FPC (Flexible Printed Circuit) for battery temperature acquisition

Abstract

The FPC for battery temperature acquisition comprises a flexible board, a plurality of acquisition circuits and a plurality of reinforcing frames, the acquisition circuits and the reinforcing frames are located on the upper surface of the flexible board, and the reinforcing frames surround the welding ends of the acquisition circuits; the upper surface of the flexible board is provided with a bonding pad, the welding end is connected with the bonding pad, the upper surface of the flexible board is further provided with a soldering tin area, the soldering tin area is located on the peripheral side of the bonding pad, and a soldering tin layer is arranged between the reinforcing frame and the soldering tin area on the upper surface of the collection board. The reinforcing frame of the FPC can be fixed on the flexible board in a tin soldering mode, on one hand, the cost generated by fixing the reinforcing frame is reduced, the fixing technological process is simplified, on the other hand, the requirement for firmness can be met, and the effective protection effect is achieved.

Description

Technical Field

[0001] The utility model relates to an FPC of a new energy power battery, in particular to an FPC for battery temperature acquisition. Background Art

[0002] Some new energy power batteries are provided with an FPC (flexible printed circuit board) for temperature acquisition. The FPC has pads for welding with temperature acquisition lines, and in order to protect the pads and the circuit structure, some FPCs for temperature acquisition also have a reinforcing frame arranged around the pads. At present, there are two ways to fix the reinforcing frame:

[0003] One is by means of hot pressing. However, the hot pressing method requires processes such as component placement, pre-attaching the reinforcing frame, vacuum lamination, and curing. The process flow is complex, and the equipment cost of the vacuum laminator is high. Moreover, the high temperature during hot pressing will cause rosin residue at the temperature acquisition position on the FPC.

[0004] The other is to fix it by means of pressure-sensitive adhesive bonding. However, the firmness after pressure-sensitive adhesive bonding is insufficient, and the reinforcing frame is easy to fall off, unable to effectively protect the pads. Content of the Utility Model

[0005] In order to overcome the defects and deficiencies existing in the prior art, the purpose of the utility model is to design an FPC for battery temperature acquisition, which can fix the reinforcing frame by means of soldering, thereby simplifying the process flow and forming a firm fixation at the same time.

[0006] To achieve the above purpose, the utility model provides an FPC for battery temperature acquisition, including: a flexible board, a plurality of acquisition lines, and a plurality of reinforcing frames. The acquisition lines and the reinforcing frames are both located on the upper surface of the flexible board, and the reinforcing frames surround the welding ends of the acquisition lines; a pad is arranged on the upper surface of the flexible board, the welding ends are connected to the pads, a soldering area is further arranged on the upper surface of the flexible board, the soldering area is located on the periphery of the pads, and a soldering layer is arranged between the reinforcing frames and the soldering area on the upper surface of the acquisition board.

[0007] Further, a soldering groove is arranged in the soldering area. Among them, the soldering groove is set to accommodate the solder paste for soldering, and soldering can be carried out by means of reflow soldering, with high production efficiency.

[0008] Further, there are multiple soldering grooves in the soldering area, and the multiple soldering grooves are arranged at equal intervals. Among them, setting multiple soldering grooves arranged at equal intervals can ensure uniform soldering and improve the fixing effect.

[0009] Further, the welding end is located at the rear end of the acquisition circuit; there are three solder regions on the periphery of the pad, which are located on the left side, right side, and rear side of the pad respectively. Among them, setting the three solder regions on the left side, right side, and rear side of the pad can avoid the wiring of the acquisition circuit and form a stable soldering effect at the same time.

[0010] Further, the FPC further includes: a plurality of reinforcing plates, which are located on the lower surface of the flexible board and directly below the welding end; there is also a solder region on the lower surface of the flexible board, and there is also a solder layer between the reinforcing plate and the solder region on the lower surface of the flexible board. Among them, setting the reinforcing plate can further protect the position of the pad.

[0011] Further, the flexible board includes: a main board and a plurality of acquisition boards, the acquisition boards are connected to the main board and are located on the side of the main board, the upper surface of the acquisition board is provided with pads, the upper surface and the lower surface of the acquisition board are both provided with solder regions, the acquisition circuit and the reinforcing frame are both located on the upper surface of the acquisition board, and the reinforcing plate is located on the lower surface of the acquisition board. Among them, setting the acquisition board on the side of the main board can facilitate fixing the acquisition board at the temperature acquisition position on the battery.

[0012] Further, there are multiple acquisition circuits, pads, reinforcing frames, reinforcing plates, and acquisition boards. The multiple acquisition boards are arranged in two rows, and the two rows of acquisition boards are respectively located on the left side and the right side of the main board. The number of acquisition boards in the two rows is equal and they are directly opposite to each other left and right. Among them, setting multiple acquisition circuits, pads, reinforcing frames, reinforcing plates, and acquisition boards can form multiple acquisition points, so as to achieve the effect of multi-point temperature acquisition.

