Wiping device for wafer chip processing

Abstract

The utility model discloses a wiping device for wafer chip processing. The wiping device comprises a machine base, a wiping box arranged on the top face of the machine base, inlet and outlet notches formed in the surfaces of the two sides of the wiping box, two pairs of conveying rollers and two pairs of wiping rollers which are arranged on the inner side of the wiping box, and T-shaped sliding grooves formed in the surfaces of the two sides of the wiping box and located above the inlet and outlet notches. The dust blocking plates are installed on the surfaces of the two sides of the wiping box in a sliding mode, and the T-shaped rear seats are fixed to the back faces of the dust blocking plates and located in the T-shaped sliding grooves in a sliding mode; the adjusting mechanism is arranged between the dust baffle and the wiping box; according to the utility model, by improving and optimizing a wiping device for wafer chip processing in the prior art, structures such as the ash baffle and the adjusting mechanism are additionally arranged on the basis of the original structure, so that the inlet and outlet gaps can be effectively covered and shielded on the premise of not influencing the feeding and discharging of the wafer chip; and external dust and foreign matters are prevented from entering the wiping box as much as possible, so that the subsequent wiping effect of the wafer chip in the wiping box is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer chip processing, and particularly relates to a wiping device for wafer chip processing. Background Technique

[0002] A wafer chip refers to a silicon wafer used to fabricate silicon semiconductor circuits. In the production and processing of wafer chips, multiple steps are required, and corresponding equipment and devices are needed for each step. During the wiping process of wafer chip processing, a wiping device is required to wipe off dirt and dust on the surface of the wafer chip. For example, in the existing patent with the publication number CN215815806U, "a wiping device for wafer chip processing, including a wiping mechanism for wiping, a drying mechanism for cooperating with the wiping mechanism for circulation, and an outer fixing mechanism for assisting in dust prevention. A conveying mechanism is arranged inside the outer fixing mechanism, the wiping mechanism is arranged between the conveying mechanisms, and the drying mechanism is connected to the upper end of the wiping mechanism", it can be seen that what is described in this application is exactly a common wiping device for wafer chip processing, which can rely on the wiping roller to achieve the wiping process on the surface of the wafer chip;

[0003] When the above-mentioned wiping device for wafer chip processing is actually used, the wiping process of the wafer chip is mainly carried out in the wiping box at the top. However, since there is no design of any shielding structure at the two sides' inlets and outlets of the wiping box, which is in an open state for a long time, some foreign matters such as dust in the outside world are likely to enter the wiping box from the inlets and outlets, reducing the cleanliness inside the wiping box, thereby affecting the wiping effect of the subsequent wafer chips entering the wiping box. There are drawbacks, so the utility model needs to improve and optimize this wiping device for wafer chip processing. Content of the Utility Model

[0004] The purpose of the utility model is to provide a wiping device for wafer chip processing to solve the problems put forward in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A wiping device for wafer chip processing, including

[0006] A machine base, a wiping box arranged on the top surface of the machine base, access gaps opened on both side surfaces of the wiping box, two pairs of conveying rollers and two pairs of wiping rollers installed inside the wiping box, and T-shaped sliding grooves opened on both side surfaces of the wiping box and located above the access gaps;

[0007] Dust-proof plates slidably installed on both side surfaces of the wiping box, T-shaped rear seats fixed on the back surfaces of the dust-proof plates and slidably located in the T-shaped sliding grooves, and the bottom ends of the dust-proof plates cover a part of the access gaps;

[0008] An adjustment mechanism is arranged between the dust baffle and the wiping box, and the adjustment mechanism includes an inner slide groove opened in the T-shaped rear seat, a spring and an inner slide block installed in the inner slide groove, a limit rod fixed on one side surface of the inner slide block, and a plurality of T-shaped slide grooves opened on the inner wall of the T-shaped slide groove, and the end of the limit rod passes through one of the limit grooves. The adjustment mechanism also includes a pull rod fixed on the other side surface of the inner slide block, and the end of the pull rod passes through the surface of the dust baffle and is fixed with a pull block.

[0009] Preferably, one end of the spring abuts against the inner wall of the inner slide groove, and the other end of the spring abuts against the surface of the inner slide block.

[0010] Preferably, a through hole corresponding to the pull rod is formed through the surface of the dust baffle.

[0011] Preferably, a rectangular buckle groove is provided on the bottom surface of the pull block.

