Chip high-temperature test equipment

Abstract

The utility model discloses chip high-temperature test equipment, which comprises a test equipment main body, moving wheels arranged at the lower end of the test equipment main body, a display and control panel arranged at the left front part of the test equipment main body, and a high-temperature annular conveying assembly arranged at the middle part of the test equipment main body, the detection assembly comprises a detection support frame fixedly mounted at the rear end of the middle part of the test equipment main body, a probe plate mounted at the top end of the detection support frame, a jacking cylinder arranged at the lower end of the detection support frame, and a test seat and a gantry carrying mechanism which are arranged at the output end of the jacking cylinder; and the gantry carrying mechanism is mounted at the right end of the middle part of the test equipment main body, and is used for taking and placing the chip. According to the chip high-temperature test equipment, feeding and carrying of waffle boxes loaded with chips are facilitated, and the heated chips can be automatically detected through arrangement of the detection assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and particularly relates to a chip high-temperature testing device. Background Art

[0002] With the rapid development of electronic technology, as the core component in modern electronic devices, the quality and performance stability of chips are particularly important. In the production process of chips, high-temperature testing is one of the key links to ensure that chips can operate normally under extreme working conditions. However, traditional chip high-temperature testing devices have some obvious limitations in practical applications, which are specifically as follows:

[0003] Firstly, in the loading and unloading operations of chips for traditional chip high-temperature testing devices, manual operation is usually required, which not only increases the labor intensity of operators but also reduces the testing efficiency. In addition, due to the instability of manual operation, the position of the chip may shift or be damaged during the testing process, thus affecting the testing accuracy.

[0004] Secondly, for the handling and conveying of chips, traditional testing devices often lack an effective automation mechanism. This not only increases the risk of chips being contaminated or damaged during the testing process but also limits the processing capacity and testing efficiency of the testing device.

[0005] Furthermore, for unqualified chips, traditional testing devices often lack an automatic separation and processing mechanism. After the testing is completed, manual screening and classification of chips are usually required, which not only increases the labor cost but also reduces the automation degree of the testing.

[0006] Therefore, in order to overcome the above deficiencies of traditional chip high-temperature testing devices, those skilled in the art urgently need to propose a high-temperature testing device that can improve the automation degree and efficiency of chip testing. Content of the Utility Model

[0007] The purpose of the utility model is to provide a chip high-temperature testing device to solve the problems raised in the above background art, that is, for the usual chip high-temperature testing device, in the actual use process, the loading and unloading operations of chips are relatively inconvenient, it is not convenient to handle and convey chips, it is not convenient to separate unqualified chips, and the automation degree is not high.

[0008] To achieve the above purpose, the utility model provides the following technical solution: A chip high-temperature testing device, including a testing device main body, moving wheels installed at the lower end of the testing device main body, and a display and control panel arranged at the front left of the testing device main body;

[0009] It further includes:

[0010] High-temperature annular conveying assembly, the high-temperature annular conveying assembly is arranged in the middle of the test equipment main body, and the high-temperature annular conveying assembly is used to convey the waffle box carrying the chip to be detected. A chip preheating platform is arranged at the left end of the middle part of the test equipment main body, and a cooling platform is arranged at the right end of the middle part of the test equipment main body;

[0011] Detection assembly, the detection assembly includes a detection support frame fixedly installed at the rear end of the middle part of the test equipment main body, a probe board installed at the top of the detection support frame, a jacking cylinder arranged at the lower end of the detection support frame, and a test seat arranged at the output end of the jacking cylinder;

[0012] Among them, multiple groups of the detection support frame, probe board and jacking cylinder are respectively arranged at the lower end of the detection assembly;

[0013] Gantry handling mechanism, the gantry handling mechanism is installed at the right end of the middle part of the test equipment main body, and the gantry handling mechanism is used to pick and place the chip.

[0014] Preferably, a waffle box loading assembly is installed at the left end of the test equipment main body, an upper loading handling assembly is arranged at the rear end of the waffle box loading assembly, and a high-temperature annular conveying assembly is arranged at the rear end of the upper loading handling assembly.

[0015] Preferably, the high-temperature annular conveying assembly includes a high-temperature resistant conveyor belt and a conveying mechanism. The waffle boxes are evenly spaced on the conveyor belt, and the conveying mechanism drives the conveyor belt carrying the waffle boxes to move.

[0016] Preferably, multiple groups of waffle box unloading assemblies are arranged at the right front side of the middle part of the test equipment main body, and an empty waffle box bin is arranged at the right end of the waffle box unloading assembly.

[0017] Preferably, a sealing ring is arranged in the middle of the test seat, an air vent groove is arranged inside the sealing ring, and the air vent groove is opened at the central position of the test seat. An NG area is arranged at the right rear side of the upper end of the test equipment main body.

