Single Beidou positioning module

Abstract

The utility model relates to a single Beidou positioning module, which comprises a plurality of interfaces, a passive antenna, a radio frequency matching circuit, a surface acoustic wave filter, a low noise amplifier, a capacitor, a crystal oscillator and a single Beidou positioning chip, and is characterized in that the single Beidou positioning chip is connected with the crystal oscillator and is sequentially connected with the capacitor and the surface acoustic wave filter through the radio frequency matching circuit; the low noise amplifier is connected with the passive antenna; the capacitor comprises a blocking capacitor, a first output end of the low noise amplifier is connected with a signal receiving interface of the surface acoustic wave filter, an output end of the surface acoustic wave filter is connected with a blocking capacitor receiving interface, and an output end of the blocking capacitor is connected with an input end of the radio frequency matching circuit. The output end of the radio frequency matching circuit is connected with the radio frequency input port of the single Beidou positioning chip. According to the single Beidou positioning module, the hardware design period is shortened, and the positioning is accurate.

Description

Technical Field

[0001] The utility model relates to the technical field of positioning, and in particular to a single Beidou positioning module. Background Art

[0002] The single Beidou positioning module is a hardware module that only uses my country's Beidou satellite for positioning. The positioning module currently commonly used on the market is a module that integrates GPS+Galileo+Beidou, and its positioning chip integrates positioning satellites from multiple countries. This is of great significance for the development of my country's satellite positioning to get rid of dependence on foreign positioning satellite systems, but in the design from chip to module, continuous debugging is required, especially the workload of radio frequency debugging is large and complicated, and it cannot be quickly transplanted to other devices for secondary development. Therefore, the present invention designs a single Beidou positioning module to solve the above problems.

[0003] Chinese patent document CN 117479106 A discloses an intelligent management and tracking system for animal husbandry, including a tracking collar, a LoraWAN gateway, a LoraWAN manager, an animal husbandry control terminal, and a smart phone APP; the tracking collar is worn on the animals raised on the ranch, and the tracking collar is connected to the LoraWAN gateway using the LoraWAN communication method; the LoraWAN gateway is set up in the ranch, the LoraWAN gateway is connected to the LoraWAN manager using the LoraWAN communication method, the LoraWAN manager is set up in the ranch management room, the LoraWAN manager is connected to the animal husbandry control terminal by electronic information, and the animal husbandry control terminal is set up in the system control center; the animal husbandry control terminal is connected to the smart phone APP The livestock management and control terminal is connected to the machine APP radio information, and the livestock management and control terminal is also connected to the web page viewing terminal for electrical information communication; the Beidou module designed in the monitoring and tracking of the technical solution is used as a part of the mainboard, and can also perform Beidou positioning, but its circuit design is not portable and cannot be used directly when a new mainboard is designed; there is no impedance matching at the chip RF port to control the VSWR (standing wave ratio) of the Beidou chip, which may result in lower efficiency when the chip is working; and no DC blocking capacitors are added between the chip and the surface acoustic wave filter, LNA (low noise amplifier) ​​and SAW (surface acoustic wave filter), which may cause the Beidou transmission signal to be interfered with by the surrounding DC signals.

[0004] Chinese patent document CN 219737784 U discloses a UAV communication positioning module based on Beidou-3 short message, including a housing, a bracket, an interface module, a power module, a Beidou-3 module, a radio frequency transceiver channel module, a navigation positioning module, an S low noise amplifier module, an L power amplifier module, a B1L1 low noise amplifier module, a tri-band antenna, and a main control module; the positioning module in the utility model can perform dual-mode positioning, realize Beidou and GPS dual synchronous positioning, and improve the positioning accuracy in a non-communication environment. And it is sent to the outside in the form of Beidou-3 short messages, and the UAV position is reported in quasi-real time to ensure the safety of flight operations. The utility model adopts an integrated structure, the host and the antenna are designed separately, and the bracket is used to install it on the UAV, which is convenient and quick to install and disassemble. The technical solution is based on the design of the Beidou-3 short message module. The communication mode and communication rate of short message communication are different from those of single Beidou communication. The power consumption of the short message module when in use is much higher than that of single Beidou positioning, which is not in the same order of magnitude and is not suitable for positioning applications in general places. For example, a battery can be used for 10 hours using a single Beidou positioning module, but less than an hour using a short message module; it is a direct application based on the existing short message module (if the communication is exactly the same, this application is equivalent to application development based on the Beidou module).

