Graded oscillation device for semiconductor material

Abstract

The utility model discloses a grading oscillation device for semiconductor materials, which comprises a screening box, a screening mechanism is arranged in an inner cavity of the screening box, the screening mechanism comprises two sliding plates, the two sliding plates are arranged left and right, two brushing mechanisms are connected between the two sliding plates, each brushing mechanism comprises a sliding rod, and the left side and the right side of each sliding rod are fixedly connected with the sliding plates. The outer ring of the sliding rod is sleeved with a sliding block, a plurality of bristles are evenly arranged at the top of the sliding block, supporting legs are arranged at the four corners of the bottom of the screening box, a supporting plate is connected among the four supporting legs, an oscillating mechanism is arranged at the top of the supporting plate, and bottom wheels are arranged at the bottoms of the supporting legs. According to the device, during grading screening and when the screening mechanism rotates, the sliding block can slide left and right on the sliding rod, meanwhile, the bristles are driven to move left and right, the bristles can dredge the first screening holes and the second screening holes, semiconductor materials blocked in the first screening holes and the second screening holes are brushed out, normal screening of the first screening plate and the second screening plate is guaranteed, and therefore the screening efficiency of the semiconductor materials can be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production, and particularly relates to a grading oscillation device for semiconductor materials. Background Art

[0002] Semiconductor materials are a class of electronic materials with semiconductor properties (the conductivity is between that of conductors and insulators, and the resistivity is about in the range of 1 mΩ·cm to 1 GΩ·cm), which can be used to manufacture semiconductor devices and integrated circuits. The semiconductor material oscillation grading device is a device specifically used for processing semiconductor materials. Through the methods of oscillation and grading, it can effectively screen out high-purity semiconductor materials. This device is usually applied in the production and R & D processes of the semiconductor industry, and plays an important role in ensuring product quality and improving production efficiency.

[0003] In the process of oscillating and screening semiconductor materials by the existing semiconductor material oscillation grading device, the screening holes of the sieve plate can allow semiconductor materials with smaller particle sizes to pass through, while leaving semiconductor materials with larger particle sizes to separate semiconductor materials with different particle sizes. When the semiconductor materials with smaller particle sizes pass through the screening holes of the sieve plate, it is very easy to block the screening holes, resulting in the sieve plate being unable to screen normally, and thus slowing down the screening efficiency of semiconductor materials. Therefore, we provide a grading oscillation device for semiconductor materials to solve the above problems. Summary of the Utility Model

[0004] (1) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the existing technology, the utility model provides a grading oscillation device for semiconductor materials, which solves the problem that semiconductor materials are easy to block the sieve plate when the existing semiconductor material oscillation grading device screens semiconductor materials.

[0006] (2) Technical Solutions

[0007] To achieve the above object, the utility model provides the following technical solutions: A grading oscillation device for semiconductor materials, including a screening box, a screening mechanism is arranged in the inner cavity of the screening box. The screening mechanism includes two sliding plates, the two sliding plates are arranged left and right, and two brushing mechanisms are connected between the two sliding plates, the two brushing mechanisms are arranged up and down. Four legs are arranged at the four corners of the bottom of the screening box, a support plate is connected between the four legs, an oscillation mechanism is arranged on the top of the support plate, and bottom wheels are arranged at the bottoms of the legs.

[0008] Preferably, sliding grooves are respectively opened on the left and right sides of the inner wall of the screening box, the sliding plates are attached to the inner walls of the sliding grooves, and both the sliding plates and the sliding grooves are arc-shaped.

[0009] Preferably, a first sieve plate, a second sieve plate and a connecting plate are fixedly connected in sequence from top to bottom between the two sliding plates. The front and back surfaces of the connecting plate are respectively rotatably connected to the front and back inner walls of the screening box through rotating shafts.

[0010] Preferably, the oscillating mechanism includes a cylinder and a spring. The cylinder and the spring are respectively fixed to the left and right sides of the top of the support plate. The output shaft of the cylinder and the top of the spring are both connected with a pull rope. The top of the pull rope penetrates through the bottom of the screening box and is fixedly connected to the bottom of the connecting plate.

[0011] Preferably, the brushing mechanism includes a sliding rod. The left and right sides of the sliding rod are both fixedly connected to the sliding plate. A slider is sleeved on the outer circle of the sliding rod, and a plurality of brush hairs are evenly arranged on the top of the slider.

[0012] Preferably, a plurality of first sieve holes are evenly formed in the top of the first sieve plate, and a plurality of second sieve holes are evenly formed in the top of the second sieve plate. The inner diameter of the first sieve holes is larger than that of the second sieve holes.

[0013] Preferably, the top of the brush hairs located above is attached to the bottom of the first sieve plate, and the top of the brush hairs located below is attached to the bottom of the second sieve plate.

