High-temperature, high-voltage and large-current sample test board

Abstract

The utility model discloses a high-temperature, high-voltage and large-current sample testboard, which comprises a bottom plate, the grounding protection shell is arranged on the bottom plate, and the bottom plate and the grounding protection shell are both used for grounding; the shielding part is arranged on the upper surface of the bottom plate and is surrounded by the grounding protection shell; the test platform is arranged in the shielding part, and an adsorption hole and an adsorption groove are formed in the upper surface of the test platform; the temperature control part is arranged on the lower surface of the test platform and comprises a heat insulation plate, a heating plate, a heat conduction protection plate and a heat transfer plate which are sequentially arranged from bottom to top, and the heat transfer plate is connected with the lower surface of the test platform. According to the utility model, heat energy generated by the heating plate sequentially passes through the heat conduction protection plate and the heat transfer plate and then can be uniformly transferred to the test platform to heat a product, so that the temperature control effect of the product is good, and the test precision is high; in addition, the grounding protection shell and the bottom plate are grounded, and the shielding part can shield external interference when the product is in a high-voltage large-current test, so that the stability is good, and the test precision is high.

Description

Technical Field

[0001] The utility model relates to a test bench, in particular to a test bench for high-temperature, high-pressure and high-current samples. Background Art

[0002] In the semiconductor field, semiconductor samples need to be tested under high temperature and high pressure during research and development to meet the requirements for the relevant performance of products, so as to improve and enhance the products.

[0003] Currently, when testing products, a special sample test bench is mostly used to put semiconductor samples into the sample and then simulate the test under high-temperature and high-pressure environments. However, in the existing high-temperature tests, a heating plate is mostly directly used to heat the product, resulting in poor uniformity of the product temperature during heating, leading to inaccurate testing. At the same time, the shielding performance of the product under high pressure and high current is also not good, which may cause interference during sample testing, further resulting in poor testing accuracy. Summary of the Utility Model

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a test bench for high-temperature, high-pressure and high-current samples, which has a compact structure, good temperature uniformity of the product during heating, strong shielding effect, and high stability and reliability of testing.

[0005] To achieve the above object, the technical solution adopted by the utility model is: a test bench for high-temperature, high-pressure and high-current samples, comprising:

[0006] A bottom plate;

[0007] An earthing protection shell, arranged on the bottom plate, wherein both the bottom plate and the earthing protection shell are used for earthing;

[0008] A shielding part, arranged on the upper surface of the bottom plate and surrounded by the earthing protection shell;

[0009] A test platform, arranged inside the shielding part, and the upper surface of the test platform is provided with adsorption holes and adsorption grooves for adsorbing products;

[0010] A temperature control part, arranged on the lower surface of the test platform for heating and raising the temperature of the test platform. Among them, the temperature control part includes a heat insulation plate, a heating plate, a heat conduction protection plate and a heat transfer plate arranged in sequence from bottom to top, and the heat transfer plate is connected to the lower surface of the test platform.

[0011] Further, the materials of the earthing protection shell and the bottom plate are aluminum.

[0012] Further, the shielding part includes a shielding bottom plate, which is arranged inside the earthing protection shell and located at the bottom of the bottom plate; a hollow shielding shell is arranged on the upper surface of the shielding bottom plate.

[0013] Further, the materials of the shielding bottom plate and the shielding housing are both tetrafluoroethylene rings.

[0014] Further, the material of the heat-conducting protection plate is copper.

[0015] Further, the material of the heat-transfer plate is alumina.

[0016] Further, the areas of the heating plate, the heat-transfer plate, and the heat-conducting protection plate increase in sequence.

[0017] Further, the test platform is also provided with a water inlet and a water outlet on one side of the notch of the shielding part and the grounding protection shell; the water inlet and the water outlet are communicated with the circulating water path in the test platform.

[0018] Further, a temperature-sensing wire connected to the temperature sensor is also installed on one side of the test platform.

