PCB bonding pad for liquid crystal display module

Abstract

The utility model relates to the technical field of liquid crystal display modules, and discloses a PCB (Printed Circuit Board) bonding pad for a liquid crystal display module, which comprises a PCB, an LCD (Liquid Crystal Display) screen, a backlight plate and a pin header, and the upper surface of the PCB is contacted with the backlight plate. According to the utility model, the bonding pads at the two sides of the metal through hole of the PCB are designed in two different shapes, and the two sides of the bonding pads of the through hole on the PCB are designed to be circular generally, so that the welding firmness is improved by changing the shapes of the bonding pads and increasing the flowing and solidifying area of soldering tin; the soldering tin flows and solidifies according to the shape of the metal bonding pad, and the circular design of the bonding pad can avoid tin connection, can increase the tin absorption amount of the bonding pad, can increase the tin absorption amount of the bonding pad, and can improve the welding quality of the PCB bonding pad when the phenomenon that the welding is not firm or the contact is poor due to the fact that the tin bonding amount is insufficient and the tin shortage phenomenon is prone to occurring on the other side is avoided. The soldering tin coverage comprehensiveness is enhanced, the soldering tin permeation amount can be controlled, and the soldering tin cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display modules, and particularly to a PCB pad for a liquid crystal display module. Background Technique

[0002] The current liquid crystal display module mainly consists of an LCD, a backlight, a PCB, and a pin header. Among them, both the LCD and the pin header are well welded and fixed on the PCB. Generally, both sides of the pads of the through holes on the PCB are circularly designed. Since the soldering is done by applying solder from one side with a soldering iron, the solder will flow and solidify according to the shape of the metal pad. Due to the insufficient amount of solder sticking to this circular design of the pad, the lack of solder is likely to occur on the other side, resulting in poor soldering or poor contact. Therefore, we provide a new PCB pad for a liquid crystal display module. By changing the shape of the pad, the flowing and solidifying area of the solder is increased, and the soldering firmness is improved. Content of the Utility Model

[0003] The purpose of the utility model is to provide a PCB pad for a liquid crystal display module to solve the problems raised in the above background technique.

[0004] To achieve the above purpose, the utility model provides the following technical solution: A PCB pad for a liquid crystal display module, including a PCB board, an LCD screen, a backlight board, and a pin header. The upper surface of the PCB board is in contact with the backlight board, the upper surface of the backlight board is in contact with the LCD screen, and the display module is connected to the terminal application host through the pin header, and the pin header needs to be welded and fixed on the PCB board.

[0005] Preferably, the LCD screen from top to bottom is respectively an upper polarizer, an upper glass substrate, a lower glass substrate, and a lower polarizer, and a liquid crystal cell is filled between the upper glass substrate and the lower glass substrate.

[0006] Preferably, metal clip PINs are connected to both sides of the lower glass substrate, and the PIN feet of the metal clip PINs are fixed to the PCB board through solder.

[0007] Preferably, the PCB board is divided into two types of pads, namely a soldering side PCB pad and a non-soldering side PCB pad.

[0008] Preferably, if the PCB board is the soldering side PCB pad, there are two groups of LCD metal PIN foot through holes on it. The non-soldering side pad of the LCD metal PIN foot through hole is circularly designed, while the through hole pad on the soldering side of the pin header lead on the soldering side PCB pad is elliptically designed, and the elliptical pad bulges symmetrically towards the soldering side of the soldering iron.

[0009] Preferably, if the PCB board is the non-welding side PCB pad and there is a set of pin through-holes on it, the non-welding side pad of the pin through-hole is circularly designed, while the through-hole pad on the tin soldering side of the LCD metal PIN foot provided on the non-welding side PCB pad is elliptically designed, and the elliptical pad protrudes symmetrically towards the soldering iron soldering side.

[0010] The utility model provides a PCB pad for a liquid crystal display module. It has the following beneficial effects:

[0011] (1). Through the two different shape designs of the pads on both sides of the PCB metal through-hole, the pad on the soldering side is elliptically designed, and the elliptical protruding part faces the side where the soldering iron is placed. The elliptical pad can not only ensure the distance between adjacent pads to avoid solder bridging, but also increase the solder absorption amount of the pad and enhance the comprehensiveness of solder coverage; the non-welding side pad is circularly designed, which can control the penetration amount of solder and reduce the solder cost.