[0014] (III) Beneficial effects

[0015] Compared with the prior art, the present utility model has the following beneficial effects:

[0016] 1. When the device performs grading and screening, when the screening mechanism rotates, the slider can slide left and right on the sliding rod, and at the same time drive the brush hairs to move left and right. The brush hairs can dredge the first sieve holes and the second sieve holes, and brush out the blocked semiconductor materials therein to ensure the normal screening of the first sieve plate and the second sieve plate. In this way, the screening efficiency of semiconductor materials can be improved.

[0017] 2. When the device performs grading and screening, since the spring will bounce up and down after retracting, it can drive the screening mechanism to oscillate left and right, and the semiconductor materials can shake left and right accordingly. In this process, the first sieve holes can perform primary screening on the semiconductor materials, leaving the semiconductor materials with larger particles. The second sieve holes can perform secondary screening on the semiconductor materials, leaving the semiconductor materials with smaller particles. The semiconductor materials with even smaller particles will fall onto the connecting plate. In this way, semiconductor materials with different particle size levels can be screened out. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0019] Figure 2 is a planar structural schematic diagram of the present utility model;

[0020] Figure 3For the present utility model Figure 2 is an enlarged view of part A in it;

[0021] Figure 4 For the present utility model Figure 2 is an enlarged view of part B in it.

[0022] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0023] 1. Screening box; 11. Slide groove; 2. Screening mechanism; 21. Slide plate; 22. First sieve plate; 221. First sieve holes; 23. Second sieve plate; 231. Second sieve holes; 24. Connecting plate; 25. Rotating shaft; 3. Brushing mechanism; 31. Slide rod; 32. Slide block; 33. Brush bristles; 4. Legs; 5. Oscillating mechanism; 51. Cylinder; 52. Spring; 53. Pull rope; 6. Bottom wheels; 7. Support plate. Detailed implementation manners

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the attached drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0025] As Figures 1-4 shown, the present utility model provides a technical solution: a grading and oscillating device for semiconductor materials, including a screening box 1. Legs 4 are provided at the four corners of the bottom of the screening box 1, and bottom wheels 6 are provided at the bottoms of the legs 4. The bottom wheels 6 are universal wheels with built-in fixators. The device can move freely on the ground through the bottom wheels 6, and at the same time, the fixator can also fix the device to the ground.

[0026] Among them, a feed hopper is connected through the top of the screening box 1, and a hopper cover is provided at the top of the feed hopper. The back of the hopper cover is hinged to the back of the feed hopper through a hinge. During use, the hopper cover can be opened, and the semiconductor materials to be screened can be poured into the screening box 1 through the feed hopper, and then the hopper cover can be closed.

[0027] Specifically, a screening mechanism 2 is provided in the inner cavity of the screening box 1. The screening mechanism 2 includes two slide plates 21. The two slide plates 21 are arranged left and right. A first sieve plate 22, a second sieve plate 23, and a connecting plate 24 are fixedly connected in sequence from top to bottom between the two slide plates 21. The front and back surfaces of the slide plates 21, the first sieve plate 22, the second sieve plate 23, and the connecting plate 24 are respectively in contact with the front and back surfaces of the screening box 1. The front and back surfaces of the connecting plate 24 are respectively rotatably connected to the front and back surfaces of the inner wall of the screening box 1 through a rotating shaft 25. The screening mechanism 2 can rotate in the screening box 1 through the rotating shaft 25.

[0028] Among them, sliding grooves 11 are provided on both the left and right sides of the inner wall of the screening box 1. The sliding plate 21 is fitted to the inner wall of the sliding groove 11. Both the sliding plate 21 and the sliding groove 11 are arc-shaped, and the sliding plate 21 can slide up and down in the sliding groove 11.

[0029] Among them, a plurality of first screening holes 221 are evenly provided at the top of the first screening plate 22, and a plurality of second screening holes 231 are evenly provided at the top of the second screening plate 23. The inner diameter of the first screening hole 221 is larger than that of the second screening hole 231. The first screening hole 221 can screen out semiconductor materials with smaller particle sizes and leave semiconductor materials with larger particle sizes. The second screening hole 231 can screen out semiconductor materials with even smaller particle sizes and leave semiconductor materials with smaller particle sizes.

[0030] Furthermore, a support plate 7 is connected between the four legs 4. An oscillation mechanism 5 is provided on the top of the support plate 7. The oscillation mechanism 5 includes a cylinder 51 and a spring 52. The cylinder 51 and the spring 52 are respectively fixed to the left and right sides of the top of the support plate 7. The output shaft of the cylinder 51 and the top of the spring 52 are both connected with a pull rope 53. The top of the pull rope 53 penetrates through the bottom of the screening box 1 and is fixedly connected to the bottom of the connecting plate 24.

