Silicon wafer drying device and drying system

Abstract

The utility model relates to the technical field of solar cells, in particular to a silicon wafer drying device and a silicon wafer drying system. The utility model provides a silicon wafer drying device. The silicon wafer drying device comprises a groove body, an air blowing sheet, a lifting mechanism and an air supply mechanism, a placing cavity is formed in the groove body and is used for placing a silicon wafer; a plurality of blowing sheets are arranged in sequence, an insertion interval is arranged between any adjacent blowing sheets, and the insertion intervals are in one-to-one correspondence with the silicon wafers; an air inlet and an air blowing opening are formed in the air blowing piece, the air inlet communicates with the air blowing opening, the air inlet communicates with the air supply mechanism, and the air blowing opening is located in the side, facing the insertion interval, of the air blowing piece; all the blowing pieces are connected to the lifting mechanism. In the descending process of all the blowing pieces, the blowing openings in the blowing pieces on the two sides of the silicon wafer can blow air to the silicon wafer from top to bottom, liquid on the silicon wafer is driven downwards while the silicon wafer is blow-dried, the drying process time after cleaning can be shortened, and the product yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cells, in particular to a silicon wafer drying device and a drying system. Background Art

[0002] In the production process of photovoltaic cells, an external heating circulation drying system is usually used to dry the flower basket. Specifically, the flower basket is placed in the drying tank of the external heating circulation drying system for hot air drying. Since the tank body of the drying tank has a large space, the hot air inlet is located on the side of the tank body. There are many hot air inlets on the side and they are relatively close to the tank cover. The hot air is easy to overflow from the gap of the tank cover, resulting in heat reduction. Moreover, the hot air inlet is relatively close to the tank cover, and the hot air circulation effect in the tank body is poor, affecting the temperature of the drying tank and the drying effect of the flower basket. At present, after the silicon wafer battery is cleaned by a trough-type machine and dried in the drying tank, it takes a long time, generally more than 600S, which affects the overall production efficiency. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a silicon wafer drying device and a drying system to solve the technical problems that after the silicon wafer battery is cleaned by a trough-type machine on the market at present and then dried in the drying tank, the drying effect is poor and it takes a long time, affecting the overall production efficiency.

[0004] A silicon wafer drying device provided by the utility model includes: a tank body, a blowing sheet, a lifting mechanism and a air supply mechanism;

[0005] A placing cavity is arranged in the tank body, and the placing cavity is used for placing silicon wafers;

[0006] A plurality of blowing sheets are arranged in sequence, and an insertion interval is provided between any adjacent blowing sheets, and the insertion intervals correspond to the silicon wafers one by one;

[0007] An air inlet and a blowing port are arranged on the blowing sheet, and the air inlet is communicated with the blowing port. The air inlet is communicated with the air supply mechanism, and the blowing port is located on one side of the blowing sheet facing the insertion interval;

[0008] All the blowing sheets are connected to the lifting mechanism, and the lifting mechanism is used to drive all the blowing sheets to synchronously lift in and out of the placing cavity along the relative direction of the silicon wafers.

[0009] As a further technical solution, the upper end of the blowing sheet is connected to the lifting mechanism, and the blowing port is arranged at the lower end of the blowing sheet.

[0010] As a further technical solution, the blowing port is arranged to incline downward.

[0011] As a further technical solution, through holes are provided at the bottom of the tank body, and the through holes are used for exhausting air.

[0012] As a further technical solution, a plurality of the through holes are provided and correspond to the silicon wafers one by one.

[0013] As a further technical solution, at least a part of the through holes is located outside the projection of the corresponding silicon wafer on the bottom of the tank body.

[0014] As a further technical solution, an air extraction mechanism is further included, and the air extraction mechanism is communicated with the through holes.

[0015] As a further technical solution, the lifting mechanism includes a manipulator and a connecting frame, and all the air blowing sheets are connected to the manipulator through the connecting frame.

[0016] As a further technical solution, the air supply mechanism includes a nitrogen source and a heater;

[0017] The air outlet of the nitrogen source is communicated with one end of the heater, the heater is used for heating the nitrogen introduced by the nitrogen source, and the other end of the heater is communicated with the air inlet.

[0018] A drying system provided by the present utility model includes the silicon wafer drying device and a controller as described above;

[0019] The controller is electrically connected to the lifting mechanism and the air supply mechanism.