[0012] (2). Through the two different shape designs of the pads on both sides of the PCB metal through-hole, generally, the pads on both sides of the through-hole on the PCB are circularly designed. By changing the shape of the pad, the flowing and solidifying area of the solder is increased, and the welding firmness is improved. Compared with the prior art where the solder is applied from one side by the soldering iron during welding, and the solder will flow and solidify according to the shape of the metal pad. Due to insufficient solder adhesion of this circular design of the pad, the other side is prone to tin deficiency, resulting in insecure welding or poor contact. In comparison, the PCB pad designed in this application can avoid solder bridging, increase the solder absorption amount of the pad, enhance the comprehensiveness of solder coverage, control the penetration amount of solder, and reduce the solder cost. Description of the Drawings

[0013] Figure 1 It is a front view structural schematic diagram of the PCB pad of the utility model;

[0014] Figure 2 It is a top view structural schematic diagram of the PCB pad of the utility model;

[0015] Figure 3 It is a side view structural schematic diagram of the PCB pad of the utility model;

[0016] Figure 4 It is a structural schematic view of the LCD screen of the utility model;

[0017] Figure 5 It is a structural schematic view of the metal clip PIN of the utility model;

[0018] Figure 6 It is a structural schematic view of the soldering side PCB pad of the utility model;

[0019] Figure 7This is a schematic view of the non-welding side PCB pad structure of the present utility model.

[0020] In the figure: 1 PCB board, 2 LCD screen, 3 backlight board, 4 pin header, 21 upper polarizer, 22 upper glass substrate, 23 lower glass substrate, 24 lower polarizer, 25 metal clip PIN, 11 welding side PCB pad, 12 non-welding side PCB pad, 111 LCD metal PIN foot through hole, 112 pin header pin, 121 pin header through hole, 122 LCD metal PIN foot. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present utility model and should not be construed as limiting the present utility model.

[0023] A preferred embodiment of the PCB pad for a liquid crystal display module provided by the present utility model is as Figures 1-6 shown: A PCB pad for a liquid crystal display module includes a PCB board 1, an LCD screen 2, a backlight board 3, and a pin header 4. The upper surface of the PCB board 1 is in contact with the backlight board 3, and the upper surface of the backlight board 3 is in contact with the LCD screen 2. The display module is connected to the terminal application host through the pin header 4, and the pin header 4 needs to be soldered and fixed on the PCB board 1; The LCD screen 2 includes an upper polarizer 21, an upper glass substrate 22, a lower glass substrate 23, and a lower polarizer 24 from top to bottom. A liquid crystal cell is filled between the upper glass substrate 22 and the lower glass substrate 23. Metal clip PINs 25 are connected to both sides of the lower glass substrate 23, and the PIN feet of the metal clip PINs 25 are fixed to the PCB board 1 by soldering;

[0024] The PCB board 1 is a welding side PCB pad 11, on which there are two groups of LCD metal PIN foot through holes 111. The non-welding side pad of the LCD metal PIN foot through hole 111 is circular in design, while the through hole pad on the tin soldering side of the pin header pin 112 is oval in design, and the oval pad protrudes symmetrically towards the soldering iron welding side.

[0025] Furthermore, in this embodiment, if the PCB metal through-hole is the LCD metal PIN foot through-hole 111, the non-welding side pad of the LCD metal PIN foot through-hole 111 is designed to be circular, which can control the amount of solder infiltration and reduce the solder cost. The through-hole pad on the tin soldering side of the pin header pin 112 is designed to be oval, and the oval pad protrudes symmetrically towards the soldering iron soldering side. The oval pad can not only ensure the distance between adjacent pads to avoid solder bridging, but also increase the solder absorption amount of the pad and enhance the comprehensiveness of solder coverage. Through this carefully designed PCB metal through-hole and pad shape, not only the soldering process is optimized, the soldering quality is improved, but also the solder cost is significantly reduced. At the same time, this design also takes into account the balance between production efficiency and product quality, making the entire soldering process more efficient and stable.

