Industrial control board with Apoll Lake chip and industrial control computer
By integrating multiple interfaces and network port conversion chips on the industrial control board to form a heat dissipation channel, the problem of limited number of existing industrial control board interfaces and poor heat dissipation effect is solved, and more efficient operation and economic cost reduction are achieved.
Patent Information
- Application Number
- CN202420718370.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-08
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-04-08
AI Technical Summary
The existing industrial control boards have limited number of interfaces, lack of flexibility in layout and design, and poor heat dissipation effects in complex industrial environments, resulting in inconvenient operation and high economic costs.
Design an industrial control board with Apollo Lake chip, and enhance the number and flexibility of the interfaces by installing multiple network port conversion chips on the back of the motherboard to form a cooling channel, and integrate multiple interfaces on the front of the motherboard, such as HDMI+DP, MINIPCIE, M2 memory, DDR3, USB3.0 and DC power interfaces.
It achieves better heat dissipation effect, is more convenient to operate, and meets the needs of complex industrial environments through the integration of multiple interfaces, reducing the economic cost of equipment replacement and expansion.
Smart Images
Figure CN222965620U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of industrial control, and particularly relates to an industrial control board with an Apollo Lake chip and an industrial control computer. Background Art
[0002] In modern industrial automation systems, industrial control boards play an important role. They usually need to be connected to various devices and sensors to collect and process data.
[0003] In the prior art, some industrial control boards can provide additional network interfaces and other protocol interfaces, but the number of these interfaces is limited and cannot meet the requirements of complex industrial environments. The layout and design of these interfaces often lack flexibility, and the heat dissipation effect is not good, which easily causes inconvenience to users during use. In addition, when the interfaces of the device are replaced or added, it is necessary to purchase a new industrial control board or add an industrial control board, thus increasing the economic cost.
[0004] For the above reasons, there is an urgent need to design an industrial control board that solves the above problems. Summary of the Utility Model
[0005] The purpose of the utility model is to overcome the above-mentioned deficiencies of the prior art, and provide an industrial control board with an Apollo Lake chip and an industrial control computer that have good heat dissipation effect, convenient operation and integrate multiple interfaces.
[0006] The utility model is realized as follows: An industrial control board with an Apollo Lake chip includes a main board and an Apollo Lake chip installed on the back of the main board and having computing and control functions. The Apollo Lake chip is connected to a plurality of first network port conversion chips installed on the back of the main board and at least one second network port conversion chip. The first network port conversion chips and the second network port conversion chips are located on the outer periphery of the Apollo Lake chip and are spaced apart from the Apollo Lake chip, and are used to form a channel for dissipating heat from the Apollo Lake chip. Each first network port conversion chip is connected to a first network port located on the front of the main board, and the second network port conversion chip is connected to a second network port located on the front of the main board. Among them, pcie signals are used for communication between the Apollo Lake chip and the first network port conversion chips, lan signals are used for communication between the first network port conversion chips and the first network ports, usb signals are used for communication between the Apollo Lake chip and the second network port conversion chips, lan signals are used for communication between the second network port conversion chips and the second network ports, and the industrial control board further includes a crystal oscillator for controlling the communication sequence between the first network port and the second network port.
[0007] Further, the Apollo Lake chip is connected to an HDMI+DP interface located on the front side of the motherboard. The Apollo Lake chip communicates with the HDMI+DP interface through HDMI and DP signals, which is used to expand and access devices using this interface.
[0008] Further, the Apollo Lake chip is connected to an expansion MINIPCIE interface, and the MINIPCIE interface is located on the front side of the motherboard.
[0009] Further, the Apollo Lake chip is connected to an M2 memory interface located on the front side of the motherboard. The Apollo Lake chip communicates with the M2 memory interface through SATA signals. Among them, the M2 memory interface is used to connect different models of NVME hard drives and is used in combination with different models of NVME hard drives.
[0010] Further, the Apollo Lake chip 100 is connected to a plurality of DDR3 interfaces, and the plurality of DDR3 interfaces are located on the front side of the motherboard.
