Feeding structure for wafer testing equipment
By designing the loading structure for wafer testing equipment, including placement components, loading components and rotating components, the problem of poor wafer conveying effect is solved, the loading efficiency is improved, and the continuous loading of wafers is achieved.
Patent Information
- Application Number
- CN202422073449.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-26
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-26
AI Technical Summary
The prior art has poor results in wafer conveying process, resulting in low loading efficiency.
A feeding structure for wafer testing equipment is designed, including placement assembly, feeding assembly and rotary assembly. The placement assembly is used to place the wafer to be tested. The loading assembly is driven by the rotating assembly to be rotated and transported to achieve continuous loading of the wafer.
Through this feeding structure, the feeding efficiency of the wafer is improved, the problem of poor conveying effect is solved, and the continuous feeding and testing of the wafer is facilitated.
Smart Images
Figure CN222953063U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer testing, in particular to a feeding structure for wafer testing equipment. Background Art
[0002] A wafer, also known as a silicon slice, is a thin, round, high-purity silicon chip. It is the basic material for manufacturing integrated circuits (ICs). Various tiny circuit component structures, such as transistors, capacitors, and resistors, can be processed and produced on the surface of the wafer through semiconductor processes such as photolithography and etching, thereby forming IC products with specific electronic functions. The wafer manufacturing process is very complicated, including single crystal growth, cutting, polishing and other steps. After the wafer is manufactured, photolithography, etching, ion implantation, chemical vapor deposition and other processes will be performed on its surface to form a circuit pattern.
[0003] Regarding the above-mentioned related technologies, the inventors believe that the following defects exist: although the wafers can be transported, the transport effect is poor, which makes it inconvenient to load the wafers continuously, thereby reducing the loading efficiency. Therefore, we propose a loading structure for wafer testing equipment to solve the above-mentioned problems. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a feeding structure for wafer testing equipment, which solves the problem of poor conveying effect.
[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a loading structure for wafer testing equipment, comprising a placement component, wherein the placement component is used to place a wafer to be tested;
[0006] A loading assembly, wherein a plurality of the loading assemblies are provided, and the plurality of the loading assemblies are distributed in a circular array, and the loading assemblies are provided on one side of the placement assembly, and the loading assemblies are used to transport wafers to be tested; and
[0007] A rotating assembly is arranged on the bottom surface of the loading assembly and is used to drive the loading assembly to rotate.
[0008] Preferably, the placement component includes a workbench, a placement table is provided on one side of the top surface of the workbench, a baffle is provided on one side of the top surface of the placement table, a placement hole is opened on the other side of the top surface of the placement table, a limiting hole is opened on the other side of the top surface of the workbench, and the inner cavity of the limiting hole is connected to the rotating component.
[0009] Preferably, a pad is provided on the other side of the top surface of the placement table and close to the baffle, and the pad is used to prevent damage to the wafer.
[0010] Preferably, the rotating assembly includes a rotating column, the rotating column is arranged on the other side of the top surface of the workbench, a servo motor is arranged at the center of the bottom surface of the rotating column, a mounting groove is opened on the top surface of the rotating column, a plurality of mounting grooves are opened, the plurality of mounting grooves are distributed in a circular array, and a slot is opened at the center of the bottom surface of each mounting groove;
[0011] An internal threaded hole is provided at the center of the top surface of the rotating column, a fixing plate is provided on the top surface of the rotating column, and an insert block is provided on the bottom surface of the fixing plate. There are multiple insert blocks, and the multiple insert blocks are distributed in a circular array.
[0012] A fixing bolt is arranged at a center position on the top surface of the fixing plate, and a bottom end of the fixing bolt is connected to the internal threaded hole.
[0013] Preferably, a limiting ring is provided at a central position on the bottom surface of the rotating column, and the bottom end of the limiting ring is connected to the inner cavity of the limiting hole.
[0014] Preferably, the loading assembly includes a circular column, which is arranged in the inner cavity of the mounting groove, a hollow column is arranged on one side of the circular column, a movable column is arranged in the inner cavity of the hollow column, a movable plate is arranged on the surface of one side of the movable column, an electric telescopic rod is arranged in the inner cavity of the hollow column, the output end of the electric telescopic rod is connected to the movable plate, a support plate is arranged in the center of one side surface of the movable plate, and an adsorption portion is arranged in the center of the top surface of the support plate.
