Image sensor chip uncovering device

Abstract

The utility model discloses an image sensor chip uncovering device which comprises a heating assembly, an uncovering adjusting assembly and a tension assembly, the heating assembly comprises a heating plate, and the uncovering adjusting assembly comprises a sliding rail and a chip pushing sliding block; the sliding rail is arranged on the heating plate, the chip pushing sliding block is arranged on the sliding rail in a sliding mode, and the tension assembly is connected with the chip pushing sliding block and used for pulling the chip pushing sliding block to slide. The cover opening efficiency and the cover opening success rate can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to an opening device for an image sensor chip. Background Art

[0002] With the development of science and technology, the requirements for the imaging quality of cameras are getting higher and higher. One of the important factors affecting the imaging quality is the protective glass cover on the surface of the image sensor chip. The transmittance and wavelength range of the glass cover will directly affect the image quality. Currently, most of the front ends of image sensor chips have glass covers, and the covers often need to be opened.

[0003] Currently, the main opening methods include prying open with tools after heating, cutting and peeling, and using a degluing agent or solution to remove glue, etc. However, these opening methods all have certain defects. Prying open the surface glass cover with tools after heating is likely to cause damage and deformation of the bottom ceramic shell. Prying the glass cover with tools is likely to cause the glass to break. If the broken chips fall into the chip interior, it may directly damage the chip and is extremely difficult to repair. The cutting and peeling method is likely to generate debris dust of the glue, greatly increasing the risk of damaging the chip, and is easily affected by human subjective factors, with a low opening success rate. At the same time, the opening efficiency is low, and one person can only be responsible for opening the cover of one chip. For the method of using a degluing agent or solution to remove glue, most of the degluing agents or degluing solutions are corrosive and are likely to seep into the chip interior during operation, causing damage to the internal circuit of the chip.

[0004] Therefore, how to lift the glass cover without damaging the chip has become an urgent problem to be solved. Content of the Utility Model

[0005] The technical problem to be solved by the utility model is: to provide an opening device for an image sensor chip, which can improve the opening efficiency and the opening success rate.

[0006] To solve the above technical problem, the technical solution adopted by the utility model is: an opening device for an image sensor chip, including a heating component, an opening adjustment component, and a pulling component. The heating component includes a heating plate. The opening adjustment component includes a slide rail and a chip pushing slider. The slide rail is arranged on the heating plate, and the chip pushing slider is slidably arranged on the slide rail. The pulling component is connected to the chip pushing slider and is used to pull the chip pushing slider to slide.

[0007] Further, a first limiting groove adapted to the chip is arranged on the heating plate, and the slide rail is located on both sides of the first limiting groove.

[0008] Further, the height of the first limiting groove is lower than the height of the glass cover in the chip.

[0009] Further, a second limiting groove adapted to the chip is provided on one side of the chip pushing slider facing the heating plate.

[0010] Further, the opening cover adjusting assembly further includes a tension adjusting slider and a tension adjusting screw. The tension adjusting slider is arranged on the slide rail; the tension adjusting screw passes through the tension adjusting slider and is used to adjust the distance between the chip pushing slider and the tension adjusting slider; one end of the tension assembly is fixedly arranged on the chip pushing slider, and the other end is fixedly arranged on the tension adjusting slider.

[0011] Further, the opening cover adjusting assembly further includes a limiting baffle. The limiting baffle is fixedly arranged on the slide rail and is located between the chip pushing slider and the tension adjusting slider; the tension adjusting slider is slidably arranged on the slide rail, and one end of the tension adjusting screw passing through the tension adjusting slider abuts against the limiting baffle.

[0012] Further, the limiting baffle and the slide rail are integrally formed.

[0013] Further, the opening cover adjusting assembly further includes a shock pad. The shock pad is arranged on the surface of the limiting baffle facing the chip pushing slider.

[0014] Further, the tension assembly includes a spring pull rod, a turning handle and a positioning hook. The spring pull rod is connected with the positioning hook, and the turning handle is arranged on the spring pull rod; the positioning hook is fixedly arranged on the chip pushing slider, and the spring pull rod is fixedly arranged on the tension adjusting slider.

