Silicon wafer limiting lifting mechanism and silicon wafer transfer device

Abstract

The utility model relates to a silicon wafer limiting lifting mechanism and a silicon wafer transfer device. The silicon wafer limiting lifting mechanism comprises a first rotating bearing part and a second rotating bearing part which are oppositely arranged. Each of the first rotary bearing part and the second rotary bearing part comprises a mounting seat, a circulating rotating crawler belt and a plurality of bearing plates, the circulating rotating crawler belts circularly rotate around the mounting seats, and the rotating directions of the circulating rotating crawler belts of the first rotary bearing part and the second rotary bearing part are opposite; the multiple bearing plates are distributed along the circulating rotating crawler belt and ascend and descend along with the circulating rotating crawler belt in a circulating mode, each bearing plate is provided with multiple limiting pieces, and the multiple pairs of bearing plates, opposite to each other in the horizontal direction and arranged at intervals, of the first rotating bearing component and the second rotating bearing component are matched to form multiple bearing tables distributed at different heights. And the plurality of limiting pieces on each bearing table are matched to limit a silicon wafer placing area. The silicon wafer limiting lifting mechanism can improve the speed of the silicon wafer entering and exiting from the coating machine and improve the production efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic, in particular to a silicon wafer limiting lifting mechanism and a silicon wafer transfer device. Background Art

[0002] The manufacturing of heterojunction solar cells includes processes such as cleaning and texturing, PECVD coating, PVD coating, and screen printing. In the PVD coating process, the traditional silicon wafer loading method is to convey the silicon wafers in the loading basket to the lifting platform through a conveyor belt. When there is no empty space on the lifting platform, the conveyor belt stops running. After the lifting platform rises, the adsorption device adsorbs the silicon wafers and loads them onto the carrier plate. After all the silicon wafers on the lifting platform are loaded, the adsorption device stops adsorbing, the lifting platform descends, and the conveyor belt continues to convey the silicon wafers. Similarly, after the PVD coating is completed, when unloading, the adsorption device adsorbs the silicon wafers and places them on the lifting platform. Then the adsorption device stops placing the wafers, the lifting platform descends, and the silicon wafers are transferred to the conveyor belt. However, the above loading and unloading methods have low efficiency and are difficult to meet the requirements of rapid mass production. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a silicon wafer limiting lifting mechanism and a silicon wafer transfer device to solve the problem of low efficiency of the traditional silicon wafer loading and unloading methods.

[0004] One of the purposes of the utility model is to provide a silicon wafer limiting lifting mechanism, and the solution is as follows:

[0005] A silicon wafer limiting lifting mechanism includes a first rotating and bearing member and a second rotating and bearing member which are oppositely arranged;

[0006] Both the first rotating and bearing member and the second rotating and bearing member include a mounting base, a circulating rotating track, and a plurality of bearing plates. The circulating rotating track surrounds the mounting base and can rotate in a cycle. The rotating direction of the circulating rotating track of the first rotating and bearing member is opposite to that of the circulating rotating track of the second rotating and bearing member. The plurality of bearing plates are distributed along the circulating rotating track and circulate up and down with the circulating rotating track. Multiple pairs of the bearing plates which are opposite and spaced in the horizontal direction on the first rotating and bearing member and the second rotating and bearing member cooperate to form a plurality of bearing platforms. The plurality of bearing platforms are distributed at different heights. A plurality of limiting members are arranged on each of the bearing plates, and the plurality of limiting members on each of the bearing platforms cooperate to form a silicon wafer placement area.

[0007] In one embodiment, a pair of the carrier plates that cooperate to form the carrier table are disposed opposite to each other in a first horizontal direction. The carrier plates are strip-shaped structures extending in a second horizontal direction. A plurality of limiting members on each of the carrier tables cooperate to form a plurality of wafer placement areas arranged along the second horizontal direction. The first horizontal direction and the second horizontal direction are perpendicular to each other.

[0008] In one embodiment, the limiting member is movably connected to the carrier plate, and the position of the limiting member on the carrier plate is adjustable.

[0009] In one embodiment, an anti-slip pad is provided in the wafer placement area.

