Curved surface fluorescent ceramic light source

By adopting curved fluorescent ceramic light source design in COB light source packaging, the problems of easy aging and high packaging cost of traditional light sources are solved, higher service life and lower packaging cost are achieved, and the light source surface is resistant to wear and easy to clean.

CN222954324UActive Publication Date: 2025-06-06ZHONGKE HAOYE (DONGGUAN) MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202421424154.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-20
Publication Date
2025-06-06
Estimated Expiration
2034-06-20

AI Technical Summary

Technical Problem

The traditional COB light source packaging process has problems such as easy aging, high packaging cost and short service life.

Method used

The curved fluorescent ceramic light source design is adopted. By fixing the blue light chip on the substrate and setting the fluorescent ceramic above it, the fluorescent ceramic includes a curved structure for excitating white light and converging.

Benefits of technology

It realizes the advantages of wear resistance, scratch resistance and easy cleaning on the surface of the light source, improves the service life of the light source, reduces the packaging cost, and has the characteristics of integrating phosphor and light concentration.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of light source packaging, in particular to a curved-surface fluorescent ceramic light source. The light source comprises a substrate, a blue light chip and fluorescent ceramic. The blue light chip is fixed on the substrate; the fluorescent ceramic is arranged above the blue light chip and is connected to the substrate; the blue light chip is used for exciting the fluorescent ceramic to emit white light; the fluorescent ceramic comprises a curved surface structure; and the fluorescent ceramic is used for converging the white light. The luminous body of the light source is prepared from the fluorescent ceramic, the luminous body and a light condensing body are designed into a whole, an additional light source outer cover is avoided, the structure of the light source is simplified, and meanwhile the light source has the advantages that the surface of the light source is resistant to abrasion and scratch, the refractive index is high, and the light source is convenient to clean. And the method has a wide application prospect in severe industrial scenes. According to the packaging method, the light emitting functionality of the fluorophor is met, meanwhile, the functions of protecting the light source chip and focusing the light beam are achieved, and particularly, the curved-surface fluorescent ceramic has the high refractive index, light condensation can be better achieved, and scattering is low.
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Description

Technical Field

[0001] The present application relates to the field of light source packaging, and in particular, to a curved fluorescent ceramic light source. Background Art

[0002] The traditional COB (chip-on-board) light source packaging process requires the COB chip to be packaged with resin packaging materials, and then an additional light source cover is added. This traditional COB (chip-on-board) light source has the problems of easy aging, high packaging cost and short service life. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a curved fluorescent ceramic light source.

[0004] The present application provides a curved fluorescent ceramic light source, comprising:

[0005] substrate;

[0006] A blue light chip, wherein the blue light chip is fixed on the substrate; and

[0007] Fluorescent ceramics; the fluorescent ceramics are arranged above the blue light chip, and the fluorescent ceramics are connected to the substrate; the blue light chip is used to excite the fluorescent ceramics to emit white light;

[0008] The fluorescent ceramic includes a curved structure; the fluorescent ceramic is used to converge white light.

[0009] In the above technical solution, fluorescent ceramics are used to prepare the light-emitting body of the light source. This design not only integrates the light-emitting body and the concentrator into one, avoiding the additional light source cover and simplifying the structure of the light source, but also has the advantages of wear resistance, scratch resistance and easy cleaning of the light source surface, and has great application prospects for harsh industrial scenes.

[0010] The curved fluorescent ceramic light source obtained by the present application is wear-resistant and has a high refractive index. The design process not only satisfies the functionality of the fluorescent body luminescence, but also protects the light source chip and focuses the light beam. In particular, the curved fluorescent ceramic has a high refractive index and can better focus light with low scattering. Compared with traditional chip packaging technology, it has the characteristics of light source aging resistance, surface scratch resistance, and integration of fluorescent body and focusing, which increases the service life of the light source, reduces packaging costs, and is convenient for industrial production.