[0013] Further, both the reinforcing frame and the reinforcing plate are formed of glass fiber epoxy resin material. Among them, the glass fiber epoxy resin material has good ultimate tensile strength, can effectively protect the pad position, and at the same time its surface is smooth and not easy to crush the circuit.

[0014] Further, the reinforcing frame is a full-frame structure. Among them, the full-frame structure reinforcing frame can provide an all-round protection effect.

[0015] Further, the reinforcing frame is a semi-frame structure with a notch, and the acquisition circuit passes through the notch of the reinforcing frame. Among them, the semi-frame structure reinforcing frame can avoid the acquisition circuit and prevent extrusion of the acquisition circuit.

[0016] After adopting the above technical solution, the beneficial effects of the present utility model are as follows: Since the solder region is provided on the flexible board of the above FPC, the reinforcing frame can be fixed on the flexible board by soldering, which has a reinforcing effect on the position of the solder pad. On the one hand, it can reduce the cost generated by fixing the reinforcing frame and simplify the fixing process flow. On the other hand, it can meet the requirement of firmness and play an effective protective effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the upper surface of the FPC related to the present utility model;

[0018] Figure 2 It is a schematic diagram of the lower surface of the FPC related to the present utility model;

[0019] Figure 3 It is a partial enlarged view of the FPC related to the present utility model at circle A;

[0020] Figure 4 It is a partial enlarged view of the flexible board related to the present utility model at circle A.

[0021] The reference numerals are: 1, flexible board; 11, main board; 12, acquisition board; 13, solder pad; 14, solder region; 15, solder groove; 2, acquisition circuit; 20, welding end; 3, reinforcing frame; 31, first reinforcing frame; 32, second reinforcing frame; 4, reinforcing plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The technical solution of the present utility model will be further described below through embodiments:

[0023] The present utility model provides an FPC for battery temperature acquisition, in combination with Figures 1-3 as shown, including: a flexible board 1, a plurality of acquisition circuits 2, a plurality of reinforcing frames 3 and a plurality of reinforcing plates 4. The acquisition circuits 2 and the reinforcing frames 3 are both located on the upper surface of the flexible board 1. The reinforcing frames 3 surround the welding ends 20 of the acquisition circuits 2. The reinforcing plates 4 are located on the lower surface of the flexible board 1 and directly below the welding ends 20 of the acquisition circuits 2. During use, the flexible board 1 is fixed on a new energy power battery; the acquisition circuits 2 are used to acquire the temperature information of the battery, and their welding ends 20 are used for welding to form an electrical connection with other circuits; both the reinforcing frames 3 and the reinforcing plates 4 are used to enhance the compressive strength of the positions of the welding ends 20 of the acquisition circuits 2, thereby playing a protective role.

[0024] Specifically, in combination with Figure 1 and 4As shown in the figure, the flexible board 1 includes: a main board 11 and a plurality of acquisition boards 12. The acquisition boards 12 are connected to the main board 11 and are located on the side of the main board 11 (i.e., the left side or the right side). The upper surface of the acquisition board 12 is provided with pads 13, and both the upper surface and the lower surface of the acquisition board 12 are provided with solder regions 14. Solder grooves 15 are provided in the solder regions 14. The solder regions 14 are located on the periphery of the pads 13 (i.e., the front side, the rear side, the left side, or the right side). The welding end 20 of the acquisition circuit 2 is connected to the pad 13. The reinforcing frame 3 is located on the upper surface of the acquisition board 12, and there is a solder layer (not shown in the figure) between the reinforcing frame 3 and the solder region 14 on the upper surface of the acquisition board 12. The reinforcing board 4 is located on the lower surface of the acquisition board 12, and there is also a solder layer (not shown in the figure) between the reinforcing board 4 and the solder region 14 on the lower surface of the acquisition board 12. Among them, the main board 11 is fixed on the battery; the acquisition board 12 is fixed at the temperature acquisition position of the battery, and the temperature information is acquired through the acquisition circuit 2; the pad 13 is used as the area for circuit welding; the solder region 14 is used to form a fixation with the solder paste; the solder groove 15 is used to accommodate the solder paste.

[0025] In this embodiment, the front end of the acquisition board 12 is connected to the main board 11, and the pad 13 is located near the rear end of the acquisition board 12, that is, the rear end of the acquisition board 12 is used as the position for circuit welding. Of course, in other embodiments, other positions of the acquisition board 12 can also be used as the welding position.