[0010] Another object of the present utility model is to provide a wafer transfer device, and the solution is as follows:

[0011] A wafer transfer device, in one embodiment, includes the wafer limiting and lifting mechanism, the first transfer mechanism, and the second transfer mechanism described in any of the above embodiments; the first transfer mechanism is used to connect and transfer wafers with the bottom carrier table, and the second transfer mechanism is used to connect and transfer wafers with the top carrier table.

[0012] In one embodiment, the first transfer mechanism includes a conveyor belt, the conveyor belt is located between a pair of the carrier plates, and the width of the conveyor belt is smaller than the distance between the pair of the carrier plates.

[0013] In one embodiment, the wafer transfer device further includes a wafer appearance detection mechanism, and the wafer appearance detection mechanism is used to perform appearance detection on the wafers conveyed on the first transfer mechanism.

[0014] In one embodiment, the wafer transfer device further includes a wafer removal mechanism, the wafer removal mechanism is disposed downstream of the wafer appearance detection mechanism, and the wafer removal mechanism is used to remove defective wafers detected by the wafer appearance detection mechanism from the first transfer mechanism.

[0015] In one embodiment, the wafer transfer device further includes a wafer buffer mechanism, the wafer buffer mechanism is disposed on the first transfer mechanism, the wafer buffer mechanism includes a lifting component and a storage component, the lifting component is used to drive the storage component to lift, and the storage component includes a plurality of support platforms distributed at different heights. Each of the support platforms includes a first support portion and a second support portion that are opposite and spaced apart in the horizontal direction.

[0016] In one embodiment, the second transfer mechanism includes a transfer component and an adsorption component, the adsorption component is used to adsorb the wafers on the carrier table, and the transfer component is connected to the adsorption component to drive the adsorption component to transfer.

[0017] Compared with the traditional solution, the above-mentioned silicon wafer limiting lifting mechanism and silicon wafer transfer device have the following beneficial effects:

[0018] The above-mentioned silicon wafer limiting lifting mechanism and silicon wafer transfer device are provided with a first rotating bearing member and a second rotating bearing member to cooperate with each other to carry multiple layers of silicon wafers for loading or unloading. Both the first rotating bearing member and the second rotating bearing member include a mounting base, a circulating rotating track, and a plurality of bearing plates. The circulating rotating track circulates around the mounting base, and the plurality of bearing plates are distributed along the circulating rotating track and circulate up and down with the circulating rotating track. The relatively arranged and spaced bearing plates cooperate to form a plurality of bearing platforms distributed at different heights. Each bearing platform is provided with a plurality of limiting members to cooperate to limit the silicon wafer placement area for positioning and placing the silicon wafers, so that the silicon wafers can be accurately transported and transferred. The plurality of bearing platforms can continuously carry the silicon wafers conveyed by the conveyor belt or the adsorption device, which can reduce the waiting time of the conveyor belt and the adsorption device for the silicon wafers to rise or fall, thereby improving the speed of the silicon wafers entering and leaving the coating machine and improving the production efficiency. Description of the Drawings

[0019] Figure 1 Schematic structural diagram of a silicon wafer limiting lifting mechanism according to an embodiment;

[0020] Figure 2 For Figure 1 Another schematic structural diagram of the silicon wafer limiting lifting mechanism shown;

[0021] Figure 3 For Figure 1 Schematic structural diagram of the bearing platform in the silicon wafer limiting lifting mechanism shown;

[0022] Figure 4 Schematic structural diagram of a silicon wafer transfer device according to an embodiment;

[0023] Figure 5 For Figure 4 Another schematic structural diagram of the silicon wafer transfer device shown, in which the second conveying mechanism is not shown;

[0024] Figure 6 For Figure 4 Schematic structural diagram of the silicon wafer loading basket in the silicon wafer transfer device shown;

[0025] Figure 7 For Figure 4 Schematic structural diagram of the second conveying mechanism in the silicon wafer transfer device shown.