[0005] Chinese patent document CN 103532579 A discloses a Bluetooth embedded module based on Beidou communication positioning. The module is a Beidou RDSS RF transceiver chip independently developed by the company. It integrates power amplifier (PA), low noise amplifier (LNA), RF frequency conversion, baseband processing and Bluetooth data transmission in a small volume. It can be used with a mobile phone through Bluetooth to realize Beidou satellite communication and positioning functions. The description of Beidou positioning implementation in this technical solution is vague, and the implementation method of Beidou positioning is not clearly stated. It is based on Bluetooth transmission, which limits the use of Beidou.

[0006] Based on the above problems, in order to overcome the scenarios in the existing technology that have high requirements for satellite positioning security, which cannot be met by traditional multi-satellite positioning, as well as the long cycle from chip to equipment and complex hardware work, it is necessary to propose a single Beidou positioning module, which shortens the hardware design cycle and has accurate positioning. Utility Model Content

[0007] The utility model provides a single Beidou positioning module, which shortens the hardware design cycle and has accurate positioning.

[0008] In order to solve the above technical problems, the technical solution adopted by the utility model is that the single Beidou positioning module includes multiple interfaces, a passive antenna, a radio frequency matching circuit, a surface acoustic wave filter, a low-noise amplifier, a capacitor, a crystal oscillator and a single Beidou positioning chip, the single Beidou positioning chip is connected to the crystal oscillator, and the capacitor and the surface acoustic wave filter are connected in sequence through the radio frequency matching circuit; the low-noise amplifier is connected to the passive antenna.

[0009] Preferably, the capacitor includes a DC blocking capacitor, the first output end of the low-noise amplifier is connected to the signal receiving interface of the surface acoustic wave filter, the output end of the surface acoustic wave filter is connected to the DC blocking capacitor receiving interface, the output end of the DC blocking capacitor is connected to the input end of the RF matching circuit, and the output end of the RF matching circuit is connected to the RF input port of the single Beidou positioning chip.

[0010] By adopting the above technical solution, an RF matching circuit is set at the RF port of a single Beidou positioning chip for impedance matching, and a DC blocking capacitor is added to the RF transmission path, which can ensure low loss of RF signal transmission and further improve accuracy and effectiveness.

[0011] Preferably, the multiple interfaces include a passive antenna interface, the passive antenna is connected to the passive antenna interface via a capacitor and an electrostatic tube, and the passive antenna interface is connected to the input end of the low noise amplifier via an inductor.

[0012] Preferably, the multiple interfaces also include a power interface, which is used to connect an external power supply and provide voltage for the single Beidou positioning chip module.

[0013] Preferably, the crystal oscillator includes an active crystal oscillator and a passive crystal oscillator, the active crystal oscillator is connected to the crystal oscillator input pin and the power output pin of the single Beidou positioning chip through a load capacitor; the passive crystal oscillator is connected to the RTC input and output pins of the single Beidou positioning chip.

[0014] Preferably, the multiple interfaces further include a low noise amplifier control interface, which is connected to the GPIO port of the single Beidou positioning chip and is switched by the single Beidou positioning chip.

[0015] Preferably, the active crystal oscillator is a temperature compensated crystal oscillator, and the passive crystal oscillator is a standard crystal oscillator; the single Beidou positioning chip is a single Beidou positioning chip that supports BDS B1I / B1C frequency points.

[0016] Preferably, the single Beidou positioning module further includes a shielding cover, which is welded on the top of the single Beidou positioning module, and multiple interfaces are provided on the shielding cover, and the shielding cover is used to shield the interference of external signals or interference with external signals. The module integrates the shielding cover to reduce the interference of external signals on Beidou and ensure the reliability of Beidou communication.