[0011] In other embodiments of the present application, the fluorescent ceramic includes a lens portion and a connecting portion;

[0012] The connecting part is arranged in the circumference of the lens part, the lens part is covered above the blue light chip, and the connecting part is bonded and connected to the substrate.

[0013] In other embodiments of the present application, the lens portion includes: a convex lens or a lens group formed by a plurality of convex lenses.

[0014] In other embodiments of the present application, the curved fluorescent ceramic light source includes: a sealing gasket, which is arranged between the lens portion and the substrate of the fluorescent ceramic and is used to seal the lens portion and the substrate.

[0015] In other embodiments of the present application, the connecting part includes connecting ears, which are arranged on two opposite sides of the lens part; a first mounting hole is arranged on the substrate; the connecting ears are provided with a second mounting hole, and are connected to the first mounting hole and the second mounting hole through a connecting member, so that the connecting part is connected to the substrate.

[0016] In other embodiments of the present application, the light wavelength of the blue light chip is 420nm-470nm.

[0017] In other embodiments of the present application, the blue light chip includes multiple blue light chips, and the multiple blue light chips are connected in series; or

[0018] The blue light chips include at least two groups; any two groups of blue light chips are connected in parallel; and in each group of blue light chips, a plurality of blue light chips are connected in series.

[0019] In other embodiments of the present application, the substrate includes: any one of a metal aluminum substrate, an aluminum oxide ceramic substrate or an aluminum nitride ceramic substrate.

[0020] In other embodiments of the present application, the fluorescent ceramic includes: any one of transparent YAG fluorescent ceramic, transparent yttrium oxide fluorescent ceramic or transparent spinel fluorescent ceramic. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of a curved fluorescent ceramic light source provided in an embodiment of the present application;

[0023] Figure 2 A schematic structural diagram of a substrate of a curved fluorescent ceramic light source provided in an embodiment of the present application (including a sealing gasket);

[0024] Figure 3 for Figure 2 A schematic structural diagram of the substrate from another perspective;

[0025] Figure 4A schematic structural diagram of a sealing gasket for a curved fluorescent ceramic light source provided in an embodiment of the present application;

[0026] Figure 5 for Figure 4 A schematic diagram of the structure of the sealing gasket from another perspective;

[0027] Figure 6 A schematic diagram of the structure of a fluorescent ceramic of a curved fluorescent ceramic light source provided in an embodiment of the present application;

[0028] Figure 7 for Figure 6 Schematic diagram of the structure of fluorescent ceramics from another perspective;

[0029] Figure 8 A schematic diagram of the structure of another curved fluorescent ceramic light source provided in an embodiment of the present application;

[0030] Fig. 9 for Figure 8 A schematic diagram of the structure of the fluorescent ceramic of the curved fluorescent ceramic light source;

[0031] Fig.10 for Fig. 9 Schematic diagram of the structure of the fluorescent ceramic of the curved fluorescent ceramic light source from another perspective.

[0032] Icon: 100 - curved fluorescent ceramic light source; 110 - substrate; 111 - first mounting hole; 120 - blue light chip; 130 - fluorescent ceramic; 131 - lens part; 132 - connecting part; 1321 - connecting ear; 133 - second mounting hole; 140 - sealing gasket. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0034] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0035] Reference Figure 1-Figure 10 The embodiment of the present application provides a curved fluorescent ceramic light source 100, comprising:

[0036] substrate 110;

[0037] A blue light chip 120 , wherein the blue light chip 120 is fixed on the substrate 110 ; and

[0038] Fluorescent ceramic 130; the fluorescent ceramic 130 is disposed above the blue light chip 120, and the fluorescent ceramic 130 is connected to the substrate 110; the blue light chip 120 is used to excite the fluorescent ceramic 130 to emit white light;

[0039] The fluorescent ceramic 130 includes a curved surface structure; the fluorescent ceramic 130 is used to converge white light.