[0012] Preferably, the top of the T-shaped slide groove is communicated with the top surface of the wiping box, and an anti-slip structure is provided at the top of the wiping box relative to the top of the T-shaped slide groove, and the anti-slip structure includes a screw fixed on the top surface of the wiping box, a limit stop strip and a butterfly nut sleeved on the surface of the screw, one end of the limit stop strip extends to the top of the T-shaped slide groove, and the butterfly nut presses and fixes the limit stop strip.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model improves and optimizes the wiping device used for wafer chip processing in the prior art, and adds structures such as a dust shield and an adjustment mechanism on the basis of its original structure. It can effectively cover and shield the inlet and outlet gaps without affecting the inlet and outlet of wafer chips, prevent unnecessary entry of external dust and foreign matter as much as possible, improve the cleanliness of the wiping box, and thus ensure the subsequent wiping effect of the wafer chips in the wiping box. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model;

[0015] Figure 2 For this utility model Figure 1 A partial enlarged view of the middle A area;

[0016] Figure 3 It is a cross-sectional view of the dust shield and the wiping box of the utility model;

[0017] Figure 4 For this utility model Figure 3 A partial enlarged view of the middle B area;

[0018] In the figure: 1. base; 2. wiping box; 21. entry and exit gap; 22. conveying roller; 23. T-shaped slide groove; 24. butterfly nut; 25. limit stop bar; 26. screw; 27. wiping roller; 3. dust baffle; 31. T-shaped rear seat; 5. adjustment mechanism; 51. pull block; 52. pull rod; 53. limit card slot; 54. inner slide groove; 55. spring; 56. inner slider; 57. limit card rod. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example

[0021] See also Figures 1 to 4 , is an embodiment of the utility model, which provides a technical solution: a wiping device for wafer chip processing, comprising

[0022] A machine base 1, a wiping box 2 arranged on the top surface of the machine base 1, inlet and outlet notches 21 opened on the two side surfaces of the wiping box 2, two pairs of conveying rollers 22 and two pairs of wiping rollers 27 rotatably installed on the inner side of the wiping box 2, and T-shaped slideways 23 opened on the two side surfaces of the wiping box 2 and located above the inlet and outlet notches 21, a plurality of driving motors are installed on the back of the wiping box 2, and the output ends of the driving motors pass through the inner side of the wiping box 2 and are connected to these conveying rollers 22 and wiping rollers 27 to drive these conveying rollers 22 and wiping rollers 27 to operate, and when the wafer chips to be wiped subsequently pass between the upper and lower conveying rollers 22 and the upper and lower wiping rollers 27, the wiping rollers 27 can wipe the upper and lower sides of the wafer chips;

[0023] The dust shield plate 3 is slidably mounted on the two side surfaces of the wiping box 2, and the T-shaped rear seat 31 is welded and fixed on the back of the dust shield plate 3 and slidably located in the T-shaped slide groove 23, and the bottom end of the dust shield plate 3 covers a part of the inlet and outlet notch 21, which can effectively cover and shield the inlet and outlet notch 21 without affecting the wafer chip inlet and outlet, and prevent unnecessary entry of external dust and foreign matter as much as possible, thereby improving the cleanliness of the wiping box 2;

[0024] The adjusting mechanism 5 arranged between the dust baffle 3 and the wiping box 2 enables the height of the dust baffle 3 to be adaptively adjusted according to different processing requirements. The adjusting mechanism 5 includes an inner sliding groove 54 opened in the T-shaped rear seat 31, a spring 55 and an inner slider 56 installed in the inner sliding groove 54, a limit clamping rod 57 welded and fixed on one side surface of the inner slider 56, and a plurality of T-shaped sliding grooves 23 opened on the inner wall of the T-shaped sliding groove 23. The end of the limit clamping rod 57 penetrates into one of the limit clamping grooves 53, which can stably limit the T-shaped rear seat 31 and the dust baffle 3. The adjusting mechanism 5 further includes a pull rod 52 fixed on the other side surface of the inner slider 56, and the end of the pull rod 52 penetrates to the surface of the dust baffle 3 and is fixed with a pull block 51. Subsequently, the pull rod 52 can be pulled through the pull block 51, so that the inner slider 56 moves laterally and compresses the spring 55 until the end of the limit clamping rod 57 moves out of the limit clamping groove 53, and the limit on the T-shaped rear seat 31 and the dust baffle 3 can be released. At this time, the dust baffle 3 can be slid up and down to adjust the height. After adjusting to the appropriate height, release the pull block 51, so that the spring 55 pushes the inner slider 56 back to its original position, and the end of the limit clamping rod 57 pops out into one of the limit clamping grooves 53, and the T-shaped rear seat 31 and the dust baffle 3 can be limited again.

[0025] Wherein, one end of the spring 55 abuts against the inner wall of the inner sliding groove 54, and the other end of the spring 55 abuts against the surface of the inner slider 56.