[0015] Preferably, the adsorption part includes a suction cup, which is arranged at a central position on the top surface of the support plate, a vacuum tube is arranged on the bottom surface of the suction cup, and a vacuum machine is arranged on the bottom surface of the vacuum tube.
[0016] Beneficial Effects
[0017] The utility model provides a feeding structure for wafer testing equipment. Compared with the prior art, it has the following beneficial effects:
[0018] The wafer testing equipment uses a loading structure. When it is necessary to load the wafer to be tested, the placement component is first placed at a preset position, and then the rotating component is rotatably connected to the top surface of the placement component, so that the placement component can provide support for the rotating component, and then it is convenient for the staff to place the wafer to be tested in the inner cavity of the placement component. Since the top surface of the rotating component is movably connected with the loading component, the rotating component can provide support for the loading component, and then the rotating component can drive the loading component to rotate, so that it is convenient for the staff to transport the wafer to be tested, and then it is convenient to load the wafer to be tested, so as to improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0020] Figure 2 This is a schematic diagram of the structure of the components placed in the utility model;
[0021] Figure 3 This is a schematic diagram of the structure of the rotating assembly of the utility model;
[0022] Figure 4 It is a schematic diagram of the cross-sectional structure of the feeding component of the utility model.
[0023] In the figure: 1. Placement component; 11. Workbench; 12. Placement table; 13. Baffle; 14. Placement hole; 15. Limit hole; 16. Pad; 2. Rotation component; 21. Rotation column; 22. Servo motor; 23. Mounting slot; 24. Slot; 25. Internal threaded hole; 26. Fixed plate; 27. Insert block; 28. Fixing bolt; 29. Limit ring; 3. Loading component; 31. Reciprocating column; 32. Hollow column; 33. Moving column; 34. Electric telescopic rod; 35. Moving plate; 36. Support plate; 37. Suction cup; 38. Vacuum tube; 39. Vacuum machine. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] See also Figure 1-4 The utility model provides a technical solution: a loading structure for a wafer testing device, comprising a placing component 1, the placing component 1 is used to place a wafer to be tested; a loading component 3, a plurality of loading components 3 are provided, the plurality of loading components 3 are distributed in a circular array, the loading component 3 is arranged on one side of the placing component 1, and the loading component 3 is used to transport the wafer to be tested; and a rotating component 2, the rotating component 2 is arranged on the bottom surface of the loading component 3, and the rotating component 2 is used to drive the loading component 3 to rotate;
[0026] When it is necessary to load the wafer to be inspected, first place the placement component 1 at the preset position, and then rotatably connect the rotating component 2 to the top surface of the placement component 1, so that the placement component 1 can provide support for the rotating component 2, and then it can be convenient for the staff to place the wafer to be inspected in the inner cavity of the placement component 1. Since the top surface of the rotating component 2 is movably connected with the loading component 3, the rotating component 2 can provide support for the loading component 3, and then the rotating component 2 can drive the loading component 3 to rotate, so that it is convenient for the staff to transport the wafer to be inspected, and then it is convenient to load the wafer to be inspected, so as to improve work efficiency.
[0027] See also Figure 1 , Figure 2 The placement component 1 includes a workbench 11, a placement platform 12 is arranged on one side of the top surface of the workbench 11, a baffle 13 is arranged on one side of the top surface of the placement platform 12, a placement hole 14 is opened on the other side of the top surface of the placement platform 12, a limiting hole 15 is opened on the other side of the top surface of the workbench 11, the inner cavity of the limiting hole 15 is connected to the rotating component 2, and a pad 16 is arranged on the other side of the top surface of the placement platform 12 and close to the baffle 13, and the pad 16 is used to prevent damage to the wafer;
[0028] By placing the workbench 11 in the component 1, it can be placed in a preset position and provide an installation foundation for the placement table 12. Since a baffle 13 is fixedly connected to one side of the top surface of the placement table 12, and a placement hole 14 is opened on the other side of the top surface of the placement table 12, the placement table 12 can provide support for the baffle 13, and then the staff can place the wafer to be inspected in the inner cavity of the baffle 13, so that the placement table 12 can provide support for the wafer to be inspected. Since a limiting hole 15 is opened on the other side of the top surface of the workbench 11, and the inner cavity of the limiting hole 15 is connected to the rotating component 2, the limiting hole 15 can limit the rotating component 2, and then the stability of the rotating component 2 can be improved. Since a pad 16 is fixedly connected to the other side of the top surface of the placement table 12 and close to the baffle 13, the placement table 12 can provide support for the pad 16, and then the pad 16 can protect the wafer to prevent damage to the wafer.
