Solder paste drying device for PCBA patch processing

Abstract

The utility model relates to a solder paste drying device for PCBA patch processing, which comprises a drying box, a partition plate is fixedly connected to the inner wall of the drying box, a push-pull frame is slidably connected to the upper surface of the partition plate, a drying cover is fixedly connected to the upper surface of the drying box, and a drying fan is fixedly connected to the upper surface of the drying cover. The output end of the drying fan is fixedly connected with an air conveying pipe, the end, away from the drying fan, of the air conveying pipe communicates with the interior of the drying cover, exhaust channels are symmetrically formed in the two sides of the inner wall of the drying box, and the two ends of each exhaust channel communicate with the upper portion and the lower portion of the partition plate correspondingly. When the PCBA patch drying device is used, a PCBA patch is pushed to the position below the drying cover through the push-pull frame, the drying fan is started, hot air is dispersed through cooperation of the air conveying pipe and the drying cover, solder paste is dried, dried gas can be conveyed to the position below the partition plate through the exhaust channel, and then the gas can be discharged outwards after being filtered through the filtering mechanism; therefore, the harm of the gas to the surrounding environment and human bodies can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of PCBA processing equipment, and in particular to a solder paste drying device for PCBA patch processing. Background Art

[0002] PCBA patch processing refers to the process of mounting various electronic components on a printed circuit board. This is an important link in the manufacture of electronic products and determines the performance and quality of electronic products. When mounting electronic components, solder paste is generally required. Solder paste is usually composed of metal tin powder and flux and is a special welding material. The main function of solder paste is to form a reliable welding connection during the welding process, so that electrical signals and electrical energy can be transmitted between electronic components and PCBs. After the electronic components are mounted with solder paste, a drying device is usually required to dry the solder paste.

[0003] The utility model with announcement number CN218224999U discloses an automatic solder paste fine tinning device for a light strip circuit board, wherein a sealing box is fixedly connected to the outer wall at one end of a body, an exhaust fan is arranged on one side of the lower end of the sealing box, an air filter is arranged on the inner wall of the sealing box close to the upper end of the exhaust fan, a ventilation duct is arranged on one side of the top of the sealing box, a drying box is arranged on the end of the body away from the sealing box, and a heating pipe is arranged on the inner wall of the top side of the drying box. The utility model has the following advantages: the rotating rod is twisted to push and pull the limit plate to move, so that the distance between the two limit plates is just the same as the corresponding width of the light strip circuit board, so that personnel can quickly place the light strip circuit board that needs to be tinned, and the exhaust fan is operated so that the air intake port can timely clear the smoke generated at the nozzle to avoid inhalation by personnel, and the conveyor belt is driven by the motor to move, so that the conveyor belt transports the light strip circuit board to the inside of the drying box, so that the light strip circuit board is dried by the heating pipe inside the drying box.

[0004] When the above technical solution is in use, the conveyor belt is driven to move by starting the motor, so that the conveyor belt transports the light bar circuit board to the inside of the drying box, and the light bar circuit board is dried through the heating tube inside the drying box. However, in the process of drying the solder paste through the heating tube, some harmful gases may be generated due to the volatilization of the solder paste inside the solder paste. These volatile gases may cause a certain degree of harm to the surrounding environment and human body, which is not conducive to actual use. Therefore, a person skilled in the art provides a solder paste drying device for PCBA patch processing to solve the problems raised in the above background technology. Utility Model Content

[0005] In order to solve the problem raised in the above background technology that in the process of drying solder paste through a heating tube, some harmful gases may be generated due to the volatilization of the solder inside the solder paste, and these volatile gases may cause a certain degree of harm to the surrounding environment and human body, the present application provides a solder paste drying device for PCBA patch processing.

[0006] The present application provides a solder paste drying device for PCBA patch processing, which adopts the following technical solution:

[0007] A solder paste drying device for PCBA patch processing comprises a drying box, an inner wall of the drying box is fixedly connected with a partition plate, an upper surface of the partition plate is slidably connected with a push-pull frame, an upper surface of the drying box is fixedly connected with a drying cover, an upper surface of the drying cover is fixedly connected with a drying fan, an output end of the drying fan is fixedly connected with an air supply pipe, an end of the air supply pipe away from the drying fan is connected with the interior of the drying cover, exhaust passages are symmetrically opened on both sides of the inner wall of the drying box, two ends of the exhaust passages are respectively connected with the top and bottom of the partition plate, and a filtering mechanism is slidably connected between the bottom of the inner wall of the drying box and the lower surface of the partition plate.