[0011] Further, the DDR3 interface is preferably two, which are used to connect two DDR3 video memory particles to increase the memory of the industrial control board.
[0012] Further, the Apollo Lake chip is connected to a FAN fan interface, and the FAN fan interface is located on the front side of the motherboard. The FAN fan interface is used to externally connect a PWM adjustable fan to dissipate heat from the Apollo Lake chip.
[0013] Further, the Apollo Lake chip is connected to an expansion USB3.0 interface, and the USB3.0 interface is located on the front side of the motherboard.
[0014] Further, the Apollo Lake chip is connected to a DC power interface located on the front side of the motherboard. The DC power interface is used to connect to an external adapter to supply power to the motherboard.
[0015] The present invention also provides an industrial control computer, which includes the above-mentioned industrial control board with an Apollo Lake chip, and further includes a power management module. The buck-boost conversion circuit of the power management module is connected to the DC power interface to manage the power of the industrial control board.
[0016] An industrial control board with an Apollo Lake chip provided by the present utility model includes a main board and an Apollo Lake chip installed on the back of the main board. The Apollo Lake chip is connected to a plurality of first network port conversion chips installed on the back of the main board and at least one second network port conversion chip. The first network port conversion chips and the second network port conversion chip are located on the outer periphery of the Apollo Lake chip and are spaced apart from the Apollo Lake chip, for forming a channel for dissipating heat from the Apollo Lake chip. Each first network port conversion chip is connected to a first network port located on the front of the main board, and the second network port conversion chip is connected to a second network port located on the front of the main board. Each first network port and the second network port are equipped with high-speed data transmission capabilities, ensuring stable performance even under high-load conditions; integrating multiple connection interfaces, the practicality is significantly enhanced, and it can meet the usage occasions of different scenarios and different requirements; setting the chip on the back of the industrial control board and the network port on the front is convenient for plugging in external devices and easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0018] Figure 1 is a block diagram of an industrial control board with an Apollo Lake chip provided by an embodiment of the present utility model.
[0019] Figure 2 is a circuit schematic diagram of the first network port conversion chip in the industrial control board with an Apollo Lake chip provided by an embodiment of the present utility model.
[0020] Figure 3 is a circuit schematic diagram of the crystal oscillator in the industrial control board with an Apollo Lake chip provided by an embodiment of the present utility model.
[0021] Figure 4 is a circuit schematic diagram of the HDMI + DP interface in the industrial control board with an Apollo Lake chip provided by an embodiment of the present utility model.
[0022] Figure 5 is a circuit schematic diagram of the MINIPCIE interface in the industrial control board with an Apollo Lake chip provided by an embodiment of the present utility model.
[0023] Figure 6It is the circuit schematic diagram of the M2 memory interface in the industrial control board with an Apollo Lake chip provided by the embodiment of the present utility model.
[0024] Figure 7 It is the circuit schematic diagram of the USB3.0 interface in the industrial control board with an Apollo Lake chip provided by the embodiment of the present utility model.
[0025] The realization of the purpose, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings in conjunction with the embodiments. Specific embodiments
[0026] In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. indicate the orientation or state relationship based on the orientation or state relationship shown in the accompanying drawings. These terms are mainly used to better describe the present utility model and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.
[0027] Moreover, in addition to being able to represent the orientation or state relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present utility model can be understood according to the specific situation.
[0028] In addition, the terms "installed", "set", "provided with", "connected", "connected to" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific situation.
[0029] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components. The specific types and structures may be the same or different, and are not used to indicate or imply the relative importance and quantity of the indicated device, element or component. Unless otherwise specified, the meaning of "a plurality" is two or more.
[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model.
