Computer host

Abstract

The utility model discloses a computer host which comprises a shell and a separator, the shell is provided with a mounting cavity, a plurality of air inlets and a plurality of air outlets, the air inlets and the air outlets are communicated with the mounting cavity, and all the air inlets and all the air outlets are oppositely arranged; the separator is arranged in the mounting cavity and is arranged between the CPU and the display card so as to divide the mounting cavity into a first cavity and a second cavity, part of the air inlet and the air outlet are communicated with the first cavity so as to form a first heat dissipation air channel in the first cavity, and the other part of the air inlet and the air outlet are communicated with the second cavity so as to form a second heat dissipation air channel in the second cavity. According to the computer host with the structure, the mounting cavity is divided into the first cavity and the second cavity, so that the heat dissipation air channels in the first cavity and the second cavity do not influence each other, and the heat dissipation efficiency in the mounting cavity is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, and particularly relates to a computer mainframe. Background Art

[0002] A computer mainframe includes a chassis and electronic devices such as a motherboard, a CPU, a graphics card, a hard disk, and a memory module placed in the chassis. Components such as the CPU, the graphics card, the hard disk, and the memory module are generally fixed on the motherboard, and the motherboard is fixed on the chassis so as to fix the components such as the CPU, the graphics card, the hard disk, and the memory module in the chassis.

[0003] In the prior art, when the computer mainframe is in use, components such as the CPU, the graphics card, the hard disk, and the memory module fixed on the motherboard will generate heat under the action of electricity. Therefore, it is necessary to discharge this heat outside the chassis to avoid the temperature inside the chassis being too high and affecting the normal operation of each component. In addition, the existing computer mainframe generally adopts an air duct design scheme of front air intake and rear air exhaust to discharge the heat inside the chassis, that is, by opening heat dissipation holes on the front and rear panels of the chassis and installing fans on the heat dissipation holes, so that the air on the front panel side is sucked into the chassis by the fan on the front panel, and the air sucked into the chassis is discharged outside the chassis by the fan on the rear panel. During the process of the air being sucked into and discharged from the chassis, the air will carry the heat inside the chassis and be discharged outside the outer chassis by the fan on the rear panel.

[0004] However, for the existing computer mainframe, its chassis only has one installation space, and the components inside the chassis are also independent of each other. Therefore, during the process of the air being sucked into and discharged from the chassis, the air flow path inside the chassis is unstable, resulting in poor heat dissipation efficiency of some components inside the chassis. Summary of the Utility Model

[0005] Therefore, the technical problem to be solved by the present utility model is to overcome the defect that the existing computer mainframe only has one installation space, and the components inside the chassis are also independent of each other, resulting in an unstable air flow path inside the chassis and poor heat dissipation efficiency of some components inside the chassis.

[0006] To this end, the present utility model provides a computer mainframe, including:

[0007] A housing having an installation cavity and a plurality of air inlets and a plurality of air outlets communicated with the installation cavity, and all the air inlets and all the air outlets are oppositely arranged;

[0008] The separator is disposed in the installation cavity and between the CPU and the graphics card to divide the installation cavity into a first cavity and a second cavity. Part of the air inlet and the air outlet communicate with the first cavity to form a first heat dissipation air duct in the first cavity, and the other part of the air inlet and the air outlet communicate with the second cavity to form a second heat dissipation air duct in the second cavity.

[0009] Optionally, the above computer mainframe further includes a blower. The blower is connected to the air inlet in the second cavity. The blower is adapted to suck external air into the second cavity through the air inlet and form a second heat dissipation air flow in the second cavity. The second heat dissipation air flow is adapted to be discharged to the outside through the air outlet.

[0010] Optionally, the above computer mainframe further includes an exhaust component. The exhaust component is connected to the air outlet in the first cavity. The exhaust component is adapted to suck the air in the first cavity to form a first heat dissipation air flow in the first cavity. The first heat dissipation air flow is adapted to be discharged to the outside through the air outlet.

[0011] Optionally, the above computer mainframe further includes a board assembly. The board assembly includes a main board, a CPU, and a graphics card. The main board is disposed in the installation cavity. The CPU is disposed on the main board and in the first cavity. The graphics card is disposed on the main board and in the second cavity.

[0012] Optionally, the above computer mainframe further includes a heat dissipation component. The heat dissipation component is disposed on the main board opposite to the CPU and in the first cavity. A first air suction component is disposed on the heat dissipation component. The first air suction component is disposed opposite to the air inlet in the first cavity to suck external air through the air inlet.

