Semiconductor chip curing processing device

Abstract

The utility model relates to the technical field of semiconductor chip processing, in particular to a semiconductor chip curing processing device which comprises a curing box, a transmission rod, a transmission belt, a bearing component and a feeding and discharging port, a storage box is arranged at the upper end of one side of the curing box, a penetrating type lead screw motor is installed on the outer side of the storage box, and the lead screw motor is connected with the transmission rod. And a lead screw is arranged in the penetrating type lead screw motor, a heating plate is installed on one side of the lead screw, the bearing component comprises a fixing plate, and a balance plate is arranged on the inner side of the fixing plate. The bearing component moves in the curing box, continuous feeding and discharging operation can be completed through the bearing component, the processing speed of the semiconductor chip is increased, the semiconductor chip is preheated through heat in the curing box, and the cooling speed after curing is reduced. Cracks on the manufactured semiconductor chip caused by too fast cooling and heating of the semiconductor material are avoided, and the curing effect of the semiconductor chip is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a semiconductor chip curing processing device. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. However, the processing difficulty of semiconductor chips is also huge, and it requires the cooperation of a variety of scientific and technological equipment, including a curing treatment box, which is used to cure the semiconductor chips after injection molding and packaging, so as to make the chip performance more complete. For example, a Chinese patent discloses a semiconductor chip curing treatment box (authorization announcement number CN219106083U). This patented technology can heat the bottom and top surfaces of the semiconductor chip respectively through the bottom heating plate and the top heating plate. Through the cooperation of the air pipe and the air pump, the hot gas in the chamber forms a certain fluidity to achieve the purpose of uniform temperature in the box. The automatic feeding or withdrawal of semiconductor chips can be realized through the feeding component;

[0003] However, the existing disclosed semiconductor chip curing processing device still has some defects that need to be improved in practical application, such as:

[0004] First, each time the material is loaded and unloaded, the device needs to be stopped, and the curing operation is interrupted, which is time-consuming and labor-intensive, affecting the processing efficiency of semiconductor chips;

[0005] Secondly, when the semiconductor chip is heated directly after placing the material, it heats up slowly and cools quickly, resulting in a large change in the morphology of the semiconductor material, and cracks are easily formed on the semiconductor chip, which is not conducive to the curing effect of the semiconductor chip. Therefore, those skilled in the art provide a semiconductor chip curing processing device to solve the problems raised in the above background technology. Utility Model Content

[0006] The purpose of the utility model is to provide a semiconductor chip curing processing device to solve the problems raised in the above background technology.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A semiconductor chip curing processing device comprises a curing box, a transmission rod, a transmission belt, a bearing member and an inlet and outlet, wherein the transmission rod is located at an inner outer end position of the curing box, the transmission belt is located at an outer position of the transmission rod, the bearing member is located at an outer position of the transmission belt, the inlet and outlet are located at a lower end position on one side of the curing box, a storage box is provided at an upper end position on one side of the curing box, a through-type screw motor is installed on the outer side of the storage box, a screw is provided inside the through-type screw motor, and a heating plate is installed on one side of the screw;

[0009] The bearing member comprises a fixing plate, a balancing plate is arranged inside the fixing plate, a tilt sensor is installed on the lower side of the balancing plate, a slide rail is arranged on the upper side of the balancing plate, and a positioning member is arranged outside the slide rail.

[0010] As a further solution of the utility model: a first motor is installed at the position of the balance plate on the front side of the fixing plate, a second motor is installed at the position of the transmission rod on the front side of the curing box, the positioning component includes a positioning plate, electric adjustable telescopic rods are installed at both ends of the positioning plate, a push plate is provided at the inner end of the electric adjustable telescopic rod, a sliding sleeve is provided on the lower side of the positioning plate, a notch is provided at one end of the upper side of the sliding sleeve, a mounting plate is provided at the upper side of the sliding sleeve adjacent to the notch, a gear is provided on the inner side of the mounting plate, a third motor is installed at the position of the gear on the front side of the mounting plate, and a tooth groove is provided on the upper side of the slide rail.

[0011] As a further solution of the utility model: the transmission rod is rotated at an internal position of the curing box, and the transmission belt is rotated at an internal position of the curing box through the transmission rod.

[0012] As a further solution of the utility model: the outer end of the screw rod slides at the outer end position of the storage box, the screw rod slides at the inner position of the storage box through a through-type screw rod motor, and the heating plate slides at the inner position of the storage box through the screw rod.

[0013] As a further solution of the utility model: the balancing plate rotates at the inner side of the fixing plate, and the positioning member slides at the outer side of the slide rail.

