electroplating interruption area 2, which is selected according to actual needs.

[0041] A method for electroplating a composite electroplating layer, using the electroplating mechanism for preparing the composite electroplating layer as described above to electroplate an object to be electroplated, selecting a corresponding number of electroplating times according to the number of electroplating layers to be prepared, repeating the electroplating multiple times, and forming a multi-layer electroplating layer on one side or both sides of the object to be electroplated, each time the electroplating process comprises:

[0042] When the object to be electroplated enters the electroplating zone 1, the temperature of the electroplating solution in the electroplating zone 1 and the current density of the electroplating current supply device 4 are controlled to perform electroplating for the first time to prepare a plating layer;

[0043] The object to be plated enters the electroplating interruption zone 2, where the contact between the object to be plated and the electroplating solution is cut off, and the electroplating interruption process is performed;

[0044] After the electroplating is completed for multiple times, the object to be electroplated is washed with water and dried to form an electroplated layer with multiple layered structures.

[0045] During different electroplating cycles, the temperature of the electroplating solution and the current density of the electroplating current supply device 4 may be the same or different, and the electroplating time may be the same or different, depending on actual needs. No specific requirements are made here.

[0046] In some feasible embodiments, the temperature of the electroplating solution is 20-40° C., which is selected according to actual needs.

[0047] In some feasible embodiments, the current density of the electroplating current supply device 4 is 5-25ASD, which is selected according to actual needs.

[0048] In some feasible embodiments, the first time mentioned above is 60-200s, which is selected according to actual needs.

[0049] A solar cell comprises a grid line prepared by the electroplating method of the composite electroplating layer as described above, wherein the grid line on at least one side of the solar cell has a plurality of layered structures, and the plurality of layered structures are sequentially arranged along the substrate to the outside of the solar cell.

[0050] In some feasible embodiments, the metal grid lines of the solar cell are prepared by copper electroplating, the metal grid lines are copper grid lines, and the material of each layered structure is copper.

[0051] The following is an explanation of preparing the grid lines of a solar cell by electroplating. The object to be electroplated is a solar cell, the electroplating solution is a copper-containing electroplating solution, and the grid lines of the solar cell are prepared by electroplating copper to form copper grid lines.

[0052] The electroplating mechanism for preparing a composite electroplating layer includes a plurality of electroplating areas 1 and a plurality of electroplating interruption areas 2 which are arranged in sequence along the moving direction of the object to be electroplated, wherein in the present embodiment, the number of the electroplating areas 1 is 6, and the number of the electroplating interruption areas 2 is 6, that is, the plurality of electroplating areas 1 and the plurality of electroplating interruption areas 2 are arranged as follows: a first electroplating area 1, a first electroplating interruption area 2, a second electroplating area 1, a second electroplating interruption area 2, a third electroplating area 1, a third electroplating interruption area 2, a fourth electroplating area 1, a fourth electroplating interruption area 2, a fifth electroplating area 1, a fifth electroplating interruption area 2, a sixth electroplating area 1 and a sixth electroplating interruption area 2, and a plating blocking device is provided in each electroplating interruption area 2 to perform the electroplating interruption process.

[0053] Embodiment 1

[0054] The solar cell is electroplated multiple times to prepare copper grid lines, including the following steps:

[0055] In the loading area for the object to be electroplated, the object to be electroplated is placed, and under the action of the loading device, the object to be electroplated is transported to the first electroplating area 1, and the object to be electroplated is electroplated in the first electroplating area 1, and the current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 8-10ASD, and the temperature of the electroplating solution is 28-30°C, and the electroplating process is performed to prepare the bottom electroplating layer;

[0056] The electroplating time in the first electroplating area 1 is 60s. After the electroplating time is over, the object to be electroplated is transported to the first electroplating interruption area 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0057] The second electroplating process is carried out. The object to be electroplated is transported to the second electroplating area 1 of the electroplating mechanism by the carrier device for the second electroplating. The current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 10-20ASD, and the temperature of the electroplating solution is 28-30°C to prepare the second electroplating layer.

[0058] The electroplating time in the second electroplating area 1 is 200s. After the electroplating time is over, the object to be electroplated is transported to the second electroplating interruption area 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0059] The third electroplating process is carried out. The object to be electroplated is transported to the third electroplating area 1 of the electroplating mechanism by the carrier device for the third electroplating. The current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 10-20ASD, and the temperature of the electroplating solution is 30-40°C. The temperature of the electroplating solution is controlled at 28-30°C to prepare a third electroplating layer.