[0013] Optionally, for the above computer mainframe, the graphics card is connected to the air outlet in the second cavity, and a second air suction component is disposed on the graphics card to suck the second heat dissipation air flow into the air outlet and discharge it to the outside through the air outlet.

[0014] Optionally, for the above computer mainframe, the board assembly further includes a plurality of memory modules and SSDs. All the memory modules are spaced apart on the main board and in the first cavity. Any one of the SSDs is disposed on the main board and in the first cavity and / or in the second cavity.

[0015] Optionally, for the above computer mainframe, all the memory modules are arranged parallel to the first heat dissipation air duct so that the first heat dissipation air flow flows through the gap between two adjacent memory modules.

[0016] Optionally, in the above computer main unit, a plurality of heat dissipation parts are arranged on the SSD, and all the heat dissipation parts are arranged at intervals so that the first heat dissipation air flow and / or the second heat dissipation air flow flow through between two adjacent heat dissipation parts.

[0017] Optionally, the above computer main unit further includes a plurality of HDDs, all the HDDs are electrically connected to the motherboard, and some of the HDDs are arranged in the first cavity, and the other part of the HDDs are arranged in the second cavity.

[0018] Optionally, the above computer main unit further includes a power supply component, and the power supply component is arranged in the second cavity and is electrically connected to the motherboard;

[0019] The power supply component is connected to the air outlet in the second cavity, and the power supply component includes a third air suction component to suck the second heat dissipation air flow into the air outlet through the third air suction component and discharge it to the outside through the air outlet.

[0020] The technical solution provided by the present utility model has the following advantages:

[0021] 1. For the computer main unit provided by the present utility model, through the isolation part arranged in the housing, wherein the housing has an installation cavity, four air inlets and four air outlets communicated with the installation cavity, the air inlets and the air outlets are arranged oppositely, and each air inlet corresponds to an air outlet, so that the air outside the housing can flow into the installation cavity through the air inlets, and carry the heat dissipated by the components installed in the installation cavity and flow out to the outside through the air outlets, thereby realizing the dissipation of the heat in the installation cavity. The isolation part is specifically arranged in the installation cavity and between the CPU and the graphics card, so as to divide the installation cavity into a first cavity and a second cavity, and isolate the CPU and the graphics card. At the same time, two air inlets and two air outlets are communicated with the first cavity to form a first heat dissipation air duct in the first cavity, and enable the heat in the first cavity to be dissipated to the outside through the first heat dissipation air duct, while the other two air inlets and air outlets are communicated with the second cavity to form a second heat dissipation air duct in the second cavity, and enable the heat in the second cavity to be dissipated to the outside through the second heat dissipation air duct. In addition, when the heat in the first cavity and the second cavity is dissipated respectively, since the first cavity and the second cavity are isolated from each other, the heat dissipation air ducts in the first cavity and the second cavity will not affect each other, which is beneficial to improving the heat dissipation efficiency of the heat in the installation cavity. Description of the Drawings

[0022] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0023] Figure 1 Schematic structural diagram of a computer mainframe provided in an embodiment of the present invention;

[0024] Figure 2 Schematic structural diagram of a housing provided in an embodiment of the present invention;

[0025] Figure 3 Schematic structural diagram of an SSD provided in an embodiment of the present invention;

[0026] Explanation of reference numerals:

[0027] 1 - Housing; 11 - Air inlet; 12 - Air outlet;

[0028] 2 - Isolation member; 3 - Air supply member; 4 - Exhaust member; 5 - Heat dissipation member; 6 - Power supply member;

[0029] 71 - Motherboard; 72 - Graphics card; 73 - Memory module; 74 - SSD; 741 - Heat dissipation part;

[0030] 8 - HDD. Specific embodiments

[0031] The following will clearly and completely describe the technical solutions of the present invention with reference to the drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0033] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0034] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0035] Embodiment 1

[0036] This embodiment provides a computer mainframe, as Figures 1 to 3 shown, including a housing 1 and a separator 2. The housing 1 has an installation cavity and a plurality of air inlets 11 and a plurality of air outlets 12 that are communicated with the installation cavity. All the air inlets 11 and all the air outlets 12 are arranged opposite to each other; the separator 2 is arranged in the installation cavity and between the CPU and the graphics card 72 to divide the installation cavity into a first cavity and a second cavity. Part of the air inlets 11 and the air outlets 12 are communicated with the first cavity to form a first heat dissipation air duct in the first cavity, and the other part of the air inlets 11 and the air outlets 12 are communicated with the second cavity to form a second heat dissipation air duct in the second cavity.