[0008] By adopting the above technical solution, the PCBA patch is pushed to the bottom of the drying hood through the push-pull frame, the drying fan is started to transport hot air to the inside of the drying hood through the air duct, and the hot air is dispersed through the drying hood to dry the solder paste. The dried gas can be transported to the bottom of the partition through the exhaust channel, and then can be discharged to the outside after being filtered by the filter mechanism, thereby reducing the harm of the gas to the surrounding environment and human body.

[0009] Preferably, the drying box comprises a rectangular box, the outer wall of the partition plate is fixedly connected to the inner wall of the rectangular box, the lower surface of the drying hood is fixedly connected to the upper surface of the rectangular box, the symmetrically arranged exhaust passages are respectively opened on both sides of the inner wall of the rectangular box, a push-pull opening is opened on the side of the rectangular box away from the partition plate, the push-pull frame is located inside the push-pull opening, an exhaust port penetrating the rectangular box is opened on one side of the rectangular box, an installation opening penetrating the rectangular box is opened on one side of the rectangular box, and the filtering mechanism is located inside the installation opening.

[0010] By adopting the above technical solution, the push-pull opening can facilitate personnel to control the push-pull frame to move inside the rectangular box, the exhaust port can discharge the gas inside the rectangular box to the outside, and the installation opening can limit the installation position of the filter mechanism.

[0011] Preferably, the push-pull frame comprises a rectangular storage plate slidably placed on the upper surface of the partition plate, and one end of the upper surface of the rectangular storage plate is fixedly connected to a rectangular push-pull plate.

[0012] By adopting the above technical solution, the rectangular storage plate is used to place PCBA patches that need to dry solder paste, and personnel can control the movement of the rectangular storage plate by pushing and pulling the rectangular push-pull plate.

[0013] Preferably, the drying hood includes a rectangular plate fixedly connected to the upper surface of the rectangular box, a ventilation groove is provided inside the rectangular plate, one end of the air duct is connected to the ventilation groove, air outlet holes connected to the ventilation groove are evenly provided on the lower surface of the rectangular plate, a storage opening that passes through the rectangular plate is provided on one side of the rectangular plate close to the push-pull opening, and a wind shield component is provided inside the storage opening.

[0014] By adopting the above technical solution, the hot air transported through the air duct can be transmitted through the cooperation of the ventilation slots and the air outlets, the storage opening can limit the installation position of the wind shield assembly, and when the wind shield assembly moves down, the area for drying inside the rectangular box can be shielded.

[0015] Preferably, the filtering mechanism includes a mounting plate located inside the mounting port, an activated carbon filter plate is fixedly connected to one side of the mounting plate, T-shaped slide bars are symmetrically fixedly connected to the upper and lower surfaces of the activated carbon filter plate, the symmetrically arranged T-shaped slide bars are respectively slidably connected to the partition plate and the rectangular box, and a second handle is fixedly connected to the side of the mounting plate away from the activated carbon filter plate.

[0016] By adopting the above technical solution, the second handle cooperates with the mounting plate to control the installation and removal of the activated carbon filter plate, and the activated carbon filter plate can filter the harmful gases volatilized during the drying of the solder paste to a certain extent.

[0017] Preferably, the windshield assembly includes a mounting bar, a lower surface of the mounting bar is fixedly connected to a windshield plate, the windshield plate passes through the interior of the storage opening, and an upper surface of the mounting bar is fixedly connected to a first handle.

[0018] By adopting the above technical solution, a person can control the wind shield to move up and down by cooperating with the first handle and the installation strip, and when the wind shield moves down, the area inside the rectangular box where drying is performed can be shielded.

[0019] In summary, this application includes the following beneficial technical effects:

[0020] 1. The solder paste drying device for PCBA patch processing can push the PCBA patch to the bottom of the drying hood through the push-pull rack, start the drying fan to transport hot air to the inside of the drying hood through the air duct, and disperse the hot air through the drying hood to dry the solder paste. The dried gas can be transported to the bottom of the partition through the exhaust channel, and then discharged to the outside through the filtration of the filter mechanism. The filter mechanism can filter the harmful gas volatilized during the drying of the solder paste to a certain extent, thereby reducing the harm of the gas to the surrounding environment and human body;