[0031] Such as Figures 1 to 3As shown in the figure, an industrial control board with an Apollo Lake chip provided by an embodiment of the present utility model includes a main board and an Apollo Lake chip 100 with computing and control functions installed on the back of the main board. The Apollo Lake chip 100 is connected to a plurality of first-type communication interface chips 200 (for example, the RTL88111H chip shown in the figure) installed on the back of the main board, a first network port conversion chip 200, and at least one second-type communication interface chip (for example, the RTL8153 chip shown in the figure) 300. The first network port conversion chip 200 and the second network port conversion chip 300 are located on the outer periphery of the Apollo Lake chip 100 and are spaced apart from the Apollo Lake chip 100, and are used to form a channel for dissipating heat from the Apollo Lake chip 100. In this embodiment, the first network port conversion chip 200 is preferably three, and each first network port conversion chip 200 is connected to a first network port 400 located on the front of the main board. The second network port conversion chip is connected to a second network port 500 located on the front of the main board. Among them, a pcie signal communication is adopted between the Apollo Lake chip 100 and the first network port conversion chip 200, a lan signal communication is adopted between the first network port conversion chip 200 and the first network port 400, a usb signal communication is adopted between the Apollo Lake chip 100 and the second network port conversion chip 300, and a lan signal communication is adopted between the second network port conversion chip 300 and the second network port 500. The industrial control board further includes a crystal oscillator 10 for controlling the communication sequence between the first network port 400 and the second network port 500.
[0032] Among them, the first network port 400 and the second network port 500 are interfaces for connecting external devices and can be independently connected to the network. In this embodiment, the first network port 400 and the second network port 500 are four in total, with three first network ports 400. The four network ports are all located on the same side of the front of the main board and are arranged vertically. All four network ports use rj45 gigabit interfaces. The three first network ports 400 are all converted and connected using their respective independent first network port conversion chips 200, and the conversion effect is good.
[0033] In this actual example, three first network port conversion chips 200 are respectively connected to three first network ports 400 through LAN differential signals and are converted into PCIE signals to be connected to the Apollo Lake chip 100. Specifically, the HSON pin and HSOP pin of the first network port conversion chip 200 are respectively connected to the input end of the Apollo Lake chip 100, and the HSIP pin, HSIN pin, REFCLK_P pin, and REFCLK_N pin of the first network port conversion chip 200 are respectively connected to the output end of the Apollo Lake chip 100. Among them, coupling capacitors CL63 and CL64 are respectively connected between the HSON pin and HSOP pin and the input end of the Apollo Lake chip 100; coupling capacitors CL65 and CL66 are respectively connected between the HSIP pin and HSIN pin of the first network port conversion chip 200 and the output end of the Apollo Lake chip 100.
[0034] As Figure 4 shown, further, the Apollo Lake chip 100 is connected to an HDMI + DP interface 600 located on the front side of the main board. The Apollo Lake chip 100 communicates with the HDMI + DP interface 600 through hdmi and dp signals for expanding and accessing devices using this interface.
[0035] In this actual example, the LANEOP pin, LANEON pin, LANE1P pin, LANE1N pin, LANE2P pin, LANE2N pin, LANE3P pin, LANE3N pin, AUXP pin, and AUXN pin of the HDMI + DP interface 600 are all connected to the output end of the Apollo Lake chip 100 through dp signals; among them, coupling capacitors C2, C3, C4, C5, C6, C7, C8, C10, C11, and C12 are respectively connected between the LANEOP pin, LANEON pin, LANE1P pin, LANE1N pin, LANE2P pin, LANE2N pin, LANE3P pin, LANE3N pin, AUXP pin, and AUXN pin of the HDMI + DP interface 600 and the output end of the Apollo Lake chip 100.
[0036] The DATA2 + pin, DATA2_ pin, DATA1 + pin, DATA1_ pin, DATAO + pin, and DATAO_ pin of the HDMI + DP interface 600 are all connected to the output end of the Apollo Lake chip 100 through hdmi signals.
[0037] As Figure 5As shown, further, the Apollo Lake chip 100 is connected to an extended MINIPCIE interface 700, and the MINIPCIE interface 700 is located on the front side of the motherboard.
