TAIKO wafer film tearing device

Abstract

The utility model discloses a TAIKO wafer film tearing device, which comprises a wafer mounting seat and a movable pressing block, the wafer mounting seat comprises a wafer placing table top and a movable pressing block, the middle of the wafer placing table top is provided with a groove, the periphery of the wafer placing table top is provided with a circle of annular supporting surface, the groove is internally provided with a first vent hole which is in a positive pressure state, the annular supporting surface is provided with a second vent hole which is in a positive pressure state, and the second vent hole is in a negative pressure state. The second vent hole is in a negative pressure state; a pressing fork at the front end of the pressing block can be lapped above the annular supporting face, the film tearing station comprises an auxiliary film and a film feeding mechanism driving the auxiliary film to rotate, and a liftable heating block is arranged on the side face of the film feeding mechanism. According to the utility model, the positive pressure vent hole is arranged at the groove in the middle of the wafer placing table top, so that the thinned part of the wafer can be jacked up under the condition that the wafer is not contacted, supporting force is provided for the wafer, and the wafer is prevented from being damaged in the film tearing process; and the negative pressure vent holes are formed in the annular supporting surface at the edge of the wafer placing table surface, so that the wafer can be firmly adsorbed and is prevented from moving.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer film tearing, in particular to a TAIKO wafer film tearing device. Background Art

[0002] When wafers come out of the wafer manufacturing plant, they are relatively thick. When packaging, the wafers need to be thinned to adapt to smaller packaging sizes. When the wafer is thinned, in order to protect the circuit layer of the wafer, a film will be attached to the circuit layer of the wafer to protect the wafer from scratches and contamination during thinning and grinding. After the wafer is thinned, this protective film needs to be removed, and the wafer must not be damaged during removal.

[0003] The Taiko process means that when the wafer is thinned, the edge of the wafer is retained and only the inner circle of the wafer is ground and thinned. The thinned wafer is disc-shaped and the edge of the wafer has high-strength support to prevent the wafer from warping. Therefore, after the Taiko wafer is thinned, the protective film on the front side needs to be removed. At this time, the thinned part of the wafer is relatively fragile and needs to be supported when the film is torn off to avoid damage to the Taiko wafer. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a TAIKO wafer film tearing device, which can quickly tear the film without damaging the wafer.

[0005] To this end, the technical solution of the utility model is: a TAIKO wafer film tearing device, comprising:

[0006] The wafer mounting seat comprises a wafer placing table and a movable pressing block, wherein a groove is provided in the middle of the wafer placing table and a ring-shaped supporting surface is provided around the groove, a first vent hole is provided in the groove and the first vent hole is in a positive pressure state, and a second vent hole is provided on the ring-shaped supporting surface and the second vent hole is in a negative pressure state; the pressure fork at the front end of the pressing block can be placed above the ring-shaped supporting surface;

[0007] UV degumming station, including a movable degumming table and a UV degumming mechanism;

[0008] Material transfer robot, which transfers wafers between the disintegration table and the wafer mounting seat;

[0009] The film tearing station comprises an auxiliary film and a film feeding mechanism for driving the auxiliary film to rotate. A liftable heating block is arranged on the side of the film feeding mechanism, and a film pulling mechanism is arranged below the film feeding mechanism.

[0010] On the basis of the above scheme and as a preferred scheme of the above scheme: the groove in the middle of the wafer placement table is adapted to the diameter of the thinned part of the wafer, and the first vent hole pushes the thinned part of the wafer upward; the annular support surface is opposite to the step ring of the wafer, and the second vent hole adsorbs the step ring of the wafer.

[0011] On the basis of the above scheme and as a preferred scheme of the above scheme: the pressing block is installed on a pressing block cylinder, and the pressing block cylinder drives the pressing block to move toward the annular supporting surface and press on the step ring of the wafer.

[0012] On the basis of the above scheme and as a preferred scheme of the above scheme: the wafer mounting seat is arranged on the first guide rail, and the first driving mechanism drives the wafer mounting seat to move along the first guide rail to the film tearing station.