[0014] As a further solution of the utility model: the transmission rod is rotated to an inner position of the curing box by the second motor, and the balance plate is rotated to an inner position of the fixed plate by the first motor.

[0015] As a further solution of the utility model: the sliding sleeve slides at the outer position of the sliding rail, the push plate slides at the upper position of the positioning plate through the electric adjustment telescopic rod, the gear is rotated at the inner position of the mounting plate through the third motor, and the outer side of the gear is located at the upper position of the tooth groove.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. A semiconductor chip curing processing device, wherein a carrying member moves inside a curing box, and the carrying member can complete uninterrupted loading and unloading operations, thereby improving the processing speed of semiconductor chips and facilitating the processing efficiency of semiconductor chips;

[0018] 2. A semiconductor chip curing processing device, which preheats the semiconductor chip through the heat inside the curing box and reduces the cooling rate after curing, thereby avoiding the occurrence of cracks on the semiconductor chip after manufacture due to the semiconductor material cooling and heating too quickly, and improving the curing effect of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a semiconductor chip curing processing device;

[0020] Figure 2 A perspective view of a semiconductor chip curing processing device;

[0021] Figure 3 It is a structural schematic diagram of a bearing component in a semiconductor chip curing processing device;

[0022] Figure 4 It is a structural schematic diagram of a positioning component in a semiconductor chip curing processing device;

[0023] Figure 5 A semiconductor chip curing processing device Figure 3 Schematic diagram of the structure of part A.

[0024] In the figure: 1. curing box; 2. transmission rod; 3. transmission belt; 4. bearing member; 5. inlet and outlet; 6. storage box; 7. through-type screw motor; 8. screw; 9. heating plate; 10. fixing plate; 11. balance plate; 12. slide rail; 13. positioning member; 14. inclination sensor; 15. first motor; 16. second motor; 17. positioning plate; 18. electric adjustable telescopic rod; 19. push plate; 20. sliding sleeve; 21. notch; 22. mounting plate; 23. gear; 24. third motor; 25. tooth groove. DETAILED DESCRIPTION

[0025] See also Figures 1 to 5In the embodiment of the utility model, a semiconductor chip curing processing device includes a curing box 1, a transmission rod 2, a transmission belt 3, a bearing member 4 and an inlet and outlet 5. The transmission rod 2 is located at the inner outer end position of the curing box 1, the transmission belt 3 is located at the outer position of the transmission rod 2, the bearing member 4 is located at the outer position of the transmission belt 3, the inlet and outlet 5 is located at the lower end position of one side of the curing box 1, and a storage box 6 is provided at the upper end position of one side of the curing box 1. A through-type screw motor 7 is installed on the outside of the storage box 6, and a screw 8 is provided inside the through-type screw motor 7. A heating plate 9 is installed on one side of the screw 8. The bearing member 4 includes a fixing plate 10, and a balancing plate 11 is provided on the inner side of the fixing plate 10. The balancing plate An inclination sensor 14 is installed on the lower side of 11, a slide rail 12 is arranged on the upper side of the balance plate 11, and a positioning member 13 is arranged on the outer side of the slide rail 12. The transmission rod 2 rotates at the internal position of the curing box 1, and the transmission belt 3 rotates at the internal position of the curing box 1 through the transmission rod 2. The outer end of the screw rod 8 slides at the outer end position of the storage box 6, and the screw rod 8 slides at the internal position of the storage box 6 through the through-type screw motor 7. The heating plate 9 slides at the internal position of the storage box 6 through the screw rod 8. The balance plate 11 rotates at the inner side of the fixed plate 10, and the positioning member 13 slides at the outer side of the slide rail 12. First, the device is started, and the bearing member 4 near the inlet and outlet 5 runs, and the positioning member 13 is The outer side of the slide rail 12 slides, and the positioning member 13 slides out of the inlet and outlet 5. The semiconductor chip to be cured is placed on the upper side of the positioning member 13, and the semiconductor chip is fixed. The positioning member 13 slides into the inlet and outlet 5, and the transmission rod 2 rotates inside the curing box 1. The transmission rod 2 drives the bearing member 4 to move inside the curing box 1 through the transmission belt 3. The inclination sensor 14 detects the angle of the balance plate 11, and the balance plate 11 rotates inside the fixed plate 10 to keep the balance plate 11 horizontal inside the curing box 1. The heating plate 9 operates to heat the inside of the storage box 6, and the heat enters the inside of the curing box 1 to preheat the semiconductor chip on the bearing member 4. When the bearing member 4 moves to the position of the storage box 6, the transmission rod 2 stops. The operation stops, the through-type screw motor 7 drives the screw 8 to slide at the outer end of the storage box 6, the screw 8 drives the heating plate 9 to move to the upper side of the bearing member 4, and the semiconductor chip is heated and cured by the heating plate 9. During the curing process, the first bearing member 4 moves to the position of the inlet and outlet 5 for loading operation. After the curing is completed, the through-type screw motor 7 runs and drives the screw 8 to slide at the outer end of the storage box 6, the screw 8 drives the heating plate 9 to move to the inside of the storage box 6, the transmission rod 2 rotates inside the curing box 1, and the transmission rod 2 drives the bearing member 4 to move inside the curing box 1 through the transmission belt 3. The cured semiconductor chip cools down slowly, and the cooled semiconductor chip is taken out through the inlet and outlet 5 and loaded again.