[0020] Compared with the prior art, the technical advantages of a silicon wafer drying device and a drying system provided by the present utility model are as follows:

[0021] The silicon wafer drying device provided by the present utility model includes: a tank body, air blowing sheets, a lifting mechanism and an air supply mechanism; a placement cavity is provided in the tank body for placing silicon wafers; a plurality of air blowing sheets are arranged in sequence, and an insertion interval is provided between any adjacent air blowing sheets, and the insertion intervals correspond to the silicon wafers one by one; an air inlet and an air blowing port are provided on the air blowing sheet, and the air inlet is communicated with the air blowing port, the air inlet is communicated with the air supply mechanism, and the air blowing port is located on the side of the air blowing sheet facing the insertion interval; all the air blowing sheets are connected to the lifting mechanism, and the lifting mechanism is used to drive all the air blowing sheets to synchronously lift in and out of the placement cavity along the relative direction of the silicon wafers.

[0022] After the silicon wafers are placed in the placement cavity, the lifting mechanism drives all the air blowing sheets to descend, so that the silicon wafers are inserted into the insertion intervals one by one, and there are air blowing sheets on both sides of each silicon wafer. Since the air blowing ports of the air blowing sheets are located on the side of the air blowing sheets facing the insertion intervals, that is, facing the silicon wafers, during the descent of all the air blowing sheets, the air blowing ports on the air blowing sheets on both sides of the silicon wafers can blow air onto the silicon wafers from top to bottom, driving the liquid on the silicon wafers downward while drying the silicon wafers. This can not only reduce the drying process time after cleaning, but also reduce the time from more than 600S to within 50S, shorten the process time, increase the product output, reduce the length of the machine, and reduce the floor area of the machine in the factory building. That is, it can achieve rapid drying, increase the output, reduce the number of drying tanks, reduce the procurement cost of the machine, reduce the length of the machine, reduce the floor area of the factory building, and at the same time cancel the slow lifting dehydration tank body.

[0023] The drying system provided by the present utility model includes the above-mentioned silicon wafer drying device and a controller. Thus, the technical advantages and effects achieved by it include the technical advantages and effects achieved by the above-mentioned silicon wafer drying device, which will not be elaborated in detail here.

[0024] Other features and advantages of the present utility model will be described in detail in the subsequent specific implementation section. Brief Description of the Drawings

[0025] In order to more clearly illustrate the specific implementation manners of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific implementation manners or the prior art. Obviously, the drawings in the following description are some implementation manners of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0026] Figure 1 Schematic diagram of the drying device provided by an embodiment of the present utility model.

[0027] Reference numerals: 1 - tank body; 2 - air blowing sheet; 3 - placement cavity; 4 - silicon wafer; 5 - insertion interval; 6 - through hole; 7 - connecting frame; 8 - air flow direction. Detailed Description of the Preferred Embodiments

[0028] The following will clearly and completely describe the technical solutions of the present utility model in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present utility model.

[0029] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0030] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0031] In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0032] The following further describes the present utility model in detail through specific embodiments and in conjunction with the drawings.

[0033] The specific structure is as Figure 1 shown.

[0034] This embodiment provides a silicon wafer drying device, including: a tank body 1, a blowing sheet 2, a lifting mechanism, and a air supply mechanism;

[0035] A placement cavity 3 is provided in the tank body 1, and the placement cavity 3 is used for placing silicon wafers 4;

[0036] A plurality of blowing sheets 2 are arranged in sequence, and an insertion interval 5 is provided between any adjacent blowing sheets 2, and the insertion interval 5 corresponds to the silicon wafer 4 one by one;

[0037] An air inlet and an air outlet are provided on the blowing sheet 2, and the air inlet is communicated with the air outlet, the air inlet is communicated with the air supply mechanism, and the air outlet is located on the side of the blowing sheet 2 facing the insertion interval 5;

[0038] All the blowing pieces 2 are connected to the lifting mechanism, and the lifting mechanism is used to drive all the blowing pieces 2 to synchronously lift in and out of the placement cavity 3 along the relative direction with the silicon wafer.

