Power module with adjustable gate resistance

Abstract

The utility model belongs to the technical field of power module structures, and discloses a power module with an adjustable gate resistance, which is characterized in that an adjustable resistor and a gate of a power chip are connected and fixed on a substrate and are simultaneously packaged in a shell, and an inward extending channel is arranged on the substrate and is connected with an adjusting knob of the adjustable resistor; therefore, the gate resistance of the power module can be directly adjusted. According to the utility model, the adjustable gate resistor is packaged in the power module, an external gate resistor is not needed, the integration level is higher, the gate resistor is closer to the chip, and the oscillation problem caused by switching signals is effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of power module structures, and in particular relates to a power module with adjustable gate resistance. Background Art

[0002] Power modules are key components in power electronics technology. They integrate one or multiple high-power semiconductor device chips (such as IGBT, MOSFET, etc.) in parallel and are packaged in a modular manner. These modules are designed to handle high voltage and high current to achieve effective conversion and control of electrical energy. They are widely used in motor drives, frequency converters, uninterruptible power supplies (UPS), solar inverters and other fields.

[0003] In order to achieve a larger current flow, the prior art generally adopts a structure of connecting multiple power chips in parallel, and adding a gate resistor outside each power chip can effectively improve the current sharing effect of the chip. Traditional power chips have a built-in gate resistor with a fixed resistance value, but in many cases the resistance value of this external gate resistor is not necessarily matched, so it is often necessary to add a total gate resistor outside the power module to adjust the switching characteristics. However, the distance between the external gate resistor of the traditional power module and the power chip is relatively far, which brings about the oscillation problem at the time of opening and closing. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the defect of the external gate resistor of the power module in the prior art causing the switching moment oscillation problem, thereby providing a power module with adjustable gate resistor.

[0005] Furthermore, the power chip is conductively connected to the adjustable resistor via a binding wire.

[0006] Furthermore, it also includes silica gel, which fills the space between the substrate and the shell.

[0007] Furthermore, the substrate is a direct copper-clad ceramic substrate.

[0008] Furthermore, the adjustable resistor is a patch adjustable resistor.

[0009] Furthermore, the power chip is welded to the substrate.

[0010] Furthermore, the adjustable resistor is welded to the substrate.

[0011] Furthermore, the power module includes at least one power chip, and the gate of each power chip is conductively connected to an adjustable chip.

[0012] Furthermore, the power chip is one of IGBT, MOSFET and BJT.

[0013] Beneficial effects: The utility model discloses a power module with adjustable gate resistance, in which the adjustable resistor is connected to the gate of the power chip and fixed on a substrate, and is packaged in a shell at the same time, and an inner extension channel is provided on the shell to connect the adjustment knob of the adjustable resistor, so that the gate resistance of the power module can be directly adjusted; the utility model packages an adjustable gate resistor inside the power module, does not require an external gate resistor, has a higher degree of integration, and the gate resistor is closer to the chip, which effectively improves the oscillation problem caused by the switching signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0016] Explanation of the reference numerals: 1. power chip; 2. adjustable resistor; 3. substrate; 4. housing; 41. inner extension channel; 5. binding wire. DETAILED DESCRIPTION

[0017] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0018] In the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0019] In this application, when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0020] Reference Figure 1 As shown, this embodiment provides a power module with adjustable gate resistance, including a power chip 1, an adjustable resistor 2, a substrate 3 and a shell 4; the power chip 1 and the adjustable resistor 2 are respectively fixed on the upper side of the substrate 3 and form a conductive connection with the substrate 3; the gate of the power chip 1 is conductively connected to the adjustable resistor 2; the shell 4 is fixed on the upper side of the substrate 3, and the power chip 1 and the adjustable resistor 2 are located between the substrate and the shell 4; the shell 4 is recessed downward to form an inwardly extending channel 41, and the inwardly extending channel 41 is connected to the adjustment knob on the upper side of the adjustable resistor 2.

[0021] The utility model discloses a power module with adjustable gate resistance, in which an adjustable resistor 2 is connected to the gate of a power chip 1 and fixed on a substrate 3, and is packaged in a shell 4, and an inner extension channel 41 is provided on the shell to connect the adjustment knob of the adjustable resistor 2, so that the gate resistance of the power module can be directly adjusted by inserting a screwdriver into the inner extension channel 41; the utility model packages an adjustable gate resistance inside the power module, does not need an external gate resistance, has a higher integration, and the gate resistance is closer to the chip, which effectively improves the oscillation problem caused by the switching signal.

[0022] Specifically, the power chip 1 is conductively connected to the adjustable resistor 2 via a binding wire 5 .

[0023] In this embodiment, silica gel is further included, and the silica gel fills the space between the substrate 3 and the shell 4 .

[0024] As a preferred embodiment of the present invention, the substrate 3 is a direct copper-clad ceramic substrate. The adjustable resistor 2 is a patch adjustable resistor. The power chip 1 is one of IGBT, MOSFET and BJT.

[0025] The power chip 1 is welded to the substrate 3 . The adjustable resistor 2 is welded to the substrate 3 .

[0026] In this embodiment, the power module includes at least one power chip 1, and the gate of each power chip 1 is conductively connected to an adjustable chip.

[0027] Preparation method: The power chip 1 and the adjustable resistor 2 are mounted on the substrate 3 by a mounting machine, and then connected by a binding wire 5, and welded by a welding furnace, and finally the housing 4 is installed and potted with silicone.

[0028] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0029] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A power module with adjustable gate resistance, characterized in that: The invention comprises a power chip (1), an adjustable resistor (2), a substrate (3) and a housing (4); the power chip (1) and the adjustable resistor (2) are respectively fixed on the upper side of the substrate (3) and are electrically connected to the substrate (3); the gate of the power chip (1) is electrically connected to the adjustable resistor (2); the housing (4) is fixed on the upper side of the substrate (3), and the power chip (1) and the adjustable resistor (2) are located between the substrate (3) and the housing (4); the housing (4) is recessed downward to form an inwardly extending channel (41), and the inwardly extending channel (41) is connected to an adjusting knob on the upper side of the adjustable resistor (2).

2. A power module with adjustable gate resistance according to claim 1, characterized in that: The power chip (1) and the adjustable resistor (2) are conductively connected via a binding wire (5).

3. The power module with adjustable gate resistance according to claim 1, characterized in that: It also includes silica gel, which fills the space between the substrate (3) and the shell (4).

4. The power module with adjustable gate resistance according to claim 1, characterized in that: The substrate (3) is a direct copper-clad ceramic substrate.

5. The power module with adjustable gate resistance according to claim 1, characterized in that: The adjustable resistor (2) is a patch adjustable resistor.

6. The power module with adjustable gate resistance according to claim 1, characterized in that: The power chip (1) is welded to the substrate (3).

7. The power module with adjustable gate resistance according to claim 1, characterized in that: The adjustable resistor (2) is welded to the substrate (3).

8. The power module with adjustable gate resistance according to claim 1, characterized in that: The power module comprises at least one power chip (1), and the gate of each power chip (1) is respectively conductively connected to an adjustable chip.

9. The power module with adjustable gate resistance according to claim 1, characterized in that: The power chip (1) is one of an IGBT, a MOSFET and a BJT.

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