[0026] In this embodiment, both the acquisition circuit 2 and the pads 13 are twenty in number, and both the reinforcing frame 3, the reinforcing board 4, and the acquisition boards 12 are ten in number. The ten acquisition boards 12 are arranged in two rows. The two rows of acquisition boards 12 are respectively located on the left side and the right side of the main board 11. The number of acquisition boards 12 in the two rows is equal and they are directly opposite to each other left and right. Two acquisition circuits 2 and one reinforcing frame 3 are provided on the upper surface of each acquisition board 12, and one reinforcing board 4 is provided on the lower surface of each acquisition board 12. That is to say, in this embodiment, the ten acquisition boards 12 of the flexible board 1 are arranged axially symmetrically. Of course, in other embodiments, the number of acquisition boards 12 is greater than or less than ten, and other arrangement methods can also be adopted, and the numbers of the acquisition circuit 2, the pads 13, the reinforcing frame 3, and the reinforcing board 4 can be adjusted according to the number of acquisition boards 12.

[0027] In this embodiment, the welding end 20 is located at the rear end of the acquisition circuit 2; there are three solder regions 14 on the periphery of the pad 13, and the three solder regions 14 are respectively located on the left side, the right side, and the rear side of the pad 13. Of course, in other embodiments, the welding end 20 can also be provided at other positions of the acquisition circuit 2. Correspondingly, the solder regions 14 are arranged at other positions so that the acquisition circuit 2 avoids all the solder regions 14.

[0028] In this embodiment, please continue to refer to Figure 4As shown, the solder bath 15 is circular, and there are three solder baths 15 in the solder area 14, and the three solder baths 15 are arranged at equal intervals. Of course, in other embodiments, the solder bath 15 can also be of other shapes, and other numbers of solder baths 15 can also be provided in the solder area 14.

[0029] In this embodiment, the solder area 14 is formed of copper material. Of course, in other embodiments, the solder area 14 can also be formed of other materials, as long as it can be fixed with the solder paste after welding.

[0030] In this embodiment, both the reinforcing frame 3 and the reinforcing plate 4 are formed of glass fiber epoxy resin material (i.e., FR4). Of course, in other embodiments, the reinforcing frame 3 and the reinforcing plate 4 can also be formed of other materials, as long as they can achieve the reinforcing effect.

[0031] As an alternative solution, please continue to refer to Figure 3 As shown, the reinforcing frame 3 can be a full-frame structure or a half-frame structure. In this embodiment, the reinforcing frame 3 in the left row is a full-frame structure, while the reinforcing frame 3 in the right row is a half-frame structure with a notch, and the acquisition line 2 passes through the notch of the reinforcing frame 3.

Claims

1. An FPC for battery temperature collection, comprising: A flexible board, a plurality of acquisition circuits and a plurality of reinforcement frames, wherein the acquisition circuits and the reinforcement frames are both located on the upper surface of the flexible board, and the reinforcement frames surround the welding ends of the acquisition circuits; a soldering pad is provided on the upper surface of the flexible board, and the welding ends are connected to the soldering pads, and the characteristic is that: a soldering area is also provided on the upper surface of the flexible board, and the soldering area is located on the peripheral side of the soldering pad, and a solder layer is provided between the reinforcement frame and the soldering area on the upper surface of the acquisition board.

2. The FPC for battery temperature acquisition according to claim 1, characterized in that: A solder groove is provided in the solder area.

3. The FPC for battery temperature acquisition according to claim 2, characterized in that: There are multiple solder grooves in the solder area, and the multiple solder grooves are arranged at equal intervals.

4. The FPC for battery temperature acquisition according to claim 1, characterized in that: The welding end is located at the rear end of the acquisition circuit; there are three soldering areas around the pad, and the three soldering areas are respectively located at the left side, the right side and the rear side of the pad.

5. The FPC for battery temperature collection according to claim 1, 2, 3 or 4, characterized in that: The FPC also includes: a plurality of reinforcing plates, which are located on the lower surface of the flexible board and directly below the welding end; a soldering area is also provided on the lower surface of the flexible board, and a solder layer is also provided between the reinforcing plates and the soldering area on the lower surface of the flexible board.

6. The FPC for battery temperature acquisition according to claim 5, characterized in that: The flexible board includes: a main body board and several acquisition boards, the acquisition board is connected to the main body board and is located on the side of the main body board, the upper surface of the acquisition board is provided with a solder pad, the upper surface and the lower surface of the acquisition board are both provided with a soldering area, the acquisition circuit and the reinforcement frame are both located on the upper surface of the acquisition board, and the reinforcement plate is located on the lower surface of the acquisition board.

7. The FPC for battery temperature acquisition according to claim 6, characterized in that: There are multiple acquisition circuits, pads, reinforcement frames, reinforcement plates and acquisition boards, which are arranged in two rows. The two rows of acquisition boards are respectively located on the left and right sides of the main board. The number of acquisition boards in the two rows is equal and they are opposite each other.

8. The FPC for battery temperature acquisition according to claim 1, characterized in that: The reinforcement frame and the reinforcement plate are both formed of glass fiber epoxy resin material.

9. The FPC for battery temperature acquisition according to claim 8, characterized in that: The reinforcement frame is a full frame structure.

10. The FPC for battery temperature acquisition according to claim 8, characterized in that: The reinforcement frame is a half-frame structure with a notch, and the acquisition line passes through the notch of the reinforcement frame.

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