[0038] In this embodiment, the REFCLK- pin, REFCLK+ pin, PETNO pin, and PETPO pin of the MINIPCIE interface 700 are all connected to the input end of the Apollo Lake chip 100 through pcie signals. Among them, functional resistors RM19 and RM21 (for testing, EMC, and debugging) are respectively connected between the REFCLK- pin and REFCLK+ pin of the MINIPCIE interface 700 and the input end of the Apollo Lake chip 100, and filtering capacitors CM9 and CM10 are connected between the PETNO pin and PETPO pin and the input end of the Apollo Lake chip 100;
[0039] The PERNO pin and PERPO pin of the MINIPCIE interface 700 are both communicatively connected to the output end of the Apollo Lake chip 100 through pcie signals. Among them, functional resistors RM24 and RM25 (for testing, EMC, and debugging) are connected between the PERNO pin and PERPO pin of the MINIPCIE interface 700 and the output end of the Apollo Lake chip 100.
[0040] As Figure 6 shown, further, the Apollo Lake chip 100 is connected to an M2 memory interface 800 located on the front side of the motherboard. The Apollo Lake chip 100 communicates with the M2 memory interface 800 through sata signals. Among them, the M2 memory interface 800 is used to connect different models of NVME hard disks and is used in combination with different models of NVME hard disks. The NVME hard disk is used to store the operating system, application programs, and user data.
[0041] In this embodiment, the PERNO / SATA_B+ pin and PERPO / SATA_B- pin of the M2 memory interface 800 are connected to the output end of the Apollo Lake chip 100 through SATA signals. Among them, coupling capacitors CX1 and CX2 are connected between the PERNO / SATA_B+ pin and PERPO / SATA_B- pin of the M2 memory interface 800 and the output end of the Apollo Lake chip 100;
[0042] The PETNO / SATA_A- pin and PETPO / SATA_A+ pin of the M2 memory interface 800 are connected to the input end of the Apollo Lake chip 100 through SATA signals. Among them, coupling capacitors CX3 and CX4 are connected between the PETNO / SATA_A- pin and PETPO / SATA_A+ pin of the M2 memory interface 800 and the input end of the Apollo Lake chip 100.
[0043] Further, the Apollo Lake chip 100 is connected with a plurality of DDR3 interfaces 900. The plurality of DDR3 interfaces 900 are located on the front side of the main board. Preferably, there are two DDR3 interfaces 900, which are used to connect two DDR3 video memory particles, so as to increase the memory of the industrial control board.
[0044] Further, the Apollo Lake chip is connected with a FAN fan interface 110. The FAN fan interface 110 is located on the front side of the main board. The FAN fan interface 110 is used to externally connect a PWM adjustable fan, and the PWM adjustable fan is arranged facing the channel to dissipate heat from the Apollo Lake chip.
[0045] As Figure 7 shown, further, the Apollo Lake chip 100 is connected with an expansion USB3.0 interface 120. The USB3.0 interface 120 is located on the front side of the main board.
[0046] In this embodiment, the D0- pin, D0+ pin, SSRX0- pin, SSRX0+ pin, SSTX0- pin, SSTX0+ pin, D1- pin, D1+ pin, SSRX1- pin, SSRX1+ pin, SSTX1- pin, and SSTX1+ pin of the USB3.0 interface 120 are all connected to the input end of the Apollo Lake chip 100 through USB signals.
[0047] Further, the Apollo Lake chip 100 is connected with a DC power interface 130 located on the front side of the main board. The DC power interface 130 is used to connect with an external adapter to supply power to the main board.
[0048] More hardware modules can be inserted through the HDMI+DP interface 600, the MINIPCIE interface 700, and the two USB3.0 interfaces 120, and the practicability is strong.