[0015] Further, the heating assembly further includes a heating platform, and the heating plate is detachably arranged on the heating platform.

[0016] The beneficial effect of the present utility model is that when the image sensor chip needs to open the cover, the glass cover of the chip is placed face down and inverted on the heating plate. The glass cover is heated by the heating plate. When the glass cover reaches a certain temperature, the glue between the glass cover and the chip body will soften, so that the adhesive force of the glue will gradually decrease. When the adhesive force of the glue is less than the pulling force of the tension assembly pulling the chip pushing slider, the chip body will be pushed by the chip pushing slider and be misaligned with the glass cover until they are separated, thereby realizing the safe opening of the chip cover.

[0017] The utility model does not require tools to pry the glass cover, avoiding damage caused by scratches on the ceramic shell of the image sensor chip and glass fragmentation; it does not require a debonding agent, but opens the cover by heating. Since the chip is inverted for heating, it can avoid the generation of debris and dust of the glue, and at the same time can effectively prevent the glue from sticking to the photosensitive surface or the inside of the chip after softening; it realizes a semi-automatic cover opening method, with high efficiency and greatly improving the success rate of cover opening. Brief Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of the image sensor chip cover opening device of the utility model;

[0019] Figure 2 It is an exploded structural diagram of the image sensor chip cover opening device according to the first embodiment of the utility model;

[0020] Figure 3 It is a schematic structural diagram of the heating component according to the first embodiment of the utility model;

[0021] Figure 4 It is a schematic structural diagram of the cover opening adjustment component according to the first embodiment of the utility model;

[0022] Figure 5 It is a schematic structural diagram of the tension component according to the first embodiment of the utility model;

[0023] Figure 6 It is a schematic structural diagram of the image sensor chip according to the first embodiment of the utility model;

[0024] Figure 7 It is a partial cross-sectional schematic diagram of the image sensor chip according to the first embodiment of the utility model Figure 1 ;

[0025] Figure 8 It is a partial cross-sectional schematic diagram of the image sensor chip according to the first embodiment of the utility model Figure 2 。

[0026] Label Description:

[0027] 1. Heating component; 2. Cover opening adjustment component; 3. Tension component; 4. Chip;

[0028] 11. Heating platform; 12. Heating plate; 121. First limiting groove;

[0029] 21. Slide rail; 22. Chip pushing slider; 23. Tension adjusting slider; 24. Tension adjusting screw; 25. Limit baffle; 26. Shock pad; 221. Second limiting groove;

[0030] 31. Spring pull rod; 32. Flipping handle; 33. Positioning hook;

[0031] 41. Chip body; 42. Glass cover. Detailed implementation mode

[0032] To describe in detail the technical content, achieved purpose and effects of the present utility model, the following is described in detail in combination with the implementation modes and with reference to the attached drawings.

[0033] Please refer to Figure 1 , an image sensor chip opening device, including a heating component, an opening adjustment component and a pulling force component. The heating component includes a heating plate. The opening adjustment component includes a slide rail and a chip pushing slider. The slide rail is arranged on the heating plate. The chip pushing slider is slidably arranged on the slide rail. The pulling force component is connected to the chip pushing slider and is used to pull the chip pushing slider to slide.

[0034] It can be seen from the above description that the beneficial effect of the present utility model is that by heating the inverted chip to open the cover, the chip is not easily damaged during the cover opening process, the success rate of cover opening is improved, and batch operation can be realized, and the cover opening efficiency is high.

[0035] Furthermore, a first limiting groove adapted to the chip is arranged on the heating plate, and the slide rail is located on both sides of the first limiting groove.

[0036] It can be seen from the above description that by arranging the limiting groove on the heating plate, it is ensured that the chip does not shift or warp during the cover opening process.

[0037] Furthermore, the height of the first limiting groove is lower than the height of the glass cover in the chip.

[0038] It can be seen from the above description that when opening the cover, the chip body does not come into contact with the heating plate, preventing scratching of the ceramic surface of the chip.