[0040] In the above technical solution, fluorescent ceramic 130 is used to prepare the light-emitting body of the light source. This design not only integrates the light-emitting body and the concentrator into one, avoiding the additional addition of a light source cover, thus simplifying the structure of the light source, but also has the advantages of the surface of the light source being wear-resistant, scratch-resistant and easy to clean, and has great application prospects for harsh industrial scenes.

[0041] The curved fluorescent ceramic light source encapsulated by the method of the present application is wear-resistant and has a high refractive index. The design process not only satisfies the functionality of the fluorescent body to emit light, but also protects the light source chip and focuses the light beam. In particular, the curved fluorescent ceramic has a high refractive index and can better focus light with low scattering. Compared with traditional chip packaging technology, it has the characteristics of light source aging resistance, surface scratch resistance, and integration of fluorescent body and focusing, which increases the service life of the light source, reduces packaging costs, and is convenient for industrial production.

[0042] Further, refer to Figure 6 and Figure 7 In some embodiments of the present application, the fluorescent ceramic 130 includes a lens portion 131 and a connecting portion 132;

[0043] The connection portion 132 is disposed around the lens portion 131 . The lens portion 131 is disposed above the blue light chip 120 . The connection portion 132 is bonded and connected to the substrate 110 .

[0044] In the above technical solution, by providing the lens portion 131 through the fluorescent ceramic 130, the white light emitted by the fluorescent ceramic excited by the blue light chip 120 can be converged, thereby improving the luminous effect of the entire curved fluorescent ceramic light source. By providing the connection portion through the fluorescent ceramic, the fluorescent ceramic can be directly connected to the substrate, which not only makes the connection more firm, but also has better heat dissipation performance.

[0045] Reference Figure 4 and Figure 5 Furthermore, in some embodiments of the present application, the curved fluorescent ceramic light source includes: a sealing gasket 140 , which is disposed between the lens portion 131 of the fluorescent ceramic and the substrate 110 , and is used to seal the lens portion 131 and the substrate 110 .

[0046] By providing a sealing gasket 140 at the lens portion of the fluorescent ceramic, the sealing effect can be effectively improved, thereby facilitating the improvement of the luminous effect of the entire curved fluorescent ceramic light source.

[0047] Furthermore, in some embodiments of the present application, the connecting portion 132 includes a connecting ear 1321, which is arranged on two opposite sides of the lens portion 131, and the connecting ear 1321 is provided with a second mounting hole 133, and the substrate 110 is provided with a first mounting hole 111; the connecting portion 132 is connected to the substrate 110 by connecting to the first mounting hole and the second mounting hole through a connecting member.

[0048] For example, in some embodiments of the present application, a connecting member such as a bolt is used to penetrate the first mounting hole 111 and the second mounting hole 133 to connect the fluorescent ceramic 130 to the substrate 110 .

[0049] It should be noted that the shape of the connecting portion 132 is not limited. Figure 6 and Figure 7 The shape of the connecting portion 132 may match the shape of the substrate 110, so that the packaged light source structure is more compact and miniaturized.

[0050] In some embodiments of the present application, the connecting portion 132 and the substrate 110 may be connected together by connecting members such as bolts and nuts.

[0051] After the connection part 132 of the fluorescent ceramic 130 is connected to the substrate 110 by a connector, the connection part 132 is bonded to the substrate 110, which can greatly improve the heat dissipation effect of the entire curved fluorescent ceramic light source. At present, in conventional technology, resin or thermal conductive silicone is usually used to encapsulate the light source. However, the thermal conductivity of such resin and thermal conductive silicone is much lower than that of the fluorescent ceramic 130. The present application creatively uses the fluorescent ceramic 130 to directly bond to the substrate 110, and uses connectors such as bolts and nuts to encapsulate the light source, which greatly improves the heat dissipation effect of the entire curved fluorescent ceramic light source, which is conducive to improving the service life of the entire curved fluorescent ceramic light source.

[0052] Furthermore, in some embodiments of the present application, the connecting portion 132 and the lens portion 131 are integrally formed.