[0021] 2. The solder paste drying device for PCBA patch processing can facilitate personnel to control the push-pull frame to move inside the rectangular box through the push-pull opening, the exhaust port can discharge the gas inside the rectangular box to the outside, and the installation port can limit the installation position of the filter mechanism. Personnel can control the rectangular storage plate with PCBA patches to move by pushing and pulling the rectangular push-pull plate. The second handle cooperates with the installation plate to control the installation and removal of the activated carbon filter plate. The activated carbon filter plate can filter the harmful gas volatilized during the drying of the solder paste to a certain extent;

[0022] 3. The solder paste drying device for PCBA patch processing can transmit the hot air transported by the air duct through the cooperation of the ventilation slots and the air outlet holes. The storage port can limit the installation position of the windshield component. The personnel can control the up and down movement of the windshield through the first handle and the installation bar. When the windshield moves down, the drying area inside the rectangular box can be shielded to minimize gas leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0024] Figure 2 It is a schematic diagram of the left-side structure in the embodiment of the present application;

[0025] Figure 3 It is a schematic diagram of the main cross-sectional structure in an embodiment of the present application;

[0026] Figure 4 It is a schematic diagram of the structure of the filtering mechanism in the embodiment of the present application.

[0027] Explanation of the reference numerals: 1. Drying box; 101. Rectangular box; 102. Push-pull opening; 103. Exhaust outlet; 104. Mounting opening; 2. Partition plate; 3. Push-pull rack; 301. Rectangular storage plate; 302. Rectangular push-pull plate; 4. Drying hood; 401. Rectangular plate; 402. Ventilation slot; 403. Air outlet; 404. Storage opening; 405. Wind shield assembly; 4051. Mounting strip; 4052. Wind shield plate; 4053. First handle; 5. Drying fan; 6. Air duct; 7. Exhaust duct; 8. Filter mechanism; 801. Mounting plate; 802. Activated carbon filter plate; 803. T-shaped slide bar; 804. Second handle. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-4 This application is described in further detail.

[0029] The present application embodiment discloses a solder paste drying device for PCBA patch processing. Figure 1 , Figure 2 and Figure 3 The solder paste drying device for PCBA patch processing includes a drying box 1, a partition plate 2 is fixedly connected to the inner wall of the drying box 1, a push-pull frame 3 is slidably connected to the upper surface of the partition plate 2, a drying cover 4 is fixedly connected to the upper surface of the drying box 1, a drying fan 5 is fixedly connected to the upper surface of the drying cover 4, an air supply pipe 6 is fixedly connected to the output end of the drying fan 5, and one end of the air supply pipe 6 away from the drying fan 5 is connected to the inside of the drying cover 4, exhaust channels 7 are symmetrically opened on both sides of the inner wall of the drying box 1, and the two ends of the exhaust channel 7 are respectively connected to the upper and lower parts of the partition plate 2, and a filtering mechanism 8 is slidably connected between the bottom of the inner wall of the drying box 1 and the lower surface of the partition plate 2.

[0030] In the present embodiment, the partition plate 2 arranged inside the drying box 1 in the solder paste drying device for PCBA patch processing can separate the space inside the drying box 1, and the push-pull rack 3 can also be placed on the partition plate 2. The push-pull rack 3 is used to place the PCBA patch that needs to be dried solder paste. The user can push the push-pull rack 3 to push the PCBA patch to the bottom of the drying cover 4, and then control the start of the drying fan 5 to transport the hot air for drying to the inside of the drying cover 4 through the air duct 6. The hot air can be dispersed through the drying cover 4, so that In order to make the solder paste on the PCBA patch dry more evenly, further, exhaust channels 7 are symmetrically opened on both sides of the inner wall of the drying box 1, and the two ends of the exhaust channels 7 are respectively connected with the top and bottom of the partition plate 2, so that the gas used to dry the solder paste can be transported to the bottom of the partition plate 2 through the exhaust channels 7, and then discharged outward through the filtration of the filter mechanism 8. The set filter mechanism 8 can filter the harmful gas volatilized during the drying of the solder paste to a certain extent, thereby reducing the harm of the gas to the surrounding environment and human body, making the present application more conducive to practical use.