[0026] Description of the Reference Numerals:

[0027] 100. Wafer limit lifting mechanism; 101. First rotating bearing member; 102. Second rotating bearing member; 110. Mounting base; 120. Circulating rotating track; 130. Bearing plate; 140. Limiting member; 103. Bearing platform; 104. Wafer placement area; 10. Wafer transfer device; 200. First conveying mechanism; 210. Conveyor belt; 300. Second conveying mechanism; 310. Transfer member; 311. Guide member; 312. Moving member; 313. Telescopic rod; 314. Mounting disc; 320. Adsorption member; 321. Suction nozzle; 400. Wafer loading basket; 500. Wafer appearance detection mechanism; 600. Wafer removal mechanism; 700. Wafer buffer mechanism; 710. Storage member; 711. Support platform; 7112. First support portion; 7114. Second support portion; 20. Wafer. Detailed implementation manner

[0028] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present utility model more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manner.

[0030] In the description of the present utility model, it should be understood that the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity or order of the indicated technical features.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used herein in the description of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0032] The present utility model provides a wafer limit lifting mechanism, which can be used for positioning and lifting transfer during the loading or unloading process of multiple layers of wafers.

[0033] AsFigures 1 to 3 As shown, the wafer limiting lifting mechanism 100 of an embodiment includes a first rotating bearing member 101 and a second rotating bearing member 102. The first rotating bearing member 101 and the second rotating bearing member 102 are arranged oppositely. The first rotating bearing member 101 and the second rotating bearing member 102 cooperate to carry multiple wafers 20.

[0034] More specifically, both the first rotating bearing member 101 and the second rotating bearing member 102 include a mounting base 110, a circulating rotating track 120, and a plurality of bearing plates 130. The circulating rotating track 120 surrounds the mounting base 110 and can rotate in a cycle. The rotating direction of the circulating rotating track 120 of the first rotating bearing member 101 is opposite to the rotating direction of the circulating rotating track 120 of the second rotating bearing member 102. The plurality of bearing plates 130 are distributed along the circulating rotating track 120 and rise and fall in a cycle along with the circulating rotating track 120. A plurality of limiting members 140 are provided on each bearing plate 130. Pairs of bearing plates 130 that are opposite and spaced apart in the horizontal direction on the first rotating bearing member 101 and the second rotating bearing member 102 cooperate to form a plurality of bearing platforms 103, and the plurality of bearing platforms 103 are distributed at different heights. The plurality of limiting members 140 on each bearing platform 103 cooperate to form a wafer placement area 104. The carried wafers 20 are limited in the wafer placement area 104 by the plurality of limiting members 140, so that the wafers 20 can be accurately transported and transferred.

[0035] It can be understood that the bearing platform 103 is dynamically circulating. Taking one of the bearing platforms 103 as an example, its dynamic circulation process is as follows. As the circulating rotating track 120 rotates, the bearing plates 130 of the first rotating bearing member 101 and the bearing plates 130 of the second rotating bearing member 102 approach each other and cooperate to form the bearing platform 103, and the bearing platform 103 can carry the wafers 20; then the bearing platform 103 drives the wafers 20 to rise or fall until it rises to the top layer or falls to the bottom layer. At this time, the vertical transportation of the wafers 20 is completed and transferred by other devices. Subsequently, the bearing plates 130 of the first rotating bearing member 101 and the bearing plates 130 of the second rotating bearing member 102 move away from each other. At this time, the two bearing plates 130 are no longer opposite, that is, they do not form the bearing platform 103.

[0036] A plurality of pairs of oppositely arranged and spaced bearing plates 130 of the first rotating bearing member 101 and the second rotating bearing member 102 cooperate to form a plurality of bearing platforms 103 distributed at different heights. That is, the silicon wafer limiting lifting mechanism 100 can simultaneously form a plurality of bearing platforms 103, and the plurality of bearing platforms 103 are dynamically distributed at different heights. In this way, the silicon wafer limiting lifting mechanism 100 can simultaneously carry a plurality of silicon wafers 20 for loading or unloading. The number of bearing platforms 103 that the silicon wafer limiting lifting mechanism 100 can simultaneously form is, for example, 2 to 30, and it can simultaneously carry 2 to 30 silicon wafers 20, specifically, for example, 4, 6, 8, 10, 12, 15, 20, 25, etc. The plurality of bearing platforms 103 can continuously carry the silicon wafers 20 conveyed by the conveyor belt or the adsorption device, which can reduce the waiting time of the conveyor belt and the adsorption device for the silicon wafers 20 to rise or fall, thereby improving the speed of the silicon wafers 20 entering and leaving the coating machine platform and improving production efficiency.