[0019] Due to the application of the above technical solution, the present utility model has the following advantages compared with the prior art:

[0020] For the high-temperature, high-pressure, and high-current sample test bench of the present utility model, the heat energy generated after heating by the heating plate is sequentially passed through the heat-conducting protection plate and the heat-transfer plate, and then the heat can be evenly transferred to the test platform to heat the product, so that the temperature control effect of the product is good and the test accuracy of the product is high; in addition, through the grounding of the grounding protection shell and the bottom plate, and the shielding part can shield external interference when the product is in high-pressure and high-current tests, and the safety performance and stability are good, and the test accuracy is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The following further describes the technical solution of the present utility model with reference to the drawings:

[0022] Figure 1 It is a three-dimensional structure schematic diagram of an embodiment of the present utility model;

[0023] Figure 2 is Figure 1 the three-dimensional structure schematic diagram after omitting the grounding protection shell and the shielding housing in

[0024] Figure 3 It is a three-dimensional structure exploded schematic diagram of the temperature control part and the bottom plate in an embodiment of the present utility model;

[0025] Among them: bottom plate 1, grounding protection shell 2, shielding part 3, test platform 4, temperature control part 5, temperature-sensing wire 6, temperature control part 5, shielding bottom plate 30, shielding housing 31, adsorption hole 40, water inlet 41, water outlet 42, adsorption groove 43, vacuum pumping hole 44, heat insulation plate 50, heating plate 51, heat-conducting protection plate 52, heat-transfer plate 53. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] To enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the protection scope of this application.

[0027] The utility model provides a high-temperature, high-pressure and high-current sample test bench to solve the problems in the prior art that the temperature uniformity of products on the test platform is inconsistent at high temperatures, the shielding effect is poor, resulting in poor test accuracy when the products are tested under high temperature, high pressure and high current, and it is inconvenient to use.

[0028] For the convenience of understanding, the specific process in the embodiments of this application will be described below. Please refer to Figures 1 to 3 A high-temperature, high-pressure and high-current sample test bench in the embodiments of this application includes a bottom plate 1, a grounding protection shell 2, a shielding part 3, a test platform 4 and a temperature control part 5; the grounding protection shell 2 is arranged on the upper surface of the bottom plate 1; the shielding part 3 is arranged on the bottom plate 1 and is surrounded by the grounding protection shell 2; the test platform 4 is arranged in the shielding part 3 and is flush with the upper surface of the grounding protection shell 2. The upper surface of the test platform 4 is provided with adsorption holes 40 and adsorption grooves 43 for adsorbing products; the temperature control part 5 is arranged on the lower surface of the test platform 4 to heat up the test platform 4. The temperature control part includes a heat insulation plate 50, a heating plate 51, a heat conduction protection plate 52 and a heat transfer plate 53 arranged in sequence from bottom to top.

[0029] In the sample test bench of the utility model, after the heating plate 51 is heated, the heat energy can be evenly transferred to the test platform 4 through the heat conduction protection plate 52 and the heat transfer plate 53 in sequence to heat up the product. In this way, the temperature control effect of the product is good, and the test accuracy of the product at high temperature is high; in addition, through the grounding of the grounding protection shell 2 and the bottom plate 1, and the shielding part 3 can shield external interference when the product is under high-pressure and high-current tests, the safety performance and stability are good, and the test accuracy is high.

[0030] Further, the grounding protection shell 2 in this embodiment is in a cylindrical shape, and the hollow part of the grounding protection shell 2 is used to place the shielding part 3, the test platform 4 and the temperature control part 5. The grounding protection shell 2 and the bottom plate 1 are made of aluminum material, which has a good electromagnetic shielding effect and is externally connected by grounding, which can effectively reduce the influence of external electromagnetic interference on the test results. In this way, the test bench can maintain stable operation under high-pressure and high-current conditions, improving the accuracy and reliability of the test.