[0018] Preferably, positioning pin studs for positioning are arranged on the upper surface of the test seat, a probe board is arranged above the test seat, and internal probes are arranged on the side surface of the probe board.

[0019] Preferably, peripheral probes are arranged outside the internal probes, and both the internal probes and the peripheral probes are installed on the side surface of the probe board.

[0020] Preferably, the gantry handling mechanism includes a clamping mechanism, and the clamping mechanism accurately picks up the chip from the test seat and transports it to the designated position.

[0021] Compared with the prior art, the beneficial effects of the present utility model are as follows: for this chip high-temperature testing equipment, through the settings of the waffle box feeding component and the feeding handling component, it is convenient to feed and handle the waffle box carrying the chip. Through the setting of the detection component, it can automatically detect the heated chip. Moreover, after the detection is completed, the chip can be clamped and conveyed by the gantry handling mechanism, and the unqualified chips can be separated after 5S detection of the chip, and then the chip is discharged, with convenient operation and detection;

[0022] 1. There are a waffle box feeding component and a feeding handling component. The waffle box feeding component is arranged at the left front end of the testing equipment main body, and the feeding handling component is arranged at the rear end of the waffle box feeding component. Through the settings of the waffle box feeding component and the feeding handling component, it is convenient to handle and convey the chip to be detected;

[0023] 2. There is a detection component. The detection component includes a detection support frame, a probe board, a lifting cylinder and a test seat, and multiple groups of the probe board, the lifting cylinder and the test seat are respectively arranged at the lower end of the detection support frame. Through the setting of the detection component, it can automatically perform high-temperature detection on the heated chip;

[0024] 3. There are a gantry handling mechanism, a waffle box discharging component and an empty waffle box bin. Through the setting of the gantry handling mechanism, it is convenient to clamp and convey the chip, and combined with the settings of the waffle box discharging component and the empty waffle box bin, it is convenient to separate and discharge the qualified and unqualified chips.

[0025] 4. There is a high-temperature resistant conveyor belt, enabling the conveyor belt to stably and reliably convey the waffle box in a high-temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is the overall structural schematic diagram of the present utility model;

[0027] Figure 2 is the overall structural schematic diagram of the connection of the waffle box feeding component, the feeding handling component, the high-temperature circular conveying component, the detection component and the gantry handling mechanism of the present utility model;

[0028] Figure 3 is the overall structural schematic diagram of the detection component of the present utility model;

[0029] Figure 4 is the overall structural schematic diagram of the connection of the test seat, the positioning pin, the internal probe and the peripheral probe of the present utility model;

[0030] Figure 5 is the detection process flow chart of the present utility model.

[0031] In the figure: 1. Main body of the test equipment; 2. Movable wheels; 3. Display and control panel; 4. Waffle box loading component; 5. Loading and handling component; 6. High-temperature circular conveying component; 7. Detection component; 8. Detection support frame; 9. Probe board; 10. Lifting cylinder; 11. Test seat; 12. NG area; 13. Gantry handling mechanism; 14. Waffle box unloading component; 15. Empty waffle box bin; 16. Sealing ring; 17. Ventilation groove; 18. Positioning pin; 19. Internal probe; 20. Peripheral probe. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Please refer to Figures 1-5 , the present invention provides a technical solution: a chip high-temperature test equipment, including the main body 1 of the test equipment, movable wheels 2, a display and control panel 3, a waffle box loading component 4, a loading and handling component 5, a high-temperature circular conveying component 6, a detection component 7, a detection support frame 8, a probe board 9, a lifting cylinder 10, a test seat 11, an NG area 12, a gantry handling mechanism 13, a waffle box unloading component 14, an empty waffle box bin 15, a sealing ring 16, a ventilation groove 17, a positioning pin 18, an internal probe 19, and a peripheral probe 20.

[0034] When using this chip high-temperature test equipment, such as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, a mobile wheel 2 is fixedly installed at the lower end of the test equipment main body 1. First, the entire test equipment is moved to the corresponding test position through the mobile wheel 2, and then the mobile wheel 2 is locked, and the equipment is fixed by being supported on the ground by an external support plate. A display and control panel 3 is arranged at the upper left end of the test equipment main body 1, and the entire detected data can be displayed through the display and control panel 3 for easy observation. A waffle box feeding component 4 is arranged at the front left end of the test equipment main body 1. A feeding handling component 5 is arranged at the rear end of the waffle box feeding component 4, and a high-temperature annular conveying component 6 is arranged at the rear end of the feeding handling component 5. The waffle box carrying the chip to be detected is placed on the waffle box feeding component 4, and the chip to be detected is carried and conveyed through the feeding handling component 5 and the high-temperature annular conveying component 6. Moreover, a chip preheating platform is arranged in the middle of the test equipment main body 1, and the chip to be detected is heated through the chip preheating platform to heat the chip to the set temperature. Combining with the setting of the detection component 7, the detection component 7 includes a detection support frame 8 fixedly installed at the rear end of the middle part of the test equipment main body 1, a probe board 9 installed at the top end of the detection support frame 8, a jacking cylinder 10 arranged at the lower end of the detection support frame 8, and a test seat 11 arranged at the output end of the jacking cylinder 10. Moreover, multiple groups of the detection support frame 8, the probe board 9, and the jacking cylinder 10 are respectively arranged at the lower end of the detection component 7;