[0037] Optionally, the number of silicon wafer placement areas 104 on the bearing platform 103 is not limited to only 1. For example, through the distribution setting of the limiting members 140, multiple silicon wafer placement areas 104 can also be formed, so that a plurality of silicon wafers 20 can be simultaneously carried on one bearing platform 103. In some examples, 2 to 10 silicon wafer placement areas 104 are formed on each bearing platform 103. In Figure 3 In the specific example shown, 4 silicon wafer placement areas 104 are formed on each bearing platform 103, and 4 silicon wafers 20 can be simultaneously carried.

[0038] In some examples, a pair of bearing plates 130 that cooperate to form the bearing platform 103 are oppositely arranged in the first horizontal direction, and the bearing plates 130 are strip-shaped structures extending in the second horizontal direction. Among them, the first horizontal direction and the second horizontal direction are perpendicular. A plurality of limiting members 140 on each bearing platform 103 cooperate to form a plurality of silicon wafer placement areas 104 arranged in the second horizontal direction.

[0039] In some examples, the part of the limiting member 140 extending out of the surface of the bearing plate 130 is provided with a slope, and the size of the lower part to the upper part of the limiting member 140 gradually decreases. In this way, the limiting member 140 can play a guiding role when the silicon wafer is placed on the silicon wafer placement area 104.

[0040] In some examples, the position of the limiting member 140 on the bearing plate 130 is adjustable, that is, the limiting member 140 is movably connected to the bearing plate 130 and can move along the surface direction of the bearing plate 130 to change the size of the silicon wafer placement area 104. Thus, the bearing platform 103 can adapt to the loading of silicon wafers 20 of different sizes. When the size of the silicon wafer 20 changes, by adjusting the position of the limiting member 140, the size of the silicon wafer placement area 104 corresponds to the size of the silicon wafer 20.

[0041] In some of these examples, the silicon wafer placement area 104 is provided with anti-slip pads (not shown in the figure). The anti-slip pads can improve the stability of the silicon wafer 20 during lifting, preventing the silicon wafer 20 from falling due to jitter during lifting. The anti-slip pads can be made of rubber materials such as silica gel, which can play roles such as buffering protection and anti-sliding.

[0042] The above-mentioned silicon wafer limiting lifting mechanism 100 is provided with a first rotating bearing member 101 and a second rotating bearing member 102 to cooperate in bearing multiple layers of silicon wafers 20 for loading or unloading. Both the first rotating bearing member 101 and the second rotating bearing member 102 include a mounting seat 110, a circulating rotating track 120, and a plurality of bearing plates 130. The circulating rotating track 120 circulates around the mounting seat 110, and the plurality of bearing plates 130 are distributed along the circulating rotating track 120 and circulate up and down with the circulating rotating track 120. The relatively and spaced-apart bearing plates 130 cooperate to form a plurality of bearing platforms 103 distributed at different heights. Each bearing platform 103 is provided with a plurality of limiting members 140, which cooperate to form a silicon wafer placement area 104 for positioning and placing the silicon wafer 20, enabling the silicon wafer 20 to be accurately transported and transferred. The plurality of bearing platforms 103 can continuously bear the silicon wafers 20 conveyed by the conveyor belt or the adsorption device, reducing the waiting time of the conveyor belt and the adsorption device for the silicon wafer 20 to rise or fall, thereby increasing the speed of the silicon wafer 20 entering and leaving the coating machine and improving production efficiency.

[0043] Furthermore, the present utility model also provides a silicon wafer transfer device.