[0031] In a further preferred embodiment of the present invention, Figure 1 , Figure 2 and Figure 3 As shown, the drying box 1 includes a rectangular box 101, the outer wall of the partition plate 2 is fixedly connected to the inner wall of the rectangular box 101, the lower surface of the drying cover 4 is fixedly connected to the upper surface of the rectangular box 101, and the symmetrically arranged exhaust passages 7 are respectively opened on both sides of the inner wall of the rectangular box 101, and a push-pull opening 102 is opened on the side of the rectangular box 101 away from the partition plate 2, and the push-pull frame 3 is located inside the push-pull opening 102, an exhaust port 103 penetrating the rectangular box 101 is opened on one side of the rectangular box 101, and an installation opening 104 penetrating the rectangular box 101 is opened on one side of the rectangular box 101, and the filtering mechanism 8 is located inside the installation opening 104.

[0032] In this embodiment, the push-pull opening 102 can facilitate personnel to control the movement of the push-pull frame 3 inside the rectangular box 101, the exhaust port 103 can discharge the internal gas of the rectangular box 101 to the outside, and the installation port 104 can limit the installation position of the filter mechanism 8, which also facilitates personnel to disassemble and replace the filter mechanism 8.

[0033] In a further preferred embodiment of the present invention, Figure 1 and Figure 2 As shown, the push-pull frame 3 includes a rectangular storage plate 301 slidably placed on the upper surface of the partition plate 2 , and one end of the upper surface of the rectangular storage plate 301 is fixedly connected to a rectangular push-pull plate 302 .

[0034] In this embodiment, the rectangular placement plate 301 is used to place PCBA patches that need to dry solder paste, and the user can control the movement of the rectangular placement plate 301 by pushing and pulling the rectangular push-pull plate 302.

[0035] In a further preferred embodiment of the present invention, Figure 1 , Figure 2 and Figure 3 As shown, the drying hood 4 includes a rectangular plate 401 fixedly connected to the upper surface of the rectangular box 101, a ventilation slot 402 is provided inside the rectangular plate 401, one end of the air duct 6 is connected to the ventilation slot 402, and air outlet holes 403 connected to the ventilation slot 402 are evenly provided on the lower surface of the rectangular plate 401. A storage opening 404 that passes through the rectangular plate 401 is provided on one side of the rectangular plate 401 close to the push-pull opening 102, and a wind shield component 405 is provided inside the storage opening 404.

[0036] In this embodiment, the area inside the rectangular box 101 where drying is performed can be covered by the rectangular plate 401, and the ventilation slots 402 cooperate with the air outlet holes 403 to transmit the hot air delivered by the air duct 6, and the storage opening 404 can limit the installation position of the wind shield assembly 405, while allowing the wind shield assembly 405 to move up and down as needed. When the wind shield assembly 405 moves down, the area inside the rectangular box 101 where drying is performed can be blocked, thereby achieving a certain sealing effect and minimizing gas leakage.

[0037] In a further preferred embodiment of the present invention, Figure 1 and Figure 2 As shown, the windshield assembly 405 includes a mounting strip 4051 , a windshield plate 4052 is fixedly connected to the lower surface of the mounting strip 4051 , the windshield plate 4052 passes through the interior of the storage opening 404 , and a first handle 4053 is fixedly connected to the upper surface of the mounting strip 4051 .

[0038] In this embodiment, the user can control the wind shield 4052 to move up and down by cooperating with the first handle 4053 and the installation strip 4051. When the wind shield 4052 moves down, the area inside the rectangular box 101 where drying is performed can be shielded to minimize gas leakage.

[0039] In a further preferred embodiment of the present invention, Figure 1 , Figure 2 and Figure 4As shown, the filtering mechanism 8 includes a mounting plate 801 located inside the mounting port 104, an activated carbon filter plate 802 is fixedly connected to one side of the mounting plate 801, and T-shaped slide bars 803 are symmetrically fixedly connected to the upper and lower surfaces of the activated carbon filter plate 802, the symmetrically arranged T-shaped slide bars 803 are respectively slidably connected to the partition plate 2 and the rectangular box 101, and a second handle 804 is fixedly connected to the side of the mounting plate 801 away from the activated carbon filter plate 802.

[0040] In this embodiment, the user can control the installation and disassembly of the activated carbon filter plate 802 by cooperating with the second handle 804 and the mounting plate 801. The activated carbon filter plate 802 can filter the harmful gases volatilized during the drying of the solder paste to a certain extent. T-shaped slide bars 803 are symmetrically fixedly connected to the upper and lower surfaces of the activated carbon filter plate 802, so that the symmetrically arranged T-shaped slide bars 803 can limit the installation position of the activated carbon filter plate 802 between the partition plate 2 and the rectangular box 101.