[0037] The computer mainframe with the above structure, through the isolation member 2 arranged in the housing 1, and the isolation member 2 is an isolation plate in this embodiment. Among them, the housing 1 has an installation cavity, four air inlets 11 and four air outlets 12 that are communicated with the installation cavity. The air inlets 11 and the air outlets 12 are arranged opposite to each other, and each air inlet 11 corresponds to an air outlet 12. Thus, the air outside the housing 1 can flow into the installation cavity through the air inlets 11, and carry the heat dissipated by the components installed in the installation cavity and flow out to the outside through the air outlets 12, thereby realizing the dissipation of the heat in the installation cavity. The isolation member 2 is specifically arranged in the installation cavity and between the CPU and the graphics card 72, so as to divide the installation cavity into a first cavity and a second cavity, and isolate the CPU and the graphics card 72. At the same time, two air inlets 11 and two air outlets 12 are communicated with the first cavity to form a first heat dissipation air duct in the first cavity, and enable the heat in the first cavity to be dissipated to the outside through the first heat dissipation air duct. The other two air inlets 11 and air outlets 12 are communicated with the second cavity to form a second heat dissipation air duct in the second cavity, and enable the heat in the second cavity to be dissipated to the outside through the second heat dissipation air duct. In addition, when the first cavity and the second cavity respectively dissipate the heat inside them, since the first cavity and the second cavity are isolated from each other, the heat dissipation air ducts in the first cavity and the second cavity will not affect each other, which is beneficial to improving the heat dissipation efficiency of the heat in the installation cavity.

[0038] The computer mainframe provided in this embodiment, as Figure 1 and Figure 2 shown, further includes a blowing member 3. The blowing member 3 is connected to the air inlet 11 in the second cavity. The blowing member 3 is adapted to suck the outside air into the second cavity through the air inlet 11, and form a second heat dissipation air flow in the second cavity. The second heat dissipation air flow is adapted to be discharged to the outside through the air outlet 12.

[0039] The computer mainframe with the above structure, through the blowing member 3 arranged on the housing 1, and the blowing member 3 is a blowing fan in this embodiment. Among them, the blowing member 3 is specifically connected to the air inlet 11 in the second cavity, and a blowing member 3 is installed on each air inlet 11 in the second cavity. Thus, after the blowing member 3 is powered on, the blowing member 3 can suck the outside air near the air inlet 11 into the second cavity, thereby forming a second heat dissipation air flow in the second cavity respectively, and the second heat dissipation air flow flows towards the air outlet 12 in the second cavity, and then dissipates the heat in the second cavity to the outside through the second heat dissipation air flow.

[0040] The computer mainframe provided in this embodiment, as Figure 1 and Figure 2 shown, further includes an exhaust member 4. The exhaust member 4 is connected to the air outlet 12 in the first cavity. The exhaust member 4 is adapted to suck the air in the first cavity to form a first heat dissipation air flow in the first cavity. The first heat dissipation air flow is adapted to be discharged to the outside through the air outlet 12.

[0041] For the computer main unit with the above structure, through the exhaust component 4 arranged on the housing 1, the exhaust component 4 is an exhaust fan in this embodiment. Specifically, the exhaust component 4 is connected to the air outlet 12 in the first cavity, and an exhaust component 4 is installed on each air outlet 12 in the first cavity. Thus, after the exhaust component 4 is powered on, the exhaust component 4 can suck the air in the first cavity, thereby forming a first cooling air flow in the first cavity, and the first cooling air flow will be sucked into the air outlet 12 in the first cavity under the action of the exhaust component 4, so that the first cooling air flow can carry the heat in the first cavity and flow out to the outside from the air outlet 12 to complete the heat dissipation in the first cavity.

[0042] The computer main unit provided in this embodiment, as Figure 1 shown, further includes a board assembly. The board assembly includes a main board 71, a CPU, and a graphics card 72. The main board 71 is arranged in the installation cavity, the CPU is arranged on the main board 71 and in the first cavity, and the graphics card 72 is arranged on the main board 71 and in the second cavity.