[0044] As Figure 4 and Figure 5 shown, the silicon wafer transfer device 10 of an embodiment includes the silicon wafer limiting lifting mechanism 100 of any of the above examples, a first transfer mechanism 200, and a second transfer mechanism 300. The first transfer mechanism 200 is used to connect and transfer the silicon wafer 20 with the bottom bearing platform 103, and the second transfer mechanism 300 is used to connect and transfer the silicon wafer 20 with the top bearing platform 103.

[0045] The above-mentioned silicon wafer transfer device 10 includes the silicon wafer limiting lifting mechanism 100 of any of the above examples, and thus can obtain corresponding beneficial effects.

[0046] In some of these examples, the first transfer mechanism 200 includes a conveyor belt 210. It can be understood that the conveyor belt 210 is located between a pair of bearing plates 130. And the width of the conveyor belt 210 is less than the distance between a pair of bearing plates 130.

[0047] In some of these examples, the silicon wafer transfer device 10 further includes a silicon wafer loading basket 400. The silicon wafer loading basket 400 is used to load multiple layers of silicon wafers 20, and the silicon wafer loading basket 400 can unload the silicon wafers 20 one by one onto the conveyor belt 210, or load the silicon wafers 20 one by one onto the conveyor belt 210.

[0048] In some of these examples, the wafer transfer device 10 further includes a wafer appearance detection mechanism 500, and the wafer appearance detection mechanism 500 is used to perform appearance detection on the wafers 20 conveyed on the first transfer mechanism 200.

[0049] In some of these examples, the wafer appearance detection mechanism 500 is an AOI detector. The AOI detector detects the appearance of the wafers to determine whether there are defects such as hidden cracks and chipped edges, so as to promptly remove the defective wafers, prevent the defective wafers from entering the subsequent coating equipment, reduce the number of wafers that need to be rewashed during coating, and improve the effective utilization rate of the target material.

[0050] In some of these examples, the wafer transfer device 10 further includes a wafer removal mechanism 600. The wafer removal mechanism 600 is arranged downstream of the wafer appearance detection mechanism 500 and is used to remove the defective wafers detected by the wafer appearance detection mechanism 500 from the first transfer mechanism 200. For example, the wafer removal mechanism 600 can remove the defective wafers by means of adsorption and transfer.

[0051] In some of these examples, the wafer transfer device 10 further includes a wafer buffer mechanism 700. The wafer buffer mechanism 700 is arranged on the first transfer mechanism 200.

[0052] As Figure 6 shown, in some of these examples, the wafer buffer mechanism 700 includes a lifting member (not shown in the figure) and a storage member 710. The lifting member is used to drive the storage member 710 to move up and down. The storage member 710 includes a plurality of support platforms 711 distributed at different heights, and each support platform 711 includes a first support portion 7112 and a second support portion 7114 that are opposite and spaced apart in the horizontal direction.

[0053] The storage member 710 can store a plurality of wafers 20 at different heights. When the number of wafers 20 on the first transfer mechanism 200 is not enough to cover the carrier table 103, the lifting member drives the storage member 710 to gradually rise, so that the first support portion 7112 and the second support portion 7114 located on both sides of the wafer conveying path contact the wafers 20 and lift the wafers 20 one by one to achieve wafer buffering. When continuous feeding is required, the lifting member drives the storage member 710 to gradually descend to place the wafers 20 on the first transfer mechanism 200 one by one.

[0054] In some of these examples, the wafer buffer mechanism 700 is located between the wafer appearance detection mechanism 500 and the wafer limit lifting mechanism 100. Further, the wafer buffer mechanism 700 is located between the wafer removal mechanism 600 and the wafer limit lifting mechanism 100.

[0055] When the number of wafers 20 on the first transfer mechanism 200 is not enough to cover the carrier 103, the wafers 20 are stored in the wafer buffer mechanism 700, and after continuous feeding, the wafers 20 in the wafer buffer mechanism 700 are transported onto the carrier 103. When only the tail stock remains in the wafer loading basket 400, the staff can confirm to discharge the wafer buffer mechanism 700, avoiding the situation that the first transfer mechanism 200 needs to be manually emptied during the feeding of the tail stock of the wafer source.