[0035] The jacking cylinder 10 jacks up the test seat 11. Sapphire is arranged at the bottom of the test seat 11, which is wear-resistant and has strong heat conduction performance, so that the test seat 11 and the probe board 9 above are mutually attached. Then, nitrogen is filled for testing. The positioning pin 18 at the upper end of the test seat 11 is engaged with the probe board 9 for positioning the two. Through the setting of the sealing ring 16, a certain sealing effect can be achieved. Ventilation can be carried out through the ventilation groove 17, and the internal probe 19 contacts the chip to be detected, and the peripheral probe 20 contacts the peripheral copper substrate to realize the automatic detection of the chip;

[0036] Combined with Figure 5 The entire detection process flow can be demonstrated. Moreover, a gantry handling mechanism 13 is arranged in the middle of the test equipment main body 1. Through the setting of the gantry handling mechanism 13, the chip can be carried, and then the chip is subjected to 5S surface inspection. Moreover, a cooling platform is arranged in the middle of the test equipment main body 1. After the chip is cooled, the chip is unloaded. The chip is placed on the waffle box unloading component 14, and at the same time, the unqualified chips located in the NG area 12 are placed on the empty waffle box bin 15 at the right end of the waffle box unloading component 14.

[0037] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A chip high temperature testing device, comprising a testing device body (1), a moving wheel (2) installed at the lower end of the testing device body (1), and a display and control panel (3) arranged at the left front of the testing device body (1); It is characterized in that Also includes: A high-temperature annular conveying assembly (6), the high-temperature annular conveying assembly (6) being arranged in the middle of the test equipment body (1), and the high-temperature annular conveying assembly (6) being used to convey the waffle box carrying the chip to be tested, a chip preheating platform being arranged at the left end of the middle of the test equipment body (1), and a cooling platform being arranged at the right end of the middle of the test equipment body (1); A detection component (7), the detection component (7) comprising a detection support frame (8) fixedly mounted at the middle rear end of the test equipment body (1), a probe plate (9) mounted at the top of the detection support frame (8), a lifting cylinder (10) arranged at the lower end of the detection support frame (8), and a test seat (11) arranged at the output end of the lifting cylinder (10); Wherein, the detection support frame (8), the probe plate (9) and the lifting cylinder (10) are respectively arranged in multiple groups at the lower end of the detection component (7); A gantry transport mechanism (13), wherein the gantry transport mechanism (13) is installed at the right end of the middle part of the test equipment body (1), and the gantry transport mechanism (13) is used to take and place chips.

2. A chip high temperature testing device according to claim 1, characterized in that: A waffle box loading assembly (4) is installed at the left end of the test equipment body (1), and a loading and conveying assembly (5) is arranged at the rear end of the waffle box loading assembly (4), and a high-temperature annular conveying assembly (6) is arranged at the rear end of the loading and conveying assembly (5).

3. A chip high temperature testing device according to claim 2, characterized in that: The high-temperature annular conveying assembly (6) comprises a high-temperature resistant conveyor belt and a conveying mechanism, the waffle boxes are evenly spaced on the conveyor belt, and the conveying mechanism drives the conveyor belt carrying the waffle boxes to move.

4. The chip high temperature testing equipment according to claim 1, characterized in that: A plurality of waffle box feeding assemblies (14) are arranged on the right front side of the middle of the test device body (1), and the right end of the waffle box feeding assemblies (14) is an empty waffle box material bin (15), and an NG zone (12) is arranged on the right rear side of the upper end of the test device body (1).

5. The chip high temperature testing equipment according to claim 1, characterized in that: A sealing ring (16) is provided in the middle of the test seat (11), and a ventilation groove (17) is provided on the inner side of the sealing ring (16), and the ventilation groove (17) is opened at the center position of the test seat (11).

6. The chip high temperature testing equipment according to claim 1, characterized in that: The upper surface of the test seat (11) is provided with positioning pins (18) for positioning, and a probe plate (9) is provided above the test seat (11), and an internal probe (19) is provided on the side of the probe plate (9).

7. The chip high temperature testing equipment according to claim 6, characterized in that: A peripheral probe (20) is arranged outside the internal probe (19), and both the internal probe (19) and the peripheral probe (20) are installed on the side of the probe plate (9).

8. The chip high temperature testing equipment according to claim 1, characterized in that: The gantry transport mechanism (13) comprises a clamping mechanism, which accurately clamps the chip from the test seat (11) and transports it to a designated position.

Images