[0043] For the computer main unit with the above structure, through the board assembly arranged in the installation cavity, after the board assembly is installed in the installation cavity, it is connected to the housing 1 and thus fixed in the installation cavity. Specifically, the board assembly includes a main board 71, a CPU, and a graphics card 72. Among them, the main board 71 is installed in the installation cavity, and parts of the main board 71 exist in both the first cavity and the second cavity. The CPU and the graphics card 72 are installed on the main board 71. Specifically, the CPU is installed on the main board 71 arranged in the first cavity, and the graphics card 72 is installed on the main board 71 arranged in the second cavity. Thus, the CPU and the graphics card 72 can be cooled respectively in the first cavity and the second cavity, avoiding the convection of the heat dissipated by the CPU and the heat dissipated by the graphics card 72 in the installation cavity, which affects the normal flow of the cooling air flow and the cooling efficiency.

[0044] The computer main unit provided in this embodiment, as Figure 1 shown, further includes a heat dissipation component 5. The heat dissipation component 5 is arranged on the main board 71 opposite to the CPU and in the first cavity. A first air suction component is arranged on the heat dissipation component 5, and the first air suction component is arranged opposite to the air inlet 11 in the first cavity to suck the outside air through the air inlet 11.

[0045] For the computer main unit with the above structure, through the heat dissipation component 5 arranged on the main board 71, the heat dissipation component 5 is a radiator in this embodiment. The heat dissipation component 5 is specifically arranged on the main board 71 corresponding to the CPU and is arranged in the first cavity. The volume of the heat dissipation component 5 is relatively larger than that of the CPU, and it can transfer the heat generated by the CPU. Thus, during the flow of the first heat dissipation air flow in the first cavity, the first heat dissipation air flow can directly carry the heat on the heat dissipation component 5 and flow, and then flow out to the outside through the exhaust component 4 from the air outlet 12. In addition, a first air suction component is arranged on the heat dissipation component 5. The first air suction component is a first fan in this embodiment. The first air suction component is specifically arranged opposite to the air inlet 11 in the first cavity. Thus, after the first air suction component is powered on, the first air suction component can suck the outside air on the side of the air inlet 11 into the first cavity through the air inlet 11 in the first cavity, and then can improve the formation efficiency of the first heat dissipation air flow in the first cavity.

[0046] The computer main unit provided in this embodiment, as Figure 1 shown, the graphics card 72 is connected to the air outlet 12 in the second cavity, and a second air suction component is arranged on the graphics card 72 to suck the second heat dissipation air flow into the air outlet 12 through the second air suction component and discharge it to the outside through the air outlet 12.

[0047] For the computer main unit with the above structure, by arranging the connection between the graphics card 72 and the air outlet 12 in the second cavity and the second air suction component arranged on the graphics card 72, the second heat dissipation air flow flowing in the second cavity can be sucked into the graphics card 72 by the second air suction component on the graphics card 72 and flow towards the air outlet 12 in the graphics card 72. Thus, during this flowing process, the second heat dissipation air flow absorbs the heat dissipated by the graphics card 72 and is discharged to the outside through the air outlet 12 connected first to complete the heat dissipation of the graphics card 72.

[0048] The computer main unit provided in this embodiment, as Figure 1 shown, the board component further includes a plurality of memory modules 73 and SSDs 74 (solid state drives). All the memory modules 73 are arranged on the main board 71 at intervals and are arranged in the first cavity. Any one SSD 74 is arranged on the main board 71 and is arranged in the first cavity and / or arranged in the second cavity.

[0049] For the computer mainframe with the above structure, by setting that the board assembly further includes several memory modules 73 and SSDs 74. Among them, all the memory modules 73 are arranged at intervals on the main board 71 and are all arranged in the first cavity. The SSDs 74 are also all arranged on the main board 71 and are all arranged in the first cavity. This is because the installation positions of the memory modules 73 and SSDs 74 on the main board 71 are relatively close to the CPU. Therefore, the memory modules 73 and SSDs 74 are both installed in the first cavity to dissipate heat in the first cavity under the action of the first cooling air flow. Of course, some of the SSDs 74 can also be arranged in the second cavity, which can be determined according to the installation area on the main board 71 arranged in the first cavity and is not absolute.

[0050] The computer mainframe provided in this embodiment, as Figure 1 shown, all the memory modules 73 are arranged parallel to the first cooling air duct so that the first cooling air flow flows through the interval between two adjacent memory modules 73.