[0053] For example, in some embodiments of the present application, the connection portion 132 and the lens portion 131 are integrally formed to ensure that the connection portion 132 and the lens portion 131 are made of the same material, which is beneficial to improving the heat dissipation effect. At the same time, the connection portion 132 and the lens portion 131 are integrally formed, which is easy to process and apply.

[0054] Furthermore, in some embodiments of the present application, the lens portion 131 includes: a convex lens or a lens group formed by a plurality of convex lenses.

[0055] In the above technical solution, the lens portion 131 is a convex lens or a lens group formed by multiple convex lenses, which is beneficial to improving the convergence effect of the white light emitted by the fluorescent ceramic excited by the blue light chip.

[0056] Furthermore, in some embodiments of the present application, the blue light chip 120 includes a plurality of blue light chips 120, and the plurality of blue light chips 120 are connected in series.

[0057] In the above technical solution, by arranging a plurality of blue light chips 120 in series, the luminous effect of the curved fluorescent ceramic light source can be increased.

[0058] Furthermore, in some embodiments of the present application, the blue light chip 120 includes at least two groups; any two groups of blue light chips are connected in parallel; and within each group of blue light chips, multiple blue light chips are connected in series.

[0059] In the above technical solution, any two groups of blue light chips are connected in parallel; in each group of blue light chips, multiple blue light chips are connected in series, which can increase the luminous effect of the curved fluorescent ceramic light source.

[0060] Further, in some embodiments of the present application, the above-mentioned blue light chips 120 are evenly distributed on the substrate 110. Further optionally, in some embodiments of the present application, the above-mentioned blue light chips 120 are distributed on the substrate 110 in an array.

[0061] Further, in some embodiments of the present application, the wavelength of the blue light chip is between 420nm and 470nm. Exemplarily, in some embodiments of the present application, the wavelength of the blue light chip is 420nm, 425nm, 430nm, 435nm, 440nm, 445nm, 450nm, 455nm, 460nm, 465nm, 470nm or a range between any two of the foregoing values.

[0062] In the above range, the fluorescent ceramic can be effectively excited to emit white light.

[0063] Further, in some embodiments of the present application, reference is made to Figure 2 and Figure 3 The substrate 110 includes: any one of a metal aluminum substrate, an aluminum oxide ceramic substrate or an aluminum nitride ceramic substrate.

[0064] In the above technical solution, the substrate is provided to include any one of a metal aluminum substrate, an aluminum oxide ceramic substrate or an aluminum nitride ceramic substrate, which is beneficial to heat dissipation.

[0065] In other optional implementations of the present application, the material of the substrate 110 may also be other heat dissipation materials.

[0066] Furthermore, in some embodiments of the present application, the fluorescent ceramic includes: any one of transparent YAG fluorescent ceramic, transparent yttrium oxide fluorescent ceramic or transparent spinel fluorescent ceramic.

[0067] In the above technical solution, the fluorescent ceramic includes: any one of transparent YAG fluorescent ceramic, transparent yttrium oxide fluorescent ceramic or transparent spinel fluorescent ceramic, which can effectively realize the blue light chip exciting the fluorescent ceramic to emit white light.

[0068] It should be noted that the above-mentioned transparent YAG fluorescent ceramics, transparent yttrium oxide fluorescent ceramics or transparent spinel fluorescent ceramics can all be purchased from the market.

[0069] In some other embodiments of the present application, the fluorescent material in the transparent YAG fluorescent ceramic is Y 3 Al 5 O 12 :xCe 3+ , where x≤0.05, for example, x=0.03.

[0070] In some other embodiments of the present application, the transparent YAG fluorescent ceramic Y 3 Al 5 O 12 :xCe 3+ It can be prepared by the preparation method in Chinese Patent No. 202010110472.8. For example, the fluorescent material is Y 3 Al 5 O 12 :xCe 3+ The YAG fluorescent ceramic lens is made by sintering ceramic raw material powder and sintering aid. 2 O 3 , Y 2 O 3 and CeO 2 , sintering aids are MgO and SiO 2 At least one of; optionally, the ratio of the mass of the sintering aid to the mass of the ceramic raw material powder does not exceed 1%, for example, the mass of the sintering aid is 1% of the mass of the ceramic raw material powder.