[0049] An industrial control board with an Apollo Lake chip provided by the present utility model is provided with an Apollo Lake chip 100, a first network port 400, a second network port 500, an HDMI + DP interface 600, a MINIPCIE interface 700, an M2 memory interface 800, and a USB interface 120 directly or indirectly connected to the Apollo Lake chip 100 on the main board. It has diverse functions and strong expandability. Each of the first network port 400 and the second network port 500 is equipped with high-speed data transmission capabilities to ensure stable performance under high-load conditions. Multiple connection interfaces are integrated, significantly enhancing the practicality and meeting the usage requirements of different scenarios and different needs.
[0050] The present utility model also provides an industrial control computer, which includes the above-mentioned industrial control board with an Apollo Lake chip, and further includes a power management module (not shown). The buck-boost conversion circuit of the power management module is connected to the DC power interface for managing the power supply of the industrial control board.
[0051] The above is the preferred implementation manner of the present utility model. It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of the present utility model, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present utility model.
Claims
1. An industrial control board with an Apollo Lake chip, characterized in that: It includes a mainboard and an Apollo Lake chip installed on the back of the mainboard and having computing and control functions, wherein the Apollo Lake chip is connected to a plurality of first network port conversion chips and at least one second network port conversion chip installed on the back of the mainboard, wherein the first network port conversion chip and the second network port conversion chip are located at the periphery of the Apollo Lake chip and are spaced apart from the Apollo Lake chip to form a channel for dissipating heat for the Apollo Lake chip, wherein each first network port conversion chip is connected to a first network port located on the front of the mainboard, and the second network port conversion chip is connected to a second network port located on the front of the mainboard; Among them, the Apollo Lake chip and the first network port conversion chip use pcie signal communication, the first network port conversion chip and the first network port use lan signal communication, the Apollo Lake chip and the second network port conversion chip use usb signal communication, and the second network port conversion chip and the second network port use lan signal communication; The industrial control board also includes a crystal oscillator for controlling the communication sequence between the first network port and the second network port.
2. The industrial control board with Apollo Lake chip according to claim 1, characterized in that: The Apollo Lake chip is connected to the HDMI + DP interface on the front of the motherboard. The Apollo Lake chip communicates with the HDMI + DP interface via HDMI and DP signals to expand access to devices using this interface.
3. The industrial control board with Apollo Lake chip according to claim 1, characterized in that: The Apollo Lake chip is connected to a MINI PCI E interface for expansion, and the MINI PCI E interface is located on the front side of the mainboard.
4. The industrial control board with Apollo Lake chip according to claim 1, characterized in that: The Apollo Lake chip is connected to the M2 memory interface located on the front of the motherboard. The Apollo Lake chip communicates with the M2 memory interface through a SATA signal, wherein the M2 memory interface is used to connect different models of NVME hard drives for use with different models of NVME hard drives.
5. The industrial control board with Apollo Lake chip according to claim 1, characterized in that: The ApolloLake chip 100 is connected to multiple DDR3 interfaces, and the multiple DDR3 interfaces are located on the front side of the motherboard.
6. The industrial control board with Apollo Lake chip according to claim 5, characterized in that: There are two DDR3 interfaces, which are used to connect two DDR3 video memory particles to increase the memory of the industrial control board.
7. The industrial control board with Apollo Lake chip according to claim 1, characterized in that: The Apollo Lake chip is connected to a FAN fan interface, which is located on the front of the motherboard. The FAN fan interface is used to connect an external PWM adjustable fan to dissipate heat for the Apollo Lake chip.
8. The industrial control board with Apollo Lake chip according to claim 1, characterized in that: The Apollo Lake chip is connected to a USB 3.0 interface for expansion, and the USB 3.0 interface is located on the front of the motherboard.
9. The industrial control board with Apollo Lake chip according to claim 1, characterized in that: The ApolloLake chip is connected to a DC power interface located on the front side of the mainboard, and the DC power interface is used to connect to an external adapter to power the mainboard.
10. An industrial computer, comprising the industrial control board with an Apollo Lake chip as claimed in any one of claims 1 to 9, characterized in that: It also includes a power management module, the step-up and step-down conversion circuit of the power management module is connected to the DC power interface and is used to manage the power supply of the industrial control board.