[0039] In this embodiment, after the silicon wafer with a flower basket is placed in the placement cavity 3, the lifting mechanism drives all the blowing pieces 2 to descend, so that the silicon wafers 4 are inserted into the insertion intervals 5 one by one. And there are blowing pieces 2 on both sides of each silicon wafer 4. Since the air blowing openings of the blowing pieces 2 are located on the side of the blowing pieces 2 facing the insertion intervals 5, that is, facing the silicon wafers 4, during the descent of all the blowing pieces 2, the air blowing openings on the blowing pieces 2 on both sides of the silicon wafer 4 can blow air onto the silicon wafer 4 from top to bottom. While drying the silicon wafer 4, the liquid on the silicon wafer 4 is driven downward. This can not only reduce the drying process time after cleaning, but also reduce the time from more than 600S to within 50S. It can also shorten the process time, increase the product output, and can reduce the length of the machine, reduce the floor area of the machine in the factory building, that is, it can achieve rapid drying, increase the output, reduce the number of drying tanks, reduce the procurement cost of the machine, reduce the length of the machine, reduce the floor area of the factory building, and at the same time can cancel the slow lifting dehydration tank body 1.

[0040] In this embodiment, when the lifting mechanism drives all the blowing pieces 2 to descend to the bottom of the silicon wafer 4, the drying of the silicon wafer 4 is completed. Then the lifting mechanism drives all the blowing pieces 2 to rise so that the silicon wafers 4 exit the insertion intervals 5, and then another silicon wafer with a flower basket is replaced for drying, and so on. Among them, the speed at which the lifting mechanism drives all the blowing pieces 2 to descend is adjusted according to the specific drying effect, as long as the drying effect can be ensured. And when the lifting mechanism drives all the blowing pieces 2 to rise so that the silicon wafers 4 exit the insertion intervals 5, since there is no need to dry the silicon wafers 4 at this time, the rising speed can be fast to improve the efficiency, but it can also be the same as the descending speed, depending on the specific requirements.

[0041] In this embodiment, along the setting direction of the blowing pieces 2, only one side of the blowing pieces 2 at both ends is provided with air blowing openings, and the blowing pieces 2 in the remaining middle part are provided with air blowing openings on both sides. During the descent, the air blown out from the air blowing openings can linearly move from the lower end of one side of the silicon wafer 4 to the bottom end.

[0042] It should be noted that the blowing piece 2 has an air passage inside, and the air inlet and the air blowing opening are connected through the air passage.

[0043] In an alternative technical solution of this embodiment, the upper end of the blowing piece 2 is connected to the lifting mechanism, and the air blowing opening is arranged at the lower end of the blowing piece 2. During the descent of the blowing piece 2, the air blowing opening located at the lower end of the blowing piece 2 can blow to the silicon wafer 4 faster, reduce the overall descent stroke, and improve the drying efficiency.

[0044] In an alternative technical solution of this embodiment, the air outlet is arranged to incline downward. The air flow blown out is inclined downward, which can, on the one hand, reach the silicon wafer 4 faster, and on the other hand, can better drive the liquid on the silicon wafer 4 downward, improving the drying efficiency.

[0045] Specifically, the inclination angle of the air outlet is between 20° and 70°. Preferably, the inclination angle of the air outlet is 45°, so that the air flow direction 8 of the air outlet can incline downward by 45°.

[0046] In an alternative technical solution of this embodiment, through holes 6 are provided at the bottom of the tank body 1, and the through holes 6 are used for exhausting air. The gas in the tank body 1 can be discharged through the through holes 6 to avoid air flow disorder. At the same time, the through holes 6 can also discharge liquid to avoid liquid accumulation in the tank body 1.

[0047] In an alternative technical solution of this embodiment, a plurality of through holes 6 are provided and are in one-to-one correspondence with the silicon wafers 4. The air flow blown out by each blowing piece 2 flows downward after contacting the silicon wafer 4 and is finally discharged through the corresponding through hole 6, further reducing the possibility of air flow disorder and improving the drying effect.

[0048] In an alternative technical solution of this embodiment, at least a part of the through hole 6 is located outside the projection of the corresponding silicon wafer 4 on the bottom of the tank body 1.

[0049] In this embodiment, the through hole 6 is opened at the projection of the silicon wafer 4 on the bottom of the tank body 1, and at least a part of the through hole 6 is located outside the projection, making it more convenient for the air flow to enter the through hole 6, further reducing the possibility of air flow disorder and improving the drying effect.

[0050] In an alternative technical solution of this embodiment, a pumping mechanism is further included, and the pumping mechanism is communicated with the through hole 6. By pumping air through the pumping mechanism, a negative pressure is formed at the through hole 6, facilitating the entry of air flow into the through hole 6. Among them, the pumping mechanism can be an electric air pump, a vacuum unit, or a vacuum pump, but is not limited thereto, as long as the air pumping requirement is met.