[0013] On the basis of the above solution and as a preferred solution of the above solution: the film feeding mechanism is further provided with a film cutting blade which can be translated.

[0014] On the basis of the above scheme and as a preferred scheme of the above scheme: the film-drawing mechanism includes a chuck and a film-drawing cylinder for controlling the movement of the chuck, and the end of the auxiliary film is fixed on the chuck.

[0015] On the basis of the above scheme and as a preferred scheme of the above scheme: two clamping rollers that can be opened and closed horizontally are arranged under the film-drawing mechanism, and the heating block can pass through the middle of the two clamping rollers and move downward.

[0016] When using:

[0017] 1) Place the Taiko wafer on the disassembly table, which drives the wafer under the UV disassembly mechanism, and disassembles the film through the UV lamp;

[0018] 2) The wafer after debonding is transferred to the wafer placement table by the material transfer robot. The first vent hole in the middle groove of the wafer placement table is in a positive pressure state, which can push up the thinned part of the wafer; while the second vent hole on the annular support surface is in a negative pressure state, firmly adsorbing the unthinned step ring of the wafer, which not only fixes the wafer but also provides support for the thinned part of the wafer without contact; at this time, the pressing block is located on the side away from the annular support surface.

[0019] 3) The wafer mounting seat is driven by the first driving mechanism to move below the heating block of the film tearing station;

[0020] 4) The film feeding mechanism works, the auxiliary film is wound on the expansion roller and fed out by the expansion roller, and the end of the auxiliary film passes through two separate clamping rollers and is clamped by the film pulling mechanism;

[0021] 5) The heating block moves down and drives the auxiliary film to pass through the two clamping rollers and fit with the thin film on the wafer. The heating block heats and the auxiliary film and the thin film are fixed by hot melting;

[0022] 6) The heating block moves up, the film cutting blade cuts the auxiliary film, and the clamping roller closes to fix the auxiliary film remaining on the wafer;

[0023] 7) The wafer moves with the wafer mount, while the thin film is fixed by two clamping rollers through the auxiliary film and separated from the wafer;

[0024] 8) After the thin film on the wafer is torn off a short distance, the pressing block moves toward one side of the wafer under the action of the pressing block cylinder, so that the pressing fork of the pressing block presses on the wafer step ring with the film torn off, pressing the wafer;

[0025] 9) The wafer mounting seat continues to translate until the thin film on the wafer is completely torn off, thereby completing the wafer film tearing operation.

[0026] Compared with the prior art, the beneficial effects of the utility model are:

[0027] 1. A positive pressure vent hole is set in the middle groove of the wafer placement table, which can lift the thinned part of the wafer without contact, provide support to the wafer, and prevent the wafer from being damaged during the film tearing process; a negative pressure vent hole is set on the annular support surface at the edge of the wafer placement table, which can firmly adsorb the wafer to prevent the wafer from moving.

[0028] 2. A pressure block is set on the side of the wafer placement table. After a part of the film is torn off, the pressure block can press the step ring of the wafer so that the wafer will not be moved during the separation process of the film and the wafer.

[0029] 3. Hot-melt a section of auxiliary film on the wafer film, and use the auxiliary film to separate the thinning film from the wafer. The thinning film can be easily torn off without damaging the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of the utility model;

[0031] Figure 2 It is a schematic diagram of the structure of the utility model (another orientation);

[0032] Figure 3 It is a structural front view of the utility model;

[0033] Figure 4 This is a schematic diagram of the structure of the wafer mounting seat of the utility model;

[0034] Figure 5 for Figure 4 A partial enlarged view of

[0035] Figure 6 It is a top view of the structure of the wafer mounting seat of the utility model.

[0036] Marked in the figure are: wafer mounting seat 1, base 11, wafer placing table 12, pressing block 13, groove 14, first ventilation hole 15, annular supporting surface 16, second ventilation hole 17, pressing block cylinder 18, UV degumming station 2, degumming table 21, UV degumming mechanism 22, linear drive module 23, material transfer robot 3, moving track 31, film tearing station 4, film feeding mechanism 41, expansion roller 42, film cutting mechanism 43, film pulling mechanism 44, clamping roller 45, heating and welding mechanism 46, first drive mechanism 5. DETAILED DESCRIPTION

[0037] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present invention.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "several" and "a number" is two or more, unless otherwise clearly and specifically defined.