[0026] exist Figure 2 , 34 and 5: a first motor 15 is installed at a position of the front side of the fixing plate 10 corresponding to the position of the balancing plate 11, a second motor 16 is installed at a position of the front side of the curing box 1 corresponding to the position of the transmission rod 2, the positioning member 13 includes a positioning plate 17, electric adjustment telescopic rods 18 are installed at both ends of the positioning plate 17, a push plate 19 is provided at the inner end of the electric adjustment telescopic rod 18, a sliding sleeve 20 is provided at the lower side of the positioning plate 17, a notch 21 is provided at one end of the upper side of the sliding sleeve 20, and the upper side of the sliding sleeve 20 is adjacent to the A mounting plate 22 is provided near the notch 21, a gear 23 is provided inside the mounting plate 22, a third motor 24 is provided at the position corresponding to the gear 23 on the front side of the mounting plate 22, a tooth groove 25 is provided on the upper side of the slide rail 12, the transmission rod 2 is rotated at the inner position of the curing box 1 by the second motor 16, the balance plate 11 is rotated at the inner position of the fixed plate 10 by the first motor 15, the sliding sleeve 20 slides at the outer position of the slide rail 12, and the push plate 19 slides by the electric adjustment telescopic rod 18 At the upper side of the positioning plate 17, the gear 23 is rotated at the inner side of the mounting plate 22 by the third motor 24, and the outer side of the gear 23 is located at the upper side of the tooth groove 25. The device is started, and the bearing member 4 near the inlet and outlet 5 runs. The third motor 24 drives the gear 23 to rotate inside the mounting plate 22, and the gear 23 rolls inside the third motor 24, driving the sleeve 20 to slide on the outer side of the slide rail 12, and the positioning member 13 slides out of the inlet and outlet 5, and the semiconductor chip to be cured is placed on the upper side of the positioning plate 17. The electric adjustment telescopic rod 18 runs to push the push plate 19 to move and fix the semiconductor chip. The third motor 24 drives the gear 23 to rotate in the opposite direction inside the mounting plate 22, and the gear 23 rolls inside the third motor 24, driving the sleeve 20 to slide on the outer side of the slide rail 12, and the positioning member 13 slides into the inlet and outlet 5. The second motor 16 runs to drive the transmission rod 2 to rotate inside the curing box 1, and the transmission rod 2 drives the bearing member 4 to move inside the curing box 1 through the transmission belt 3.

[0027] The working principle of the utility model is as follows: first, the device is started, the bearing member 4 near the inlet and outlet 5 is operated, the third motor 24 drives the gear 23 to rotate inside the mounting plate 22, the gear 23 rolls inside the third motor 24, drives the sleeve 20 to slide on the outside of the slide rail 12, the positioning member 13 slides out of the inlet and outlet 5, and the semiconductor chip to be cured is placed on the upper side of the positioning plate 17, the electric adjustment telescopic rod 18 runs to push the push plate 19 to move and fix the semiconductor chip, the third motor 24 drives the gear 23 to rotate in the opposite direction inside the mounting plate 22, the gear 23 rolls inside the third motor 24, drives the sleeve 20 to slide on the outside of the slide rail 12, the positioning member 13 slides into the inlet and outlet 5, the second motor 16 runs to drive the transmission rod 2 to rotate inside the curing box 1, the transmission rod 2 drives the bearing member 4 to move inside the curing box 1 through the transmission belt 3, the inclination sensor 14 detects the angle of the balance plate 11, and the first motor 15 runs to drive the balance plate 11 to rotate inside the fixed plate 10 The balance plate 11 is kept horizontally inside the curing box 1, and the heating plate 9 is operated to heat the inside of the storage box 6. The heat enters the inside of the curing box 1 to preheat the semiconductor chip on the bearing member 4. When the bearing member 4 moves to the position of the storage box 6, the transmission rod 2 stops running, and the through-type screw motor 7 runs to drive the screw 8 to slide at the outer end of the storage box 6, and the screw 8 drives the heating plate 9 to move to the upper side of the bearing member 4, and the semiconductor chip is heated and cured by the heating plate 9. During the curing process, the first bearing member 4 moves to the position of the inlet and outlet 5 for loading operation. After the curing is completed, the through-type screw motor 7 runs to drive the screw 8 to slide at the outer end of the storage box 6, and the screw 8 drives the heating plate 9 to move to the inside of the storage box 6. The second motor 16 runs to drive the transmission rod 2 to rotate inside the curing box 1, and the transmission rod 2 drives the bearing member 4 to move inside the curing box 1 through the transmission belt 3. The cured semiconductor chip cools down slowly, and the cooled semiconductor chip is taken out through the inlet and outlet 5 and loaded again.