[0071] Sintering includes vacuum sintering and annealing treatment in sequence. Optionally, the vacuum sintering temperature is 1730-1800°C, the holding time is 5-30 hours, and the vacuum degree is 10 -3 -10 -5 Pa; the annealing conditions are: keeping warm at 1200-1500°C for 5-40 hours, and then cooling with the furnace.

[0072] In some embodiments of the present application, the above-mentioned blue light chip 120 is a COB chip.

[0073] The above-mentioned blue light chip can be purchased commercially.

[0074] Some embodiments of the present application provide a method for packaging a curved fluorescent ceramic light source, including:

[0075] Paste a blue light chip on the surface of the substrate;

[0076] Connect the pins of the blue light chip to the substrate;

[0077] Connect the pins to the external circuit;

[0078] Fixing the fluorescent ceramic on the blue light chip and connecting the fluorescent ceramic to the substrate;

[0079] Among them, the blue light chip is used to stimulate the fluorescent ceramic to emit white light;

[0080] Fluorescent ceramics have a curved structure; fluorescent ceramics are used to converge white light.

[0081] In the above technical scheme, the packaging method can effectively realize the packaging of the light source, avoid the use of resin packaging materials, and have a COB light source that is resistant to aging, scratch-resistant, and has a phosphor and a lens integrated into one, thereby increasing the service life of the light source and reducing the packaging cost, making it convenient for industrial production.

[0082] Furthermore, in some embodiments of the present application, a method for packaging a curved fluorescent ceramic light source comprises the following steps:

[0083] Step S1, substrate preparation.

[0084] In some embodiments of the present application, substrate preparation includes:

[0085] Select a suitable substrate material, such as metal aluminum, as the substrate material, and clean and surface treat it to ensure reliable bonding of the chip.

[0086] Step S2: chip pasting.

[0087] In some embodiments of the present application, chip pasting includes: placing a commercial COB blue light source chip at a predetermined position on a substrate, and fixing it on the substrate using an adhesive.

[0088] Step S3: wire connection.

[0089] In some embodiments of the present application, the wire connection includes: using a wire material to connect the electrode of the chip to the pin on the substrate.

[0090] Step S4: welding.

[0091] In some embodiments of the present application, welding includes: using welding technology to connect pins on the substrate to an external circuit to ensure the transmission of signals and power.

[0092] Step S5: fluorescent ceramic packaging.

[0093] In some embodiments of the present application, the fluorescent ceramic packaging includes: fixing the processed curved fluorescent ceramic and the sealing gasket on the chip surface, and then locking the fluorescent ceramic and the substrate with bolts.

[0094] In some embodiments of the present application, the packaging method further comprises the following steps:

[0095] Step S6: Testing and quality inspection.

[0096] In some embodiments of the present application, the testing and quality inspection include: performing functional testing and quality inspection on the light source obtained in the aforementioned step S5 to ensure that it meets the prescribed standards and requirements.

[0097] Step S7: Appearance identification.

[0098] In some embodiments of the present application, the light source packaged in the aforementioned step S6 is further labeled in appearance, such as marking the chip model, etc., as needed.

[0099] The curved fluorescent ceramic light source encapsulated by the method of the present application is wear-resistant, has a high refractive index, and has a convenient encapsulation step. The design process not only satisfies the functionality of the fluorescent body to emit light, but also has the functions of protecting the light source chip and focusing the light beam. In particular, the curved fluorescent ceramic has a high refractive index that can better focus light and has low scattering. Compared with the traditional COB packaging technology, the COB light source has the characteristics of light source aging resistance, surface scratch resistance, and integrated fluorescent body and lens, which improves the service life of the light source and can reduce the packaging cost, making it convenient for industrial production.