[0029] See also Figure 1 , Figure 3The rotating assembly 2 includes a rotating column 21, which is arranged on the other side of the top surface of the workbench 11. A servo motor 22 is arranged at the center of the bottom surface of the rotating column 21. A mounting groove 23 is provided on the top surface of the rotating column 21. There are multiple mounting grooves 23, which are distributed in a circular array. A slot 24 is provided at the center of the bottom surface of each mounting groove 23. An internal threaded hole 25 is provided at the center of the top surface of the rotating column 21. A fixing plate 26 is provided on the top surface of the rotating column 21. An insert block 27 is provided on the bottom surface of the fixing plate 26. There are multiple insert blocks 27, which are distributed in a circular array. A fixing bolt 28 is provided at the center of the top surface of the fixing plate 26. The bottom end of the fixing bolt 28 is connected to the internal threaded hole 25. A limiting ring 29 is provided at the center of the bottom surface of the rotating column 21. The bottom end of the limiting ring 29 is connected to the inner cavity of the limiting hole 15.
[0030] The rotating column 21 in the rotating component 2 can be placed on the other side of the top surface and provide a mounting base for the servo motor 22, so that the workbench 11 can provide support for the servo motor 22, and then the output end of the servo motor 22 can drive the rotating column 21 to rotate. Since a mounting groove 23 is provided on the top surface of the rotating column 21, and a plurality of mounting grooves 23 are provided, and a slot 24 is provided at the center of the bottom surface of each mounting groove 23, and the inner cavity of the mounting groove 23 is connected to the loading component 3, so that a plurality of loading components 3 can be movably connected to the inner cavity of the mounting groove 23, and then the mounting groove 23 can limit the loading component 3, so that the wafer can be continuously loaded. An internal threaded hole 25 is provided at the center of the surface, and a fixing plate 26 is movably connected to the top surface of the rotating column 21, and a plurality of plug blocks 27 are fixedly connected to the bottom surface of the fixing plate 26, so that the plug blocks 27 can be inserted into the inner cavity of the slot 24, and then the plug blocks 27 can limit the loading assembly 3, so as to improve the stability of the loading assembly 3. Since a fixing bolt 28 is embedded and connected at the center of the top surface of the fixing plate 26, and the bottom end of the fixing bolt 28 is connected to the internal threaded hole 25, the fixing bolt 28 can be rotatably connected to the internal threaded hole 25, and then the fixing bolt 28 can fix the fixing plate 26, so that the fixing plate 26 can fix the loading assembly 3, thereby improving the stability during the loading process.
[0031] See also Figure 1 , Figure 4The feeding assembly 3 includes a return column 31, which is arranged in the inner cavity of the mounting groove 23, a hollow column 32 is arranged on one side of the return column 31, a moving column 33 is arranged in the inner cavity of the hollow column 32, a moving plate 35 is arranged on the surface of one side of the moving column 33, an electric telescopic rod 34 is arranged in the inner cavity of the hollow column 32, the output end of the electric telescopic rod 34 is connected to the moving plate 35, a support plate 36 is arranged in the middle position of one side surface of the moving plate 35, an adsorption part is arranged in the middle position of the top surface of the support plate 36, the adsorption part includes a suction cup 37, the suction cup 37 is arranged in the middle position of the top surface of the support plate 36, a vacuum tube 38 is arranged on the bottom surface of the suction cup 37, and a vacuum machine 39 is arranged on the bottom surface of the vacuum tube 38;
[0032] The return column 31 in the feeding assembly 3 can be fixedly connected to the inner cavity of the installation groove 23, and can also provide an installation foundation for the hollow column 32. Since the hollow column 32 is fixedly connected to one side of the return column 31, and the inner cavity of the hollow column 32 is movably connected to the moving column 33, and at the same time, a moving plate 35 is fixedly connected to the surface of one side of the moving column 33, and an electric telescopic rod 34 is fixedly connected to the inner cavity of the hollow column 32, the output end of the electric telescopic rod 34 can drive the moving plate 35 to move, and then the moving plate 35 can drive the moving column 33 to move, so that the position of the moving plate 35 can be easily adjusted. Since a support plate 36 is fixedly connected to the center position of one side surface of the moving plate 35, The movable plate 35 can provide support for the support plate 36, and then the movable plate 35 can adjust the position of the support plate 36, so that the support plate 36 can drive the round wafer to move, and then the round wafer can be easily loaded. Since a suction cup 37 is fixedly connected to the center position of the top surface of the support plate 36, and a suction cup 37 is fixedly connected to the center position of the top surface of the support plate 36, and a vacuum tube 38 is arranged on the bottom surface of the suction cup 37, and a vacuum machine 39 is arranged on the bottom surface of the vacuum tube 38, the vacuum machine 39 can evacuate the air in the inner cavity of the suction cup 37 through the vacuum tube 38, and then the suction cup 37 can adsorb the round wafer, so as to improve the stability of the round wafer loading.
