Cooling device for ceiling film processing

Abstract

The utility model discloses a cooling device for ceiling film processing, which is characterized in that a first cooling cavity, a second cooling cavity and a drying cavity are arranged in a cooling box, the first cooling cavity is used for primarily cooling a film material through heated cooling liquid, and the second cooling cavity is used for secondarily cooling the film material through low-temperature cooling liquid; the drying cavity dries the membrane material to remove the cooling liquid, the cooling efficiency is high, meanwhile, flaws caused by too fast cooling of the membrane material can be prevented, the multiple refrigeration pieces are further arranged, the temperature of the cooling liquid is controlled through the refrigeration and heating characteristics of the two faces of each refrigeration piece, and temperature control of the cooling liquid is more efficient and convenient.

Description

Technical Field

[0001] The utility model relates to the field of cooling, and more specifically, it relates to a cooling device for processing ceiling films. Background Art

[0002] A ceiling film is a soft film ceiling material used for interior decoration. It is made of special PVC (polyvinyl chloride) material and has good flexibility and plasticity, which can create various shapes and design effects. The processing of ceiling films requires processes such as melting and extrusion, cooling and shaping, stretching, coating treatment, slitting and packaging, etc. In the production process of ceiling films, the cooling and shaping link is very important. The cooling process directly affects the forming quality of the film, including the flatness, transparency and strength of the film, etc. Here, a film cooling device is needed.

[0003] Most of the existing film cooling devices are air-cooled or water-cooled. The air-cooling has a low cooling efficiency, and the water-cooling is prone to the situation that the temperature of the cooling medium is too low or too high, which affects the film quality. When the temperature of the cooling medium is too low, the rapid cooling speed of the film will cause stress concentration. The rapid cooling will cause large thermal stress inside the film material, especially forming a temperature gradient on the material, thus causing stress concentration, which may lead to deformation, warping or cracking of the film material. When the temperature of the cooling medium is too high, the cooling efficiency will be reduced and the energy consumption will increase.

[0004] Based on the above, the purpose of the present utility model is to provide a cooling device for processing ceiling films to solve the above problems. Summary of the Utility Model

[0005] Aiming at the deficiencies of the existing technology, the purpose of the present utility model is to provide a cooling device for processing ceiling films. The present utility model sets a first cooling chamber, a second cooling chamber and a drying chamber in the cooling box. The first cooling chamber performs primary cooling on the film material through the heated coolant, the second cooling chamber performs secondary cooling on the film material through the low-temperature coolant, and the drying chamber dries the film material to remove the coolant. It has a high cooling efficiency and can prevent the film material from having defects due to too rapid cooling.

[0006] The above technical object of the present utility model is achieved by the following technical solutions: A cooling device for processing ceiling membranes, including a cooling box, on which a feed inlet and a discharge outlet are provided. The cooling box is successively provided with a first cooling chamber, a second cooling chamber and a drying chamber from the feed inlet to the discharge outlet direction. A number of support rollers are provided in both the first cooling chamber and the second cooling chamber. A first reservoir and a second reservoir, a first atomizing nozzle and a second atomizing nozzle are respectively provided in the first cooling chamber and the second cooling chamber. A heating pipe and a cooling pipe are provided on the cooling box. An installation frame is provided between the heating pipe and the cooling pipe, and a number of first refrigeration chips are provided on the installation frame. A first fan and a second fan, a connecting pipe one and a connecting pipe two are respectively provided at the upper and lower ends of the inner cavity of the drying chamber. The second reservoir is communicated with the water inlet of the connecting pipe two, the water outlet of the connecting pipe two is communicated with the water inlet of the heating pipe, the water outlet of the heating pipe is communicated with the first atomizing nozzle, the first reservoir is communicated with the water inlet of the connecting pipe one, the water outlet of the connecting pipe one is communicated with the water inlet of the cooling pipe, and the water outlet of the cooling pipe is communicated with the second atomizing nozzle. A driving mechanism for driving the cooling medium to circulate in the above connection manner is provided on the cooling box.