[0026] Wherein, a through hole corresponding to the pull rod 52 is penetrated on the surface of the dust baffle 3 for the smooth penetration of the pull rod 52.

[0027] Wherein, a rectangular buckle groove is opened on the bottom surface of the pull block 51, and subsequent operators can buckle their fingers into the rectangular buckle groove for convenient pulling of the pull block 51.

[0028] Wherein, the top end of the T-shaped sliding groove 23 communicates with the top surface of the wiping box 2, and an anti-detachment structure is arranged at the top of the wiping box 2 relative to the top end of the T-shaped sliding groove 23. The anti-detachment structure includes a screw rod 26 welded and fixed on the top surface of the wiping box 2, a limit retaining strip 25 sleeved on the surface of the screw rod 26, and a wing nut 24. The wing nut 24 is threadedly connected with the screw rod 26. One end of the limit retaining strip 25 extends to the top end of the T-shaped sliding groove 23, and the wing nut 24 presses and fixes the limit retaining strip 25. Under the blocking of the limit retaining strip 25, when the dust baffle 3 slides up and down to adjust the height, the T-shaped rear seat 31 will not directly slip off from the top end of the T-shaped sliding groove 23, playing an anti-detachment role. When the dust baffle 3 needs to be removed for maintenance in the future, only need to rotate the wing nut 24 counterclockwise to loosen it, and then rotate the limit retaining strip 25 around the screw rod 26 so that the end of the limit retaining strip 25 no longer blocks the top end of the T-shaped sliding groove 23, and the T-shaped rear seat 31 can be normally slid out from the top end of the T-shaped sliding groove 23 to realize the disassembly of the dust baffle 3.

[0029] Although embodiments of the present utility model have been shown and described (see the above detailed description), those of ordinary skill in the art will understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A wiping device for wafer chip processing, characterized in that: include A machine base (1), a wiping box (2) arranged on the top surface of the machine base (1), inlet and outlet notches (21) provided on the surfaces of both sides of the wiping box (2), two pairs of conveying rollers (22) and two pairs of wiping rollers (27) installed on the inner side of the wiping box (2), and a T-shaped slide groove (23) provided on the surfaces of both sides of the wiping box (2) and located above the inlet and outlet notches (21); An ash baffle (3) is slidably mounted on the two side surfaces of the wiping box (2), and a T-shaped rear seat (31) is fixed on the back of the ash baffle (3) and slidably located in the T-shaped slide groove (23), and the bottom end of the ash baffle (3) covers a portion of the inlet and outlet notch (21); An adjustment mechanism (5) is arranged between the dust baffle plate (3) and the wiping box (2).

2. A wiping device for wafer chip processing according to claim 1, characterized in that: The adjusting mechanism (5) comprises an inner slide groove (54) provided in the T-shaped rear seat (31), a spring (55) and an inner slide block (56) installed in the inner slide groove (54), a limit clamping rod (57) fixed on a side surface of the inner slide block (56), and a plurality of T-shaped slide grooves (23) provided on the inner wall of the T-shaped slide groove (23), wherein an end of the limit clamping rod (57) penetrates into one of the limit clamping grooves (53).

3. A wiping device for wafer chip processing according to claim 2, characterized in that: The adjustment mechanism (5) further comprises a pull rod (52) fixed to the other side surface of the inner sliding block (56), and the end of the pull rod (52) penetrates the surface of the dust shield (3) and is fixed with a pull block (51).

4. The wiping device for wafer chip processing according to claim 2, characterized in that: One end of the spring (55) abuts against the inner wall of the inner slide groove (54), and the other end of the spring (55) abuts against the surface of the inner slide block (56).

5. The wiping device for wafer chip processing according to claim 3, characterized in that: The surface of the dust baffle plate (3) is penetrated by a through hole corresponding to the pull rod (52).

6. The wiping device for wafer chip processing according to claim 3, characterized in that: A rectangular buckle groove is formed on the bottom surface of the pull block (51).

7. The wiping device for wafer chip processing according to claim 1, characterized in that: The top end of the T-shaped slide groove (23) is in communication with the top surface of the wiping box (2), and an anti-slip structure is provided at the top of the wiping box (2) relative to the top end of the T-shaped slide groove (23).

8. The wiping device for wafer chip processing according to claim 7, characterized in that: The anti-slip structure comprises a screw rod (26) fixed on the top surface of the wiping box (2), a limit stop bar (25) sleeved on the surface of the screw rod (26), and a butterfly nut (24), one end of the limit stop bar (25) extends to the top end of the T-shaped slide groove (23), and the butterfly nut (24) presses and fixes the limit stop bar (25).

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