[0033] During operation, when it is necessary to load the wafer to be inspected, first place the placement component 1 at the preset position, and then rotate the rotating component 2 to connect to the top surface of the placement component 1, so that the placement component 1 can provide support for the rotating component 2, and then it can be convenient for the staff to place the wafer to be inspected in the inner cavity of the placement component 1. Since the top surface of the rotating component 2 is movably connected with the loading component 3, the rotating component 2 can provide support for the loading component 3, and then the rotating component 2 can drive the loading component 3 to rotate, so that it is convenient for the staff to transport the wafer to be inspected, and then it is convenient to load the wafer to be inspected, so as to improve work efficiency.
[0034] By placing the workbench 11 in the component 1, it can be placed in a preset position and provide an installation foundation for the placement table 12. Since a baffle 13 is fixedly connected to one side of the top surface of the placement table 12, and a placement hole 14 is opened on the other side of the top surface of the placement table 12, the placement table 12 can provide support for the baffle 13, and then the staff can place the wafer to be inspected in the inner cavity of the baffle 13, so that the placement table 12 can provide support for the wafer to be inspected. Since a limiting hole 15 is opened on the other side of the top surface of the workbench 11, and the inner cavity of the limiting hole 15 is connected to the rotating component 2, the limiting hole 15 can limit the rotating component 2, and then the stability of the rotating component 2 can be improved. Since a pad 16 is fixedly connected to the other side of the top surface of the placement table 12 and close to the baffle 13, the placement table 12 can provide support for the pad 16, and then the pad 16 can protect the wafer to prevent damage to the wafer.
[0035] The rotating column 21 in the rotating component 2 can be placed on the other side of the top surface and provide a mounting base for the servo motor 22, so that the workbench 11 can provide support for the servo motor 22, and then the output end of the servo motor 22 can drive the rotating column 21 to rotate. Since a mounting groove 23 is provided on the top surface of the rotating column 21, and a plurality of mounting grooves 23 are provided, and a slot 24 is provided at the center of the bottom surface of each mounting groove 23, and the inner cavity of the mounting groove 23 is connected to the loading component 3, so that a plurality of loading components 3 can be movably connected to the inner cavity of the mounting groove 23, and then the mounting groove 23 can limit the loading component 3, so that the wafer can be continuously loaded. An internal threaded hole 25 is provided at the center of the surface, and a fixing plate 26 is movably connected to the top surface of the rotating column 21, and a plurality of plug blocks 27 are fixedly connected to the bottom surface of the fixing plate 26, so that the plug blocks 27 can be inserted into the inner cavity of the slot 24, and then the plug blocks 27 can limit the loading assembly 3, so as to improve the stability of the loading assembly 3. Since a fixing bolt 28 is embedded and connected at the center of the top surface of the fixing plate 26, and the bottom end of the fixing bolt 28 is connected to the internal threaded hole 25, the fixing bolt 28 can be rotatably connected to the internal threaded hole 25, and then the fixing bolt 28 can fix the fixing plate 26, so that the fixing plate 26 can fix the loading assembly 3, thereby improving the stability during the loading process.
[0036] The return column 31 in the feeding assembly 3 can be fixedly connected to the inner cavity of the installation groove 23, and can also provide an installation foundation for the hollow column 32. Since the hollow column 32 is fixedly connected to one side of the return column 31, and the inner cavity of the hollow column 32 is movably connected to the moving column 33, and at the same time, a moving plate 35 is fixedly connected to the surface of one side of the moving column 33, and an electric telescopic rod 34 is fixedly connected to the inner cavity of the hollow column 32, the output end of the electric telescopic rod 34 can drive the moving plate 35 to move, and then the moving plate 35 can drive the moving column 33 to move, so that the position of the moving plate 35 can be easily adjusted. Since a support plate 36 is fixedly connected to the center position of one side surface of the moving plate 35, The movable plate 35 can provide support for the support plate 36, and then the movable plate 35 can adjust the position of the support plate 36, so that the support plate 36 can drive the round wafer to move, and then the round wafer can be easily loaded. Since a suction cup 37 is fixedly connected to the center position of the top surface of the support plate 36, and a suction cup 37 is fixedly connected to the center position of the top surface of the support plate 36, and a vacuum tube 38 is arranged on the bottom surface of the suction cup 37, and a vacuum machine 39 is arranged on the bottom surface of the vacuum tube 38, the vacuum machine 39 can evacuate the air in the inner cavity of the suction cup 37 through the vacuum tube 38, and then the suction cup 37 can adsorb the round wafer, so as to improve the stability of the round wafer loading.