[0007] By adopting the above technical solutions, when ceiling membrane cooling is required, start the refrigeration chips, the first fan, the second fan and the driving mechanism. Then, the driving mechanism pumps the coolant out of the second reservoir and sends it into the second connecting pipe. After passing through the second connecting pipe, it flows into the heating pipe. During this process, the air flow generated by the second fan will exchange heat with the connecting pipe two. The air flow will take away the heat energy of the coolant and transfer this heat energy to the membrane material. The cooled coolant then passes through the heating pipe and flows to the first atomizing nozzle. During this process, the two sides of the refrigeration chip will respectively cool and heat. The heating side is attached to the heating pipe, and the heat energy will heat the coolant. The heated coolant is then atomized and sprayed out through the first atomizing nozzle, thereby performing primary cooling on the membrane material located in the first cooling chamber. Since the coolant is heated, the temperature reduction speed of the membrane material will not be too fast, preventing situations such as deformation and cracking of the membrane material. The coolant then falls into the first reservoir, and then the driving mechanism pumps out the hot water in the first reservoir and sends it into the first connecting pipe. After passing through the first connecting pipe, it is sent into the cooling pipe. During this process, the air flow generated by the first fan will exchange heat with the connecting pipe one to achieve the first temperature reduction. The air flow will take away the heat energy of the coolant and transfer this heat energy to the membrane material. The hot air flow below can cooperate to dry both sides of the membrane material, thereby removing the residual coolant on the membrane material. After the coolant enters the cooling pipe, it will exchange heat with the cooling surface of the refrigeration chip, thereby achieving the second temperature reduction. The coolant that has undergone two temperature reductions is then sprayed out through the second atomizing nozzle, thereby performing secondary cooling on the membrane material. By using coolants with different water temperatures to perform multi-stage cooling on the membrane material, the cooling efficiency is high and at the same time, the membrane material can be prevented from having defects due to too fast temperature reduction.

[0008] The present utility model is further configured such that: the first connecting pipe and the second connecting pipe are arranged in a meandering shape.

[0009] The present utility model is further configured such that: heat conducting rings are provided on both sides of the mounting bracket, and the heat conducting rings on both sides respectively wrap the heating pipe and the cooling pipe.

[0010] The present utility model is further configured such that: a cooling bracket is provided on the side of the heat conducting ring close to the cooling roller, a plurality of second refrigeration chips are provided on the cooling bracket, and a heat dissipation structure is provided on the side of the cooling bracket away from the cooling roller.

[0011] The present utility model is further configured such that: guide rollers are provided at the connection points between the first cooling chamber and the second cooling chamber, and between the second cooling chamber and the drying chamber, and the horizontal height of the guide rollers is higher than that of the support rollers.

[0012] In summary, the present utility model has the following beneficial effects:

[0013] By providing a first cooling chamber, a second cooling chamber and a drying chamber in the cooling box, the present utility model performs primary cooling on the film material through the heated cooling liquid in the first cooling chamber, performs secondary cooling on the film material through the low-temperature cooling liquid in the second cooling chamber, and dries the film material in the drying chamber to remove the cooling liquid. While having high cooling efficiency, it can also prevent the film material from cooling too quickly and having defects. Multiple refrigeration chips are also provided, and the temperature of the cooling liquid is controlled more efficiently and conveniently by utilizing the characteristics of the two sides of the refrigeration chip for refrigeration and heating respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall structure of the patent of the present utility model Figure 1 , showing the overall structure of the present utility model;

[0015] Figure 2 is a schematic diagram of the overall structure of the patent of the present utility model Figure 2 , showing the overall structure of the present utility model;

[0016] Figure 3 is a schematic diagram of the overall structure of the patent of the present utility model Figure 3 , showing the structural relationship of the mounting bracket, the first refrigeration chip, the heat conducting ring, the cooling bracket, the second refrigeration chip and the heat dissipation mechanism;

[0017] Figure 4 is a schematic diagram of the overall structure of the patent of the present utility model Figure 4 , showing the structural relationship of the mounting bracket, the first refrigeration chip, the heat conducting ring, the cooling bracket, the second refrigeration chip and the heat dissipation mechanism;

[0018] Figure 5 is a schematic diagram of the overall structure of the patent of the present utility model Figure 5, which shows the shapes of the connecting pipe 1 and the connecting pipe 2.

[0019] In the figure: 1. Cooling box; 2. Feed inlet; 3. Discharge outlet; 4. First cooling chamber; 5. Second cooling chamber; 6. Drying chamber; 7. Support roller; 8. First reservoir; 9. Second reservoir; 10. First atomizing nozzle; 11. Second atomizing nozzle; 12. Heating pipe; 13. Cooling pipe; 14. Mounting rack; 15. First Peltier element; 16. Fan 1; 17. Fan 2; 18. Connecting pipe 1; 19. Connecting pipe 2; 20. Heat conduction ring; 21. Cooling rack; 22. Heat dissipation structure; 23. Guide roller; 24. Second Peltier element. Detailed implementation mode

[0020] In order to enable those skilled in the art to better understand the technical solution of the present utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0021] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0022] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / sleeved / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0023] The present utility model will be described in detail below with reference to the accompanying drawings.