[0017] Preferably, the single Beidou positioning module also includes a base plate, which is connected to the shielding cover to form a closed space for accommodating the single Beidou positioning module; and a plurality of data interfaces are also provided on the base plate for transmitting data.

[0018] Preferably, it also includes pads, and the pads are connected by metal wires.

[0019] Compared with the prior art, the utility model has the following beneficial effects: the single Beidou positioning module realizes modularization by controlling the standing wave ratio of the Beidou chip to be below 2, adding DC blocking capacitors, and integrating with other devices on a circuit board; the module integrates a shielding cover to reduce the interference of external signals to Beidou, thereby ensuring the reliability of Beidou communication, and being able to accelerate the progress of hardware design in product development; and the product adopts a small package SMD method for easy replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a connection diagram of a single Beidou positioning module according to an embodiment of the present utility model;

[0021] Figure 2 It is a schematic diagram of a single Beidou positioning module in an embodiment of the present utility model;

[0022] Figure 3 This is a schematic diagram of the pads being connected via metal leads in an embodiment of the utility model;

[0023] Figure 4 This is a schematic diagram of an application case based on a single Beidou module according to an embodiment of the present utility model;

[0024] Among them, 1-passive antenna interface; 2-low noise amplifier; 3-surface acoustic wave filter; 4-DC blocking capacitor; 5-RF matching circuit; 6-single Beidou positioning chip; 7-power interface; 8-active crystal oscillator; 9-passive crystal oscillator; 10-static tube; 11-passive antenna; 12-low noise amplifier control interface; 13-data interface; 14-shielding cover; 15-bottom plate; 16-metal lead; 17-soldering pad; 18-a single Beidou positioning module; 19-main control MCU. DETAILED DESCRIPTION

[0025] The technical solution is further described below in conjunction with the accompanying drawings.

[0026] Example 1: Figure 1As shown, the single Beidou positioning module 18 includes multiple interfaces, a passive antenna 11, a radio frequency matching circuit 5, a surface acoustic wave filter 3, a low noise amplifier 2, a capacitor, a crystal oscillator and a single Beidou positioning chip 6, wherein the single Beidou positioning chip 6 is connected to the crystal oscillator, and the capacitor and the surface acoustic wave filter 3 are sequentially connected through the radio frequency matching circuit 5; the low noise amplifier 2 is connected to the passive antenna 11; the multiple interfaces include a passive antenna interface 1, the passive antenna 11 is connected to the passive antenna interface 1 through a capacitor and an electrostatic tube 10, and the passive antenna interface 1 is connected to the input end of the low noise amplifier 2 through an inductor; the capacitor includes a DC blocking capacitor 4, the first output end of the low noise amplifier 2 is connected to the signal receiving interface of the surface acoustic wave filter 3, the output end of the surface acoustic wave filter 3 is connected to the receiving interface of the DC blocking capacitor 4, and the output end of the DC blocking capacitor 4 is connected The input end of the RF matching circuit 5 and the output end of the RF matching circuit 5 are connected to the RF input port of the single Beidou positioning chip 6; the multiple interfaces also include a power interface 7, and the power interface 7 is used to connect an external power supply and provide voltage for the single Beidou positioning chip module; the crystal oscillator includes an active crystal oscillator 8 and a passive crystal oscillator 9, and the active crystal oscillator 8 is connected to the crystal oscillator input pin and the power output pin of the single Beidou positioning chip 6 through a load capacitor; the passive crystal oscillator 9 is connected to the RTC input and output pins of the single Beidou positioning chip 6; the multiple interfaces also include a low-noise amplifier control interface 12, and the low-noise amplifier control interface 12 is connected to the GPIO port of the single Beidou positioning chip 6, i.e., the main control MCU, and the switch is controlled by the single Beidou positioning chip 6; the active crystal oscillator 8 is a temperature compensated crystal oscillator, and the passive crystal oscillator 9 is a standard crystal oscillator; the single Beidou positioning chip 6 supports BDS A single Beidou positioning chip with B1I / B1C frequency point, the single Beidou positioning module 18 also includes a shielding cover 14, the shielding cover 14 is welded on the top of the single Beidou positioning module 18, the shielding cover 14 is used to shield the interference of external signals or interference to external signals; the module integrates the shielding cover 14 to reduce the interference of external signals to Beidou, and ensures the reliability of Beidou communication. The single Beidou positioning module 18 also includes a base plate 15, the base plate 15 is connected to the shielding cover 14, that is, the shielding cover 14 is connected to the ground of the base plate 15 to shield interference; a closed space is formed to accommodate the single Beidou positioning module 18; the base plate 15 is also provided with a plurality of data interfaces 13 for transmitting data; it also includes a welding pad 17, and the welding pads 17 are connected by metal leads 16; the data interface 13 is used to exchange data with an external chip