[0056] In some examples, multiple sets of wafer limiting lifting mechanisms 100 and first transfer mechanisms 200 can be provided and arranged side by side, so as to be able to load or unload multiple groups of wafers 20 simultaneously, improving production efficiency.

[0057] As Figure 7 shown, in some examples, the second transfer mechanism 300 includes a transfer component 310 and an adsorption component 320. The adsorption component 320 is used to adsorb the wafer 20 on the carrier 103, and the transfer component 310 is connected to the adsorption component 320 to drive the adsorption component 320 to transfer.

[0058] In some examples, the transfer component 310 includes a guide member 311 and a moving member 312. The moving member 312 is arranged on the guide member 311 and can move along the guide member 311, thereby driving the adsorption component 320 to transfer. Among them, the guide member 311 is, for example, a slide rail, and the moving member 312 is slidably matched with the guide member 311.

[0059] In some examples, the transfer component 310 further includes a telescopic rod 313. The telescopic rod 313 can be telescoped in the vertical direction, and can adjust the height and adsorption force of the adsorption component 320 according to the height of the carrier 103, so that the adsorption component 320 can effectively adsorb the wafer 20.

[0060] In some examples, the transfer component 310 further includes a mounting plate 314. The mounting plate 314 is connected to the telescopic rod 313, and the adsorption component 320 is connected to the mounting plate 314.

[0061] Optionally, the number of the adsorption components 320 is not limited to only 1, and there can also be multiple, so as to be able to pick up multiple wafers 20 simultaneously. In some examples, the number of the adsorption components 320 is 2 to 10, specifically, for example, 2, 4, 5, 6, 8, 10, etc.

[0062] In some examples, the adsorption component 320 has a suction nozzle 321. The number of the suction nozzles 321 can be set to be multiple, and the multiple suction nozzles 321 can respectively adsorb different positions of the wafer 20, so that the wafer 20 is balanced in force.

[0063] In some of these examples, the position of the suction nozzle 321 on the mounting plate 314 of the transfer member 310 is adjustable. For example, the suction nozzle 321 is connected to the mounting plate 314 through a slider (not shown in the figure), and the slider is slidably engaged with the mounting plate 314, so that the position where the suction nozzle 321 adsorbs the silicon wafer 20 can be adjusted to adapt to silicon wafers 20 of different sizes.

[0064] Optionally, the above-mentioned silicon wafer transfer device 10 can be a loading device or an unloading device. The following takes the working process of the silicon wafer transfer device 10 as a loading device as an example to further illustrate the present invention.

[0065] When loading with the above-mentioned silicon wafer transfer device 10, the silicon wafers 20 are loaded through the silicon wafer loading basket 400. The conveyor belt 210 transmits the silicon wafers 20 in the silicon wafer loading basket 400 one by one. When defective wafers such as hidden cracks and chipped edges are detected by the silicon wafer appearance inspection mechanism 500, the defective wafer removal mechanism 600 adsorbs and removes the defective wafers.

[0066] The silicon wafer 20 is conveyed by the conveyor belt 210 to above the carrier table 103 at the bottom layer of the silicon wafer limiting and lifting mechanism 100. As the carrier table 103 rises, the silicon wafer 20 is lifted and placed in the silicon wafer placement area 104 in a limited manner and rises with the carrier table 103. The second transfer mechanism 300 adsorbs the silicon wafer 20 on the top-layer carrier table 103 and loads it onto the carrier plate.

[0067] When the above-mentioned silicon wafer transfer device 10 is used as an unloading device, it is similar to the loading process. The second transfer mechanism 300 adsorbs the silicon wafer 20 and places it on the top-layer carrier table 103, and the carrier table 103 descends to transfer the silicon wafer 20 to the conveyor belt 210 below.