[0039] See the attached drawings. The TAIKO wafer film tearing device described in this embodiment comprises: a wafer mounting seat 1 , a UV debonding station 2 , a material transfer robot 3 and a film tearing station 4 .

[0040] The UV degumming station 2 includes a movable degumming table 21 and a UV degumming mechanism 22. The degumming table 21 is set on a linear driving module 23 and can be moved to the bottom of the UV degumming mechanism 22. A through hole is provided on the degumming table 21, and the through hole is in a negative pressure state, which can adsorb and fix the wafer, and send the wafer to the bottom of the UV degumming mechanism 22 for irradiation with UV lamp for degumming.

[0041] A material transfer robot 3 is provided between the debonding table 21 and the wafer mounting seat 1 . The material transfer robot 3 is installed on a moving track 31 . A Bernoulli suction cup is provided below the material transfer robot 3 to transfer the wafer between the debonding table 21 and the wafer mounting seat 1 .

[0042] The wafer mounting seat 1 includes a base 11, a wafer placement table 12 and a pressing block 13. The wafer placement table 12 is located at the top of the base. A groove 14 is provided in the middle of the wafer placement table 12. A first vent 15 is provided in the groove 14. The first vent 15 is in a positive pressure state. The groove 14 in the middle of the wafer placement table 12 is adapted to the diameter of the wafer thinning portion. The first vent 15 can lift the wafer thinning portion upward. A ring-shaped supporting surface 16 is provided around the wafer placement table 12. A second vent 17 is provided on the ring-shaped supporting surface 16. The second vent 17 is in a negative pressure state. The ring-shaped supporting surface 16 is opposite to the step ring of the wafer. The second vent 17 can absorb the step ring of the wafer through negative pressure, thereby fixing the wafer.

[0043] A pressing block cylinder 18 is installed on the base 1, and the pressing block 13 is installed on the output shaft of the pressing block cylinder 18. The pressing block cylinder 18 can drive the pressing block 13 to move toward the annular supporting surface 16, so that the front end pressure fork of the pressing block 13 can be placed above the annular supporting surface 16 and pressed on the step ring of the wafer, pressing the wafer when tearing the film to prevent the wafer from shaking.

[0044] The wafer mounting seat 1 is mounted on the first driving mechanism 5 and can be driven by the first driving mechanism 5 to move to the film tearing station 4 for film tearing operation. A slider is provided at the bottom of the wafer mounting seat 1 and can be slidably arranged on the first guide rail. The first driving mechanism includes a driving motor and a screw rod, which can drive the wafer mounting seat to move along the first guide rail to the film tearing station.

[0045] The film tearing station 4 includes an auxiliary film and a film feeding mechanism 41 for driving the auxiliary film to rotate. The film feeding mechanism includes an expansion roller 42. The auxiliary film roll is fixed on the expansion shaft and driven to rotate by the torque motor to release the auxiliary film. The film feeding mechanism 41 is also provided with a film cutting mechanism 43. The film cutting mechanism is provided with a film cutting blade that can be translated to cut the auxiliary film. A film pulling mechanism 44 is provided below the film feeding mechanism 41, including a chuck and a film pulling cylinder for controlling the movement of the chuck. The end of the auxiliary film can be fixed on the chuck. Two clamping rollers 45 that can be opened and closed horizontally are provided below the film pulling mechanism 44.

[0046] A heating welding mechanism 46 is disposed on the side of the film feeding mechanism 41. The heating welding mechanism includes a liftable heating block. The heating block can move downward from between two clamping rollers to heat-melt and fix the auxiliary film and the thin film.