[0039] Furthermore, a second limiting groove adapted to the chip is arranged on the surface of the chip pushing slider facing the heating plate.

[0040] It can be seen from the above description that by arranging the limiting groove on the chip pushing slider, it is further ensured that the chip does not shift or warp during the cover opening process.

[0041] Furthermore, the opening adjustment component further includes a pulling force adjustment slider and a pulling force adjustment screw. The pulling force adjustment slider is arranged on the slide rail. The pulling force adjustment screw passes through the pulling force adjustment slider and is used to adjust the distance between the chip pushing slider and the pulling force adjustment slider. One end of the pulling force component is fixedly arranged on the chip pushing slider, and the other end is fixedly arranged on the pulling force adjustment slider.

[0042] As can be seen from the above description, by rotating the tension adjusting screw, the distance between the chip pushing slider and the tension adjusting slider can be adjusted, thereby realizing the adjustment of the tension.

[0043] Further, the opening cover adjusting assembly further includes a limit baffle, the limit baffle is fixedly arranged on the slide rail and is located between the chip pushing slider and the tension adjusting slider; the tension adjusting slider is slidably arranged on the slide rail, and one end of the tension adjusting screw passing through the tension adjusting slider abuts against the limit baffle.

[0044] Further, the limit baffle and the slide rail are integrally formed.

[0045] As can be seen from the above description, since the position of the limit baffle is fixed, by rotating the tension adjusting screw, the tension adjusting slider can be made to approach or move away from the limit baffle, adjusting the distance between the tension adjusting slider and the limit baffle, thereby adjusting the distance between the chip pushing slider and the tension adjusting slider, and further realizing the adjustment of the tension.

[0046] Further, the opening cover adjusting assembly further includes a shock pad, and the shock pad is arranged on the surface of the limit baffle facing the chip pushing slider.

[0047] As can be seen from the above description, by arranging the shock pad, it can effectively prevent the chip body from being damaged by hitting the limit baffle due to the inertia of the tension.

[0048] Further, the tension assembly includes a spring pull rod, a flipping handle and a positioning hook, the spring pull rod is connected with the positioning hook, and the flipping handle is arranged on the spring pull rod; the positioning hook is fixedly arranged on the chip pushing slider, and the spring pull rod is fixedly arranged on the tension adjusting slider.

[0049] As can be seen from the above description, by lifting the flipping handle, the spring pull rod is buckled to the positioning hook, and then the flipping handle is rotated and pressed down, so that the spring pull rod and the positioning hook form a reverse tension.

[0050] Further, the heating assembly further includes a heating platform, and the heating plate is detachably arranged on the heating platform.

[0051] As can be seen from the above description, it can be matched and processed according to different model sizes of the chips, so as to realize the sharing of one heating platform by multiple types of chips.

[0052] Embodiment 1

[0053] Please refer to Figure 1-8 , Embodiment 1 of the present utility model is: An opening device for an image sensor chip, as Figure 1-2As shown in the figure, it includes a heating component 1, an opening cover adjustment component 2 and a pulling component 3, and can be used to open the cover of an image sensor chip 4 (hereinafter referred to as the chip).

[0054] Among them, the structure of the chip 4 is as Figure 6 shown, including a chip main body 41 and a glass cover 42 arranged on the surface of the chip main body 41. Opening the cover of the chip 4 means separating the main body of the chip 41 from the glass cover 42.

[0055] As Figure 3 shown, the heating component 1 includes a heating platform 11 and a heating plate 12. The heating plate 12 is detachably arranged on the heating platform 11, and a first limiting groove 121 adapted to the chip 4 is arranged on the heating plate 12.

[0056] By arranging the first limiting groove on the heating plate, it can be ensured that the chip does not shift or warp during the cover opening process. Further, the height of the first limiting groove is lower than the height of the glass cover on the chip, so that the chip main body does not come into contact with the heating plate during cover opening, preventing scratching of the ceramic surface of the chip. In addition, since the heating plate has a detachable replacement function, it can be matched and processed according to different model sizes of the chip, realizing the sharing of a heating platform for multiple chips.