[0024] A cooling device for processing ceiling films, as Figures 1 - 5As shown in the figure, it includes a cooling box 1. Feeding ports 2 and discharging ports 3 are respectively opened on both sides of the cooling box 1. The cooling box 1 is separated into a first cooling chamber 4, a second cooling chamber 5 and a drying chamber 6 in the direction from the feeding port 2 to the discharging port 3. A number of support rollers 7 are rotatably connected in both the first cooling chamber 4 and the second cooling chamber 5. A first reservoir 8 and a second reservoir 9, a first atomizing nozzle 10 and a second atomizing nozzle 11 are respectively installed in the first cooling chamber 4 and the second cooling chamber 5. A heating pipe 12 and a cooling pipe 13 are installed on the cooling box 1. An installation frame 14 is fixedly connected between the heating pipe 12 and the cooling pipe 13. A number of first refrigeration chips 15 are installed on the installation frame 14. A first fan 16 and a second fan 17, a connecting pipe 18 and a connecting pipe 19 are respectively installed at the upper and lower ends of the inner cavity of the drying chamber 6.

[0025] The second reservoir 9 is communicated with the water inlet of the connecting pipe 19. The water outlet of the connecting pipe 19 is communicated with the water inlet of the heating pipe 12. The water outlet of the heating pipe 12 is communicated with the first atomizing nozzle 10. The first reservoir 8 is communicated with the water inlet of the connecting pipe 18. The water outlet of the connecting pipe 18 is communicated with the water inlet of the cooling pipe 13. The water outlet of the cooling pipe 13 is communicated with the second atomizing nozzle 11. A driving mechanism for driving the cooling medium to circulate in the above connection manner is provided on the cooling box 1. The driving mechanism is a plurality of water pumps. Pumping and conveying the coolant by the water pump is a mature existing technology, so it will not be elaborated here.

[0026] Furthermore, the connecting pipe 18 and the connecting pipe 19 are arranged in a meandering shape.

[0027] Furthermore, heat conduction rings 20 are fixedly connected to both sides of the installation frame 14. The heat conduction rings are made of metals with relatively high heat conduction coefficients such as copper alloys. The two heat conduction rings 20 respectively wrap the heating pipe 12 and the cooling pipe 13.

[0028] Furthermore, a cooling frame 21 is installed on the side of the heat conduction ring 20 close to the cooling roller. A number of second refrigeration chips 24 are installed on the cooling frame 21. A heat dissipation structure 22 is fixedly connected to the side of the cooling frame 21 away from the cooling pipe. The heat dissipation structure 22 is a plurality of heat dissipation plates distributed in an array. The heat dissipation plates can increase the contact area between the cooling frame and the air, making the heat dissipation efficiency higher. A fan can also be provided on one side of the heat dissipation plates to make the heat dissipation effect better.

[0029] Furthermore, guide rollers 23 are rotatably connected at the communication positions between the first cooling chamber 4 and the second cooling chamber 5, and between the second cooling chamber 5 and the drying chamber 6. The horizontal height of the guide rollers 23 is higher than that of the support rollers 7.

[0030] Working principle: When ceiling film cooling is required, start the first thermoelectric cooler 15, the first fan, the second fan and the driving mechanism. Then, the driving mechanism pumps the coolant out of the second reservoir 9 and sends it into the connecting pipe two. The coolant flows through the connecting pipe two and then into the heating pipe 12. During this process, the airflow generated by the second fan will exchange heat with the connecting pipe two 19. The airflow will take away the heat energy of the coolant and transfer this heat energy to the film material. The cooled coolant then flows through the heating pipe 12 to the first atomizing nozzle 10. During this process, the two sides of the thermoelectric cooler will be cooled and heated respectively. The heated side is in contact with the heating pipe 12, and the heat conduction ring 20 will make the heat energy conduct more evenly to the heating pipe 12. The heat energy will heat the coolant in the heating pipe 12, and the heated coolant is then atomized and sprayed out through the first atomizing nozzle 10, thereby performing primary cooling on the film material located in the first cooling chamber 4. Since the coolant is heated, the cooling rate of the film material will not be too fast, preventing situations such as deformation and cracking of the film material.

[0031] Then, the coolant that has absorbed the heat energy of the film material falls into the first reservoir 8 for storage. Then, under the drive of the driving mechanism, the hot water in the first reservoir 8 is pumped out and sent into the first connecting pipe, and then passes through the first connecting pipe and enters the cooling pipe 13. During this process, the airflow generated by the first fan will exchange heat with the connecting pipe one 18 to achieve the first cooling of the coolant. The airflow will take away part of the heat energy of the coolant and transfer this heat energy to the film material. The hot air flow below can cooperate to dry both sides of the film material, thereby removing the residual coolant on the film material. Before this process, the guide roller 23 will guide and raise the film material to help the residual coolant slide off and separate from the film material.