[0060] The electroplating time in the third electroplating area 1 is 120s. After the electroplating time is over, the object to be electroplated is transported to the third electroplating interruption area 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0061] The fourth electroplating process is carried out. The object to be electroplated is transported to the fourth electroplating area 1 of the electroplating mechanism by the carrier device for the fourth electroplating. The current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 10-20ASD, and the temperature of the electroplating solution is 30-40°C. The temperature of the electroplating solution is controlled at 28-30°C to prepare a fourth electroplating layer.

[0062] The electroplating time in the fourth electroplating zone 1 is 120s. After the electroplating time is over, the object to be electroplated is transported to the fourth electroplating interruption zone 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0063] The object to be electroplated is washed with water and dried with dry air in sequence to obtain a solar cell with low-stress electroplated copper grid lines, wherein the grid lines on both sides of the solar cell have four electroplated layers respectively.

[0064] Embodiment 2

[0065] The solar cell is electroplated multiple times to prepare copper grid lines, including the following steps:

[0066] In the loading area for the object to be electroplated, the object to be electroplated is placed. Under the action of the loading device, the object to be electroplated is placed in the first electroplating area 1. The object to be electroplated is electroplated in the first electroplating area 1, and the current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 8-10ASD, and the temperature of the electroplating solution is 28-30°C. The electroplating process is performed to prepare the bottom electroplating layer;

[0067] The electroplating time in the first electroplating area 1 is 60s. After the electroplating time is over, the object to be electroplated is transported to the first electroplating interruption area 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0068] The second electroplating process is carried out. The object to be electroplated is transported to the second electroplating area 1 of the electroplating mechanism by the carrier device for the second electroplating. The current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 10-20ASD, and the temperature of the electroplating solution is 28-30°C to prepare the second electroplating layer.

[0069] The electroplating time in the second electroplating area 1 is 200s. After the electroplating time is over, the object to be electroplated is transported to the second electroplating interruption area 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0070] The third electroplating process is carried out. The object to be electroplated is transported to the third electroplating area 1 of the electroplating mechanism by the carrier device for the third electroplating. The current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 10-20ASD, and the temperature of the electroplating solution is 30-40°C. The temperature of the electroplating solution is controlled at 28-30°C to prepare a third electroplating layer.

[0071] The electroplating time in the third electroplating area 1 is 120s. After the electroplating time is over, the object to be electroplated is transported to the third electroplating interruption area 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0072] The fourth electroplating process is carried out. The object to be electroplated is transported to the fourth electroplating area 1 of the electroplating mechanism by the carrier device for the fourth electroplating. The current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 10-20ASD, and the temperature of the electroplating solution is 30-40°C. The temperature of the electroplating solution is controlled at 28-30°C to prepare a fourth electroplating layer.

[0073] The electroplating time in the fourth electroplating zone 1 is 120s. After the electroplating time is over, the object to be electroplated is transported to the fourth electroplating interruption zone 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0074] The fifth electroplating process is performed, the object to be electroplated is transported to the fifth electroplating area 1 of the electroplating mechanism by the carrier device, and the fifth electroplating is performed, and the current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled. The current density of the electroplating current supply device 4 is 10-20ASD, and the temperature of the electroplating solution is 30-40°C. The temperature of the electroplating solution is controlled at 28-30°C to prepare a fifth electroplating layer;

[0075] The electroplating time in the fifth electroplating zone 1 is 120s. After the electroplating time is over, the object to be electroplated is transported to the fifth electroplating interruption zone 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating suspension process is performed.

[0076] The sixth electroplating process is performed, the object to be electroplated is transported to the sixth electroplating area 1 of the electroplating mechanism by the carrier device, the sixth electroplating is performed, and the current density of the electroplating current supply device 4 and the temperature of the electroplating solution are controlled, the current density of the electroplating current supply device 4 is 10-20ASD, the temperature of the electroplating solution is 30-40°C, and the temperature of the electroplating solution is controlled at 28-30°C to prepare the sixth electroplating layer;

[0077] The electroplating time in the sixth electroplating zone 1 is 120 seconds. After the electroplating time is over, the object to be electroplated is transported to the sixth electroplating interruption zone 2 of the electroplating mechanism by the action of the carrier device. The front and back sides of the object to be electroplated are respectively in contact with the electroplating blocking devices to prevent the electroplating solution from contacting the object to be electroplated, and the electroplating interruption process is performed.