[0037] In summary, the device can not only continuously load round wafers, but also adsorb round wafers, thereby conveniently improving the loading stability and further improving the loading efficiency.
[0038] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.
Claims
1. A feeding structure for wafer testing equipment, characterized in that: include: A placement component (1), the placement component (1) being used to place a wafer to be tested; A loading assembly (3), wherein a plurality of the loading assemblies (3) are provided, and the plurality of the loading assemblies (3) are distributed in a circular array, the loading assembly (3) being arranged on one side of the placement assembly (1), and the loading assembly (3) being used to transport wafers to be tested; as well as A rotating component (2), the rotating component (2) being arranged on the bottom surface of the loading component (3), and the rotating component (2) being used to drive the loading component (3) to rotate.
2. The wafer testing equipment feeding structure according to claim 1, characterized in that: The placement component (1) comprises a workbench (11), a placement platform (12) is arranged on one side of the top surface of the workbench (11), a baffle (13) is arranged on one side of the top surface of the placement platform (12), a placement hole (14) is provided on the other side of the top surface of the placement platform (12), and a limiting hole (15) is provided on the other side of the top surface of the workbench (11), and the inner cavity of the limiting hole (15) is connected to the rotating component (2).
3. The wafer testing equipment feeding structure according to claim 2, characterized in that: A pad (16) is provided on the other side of the top surface of the placement platform (12) and close to the baffle (13), and the pad (16) is used to prevent damage to the wafer.
4. The wafer testing equipment feeding structure according to claim 2, characterized in that: The rotating assembly (2) comprises a rotating column (21), the rotating column (21) being arranged on the other side of the top surface of the workbench (11), a servo motor (22) being arranged at a central position of the bottom surface of the rotating column (21), a mounting groove (23) being provided on the top surface of the rotating column (21), a plurality of the mounting grooves (23) being provided, the plurality of the mounting grooves (23) being distributed in a circular array, and a slot (24) being provided at a central position of the bottom surface of each mounting groove (23); An internal threaded hole (25) is provided at a central position on the top surface of the rotating column (21); a fixing plate (26) is provided on the top surface of the rotating column (21); an insert block (27) is provided on the bottom surface of the fixing plate (26); a plurality of the insert blocks (27) are provided, and the plurality of the insert blocks (27) are distributed in a circular array; A fixing bolt (28) is provided at a central position on the top surface of the fixing plate (26), and the bottom end of the fixing bolt (28) is connected to the internal threaded hole (25).
5. The wafer testing equipment feeding structure according to claim 4, characterized in that: A limiting ring (29) is provided at a central position on the bottom surface of the rotating column (21), and the bottom end of the limiting ring (29) is connected to the inner cavity of the limiting hole (15).
6. The feeding structure for wafer testing equipment according to claim 4, characterized in that: The loading assembly (3) comprises a circular column (31), wherein the circular column (31) is arranged in the inner cavity of the mounting groove (23), a hollow column (32) is arranged on one side of the circular column (31), a movable column (33) is arranged in the inner cavity of the hollow column (32), a movable plate (35) is arranged on the surface of one side of the movable column (33), an electric telescopic rod (34) is arranged in the inner cavity of the hollow column (32), an output end of the electric telescopic rod (34) is connected to the movable plate (35), a support plate (36) is arranged in the center of one side surface of the movable plate (35), and an adsorption portion is arranged in the center of the top surface of the support plate (36).
7. The wafer testing equipment feeding structure according to claim 6, characterized in that: The adsorption portion comprises a suction cup (37), the suction cup (37) being arranged at a central position on the top surface of the support plate (36), a vacuum tube (38) being arranged on the bottom surface of the suction cup (37), and a vacuum machine (39) being arranged on the bottom surface of the vacuum tube (38).