[0051] In an alternative technical solution of this embodiment, the lifting mechanism includes a manipulator and a connecting frame 7, and all the blowing pieces 2 are connected to the manipulator through the connecting frame 7. The structure is simple, and the manipulator is flexible, capable of better driving the connecting frame 7 to lift.

[0052] This embodiment is not limited thereto. The lifting mechanism can also be an electric lifting slide, a lifting electric cylinder, etc., as long as the lifting requirement is met.

[0053] In an alternative technical solution of this embodiment, the air supply mechanism includes a nitrogen source and a heater;

[0054] The air outlet of the nitrogen source is communicated with one end of the heater. The heater is used to heat the nitrogen introduced from the nitrogen source, and the other end of the heater is communicated with the air inlet. By using high-temperature nitrogen to dry the silicon wafer 4, not only is the drying efficiency high, but also the drying effect is good.

[0055] In this embodiment, it is not limited to this. The air supply mechanism can also be an air compressor, a gas storage tank, etc., as long as it can meet the air supply requirements.

[0056] The air supply mechanism can also include an air duct, a filter element and a motor. After the air supply mechanism sends the preliminarily filtered gas to the heater for heating to form heated gas, the heated gas is then secondarily filtered through the filter element to prevent impurities from being blown onto the silicon wafer 4, effectively ensuring the production quality of the silicon wafer 4.

[0057] A drying system provided in this embodiment includes the above-mentioned silicon wafer drying device. Therefore, the technical advantages and effects achieved by this drying system include the technical advantages and effects achieved by the above-mentioned silicon wafer drying device, which will not be elaborated here.

[0058] In this embodiment, the drying system further includes a controller; the controller is electrically connected to the lifting mechanism and the air supply mechanism. By controlling the lifting mechanism and the air supply mechanism to work through the controller, the degree of automation is high.

[0059] Furthermore, the air extraction mechanism is also electrically connected to the controller, and its work is controlled through the controller.

[0060] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A silicon wafer drying device, characterized in that: include: A tank body (1), an air blowing plate (2), a lifting mechanism and an air supply mechanism; The tank body (1) has a placement cavity (3) therein, and the placement cavity (3) is used to place a silicon wafer (4); A plurality of the blowing sheets (2) are arranged in sequence, and an insertion gap (5) is provided between any adjacent blowing sheets (2), and the insertion gap (5) corresponds one-to-one to the silicon sheet (4); The air blowing plate (2) is provided with an air inlet and an air blowing port, and the air inlet is connected to the air blowing port, the air inlet is connected to the air supply mechanism, and the air blowing port is located on a side of the air blowing plate (2) facing the insertion space (5); All of the air blowing plates (2) are connected to the lifting mechanism, and the lifting mechanism is used to drive all of the air blowing plates (2) to synchronously lift and lower in and out of the placement cavity (3) along a direction relative to the silicon wafer.

2. The silicon wafer drying device according to claim 1, characterized in that: The upper end of the air blowing piece (2) is connected to the lifting mechanism, and the lower end of the air blowing piece (2) is provided with the air blowing port.

3. The silicon wafer drying device according to claim 2, characterized in that: The air blowing port is arranged to be tilted downward.

4. The silicon wafer drying device according to claim 1, characterized in that: The bottom of the tank body (1) is provided with a through hole (6), and the through hole (6) is used for exhaust.

5. The silicon wafer drying device according to claim 4, characterized in that: A plurality of through holes (6) are provided, and correspond one to one with the silicon wafers (4).

6. The silicon wafer drying device according to claim 5, characterized in that: The through hole (6) is at least partially located outside the projection of the corresponding silicon wafer (4) on the bottom of the groove body (1).

7. The silicon wafer drying device according to claim 4, characterized in that: It also comprises an air extraction mechanism, which is connected to the through hole (6).

8. The silicon wafer drying device according to any one of claims 1 to 7, characterized in that: The lifting mechanism comprises a robot and a connecting frame (7), and all the blowing sheets (2) are connected to the robot via the connecting frame (7).

9. The silicon wafer drying device according to any one of claims 1 to 7, characterized in that: The air supply mechanism includes a nitrogen source and a heater; The air outlet of the nitrogen source is communicated with one end of the heater, and the heater is used to heat the nitrogen introduced from the nitrogen source. The other end of the heater is communicated with the air inlet.

10. A drying system, characterized in that: A silicon wafer drying device and a controller comprising any one of claims 1 to 9; The controller is electrically connected to the lifting mechanism and the air supply mechanism.

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