[0041] The implementation principle of the solder paste drying device for PCBA patch processing in the embodiment of the present application is:

[0042] When in use, the PCBA patch that needs to dry the solder paste is placed on the push-pull rack 3, and the personnel pushes the PCBA patch to the bottom of the drying hood 4 by pushing the push-pull rack 3, and starts the drying fan 5 to convey hot air to the inside of the drying hood 4 through the air duct 6. The hot air is dispersed through the drying hood 4 to dry the solder paste. The dried gas can be conveyed to the bottom of the partition plate 2 through the exhaust channel 7, and then can be discharged to the outside after filtering by the filter mechanism 8. The set filter mechanism 8 can filter the harmful gas volatilized during the drying of the solder paste to a certain extent, thereby reducing the harm of the gas to the surrounding environment and human body, making the present application more conducive to practical use.

[0043] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A solder paste drying device for PCBA patch processing, comprising a drying box (1), characterized in that: The inner wall of the drying box (1) is fixedly connected with a partition plate (2), the upper surface of the partition plate (2) is slidably connected with a push-pull frame (3), the upper surface of the drying box (1) is fixedly connected with a drying cover (4), the upper surface of the drying cover (4) is fixedly connected with a drying fan (5), the output end of the drying fan (5) is fixedly connected with an air supply pipe (6), the end of the air supply pipe (6) away from the drying fan (5) is connected with the interior of the drying cover (4), exhaust passages (7) are symmetrically provided on both sides of the inner wall of the drying box (1), the two ends of the exhaust passage (7) are respectively connected with the upper and lower parts of the partition plate (2), and a filtering mechanism (8) is slidably connected between the bottom of the inner wall of the drying box (1) and the lower surface of the partition plate (2).

2. The solder paste drying device for PCBA patch processing according to claim 1, characterized in that: The drying box (1) comprises a rectangular box (101), the outer wall of the partition plate (2) is fixedly connected to the inner wall of the rectangular box (101), the lower surface of the drying cover (4) is fixedly connected to the upper surface of the rectangular box (101), the symmetrically arranged exhaust passages (7) are respectively opened on both sides of the inner wall of the rectangular box (101), a push-pull opening (102) is opened on the side of the rectangular box (101) away from the partition plate (2), the push-pull frame (3) is located inside the push-pull opening (102), an exhaust opening (103) penetrating the rectangular box (101) is opened on one side of the rectangular box (101), a mounting opening (104) penetrating the rectangular box (101) is opened on one side of the rectangular box (101), and the filter mechanism (8) is located inside the mounting opening (104).

3. The solder paste drying device for PCBA patch processing according to claim 1, characterized in that: The push-pull frame (3) comprises a rectangular storage plate (301) slidably placed on the upper surface of the partition plate (2), and one end of the upper surface of the rectangular storage plate (301) is fixedly connected to a rectangular push-pull plate (302).

4. The solder paste drying device for PCBA patch processing according to claim 2, characterized in that: The drying cover (4) comprises a rectangular plate (401) fixedly connected to the upper surface of the rectangular box (101); a ventilation slot (402) is provided inside the rectangular plate (401); one end of the air supply pipe (6) is connected to the ventilation slot (402); air outlet holes (403) connected to the ventilation slot (402) are evenly provided on the lower surface of the rectangular plate (401); a storage opening (404) passing through the rectangular plate (401) is provided on one side of the rectangular plate (401) close to the push-pull opening (102); a wind shielding component (405) is provided inside the storage opening (404).

5. The solder paste drying device for PCBA patch processing according to claim 2, characterized in that: The filtering mechanism (8) comprises a mounting plate (801) located inside the mounting opening (104); an activated carbon filter plate (802) is fixedly connected to one side of the mounting plate (801); T-shaped slide bars (803) are symmetrically fixedly connected to the upper and lower surfaces of the activated carbon filter plate (802); the symmetrically arranged T-shaped slide bars (803) are slidably connected to the partition plate (2) and the rectangular box (101), respectively; and a second handle (804) is fixedly connected to the side of the mounting plate (801) away from the activated carbon filter plate (802).

6. The solder paste drying device for PCBA patch processing according to claim 4, characterized in that: The windshield assembly (405) comprises a mounting strip (4051), the lower surface of the mounting strip (4051) being fixedly connected to a windshield plate (4052), the windshield plate (4052) passing through the interior of the storage opening (404), and the upper surface of the mounting strip (4051) being fixedly connected to a first handle (4053).

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