[0051] For the computer mainframe with the above structure, by setting that all the memory modules 73 are arranged parallel to the first cooling air duct, when the first cooling air flow in the first cavity flows in the first cavity, the first cooling air flow can flow through the gap between adjacent memory modules 73 and will not be blocked by the memory modules 73 arranged perpendicular to the first cooling air duct. Furthermore, it is beneficial to improve the flow efficiency of the first cooling air flow, that is, it is beneficial to improve the heat dissipation efficiency in the first cavity.

[0052] The computer mainframe provided in this embodiment, as Figure 2 shown, several heat dissipation parts 741 are arranged on the SSD 74, and all the heat dissipation parts 741 are arranged at intervals so that the first cooling air flow and / or the second cooling air flow flow through the interval between two adjacent heat dissipation parts 741.

[0053] For the computer mainframe with the above structure, by setting several heat dissipation parts 741 on the SSD 74, the heat dissipation parts 741 are heat dissipation columns arranged on the SSD 74, and all the heat dissipation parts 741 are arranged at intervals. The heat dissipation parts 741 can transfer the heat generated by the SSD 74. And when all the SSDs 74 are arranged in the first cavity and the first cooling air flow flows through the interval between adjacent heat dissipation parts 741, the first cooling air flow can carry the heat transferred to the heat dissipation parts 741 and flow together. Thus, it is beneficial to improve the heat dissipation efficiency of the SSD 74. And when some of the SSDs 74 are arranged in the second cavity, the second cooling air flow can also carry the heat on the heat dissipation parts 741 of the SSDs 74 arranged in the second cavity and flow.

[0054] The computer mainframe provided in this embodiment, as Figure 1As shown, it further includes a number of HDDs 8 (mechanical hard drives), all of the HDDs 8 are electrically connected to the motherboard 71, and some of the HDDs 8 are arranged in the first cavity, and the other part of the HDDs 8 are arranged in the second cavity.

[0055] For the computer mainframe with the above structure, through a number of HDDs 8 arranged in the installation cavity, all of the HDDs 8 are electrically connected to the motherboard 71, and some of the HDDs 8 are arranged in the first cavity, and the other part of the HDDs 8 are arranged in the second cavity, so that the HDDs 8 can be cooled by the first cooling air flow and the second cooling air flow at the same time, which is beneficial to improving the cooling efficiency of the HDDs 8.

[0056] The computer mainframe provided in this embodiment, as Figure 1 shown, further includes a power supply unit 6, the power supply unit 6 is arranged in the second cavity and is electrically connected to the motherboard 71;

[0057] The power supply unit 6 is connected to the air outlet 12 in the second cavity, and the power supply unit 6 includes a third air suction member to suck the second cooling air flow into the air outlet 12 through the third air suction member, and discharge it to the outside through the air outlet 12.

[0058] For the computer mainframe with the above structure, through the power supply unit 6 arranged in the second cavity, the power supply unit 6 is a power supply in this embodiment, and the power supply unit 6 is electrically connected to the motherboard 71, so as to provide power for the motherboard 71 and enable the motherboard 71 to work normally. In addition, the power supply unit 6 is connected to the air outlet 12 in the second cavity, and the power supply unit 6 includes a third air suction member, and the third air suction member is a second fan in this embodiment, so that the third air suction member can suck the second cooling air flow in the second cavity into the power supply unit 6, and discharge the second cooling air flow to the outside through the air outlet 12 connected to the power supply unit 6 to complete the heat dissipation in the second cavity.

[0059] The computer mainframe provided by the utility model is equipped with a separator 2 disposed within the housing 1. The housing 1 has an installation cavity, four air inlets 11 and four air outlets 12 that are communicatively connected to the installation cavity. The air inlets 11 and the air outlets 12 are oppositely arranged, and each air inlet 11 corresponds to one air outlet 12. As a result, the air outside the housing 1 can flow into the installation cavity through the air inlets 11, carry the heat dissipated by the components installed in the installation cavity, and flow out to the outside through the air outlets 12, thereby realizing the dissipation of the heat in the installation cavity. The separator 2 is specifically disposed within the installation cavity and between the CPU and the graphics card 72, thus dividing the installation cavity into a first cavity and a second cavity, isolating the CPU and the graphics card 72. At the same time, two air inlets 11 and two air outlets 12 are communicatively connected to the first cavity to form a first heat dissipation air duct within the first cavity, enabling the heat within the first cavity to be dissipated to the outside through the first heat dissipation air duct. The other two air inlets 11 and air outlets 12 are communicatively connected to the second cavity to form a second heat dissipation air duct within the second cavity, enabling the heat within the second cavity to be dissipated to the outside through the second heat dissipation air duct. Additionally, when the first cavity and the second cavity dissipate the heat within them respectively, since the first cavity and the second cavity are isolated from each other, the heat dissipation air ducts within the first cavity and the second cavity do not affect each other, which is conducive to improving the heat dissipation efficiency of the heat in the installation cavity.