[0100] The features and performance of the present application are further described in detail below in conjunction with the embodiments:

[0101] Example 1

[0102] Reference Figure 1-Figure 7 Provided is a curved fluorescent ceramic light source, comprising: a heat dissipation aluminum substrate 110, a blue light chip 120 and a fluorescent ceramic 130. The blue light chip 120 is fixed on the heat dissipation aluminum substrate 110, and the fluorescent ceramic 130 for blue light excitation and emission of white light is covered above the position where the blue light chip 120 is fixed on the heat dissipation aluminum substrate 110; the fluorescent ceramic 130 is processed into a lens form according to the drawing (such as Figure 1As shown in FIG. 1 , the light source 10 is provided with a sealing gasket 140 for sealing inside, and then locked by nuts on both sides. At the same time, since the fluorescent ceramics 130 on both sides (with higher thermal conductivity than traditional resins and thermally conductive silicone) fit the aluminum substrate 110, the heat of the light source can be well conducted out, ensuring that the light source can work well. The blue light chip 120 emits blue light to excite the fluorescent ceramics 130 and then converts it into white light. At the same time, the fluorescent ceramics 130 themselves have a convergence effect, and then form a white bright light source.

[0103] Example 2

[0104] Reference Figure 8-Figure 10 , the difference with respect to Example 1 is that a plurality of convex lenses are prepared on the surface of the curved fluorescent ceramic 130, such as Fig. 9 and Fig.10 As shown, a lens group is formed, and the finished light source after packaging is as follows Figure 8 Compared with embodiment 1, embodiment 2 can better focus the light beam.

[0105] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A curved fluorescent ceramic light source, characterized in that: include: substrate; A blue light chip, wherein the blue light chip is fixed on the substrate; as well as Fluorescent ceramic; the fluorescent ceramic is arranged above the blue light chip, and the fluorescent ceramic is connected to the substrate; the blue light chip is used to excite the fluorescent ceramic to emit white light; The fluorescent ceramic comprises a curved surface structure; the fluorescent ceramic is used to converge the white light; The fluorescent ceramic comprises a lens portion and a connecting portion; The connecting portion is arranged in the circumference of the lens portion, the lens portion is covered above the blue light chip, and the connecting portion is bonded and connected to the substrate; The connecting part includes connecting ears, which are arranged on two opposite sides of the lens part; a first mounting hole is arranged on the substrate; the connecting ear is provided with a second mounting hole, which is connected to the first mounting hole and the second mounting hole through a connecting piece, so that the connecting part is connected to the substrate.

2. The curved fluorescent ceramic light source according to claim 1, characterized in that: The lens portion includes: a convex lens or a lens group formed by a plurality of convex lenses.

3. The curved fluorescent ceramic light source according to claim 1, characterized in that: The curved fluorescent ceramic light source comprises: a sealing gasket, which is arranged between the lens portion of the fluorescent ceramic and the substrate and is used to seal the lens portion and the substrate.

4. The curved fluorescent ceramic light source according to any one of claims 1 to 3, characterized in that: The light wavelength of the blue light chip is 420nm-470nm.

5. The curved fluorescent ceramic light source according to claim 4, characterized in that: The blue light chip comprises a plurality of blue light chips, and the plurality of blue light chips are connected in series.

6. The curved fluorescent ceramic light source according to claim 4, characterized in that: The blue light chips include at least two groups; any two groups of the blue light chips are connected in parallel; and in each group of the blue light chips, a plurality of the blue light chips are connected in series.

7. The curved fluorescent ceramic light source according to any one of claims 1 to 3, characterized in that: The substrate includes: any one of a metal aluminum substrate, an aluminum oxide ceramic substrate or an aluminum nitride ceramic substrate.

8. The curved fluorescent ceramic light source according to any one of claims 1 to 3, characterized in that: The fluorescent ceramic includes any one of transparent YAG fluorescent ceramic, transparent yttrium oxide fluorescent ceramic or transparent spinel fluorescent ceramic.

Citation Information

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