[0078] The object to be electroplated is washed with water and dried with dry air in sequence to obtain a solar cell with low-stress electroplated copper grid lines, wherein the grid lines on both sides of the solar cell have six electroplated layers respectively.

[0079] Due to the adoption of the above technical solution, the copper electroplating mechanism has multiple electroplating areas and multiple electroplating interruption areas. The object to be electroplated can be electroplated multiple times in different electroplating areas. The electroplating interruption area is set between two adjacent electroplating areas, and the object to be electroplated that has completed one electroplating is interrupted. The contact between the object to be electroplated and the plating solution is blocked, and a multi-layer electroplating layer is formed on the outer side of the object to be electroplated. The electroplated copper layer can reduce or avoid stress accumulation within the atoms of the continuously deposited stack of electroplated metal. For the metal grid lines of solar cells prepared by the electroplating mechanism, more effective adhesion and ductility are provided, so that the metal grid lines have a multi-layer electroplating layer structure, which improves the bonding force between the overall metal grid lines and the cell, while reducing the contact resistance between the metal grid lines and the cell, reducing the shading area, improving the photoelectric conversion efficiency of the cell, and reducing the overall production cost of the cell.

[0080] The above is a detailed description of the embodiments of the utility model, but the contents are only preferred embodiments of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. An electroplating mechanism for preparing a composite electroplating layer, characterized in that: At least one plating area, at least one plating interruption area and a carrying device are sequentially arranged along the moving direction of the object to be plated. The plurality of plating areas and the plating interruption areas are sequentially spaced apart. The object to be plated in the plating area is transported to the plating interruption area by the carrying device. The object to be plated is plated in the plating area. After the plating, a plating interruption process is performed in the plating interruption area to block the contact between the plating solution and the object to be plated after the electroplating.

2. The electroplating mechanism for preparing a composite electroplating layer according to claim 1, characterized in that: The electroplating area includes a plating liquid containing device, a plating liquid supply device connected to the plating liquid containing device, and a plating current supply device. The plating liquid supply device supplies plating liquid to the plating liquid containing device. The plating current supply device is arranged in the plating liquid containing device. The plating current supply device interacts with the plating liquid to electroplate the object to be plated in the plating liquid.

3. The electroplating mechanism for preparing a composite electroplating layer according to claim 2, characterized in that: The electroplating liquid supply device comprises an electroplating liquid storage device and an electroplating liquid conveying device which are connected to each other. The electroplating liquid in the electroplating liquid storage device is transported to the electroplating liquid containing device through the electroplating liquid conveying device.

4. The electroplating mechanism for preparing a composite electroplated layer according to claim 3, characterized in that: The electroplating liquid conveying device includes a conveying power device, a connecting pipe and a spraying device. The connecting pipe is respectively connected to the electroplating liquid storage device and the spraying device. The conveying power device is arranged on the connecting pipe, and the spraying device is arranged in the electroplating liquid containing device. Under the action of the conveying power device, the electroplating liquid flows out from the spraying device through the connecting pipe to supply the electroplating liquid.

5. The electroplating mechanism for preparing a composite electroplated layer according to any one of claims 2 to 4, characterized in that: It also includes a temperature control device, a stirring device and a liquid medicine reflux treatment device which are respectively connected to the plating liquid containing device. When the plating liquid is configured, the stirring device stirs the plating liquid in the plating liquid containing device and controls the temperature of the plating liquid through the temperature control device, and the liquid medicine reflux treatment device treats the refluxed plating liquid.

6. The electroplating mechanism for preparing a composite electroplated layer according to claim 5, characterized in that: The electroplating current supply device comprises a power source and an anode component and a cathode component connected to the power source, and the object to be electroplated is connected to the cathode component.

7. The electroplating mechanism for preparing a composite electroplated layer according to claim 6, characterized in that: The electroplating interruption area is provided with an electroplating blocking device, and the electroplating blocking device is arranged between adjacent anode components and cathode components and is located on both sides of the object to be electroplated.

8. The electroplating mechanism for preparing a composite electroplated layer according to claim 7, characterized in that: The electroplating blocking device is an air blowing device, which includes an air knife, and the gas blown out by the air knife is air or an inert gas.

9. A solar cell, characterized in that: It comprises preparing grid lines of solar cells by using the electroplating mechanism for preparing a composite electroplating layer as described in any one of claims 1 to 8, wherein the grid lines on at least one side of the solar cell have multiple layered structures, and the multiple layered structures are arranged in sequence along the substrate of the solar cell to the outside.

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