[0026] Please refer to Figures 1-5 、 Figure 7 and, based on Embodiment 1, further obtain: A PCB pad for a liquid crystal display module, including a PCB board 1, an LCD screen 2, a backlight board 3, and a pin header 4. The upper surface of the PCB board 1 is in contact with the backlight board 3, and the upper surface of the backlight board 3 is in contact with the LCD screen 2. The display module is connected to the terminal application host through the pin header 4, and the pin header 4 needs to be soldered and fixed on the PCB board 1; The LCD screen 2 includes a polarizer 21, an upper glass substrate 22, a lower glass substrate 23, and a polarizer 24 from top to bottom. A liquid crystal cell is filled between the upper glass substrate 22 and the lower glass substrate 23. Metal clip PINs 25 are connected to both sides of the lower glass substrate 23, and the PIN feet of the metal clip PINs 25 are fixed to the PCB board 1 by soldering.

[0027] The PCB board 1 is a non-welding side PCB pad 12; a group of pin header through-holes 121 are provided thereon. The non-welding side pad of the pin header through-hole 121 is designed to be circular, while the through-hole pad on the tin soldering side of the LCD metal PIN foot 122 is designed to be oval, and the oval pad protrudes symmetrically towards the soldering iron soldering side.

[0028] Furthermore, in this embodiment, if the PCB metal via hole is the pin via hole 121, the non-welding side pad of the pin via hole 121 is circularly designed, which can control the amount of solder infiltration and reduce the solder cost. The via hole pad on the tin soldering side of the LCD metal PIN foot 122 is elliptically designed, and the elliptical pad protrudes symmetrically towards the soldering iron soldering side. The elliptical pad can not only ensure the spacing between adjacent pads to avoid solder bridging, but also increase the solder absorption amount of the pad and enhance the comprehensiveness of solder coverage. Through this differential pad design, this embodiment has successfully achieved the control of solder cost and the improvement of welding quality. The application of the circular pad on the non-welding side of the pin effectively controls the waste of solder; while the application of the elliptical pad on the tin soldering side of the LCD metal PIN foot enhances the firmness and reliability of the welding. At the same time, this design also takes into account the balance between production efficiency and product quality, providing an efficient and economical welding solution for the electronic product manufacturing industry.

[0029] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A PCB soldering pad for a liquid crystal display module, comprising a PCB board (1), an LCD screen (2), a backlight board (3), and a pin header (4), characterized in that: The upper surface of the PCB board (1) contacts the backlight board (3), and the upper surface of the backlight board (3) contacts the LCD screen (2). The display module is connected to the terminal application host via the pin header (4), and the pin header (4) needs to be welded and fixed on the PCB board (1).

2. The PCB pad for a liquid crystal display module according to claim 1, characterized in that: The LCD screen (2) comprises, from top to bottom, an upper polarizer (21), an upper glass substrate (22), a lower glass substrate (23) and a lower polarizer (24), and a liquid crystal cell is filled between the upper glass substrate (22) and the lower glass substrate (23).

3. The PCB pad for a liquid crystal display module according to claim 2, characterized in that: Metal clip PINs (25) are connected to both sides of the lower glass substrate (23), and the PIN pins of the metal clip PINs (25) are fixed to the PCB board (1) by soldering.

4. The PCB pad for a liquid crystal display module according to claim 1, characterized in that: The PCB board (1) is divided into two types of pads, namely, a soldering side PCB pad (11) and a non-soldering side PCB pad (12).

5. The PCB pad for a liquid crystal display module according to claim 4, characterized in that: If the PCB board (1) is the soldering side PCB pad (11), and two groups of LCD metal PIN pin through holes (111) are provided on it, then the non-soldering side pads of the LCD metal PIN pin through holes (111) are circular in design, while the through hole pads on the soldering side of the pin header pins (112) provided on the soldering side PCB pad (11) are elliptical in design, and the elliptical pads are symmetrically protruding toward the soldering side of the soldering iron.

6. The PCB pad for a liquid crystal display module according to claim 4, characterized in that: If the PCB board (1) is the non-soldering side PCB pad (12), and a group of pin header through holes (121) are provided on it, the non-soldering side pad of the pin header through holes (121) is circular in design, and the through hole pad on the tin soldering side of the LCD metal PIN foot (122) provided on the non-soldering side PCB pad (12) is elliptical in design, and the elliptical pad is symmetrically protruded toward the soldering side of the soldering iron.

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