[0027] Example 2: Figure 4As shown, based on the application of the single Beidou positioning module 18, that is, the fusion positioning design based on the single Beidou positioning module 18, the passive antenna 11 is connected to the passive antenna interface 1 of the single Beidou positioning module 18 through a capacitor and an electrostatic tube 10, and the main control MCU 19 is connected to the single Beidou positioning module 18 through a data interface 13; the single Beidou positioning module can be replaced and repositioned according to product design needs.

[0028] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only a specific embodiment of the utility model and is not intended to limit the utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model, such as changes in certain materials or reaction conditions, should be included in the scope of protection of the utility model.

Claims

1. A single Beidou positioning module, characterized in that: It includes multiple interfaces, a passive antenna, a radio frequency matching circuit, a surface acoustic wave filter, a low-noise amplifier, a capacitor, a crystal oscillator and a single Beidou positioning chip. The single Beidou positioning chip is connected to the crystal oscillator, and the capacitor and the surface acoustic wave filter are connected in sequence through the radio frequency matching circuit; the low-noise amplifier is connected to the passive antenna.

2. The single Beidou positioning module according to claim 1, characterized in that: The capacitor includes a DC blocking capacitor, the first output end of the low-noise amplifier is connected to the signal receiving interface of the surface acoustic wave filter, the output end of the surface acoustic wave filter is connected to the DC blocking capacitor receiving interface, the output end of the DC blocking capacitor is connected to the input end of the RF matching circuit, and the output end of the RF matching circuit is connected to the RF input port of the single Beidou positioning chip.

3. The single Beidou positioning module according to claim 1, characterized in that: The multiple interfaces include a passive antenna interface, the passive antenna is connected to the passive antenna interface via a capacitor and an electrostatic tube, and the passive antenna interface is connected to the input end of the low noise amplifier via an inductor.

4. The single Beidou positioning module according to claim 3, characterized in that: The multiple interfaces also include a power interface, which is used to connect an external power supply and provide voltage for the single Beidou positioning chip module.

5. The single Beidou positioning module according to claim 3, characterized in that: The crystal oscillator includes an active crystal oscillator and a passive crystal oscillator. The active crystal oscillator is connected to the crystal oscillator input pin and the power output pin of the single Beidou positioning chip through a load capacitor; the passive crystal oscillator is connected to the RTC input and output pin of the single Beidou positioning chip.

6. The single Beidou positioning module according to claim 3, characterized in that: The multiple interfaces also include a low noise amplifier control interface, which is connected to the GPIO port of the single Beidou positioning chip and is controlled by the single Beidou positioning chip.

7. The single Beidou positioning module according to claim 5, characterized in that: The active crystal oscillator is a temperature compensated crystal oscillator, and the passive crystal oscillator is a standard crystal oscillator; the single Beidou positioning chip is a single Beidou positioning chip that supports BDS B1I / B1C frequency points.

8. The single Beidou positioning module according to claim 3, characterized in that: The single Beidou positioning module also includes a shielding cover, which is welded on the top of the single Beidou positioning module, and is used to shield interference from external signals or interference with external signals.

9. The single Beidou positioning module according to claim 8, characterized in that: The single Beidou positioning module also includes a base plate, which is connected to the shielding cover to form a closed space for accommodating the single Beidou positioning module; the base plate is also provided with a plurality of data interfaces for transmitting data.

10. The single Beidou positioning module according to claim 9, characterized in that: It also includes pads, which are connected by metal wires.

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