[0031] In addition, after the grounding protection shell 2 and the bottom plate 1 are made of aluminum, the durability and load-bearing capacity of the test bench are greatly enhanced, enabling it to stably carry semiconductor samples.

[0032] Furthermore, the shielding part 3 is arranged in the internal space of the grounding protection shell 2. The shielding part 3 includes a shielding bottom plate 30, and the shielding bottom plate 30 is installed on the upper surface of the bottom plate 1. At the same time, a hollow shielding shell 31 is installed on the upper surface of the shielding bottom plate 30. The shielding formed by the shielding bottom plate 30 and the shielding shell 31 avoids interference from the outside to the test products on the test platform, improving the stability during testing.

[0033] Specifically, the materials of the shielding bottom plate 30 and the shielding shell 31 are tetrafluoroethylene. The tetrafluoroethylene ring can resist the erosion of various chemical substances, thus ensuring that the test results will not be affected by material corrosion during the test. In addition, the tetrafluoroethylene ring also has good insulation performance and thermal stability, which can effectively prevent the occurrence of circuit short-circuit and overheating phenomena. This enables it to work stably under high voltage and large current conditions, providing reliable support for semiconductor testing.

[0034] Furthermore, in this embodiment, on one side of the notch between the shielding part 3 and the grounding protection shell 2, four vacuum pumping holes 44 are opened on the side surface of the test platform 4. The four vacuum pumping holes 44 communicate with the adsorption hole 40 at the center of the upper surface of the test platform 4 and two coaxially arranged annular adsorption grooves 43. The product can be well adsorbed through the adsorption hole 40 and the two adsorption grooves 43 to fix the product.

[0035] Furthermore, based on Figure 3 , in this embodiment, the heat-conducting protection plate 52 completely covers the upper surface of the heating plate 51. Since the heating method of the heating plate 51 is linear heating, if the product on the test platform is directly heated and temperature increased by the heating plate 51, it will cause the temperature of each part of the product to be inconsistent, resulting in inaccurate measurement. Therefore, a heat-conducting protection plate 52 is first arranged on the upper surface of the heating plate 51. On the one hand, the heat-conducting protection plate 52 can protect the heating plate 51 to avoid the situation that the heating plate may be damaged when directly installed under the test platform; on the other hand, it can also homogenize the temperature generated by the heating plate 51, that is, the generated temperature can be homogenized through the heat-conducting protection plate 52 and then transferred upward.

[0036] At the same time, a heat-transfer plate 53 is also arranged on the upper surface of the heat-conducting protection plate 52 to further homogenize the heat energy transferred by the heat-conducting protection plate 52. In this way, the heat transferred to the product on the test platform 4 is more uniform, and the test accuracy of the product at high temperature is also more precise.

[0037] Further, in this embodiment, the areas of the heating plate 51, the heat transfer plate 53, and the heat conduction protection plate 52 increase in sequence. In this way, the heat conduction protection plate can play the role of protecting and conducting heat for the heating plate. At the same time, the heat transfer plate is larger than the heat conduction protection plate, so that the heat on the heat conduction protection plate can be received and then transferred to the test platform after being completed.

[0038] Among them, the material of the heat transfer plate is alumina, and its heat conduction effect is good, meeting the usage requirements.

[0039] In addition, the heat conduction protection plate 52 is made of copper plate, which can not only play the role of protecting the heating plate, but also transfer the heat generated by the heating plate to the heat transfer plate 53 well.

[0040] Further, an inlet 41 and an outlet 42 are also provided on one side of the test platform 4 at the notch of the shielding part 3 and the grounding protection shell 2; the inlet 41 and the outlet 42 are communicated with the circulating water path in the test platform 4, so that the circulating water path plays a role in cooling and stabilizing the temperature of the product on the test platform 4.

[0041] In addition, a temperature sensing wire 6 is installed on one side of the test platform 4, and the temperature sensing wire 6 is connected to an external temperature sensor, so that the temperature of the test platform 4 can be understood in real time, thus adapting to the temperature test requirements of different products.