[0057] As Figure 4 shown, the opening cover adjustment component 2 includes a slide rail 21, a chip pushing slider 22, a pulling force adjustment slider 23, a pulling force adjustment screw 24 and a limiting baffle 25. Combining Figure 8 shown, the slide rail 21 is arranged on the heating plate 12 and is located on both sides of the first limiting groove 121. In this embodiment, the slide rail 21 has a dovetail groove structure. Combining Figure 7 shown, the chip pushing slider 22 and the pulling force adjustment slider 23 are respectively slidably arranged on the slide rail 21. The limiting baffle 25 is fixedly arranged on the slide rail 21 and is located between the chip pushing slider 22 and the pulling force adjustment slider 23. One end of the pulling force adjustment screw 24 passes through the pulling force adjustment slider 23 and abuts against the limiting baffle 25. In an alternative embodiment, the limiting baffle 25 is integrally formed with the slide rail 21. Further, a second limiting groove 221 adapted to the chip 4 is arranged on the surface of the chip pushing slider 22 facing the heating plate 12, further ensuring that the chip 4 does not shift or warp during the cover opening process. Further, a shock pad 26 is arranged on the surface of the limiting baffle 25 facing the chip pushing slider 22, which can effectively prevent the chip main body 41 from being damaged by hitting the limiting baffle 25 due to the inertia of the pulling force.

[0058] In this embodiment, there are two tension adjustment screws 24. One end of each of the two tension adjustment screws 24 passes through the tension adjustment slider 23 from the side of the tension adjustment slider 23 away from the limit baffle 25 and protrudes from the side of the tension adjustment slider 23 close to the limit baffle 25. The function of the tension adjustment screw 24 is to utilize the limit baffle 25. By rotating the tension adjustment screw 24, one end of the tension adjustment screw 24 abuts against the limit baffle 25. As the tension adjustment screw 24 rotates, the tension adjustment slider 23 will gradually move away from the limit baffle 25, thereby adjusting the distance between the chip pushing slider 22 and the tension adjustment slider 23, and further realizing the adjustment of the tension. The tension comes from the tension assembly 3 arranged above the open cover adjustment assembly 2.

[0059] As Figure 5 shown, in this embodiment, the tension assembly 3 can be a double-spring buckle. Specifically, the tension assembly 3 includes a spring pull rod 31, a flipping handle 32, and a positioning hook 33. The spring pull rod 31 is connected to the positioning hook 32, and the flipping handle 32 is arranged on the spring pull rod 31. In this embodiment, the spring pull rod 31 and the flipping handle 32 are integrally formed. Combining Figure 7 shown, the positioning hook 33 is fixedly arranged on the chip pushing slider 22, and the spring pull rod 31 is fixedly arranged on the tension adjustment slider 23. The tension assembly 3 can achieve a reverse tension through the tension adjustment screw 24.

[0060] Combining Figure 1 and Figure 7-8 shown, when the image sensor chip 4 needs to be opened, first place the glass cover 42 of the image sensor chip 4 downward and invert it on the heating plate 12 of the heating platform 11, and make the glass cover 42 embed in the first limit groove 121. Then slide the chip pushing slider 22 along the slide rail 21 to above the image sensor chip 4, and make the chip body 41 embed in the second limit groove 221 of the chip pushing slider 22. Then lift the flipping handle 32 in the tension assembly 3 to hook the spring pull rod 31 onto the positioning hook 33, and then rotate and press down the flipping handle 32 to make the spring pull rod 31 and the positioning hook 33 form a reverse tension. At this time, according to the size of the image sensor chip 4, adjust the appropriate force through the tension adjustment screw 24. Then turn on the heating platform 11 and set a certain temperature. The heat will gradually be transferred from the heating plate 12 on the heating platform 11 to the glass cover 42 on the surface of the image sensor chip 4. When the glass cover 42 reaches a certain temperature, the glue between the glass cover 42 and the chip body 41 will soften, and the glue adhesion will gradually decrease. When the glue adhesion is less than the tension between the chip pushing slider 22 and the tension adjustment slider 23, the chip body 41 will be pushed by the chip pushing slider 22, causing it to be misaligned with the glass cover 42 until they are separated, so that the safe opening of the image sensor chip 4 can be achieved.