[0047] When using:

[0048] 1) Place the Taiko wafer on the disassembly table 21, which drives the wafer to enter under the UV disassembly mechanism 22, and disassembles the film by UV lamp;

[0049] 2) The wafer after debonding is transferred to the wafer placement table 12 by the material transfer robot 3. The first vent hole 15 of the middle groove 14 of the wafer placement table 12 is in a positive pressure state, which can push up the thinned part of the wafer; while the second vent hole 17 on the annular support surface 16 is in a negative pressure state, firmly adsorbing the unthinned step ring of the wafer, which not only fixes the wafer but also provides support for the thinned part of the wafer without contact; at this time, the pressing block 13 is located on the side away from the annular support surface 16,

[0050] 3) The wafer mounting seat 1 is driven by the first driving mechanism 5 to move below the heating block of the film tearing station 4;

[0051] 4) The film feeding mechanism 41 works, the auxiliary film is wound on the expansion roller 42, and is fed out by the expansion roller 42. The end of the auxiliary film passes through two separate clamping rollers 45 and is clamped by the film pulling mechanism 44;

[0052] 5) The heating block in the heating welding mechanism 46 moves downward, and drives the auxiliary film to pass between the two clamping rollers 45, and fits with the thin film on the wafer. The heating block is heated, and the auxiliary film and the thin film are fixed by hot melting;

[0053] 6) The heating block moves up, the film cutting blade cuts the auxiliary film, and the clamping roller closes to fix the auxiliary film remaining on the wafer;

[0054] 7) The wafer moves with the wafer mount, while the thin film is fixed by two clamping rollers through the auxiliary film and separated from the wafer;

[0055] 8) After the thin film on the wafer is torn off a short distance, the pressing block 13 moves toward one side of the wafer under the action of the pressing block cylinder, so that the pressing fork of the pressing block presses on the wafer step ring where the film is torn off, pressing the wafer;

[0056] 9) The wafer mounting seat 1 continues to translate until the thin film on the wafer is completely torn off, thereby completing the wafer film tearing operation.

[0057] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A TAIKO wafer film tearing device, characterized in that: include: The wafer mounting seat comprises a wafer placing table and a movable pressing block, wherein a groove is provided in the middle of the wafer placing table and a ring-shaped supporting surface is provided around the groove, a first vent hole is provided in the groove and the first vent hole is in a positive pressure state, and a second vent hole is provided on the ring-shaped supporting surface and the second vent hole is in a negative pressure state; the pressure fork at the front end of the pressing block can be placed above the ring-shaped supporting surface; UV degumming station, including a movable degumming table and a UV degumming mechanism; Material transfer robot, which transfers wafers between the disintegration table and the wafer mounting seat; The film tearing station comprises an auxiliary film and a film feeding mechanism for driving the auxiliary film to rotate. A liftable heating block is arranged on the side of the film feeding mechanism, and a film pulling mechanism is arranged below the film feeding mechanism.

2. A TAIKO wafer film tearing device as claimed in claim 1, characterized in that: The groove in the middle of the wafer placement table is adapted to the diameter of the thinned portion of the wafer, and the first vent hole pushes the thinned portion of the wafer upward; the annular support surface is opposite to the step ring of the wafer, and the second vent hole absorbs the step ring of the wafer.

3. A TAIKO wafer film tearing device as claimed in claim 2, characterized in that: The pressing block is mounted on a pressing block cylinder, and the pressing block cylinder drives the pressing block to move toward the annular supporting surface and press on the step ring of the wafer.

4. A TAIKO wafer film tearing device as claimed in claim 1, characterized in that: The wafer mounting seat is arranged on the first guide rail, and the first driving mechanism drives the wafer mounting seat to move along the first guide rail to the film tearing station.

5. A TAIKO wafer film tearing device as claimed in claim 1, characterized in that: The film feeding mechanism is also provided with a film cutting blade which can be translated.

6. A TAIKO wafer film tearing device as claimed in claim 1, characterized in that: The film-drawing mechanism comprises a clamp and a film-drawing cylinder for controlling the movement of the clamp, and the end of the auxiliary film is fixed on the clamp.

7. A TAIKO wafer film tearing device as claimed in claim 1, characterized in that: Two clamping rollers which can be opened and closed horizontally are arranged below the film-drawing mechanism, and the heating block can pass through between the two clamping rollers and move downward.

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