[0042] Based on Figures 1 to 3 , during operation, first place the product on the test platform 4, and the adsorption holes 40 and the two adsorption grooves 43 on the test platform 4 adsorb the product.

[0043] When an external source meter is input to this sample test bench, the product is tested under high voltage and high current conditions. At this time, the first layer of shielding is composed of the grounding protection shell 2 and the bottom plate 1, and the second layer of shielding is composed of the shielding bottom plate 30 and the shielding housing 31. In this way, under the dual shielding, the influence of external electromagnetic interference on the test results of the product under high voltage and large current can be effectively reduced, and the accuracy and reliability of the test are improved.

[0044] When it is necessary to test the product at a high temperature, the heating plate 51 is heated through an external heating wire. After heating, the linear heat generated by the heating plate 51 enters the heat conduction protection plate 52. The heat conduction protection plate 52 uniformly processes the heat. The heat after the first uniform processing enters the heat transfer plate 53 for the second heat uniform processing. In this way, the heat temperature uniformity of the product transferred to the test platform 4 is good, the product can quickly heat up, and the overall temperature uniformity of the product is ensured, so as to ensure the test of the product at a high temperature.

[0045] During high-temperature testing, the temperature can be monitored in real time through a temperature sensor connected to the temperature-sensing wire 6 to ensure that the test platform 4 is at the set temperature, and the temperature can be stably controlled through a cooling water circuit connected to the water inlet 41 and the water outlet 42 to further determine the accuracy during product testing.

[0046] The sample test platform of the present utility model has a simple structure and is convenient to operate. Under high voltage and high current conditions, it has good shielding effect. Under high-temperature conditions, it heats up rapidly, and the temperature uniformity of the product is good, and the test accuracy is high, meeting the actual test requirements.

[0047] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

1. A high temperature, high voltage and high current sample test bench, characterized in that: include: Base plate; A grounding protective shell is arranged on the bottom plate, wherein the bottom plate and the grounding protective shell are both used for grounding; A shielding portion, disposed on the upper surface of the bottom plate and surrounded by the grounding protective shell; A test platform, arranged in the shielding part, wherein an adsorption hole and an adsorption groove for adsorbing the product are provided on the upper surface of the test platform; The temperature control unit is arranged on the lower surface of the test platform and is used to heat the test platform. The temperature control unit includes a heat insulation plate, a heating plate, a heat conductive protection plate and a heat transfer plate arranged in sequence from bottom to top, and the heat transfer plate is connected to the lower surface of the test platform.

2. The high temperature, high voltage and high current sample test bench according to claim 1, characterized in that: The grounding protection shell and the bottom plate are made of aluminum.

3. The high temperature, high voltage and high current sample test bench according to claim 1, characterized in that: The shielding part comprises a shielding bottom plate, which is arranged in the grounding protection shell and located at the bottom of the bottom plate; a hollow shielding shell is arranged on the upper surface of the shielding bottom plate.

4. The high temperature, high voltage and high current sample test bench according to claim 3, characterized in that: The shielding bottom plate and the shielding shell are both made of tetrafluoroethylene ring.

5. The high temperature, high voltage and high current sample test bench according to claim 1, characterized in that: The material of the heat conductive protection plate is copper.

6. The high temperature, high voltage and high current sample test bench according to claim 1, characterized in that: The heat transfer plate is made of alumina.

7. The high temperature, high voltage and high current sample test bench according to claim 1, characterized in that: The areas of the heating plate, the heat transfer plate and the heat conductive protection plate become larger in sequence.

8. The high temperature, high voltage and high current sample test bench according to claim 1, characterized in that: The test platform is also provided with a water inlet and a water outlet on one side of the gap between the shielding part and the grounding protection shell; the water inlet and the water outlet are communicated with the circulating water circuit in the test platform.

9. The high temperature, high voltage and high current sample test bench according to claim 1, characterized in that: A temperature sensing line connected to a temperature sensor is also installed on one side of the test platform.

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