[0061] This embodiment does not require an operator to track the whole process. As long as the heating platform is properly set up according to the steps, one can wait for the cover opening to be completed. One person can be responsible for opening the covers of multiple chips simultaneously, and it is not easily affected by subjective human factors. As long as the force is uniformly adjusted, batch operation can be achieved.

[0062] In summary, an image sensor chip cover opening device provided by the present utility model does not require tools to pry the glass cover, avoiding damage caused by scratches on the ceramic housing of the image sensor chip and glass fragmentation; it does not require a debonding agent, but realizes cover opening through heating. And because the chip is inverted for heating, it can avoid the generation of debris and dust from the glue, and at the same time can effectively prevent the softened glue from sticking to the photosensitive surface or the inside of the chip; it realizes a semi-automatic cover opening method, with high efficiency. One person can be responsible for opening the covers of multiple chips simultaneously, and it is not easily affected by subjective human factors. As long as the force is uniformly adjusted, batch operation can be achieved; the operation is simple, the image sensor chip is not easily damaged, and the cover opening success rate is greatly improved.

[0063] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in the relevant technical fields, shall be similarly included in the patent protection scope of the present utility model.

Claims

1. An image sensor chip cover opening device, characterized in that: It includes a heating component, a cover opening adjustment component and a pulling component. The heating component includes a heating plate. The cover opening adjustment component includes a slide rail and a chip pushing slider. The slide rail is arranged on the heating plate. The chip pushing slider is slidably arranged on the slide rail. The pulling component is connected to the chip pushing slider and is used to pull the chip pushing slider to slide.

2. The image sensor chip cover opening device according to claim 1, characterized in that: The heating plate is provided with a first limiting groove adapted to the chip, and the slide rails are located on both sides of the first limiting groove.

3. The image sensor chip cover opening device according to claim 2, characterized in that: The height of the first limiting groove is lower than the height of the glass cover in the chip.

4. The image sensor chip cover opening device according to claim 2, characterized in that: A second limiting groove matched with the chip is provided on a surface of the chip pushing sliding block facing the heating plate.

5. The image sensor chip cover opening device according to claim 1, characterized in that: The cover opening adjustment component also includes a tension adjustment slider and a tension adjustment screw, wherein the tension adjustment slider is arranged on the slide rail; the tension adjustment screw passes through the tension adjustment slider and is used to adjust the distance between the chip pushing slider and the tension adjustment slider; one end of the tension component is fixedly arranged on the chip pushing slider, and the other end is fixedly arranged on the tension adjustment slider.

6. The image sensor chip cover opening device according to claim 5, characterized in that: The cover opening adjustment component also includes a limit baffle, which is fixedly arranged on the slide rail and located between the chip pushing slider and the tension adjustment slider; the tension adjustment slider is slidably arranged on the slide rail, and the tension adjustment screw passes through one end of the tension adjustment slider and abuts against the limit baffle.

7. The image sensor chip cover opening device according to claim 6, characterized in that: The limit baffle and the slide rail are integrally formed.

8. The image sensor chip cover opening device according to claim 6, characterized in that: The cover opening adjustment component further comprises a shock absorbing pad, and the shock absorbing pad is arranged on a surface of the limit baffle that pushes the sliding block toward the chip.

9. The image sensor chip cover opening device according to claim 5, characterized in that: The tension component includes a spring pull rod, a flip handle and a positioning hook, the spring pull rod is connected to the positioning hook, and the flip handle is arranged on the spring pull rod; the positioning hook is fixedly arranged on the chip push slide, and the spring pull rod is fixedly arranged on the tension adjustment slider.

10. The image sensor chip cover opening device according to claim 1, characterized in that: The heating assembly further comprises a heating platform, and the heating plate is detachably arranged on the heating platform.

Images