[0032] After the coolant enters the cooling pipe 13, it will exchange heat with the cooling surface of the first thermoelectric cooler 15, thereby achieving the second cooling of the coolant. The coolant that has been cooled twice is then sprayed out through the second atomizing nozzle 11, thereby performing secondary cooling on the film material. Through two-stage cooling, the temperature of the atomized coolant sprayed out by the second atomizing nozzle 11 is lower than that of the atomized coolant sprayed out by the first atomizing nozzle 10. By using coolants with different water temperatures to perform hierarchical cooling on the film material, the cooling efficiency is high while preventing the film material from cooling too quickly and resulting in defects.

[0033] It should be noted that the temperature of the coolant can be detected by installing a temperature sensor and a controller. The controller can also control the temperature of the coolant by controlling the refrigeration effect of the thermoelectric cooler. Detecting the temperature of the coolant through the temperature sensor and the controller and controlling the thermoelectric cooler by the controller are mature existing technologies, so no further elaboration will be made here. And when the temperature of the coolant is relatively high, the controller can stop the operation of the first thermoelectric cooler 15 and then start the second thermoelectric cooler 24 to cool down the coolant, preventing the heat energy generated by the first thermoelectric cooler from continuously increasing the temperature of the coolant. The heat energy generated by the second thermoelectric cooler 24 is discharged through the heat dissipation structure 22.

[0034] The above are only the preferred embodiments of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions falling within the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for those of ordinary skill in the art, several improvements and refinements made without departing from the principle of the present invention should also be regarded as within the protection scope of the present invention.

Claims

1. A cooling device for ceiling film processing, comprising a cooling box (1), wherein the cooling box (1) is provided with a feed inlet (2) and a discharge outlet (3), characterized in that: The cooling box (1) is provided with a first cooling chamber (4), a second cooling chamber (5) and a drying chamber (6) in a direction from the feed port (2) to the discharge port (3); a plurality of support rollers (7) are provided in the first cooling chamber (4) and the second cooling chamber (5); a first water reservoir (8) and a second water reservoir (9), a first atomizing nozzle (10) and a second atomizing nozzle (11) are provided in the first cooling chamber (4) and the second cooling chamber (5); a heating tube (12) and a cooling tube (13) are provided on the cooling box (1); a mounting frame (14) is provided between the heating tube (12) and the cooling tube (13); a plurality of first refrigeration plates (15) are provided on the mounting frame (14); a plurality of first refrigeration plates (15) are provided in the drying chamber (6); The upper and lower ends of the cavity are respectively provided with a fan 1 (16) and a fan 2 (17), a connecting pipe 1 (18) and a connecting pipe 2 (19); the second water reservoir (9) is connected to the water inlet of the connecting pipe 2 (19); the water outlet of the connecting pipe 2 (19) is connected to the water inlet of the heating pipe (12); the water outlet of the heating pipe (12) is connected to the first atomizing nozzle (10); the first water reservoir (8) is connected to the water inlet of the connecting pipe 1 (18); the water outlet of the connecting pipe 1 (18) is connected to the water inlet of the cooling pipe (13); the water outlet of the cooling pipe (13) is connected to the second atomizing nozzle (11); and a driving mechanism for driving the cooling medium to circulate in accordance with the above-mentioned connection method is provided on the cooling box (1).

2. A cooling device for ceiling film processing according to claim 1, characterized in that: The connecting pipe 1 (18) and the connecting pipe 2 (19) are arranged in a circuitous manner.

3. The cooling device for ceiling film processing according to claim 1, characterized in that: Heat-conducting rings (20) are provided on both sides of the mounting frame (14), and the heat-conducting rings (20) on both sides respectively wrap the heating tube (12) and the cooling tube (13).

4. A cooling device for ceiling film processing according to claim 3, characterized in that: A cooling rack (21) is arranged on the side of the heat-conducting ring (20) close to the cooling roller, a plurality of second cooling fins (24) are arranged on the cooling rack (21), and a heat dissipation structure (22) is arranged on the side of the cooling rack (21) away from the cooling roller.

5. The cooling device for ceiling film processing according to claim 1, characterized in that: A guide roller (23) is provided at the connecting point between the first cooling chamber (4) and the second cooling chamber (5), and at the connecting point between the second cooling chamber (5) and the drying chamber (6), and the horizontal height of the guide roller (23) is higher than that of the support roller (7).

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