[0031] During classification screening, first open the exhaust switch of the cylinder 51. Its output shaft can pull down the connecting plate 24 through the left pull rope. At this time, the screening mechanism 2 rotates clockwise, and at the same time, the spring 52 is pulled up through the right pull rope. The spring 52 generates elastic deformation due to stretching. Then open the suction switch of the cylinder 51. Its output shaft moves upward and releases the pull rope 52. At this time, the spring 52 returns to its original state and pulls down the connecting plate 24 through the pull rope 52, causing the screening mechanism 2 to rotate counterclockwise. Then operate repeatedly. Since the spring 52 will bounce up and down after retracting, it can drive the screening mechanism 2 to oscillate left and right, and the semiconductor materials can shake left and right accordingly. During this process, the first screening hole 221 can perform primary screening on the semiconductor materials and leave the semiconductor materials with larger particles. The second screening hole 231 can perform secondary screening on the semiconductor materials and leave the semiconductor materials with smaller particles. The semiconductor materials with even smaller particles will fall onto the connecting plate 24. In this way, semiconductor materials of different particle size levels can be screened out.

[0032] Furthermore, two brushing mechanisms 3 are connected between the two sliding plates 21. The two brushing mechanisms 3 are arranged one above the other. The brushing mechanism 3 includes a sliding rod 31. The left and right sides of the sliding rod 31 are fixedly connected to the sliding plate 21. A slider 32 is sleeved on the outer circle of the sliding rod 31. A plurality of brush hairs 33 are evenly arranged on the top of the slider 32.

[0033] Among them, the top of the brush hairs 33 located above is in contact with the bottom of the first screening plate 22, and the top of the brush hairs 33 located below is in contact with the bottom of the second screening plate 23.

[0034] During hierarchical screening, when the screening mechanism 2 rotates, the slider 32 can slide left and right on the slide bar 31, driving the brush bristles 33 to move left and right at the same time. The brush bristles 33 can dredge the first sieve holes 221 and the second sieve holes 231, and brush out the blocked semiconductor materials inside to ensure the normal screening of the first sieve plate 22 and the second sieve plate 23, thereby accelerating the screening efficiency of the semiconductor materials.

[0035] Wherein, the front of the screening box 1 is open and provided with a box door. The right side of the box door is hinged to the right side of the screening box 1 through a hinge. After the semiconductor materials are screened, the box door can be opened, and the semiconductor materials of different particle sizes can be taken out in sequence.

[0036] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the said element.

[0037] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor material classification oscillation device, comprising a screening box (1), characterized in that: The inner cavity of the screening box (1) is provided with a screening mechanism (2), the screening mechanism (2) comprising two slide plates (21), the two slide plates (21) being arranged left and right, two brushing mechanisms (3) being connected between the two slide plates (21), the two brushing mechanisms (3) being arranged up and down, four corners of the bottom of the screening box (1) are provided with supporting legs (4), support plates (7) are connected between the four supporting legs (4), an oscillating mechanism (5) is provided on the top of the supporting plate (7), and a bottom wheel (6) is provided at the bottom of the supporting legs (4).

2. A semiconductor material graded oscillation device according to claim 1, characterized in that: The left and right sides of the inner wall of the screening box (1) are provided with a slide groove (11), the slide plate (21) is in contact with the inner wall of the slide groove (11), and the slide plate (21) and the slide groove (11) are both arc-shaped.

3. A semiconductor material graded oscillation device according to claim 1, characterized in that: A first sieve plate (22), a second sieve plate (23) and a connecting plate (24) are fixedly connected in sequence from top to bottom between the two slide plates (21); the front and back sides of the connecting plate (24) are rotatably connected to the front and back sides of the inner wall of the screening box (1) via a rotating shaft (25).

4. A semiconductor material graded oscillation device according to claim 3, characterized in that: The oscillating mechanism (5) comprises a cylinder (51) and a spring (52), wherein the cylinder (51) and the spring (52) are respectively fixed to the left and right sides of the top of the support plate (7), and the output shaft of the cylinder (51) and the top of the spring (52) are both connected with a pull rope (53), and the top of the pull rope (53) passes through the bottom of the screening box (1) and is fixedly connected to the bottom of the connecting plate (24).

5. A semiconductor material graded oscillation device according to claim 3, characterized in that: The brushing mechanism (3) comprises a slide bar (31), the left and right sides of which are fixedly connected to the slide plate (21), the outer ring of the slide bar (31) is provided with a slide block (32), and the top of the slide block (32) is evenly provided with a plurality of brush bristles (33).

6. A semiconductor material graded oscillation device according to claim 3, characterized in that: A plurality of first sieve holes (221) are evenly formed on the top of the first sieve plate (22), a plurality of second sieve holes (231) are evenly formed on the top of the second sieve plate (23), and the inner diameter of the first sieve hole (221) is greater than the inner diameter of the second sieve hole (231).

7. A semiconductor material graded oscillation device according to claim 5, characterized in that: The top of the bristles (33) located at the top is in contact with the bottom of the first sieve plate (22), and the top of the bristles (33) located at the bottom is in contact with the bottom of the second sieve plate (23).

Images