[0060] Obviously, the above embodiments are merely examples given for clear illustration and not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or alterations can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. The obvious changes or alterations derived therefrom still fall within the protection scope of the present utility model.

Claims

1. A computer host, characterized in that: include: A housing (1) having a mounting cavity and a plurality of air inlets (11) and a plurality of air outlets (12) arranged in communication with the mounting cavity, wherein all the air inlets (11) and all the air outlets (12) are arranged opposite to each other; An isolation member (2) is arranged in the installation cavity and between the CPU and the graphics card (72) to divide the installation cavity into a first cavity and a second cavity, a portion of the air inlet (11) and the air outlet (12) are connected to the first cavity to form a first heat dissipation duct in the first cavity, and another portion of the air inlet (11) and the air outlet (12) are connected to the second cavity to form a second heat dissipation duct in the second cavity.

2. The computer host according to claim 1, characterized in that: The invention also comprises an air supply member (3), wherein the air supply member (3) is connected to the air inlet (11) in the second cavity, and the air supply member (3) is suitable for sucking outside air into the second cavity through the air inlet (11), and forming a second heat dissipation airflow in the second cavity, and the second heat dissipation airflow is suitable for being discharged to the outside through the air outlet (12).

3. The computer host according to claim 2, characterized in that: It also includes an exhaust member (4), which is connected to the air outlet (12) in the first cavity. The exhaust member (4) is suitable for absorbing air in the first cavity to form a first heat dissipation airflow in the first cavity. The first heat dissipation airflow is suitable for being discharged to the outside through the air outlet (12).

4. The computer host according to claim 3, characterized in that: The invention also comprises a board assembly, wherein the board assembly comprises a main board (71), a CPU and a graphics card (72), wherein the main board (71) is arranged in the installation cavity, the CPU is arranged on the main board (71) and in the first cavity, and the graphics card (72) is arranged on the main board (71) and in the second cavity.

5. The computer host according to claim 4, characterized in that: The invention also comprises a heat sink (5), wherein the heat sink (5) is arranged on the mainboard (71) relative to the CPU and is arranged in the first cavity, and a first air suction member is arranged on the heat sink (5), and the first air suction member is arranged relative to the air inlet (11) in the first cavity so as to absorb external air through the air inlet (11).

6. The computer host according to claim 5, characterized in that: The graphics card (72) is connected to the air outlet (12) in the second cavity, and a second air suction member is provided on the graphics card (72) so as to suck the second heat dissipation airflow into the air outlet (12) through the second air suction member and discharge it to the outside through the air outlet (12).

7. The computer host according to claim 6, characterized in that: The board assembly further comprises a plurality of memory bars (73) and SSDs (74); all of the memory bars (73) are arranged on the main board (71) at intervals and in the first cavity; any of the SSDs (74) is arranged on the main board (71) and in the first cavity and / or in the second cavity.

8. The computer host according to claim 7, characterized in that: All of the memory bars (73) are arranged parallel to the first heat dissipation air duct, so that the first heat dissipation airflow flows through the space between two adjacent memory bars (73).

9. The computer host according to claim 8, characterized in that: The SSD (74) is provided with a plurality of heat dissipation parts (741), and all the heat dissipation parts (741) are arranged at intervals so that the first heat dissipation airflow and / or the second heat dissipation airflow flows between two adjacent heat dissipation parts (741).

10. The computer host according to claim 9, characterized in that: It also includes a plurality of HDDs (8), all of which are electrically connected to the mainboard (71), and some of the HDDs (8) are arranged in the first cavity, while the other part of the HDDs (8) are arranged in the second cavity.

11. The computer host according to claim 10, characterized in that: It also includes a power supply (6), wherein the power supply (6) is arranged in the second cavity and is electrically connected to the main board (71); The power supply component (6) is connected to the air outlet (12) in the second cavity, and the power supply component (6) includes a third air suction component, so as to suck the second heat dissipation airflow into the air outlet (12) through the third air suction component, and discharge it to the outside through the air outlet (12).

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