[0068] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0069] The above-described embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A silicon wafer limiting lifting mechanism (100), characterized in that: It comprises a first rotating bearing component (101) and a second rotating bearing component (102) which are arranged opposite to each other; The first rotating bearing component (101) and the second rotating bearing component (102) both comprise a mounting seat (110), a circulating rotating crawler (120) and a plurality of bearing plates (130); the circulating rotating crawler (120) surrounds the mounting seat (110) and is capable of circulating rotation; the rotation direction of the circulating rotating crawler (120) of the first rotating bearing component (101) is opposite to the rotation direction of the circulating rotating crawler (120) of the second rotating bearing component (102); and the plurality of bearing plates (130) are arranged along the circulating rotating crawler (120). The rotating crawler (120) is distributed and rises and falls with the circulating rotating crawler (120), and multiple pairs of the supporting plates (130) of the first rotating supporting component (101) and the second rotating supporting component (102) that are opposite to each other and spaced apart in the horizontal direction cooperate to form multiple supporting platforms (103), and the multiple supporting platforms (103) are distributed at different heights. Multiple limiting members (140) are arranged on each of the supporting plates (130), and the multiple limiting members (140) on each of the supporting platforms (103) cooperate to form a silicon wafer placement area (104).

2. The silicon wafer limiting lifting mechanism (100) according to claim 1, characterized in that: A pair of the carrier plates (130) that cooperate to form the carrier platform (103) are arranged relative to each other in a first horizontal direction, and the carrier plates (130) are strip structures extending along a second horizontal direction. A plurality of limit members (140) on each of the carrier platforms (103) cooperate to form a plurality of silicon wafer placement areas (104) arranged along the second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction.

3. The silicon wafer limiting lifting mechanism (100) according to claim 1, characterized in that: The limiting member (140) is movably connected to the supporting plate (130), and the position of the limiting member (140) on the supporting plate (130) is adjustable.

4. The silicon wafer limiting lifting mechanism (100) according to any one of claims 1 to 3, characterized in that: The silicon wafer placement area (104) is provided with an anti-slip pad.

5. A silicon wafer transport device (10), characterized in that: It comprises a silicon wafer limiting lifting mechanism (100), a first conveying mechanism (200) and a second conveying mechanism (300) according to any one of claims 1 to 4; the first conveying mechanism (200) is used to connect with the bottom carrier (103) to transfer the silicon wafer (20), and the second conveying mechanism (300) is used to connect with the top carrier (103) to transfer the silicon wafer (20).

6. The silicon wafer transport device (10) according to claim 5, characterized in that: The first conveying mechanism (200) comprises a conveying belt (210), wherein the conveying belt (210) is located between the pair of carrying plates (130), and the width of the conveying belt (210) is smaller than the distance between the pair of carrying plates (130).

7. The silicon wafer transport device (10) according to claim 5, characterized in that: The silicon wafer transfer device (10) further comprises a silicon wafer appearance inspection mechanism (500), wherein the silicon wafer appearance inspection mechanism (500) is used to perform appearance inspection on the silicon wafer (20) transported on the first conveying mechanism (200).

8. The silicon wafer transport device (10) according to claim 7, characterized in that: The silicon wafer transfer device (10) further comprises a silicon wafer removal mechanism (600), wherein the silicon wafer removal mechanism (600) is arranged downstream of the silicon wafer appearance inspection mechanism (500), and the silicon wafer removal mechanism (600) is used to remove defective wafers detected by the silicon wafer appearance inspection mechanism (500) from the first conveying mechanism (200).

9. The silicon wafer transport device (10) according to any one of claims 5 to 8, characterized in that: The silicon wafer transfer device (10) further comprises a silicon wafer buffer mechanism (700), wherein the silicon wafer buffer mechanism (700) is arranged on the first conveying mechanism (200), and the silicon wafer buffer mechanism (700) comprises a lifting component and a storage component (710), wherein the lifting component is used to drive the storage component (710) to rise and fall, and the storage component (710) comprises a plurality of support platforms (711) distributed at different heights, and each of the support platforms (711) comprises a first support portion (7112) and a second support portion (7114) which are arranged opposite to and spaced apart in a horizontal direction.

10. The silicon wafer transport device (10) according to any one of claims 5 to 8, characterized in that: The second conveying mechanism (300) comprises a transfer component (310) and an adsorption component (320), wherein the adsorption component (320) is used to adsorb the silicon wafer (20) on the carrier platform (103), and the transfer component (310) is connected to the adsorption component (320) to drive the adsorption component (320) to transfer.

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