[0028] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor chip curing processing device, characterized in that: The invention comprises a curing box (1), a transmission rod (2), a transmission belt (3), a bearing member (4) and an inlet and outlet (5), wherein the transmission rod (2) is located at an inner outer end position of the curing box (1), the transmission belt (3) is located at an outer position of the transmission rod (2), the bearing member (4) is located at an outer position of the transmission belt (3), the inlet and outlet (5) is located at a lower end position on one side of the curing box (1), a storage box (6) is provided at an upper end position on one side of the curing box (1), a through-type screw motor (7) is installed on the outer side of the storage box (6), a screw (8) is provided inside the through-type screw motor (7), and a heating plate (9) is installed on one side of the screw (8); The bearing member (4) comprises a fixing plate (10), a balancing plate (11) is arranged on the inner side of the fixing plate (10), an inclination sensor (14) is installed on the lower side of the balancing plate (11), a slide rail (12) is arranged on the upper side of the balancing plate (11), and a positioning member (13) is arranged on the outer side of the slide rail (12).

2. A semiconductor chip curing processing device according to claim 1, characterized in that: A first motor (15) is installed at a position on the front side of the fixing plate (10) corresponding to the position of the balancing plate (11), a second motor (16) is installed at a position on the front side of the curing box (1) corresponding to the position of the transmission rod (2), the positioning member (13) comprises a positioning plate (17), electric adjustable telescopic rods (18) are installed at both ends of the positioning plate (17), a push plate (19) is provided at the inner end of the electric adjustable telescopic rod (18), a sliding sleeve (20) is provided at the lower side of the positioning plate (17), a notch (21) is provided at one end of the upper side of the sliding sleeve (20), a mounting plate (22) is provided at a position on the upper side of the sliding sleeve (20) adjacent to the notch (21), a gear (23) is provided on the inner side of the mounting plate (22), a third motor (24) is installed at a position on the front side of the mounting plate (22) corresponding to the gear (23), and a tooth groove (25) is provided on the upper side of the slide rail (12).

3. A semiconductor chip curing processing device according to claim 1, characterized in that: The transmission rod (2) rotates at an internal position of the curing box (1), and the transmission belt (3) rotates at an internal position of the curing box (1) via the transmission rod (2).

4. A semiconductor chip curing processing device according to claim 1, characterized in that: The outer end of the screw rod (8) slides at the outer end position of the storage box (6), the screw rod (8) slides at the inner position of the storage box (6) through the through-type screw rod motor (7), and the heating plate (9) slides at the inner position of the storage box (6) through the screw rod (8).

5. The semiconductor chip curing processing device according to claim 1, characterized in that: The balancing plate (11) rotates at an inner position of the fixing plate (10), and the positioning member (13) slides at an outer position of the slide rail (12).

6. A semiconductor chip curing processing device according to claim 2, characterized in that: The transmission rod (2) is rotated to an inner position of the curing box (1) by a second motor (16), and the balance plate (11) is rotated to an inner position of the fixed plate (10) by a first motor (15).

7. A semiconductor chip curing processing device according to claim 2, characterized in that: The sliding sleeve (20) slides at an outer position of the sliding rail (12), the push plate (19) slides at an upper position of the positioning plate (17) through an electrically adjustable telescopic rod (18), the gear (23) rotates at an inner position of the mounting plate (22) through a third motor (24), and the outer side of the gear (23) is located at an upper position of the tooth groove (25).

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