Protective mechanism for PCB (Printed Circuit Board) solder-resistant floating jet printing head

Abstract

The utility model belongs to the field of PCB production and processing, and particularly relates to a PCB resistance welding floating jet printing head protection mechanism which comprises a PCB and a sliding table supporting plate, a sliding rail is fixedly assembled on the sliding table supporting plate, a sliding block is movably assembled on the sliding rail, a spray head fixing plate is fixedly assembled at one end of the sliding block, assembly blocks are symmetrically and fixedly assembled on the spray head fixing plate, and the assembly blocks are movably assembled on the sliding table supporting plate. A connecting shaft rod is fixedly assembled between the assembling blocks, a rolling wheel is movably assembled on the connecting shaft rod, connecting blocks are fixedly assembled on the assembling blocks, a guide inclined plate is fixedly assembled on the two connecting blocks, and one end of the guide inclined plate is located on one side below the rolling wheel; according to the PCB resistance welding floating jet printing head protection mechanism, the problems that an existing PCB resistance welding jet printing head is fixed, a gap between a PCB and a jet head is small, and when the PCB is deformed and upwarped and the jet head horizontally moves through a sliding table supporting plate, the resistance welding jet printing head and the PCB are prone to colliding, and the jet head is damaged are solved through cooperation of the guide inclined plate and the rolling wheels.

Description

Technical Field

[0001] The utility model relates to the field of PCB production and processing, and specifically relates to a protection mechanism for a floating solder mask inkjet printing head of a PCB. Background Technique

[0002] A PCB solder mask inkjet printer is mainly used to print a solder mask on a PCB board to protect the circuit from damage, and at the same time improve the reliability and durability of the product. The working principle of the PCB solder mask inkjet printer is mainly to print the information of the electronic circuit pattern onto the PCB board through inkjet printing technology, so as to realize the printing of patterns for high-precision, high-density, multi-layer, and small-hole circuit boards. This device can not only print circuit patterns, but also realize local thermal-sensitive coating printing, directly form a solder mask, ink, etc. on the PCB, meet the requirements of high-speed and high-precision circuit pattern output, and can realize batch production, greatly reducing costs. The application scope of the PCB solder mask inkjet printer is wide, including industries such as electronics, automotive, plastics, and metals, and can be used to print solder mask on the surfaces of various objects.

[0003] However, the following problems still exist in the existing PCB solder mask inkjet printers during use:

[0004] The existing PCB solder mask inkjet printing heads are fixed, and the gap between the PCB and the printing head is relatively small. When the PCB is deformed and warped, and the printing head moves horizontally through the slide table support plate, it is easy to cause a collision between the solder mask inkjet printing head and the PCB, resulting in damage to the printing head. Therefore, it is very necessary to involve a protection mechanism for a floating solder mask inkjet printing head of a PCB in the existing PCB production and processing field. Content of the Utility Model

[0005] In order to make up for the deficiencies of the existing technology, the existing PCB solder mask inkjet printing heads are fixed, and the gap between the PCB and the printing head is relatively small. When the PCB is deformed and warped, and the printing head moves horizontally through the slide table support plate, it is easy to cause a collision between the solder mask inkjet printing head and the PCB, resulting in damage to the printing head. The utility model proposes a protection mechanism for a floating solder mask inkjet printing head of a PCB.

[0006] The technical solution adopted by the utility model to solve its technical problems is: a protection mechanism for a floating solder mask inkjet printing head of a PCB, including a PCB board, a slide table support plate, and a printing head fixing plate. Assembly blocks are symmetrically and fixedly assembled on the upper part of the printing head fixing plate. A connecting shaft rod is fixedly assembled between the assembly blocks. Rollers are movably assembled on the connecting shaft rod. Connecting blocks are fixedly assembled on the assembly blocks. A guiding inclined plate is fixedly assembled on the two connecting blocks. One end of the guiding inclined plate is located on the lower side of the roller and is close to the roller.

[0007] Preferably, a slide rail is fixedly assembled on the slide table support plate, and a slider is movably assembled on the slide rail.

[0008] Preferably, one end of the slider is fixedly assembled with the nozzle fixing plate, and the nozzle fixing plate is located on one side of the slide rail.

[0009] Preferably, a workbench is assembled at the bottom of the slide table support plate, and the PCB board is placed on the workbench.

[0010] Preferably, a connecting frame is fixedly assembled on the nozzle fixing plate, and a printing nozzle is fixedly assembled at one end of the connecting frame.

[0011] Preferably, when the PCB board is in contact with the roller, the distance between the printing nozzle and the surface of the PCB board is the same.

[0012] The beneficial effects of the present utility model are as follows:

[0013] According to the warping angle of the PCB board, when the warping angle of the PCB board is too large and the slide table support plate moves horizontally, the bottom of the guiding inclined plate is in contact with the warped part of the PCB board, and the warped part of the PCB board slides on the bottom of the guiding inclined plate until it is in contact with the bottom surface of the roller. When the warping angle of the PCB board is too small and the slide table support plate moves horizontally, the warped part of the PCB board is in contact with the bottom surface of the roller. The assembly block drives the nozzle fixing plate to move up and down on the slide rail through the slider, which is convenient for adjustment according to the situation of the PCB board, automatically keeps the gap between the printing nozzle and the PCB board fixed, enables the printing nozzle to print the solder resist on the PCB board to protect the circuit from damage, and improves the use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0015] Figure 1 It is a schematic assembly structure diagram of the PCB solder resist floating printing head and the protection mechanism of the present utility model;

[0016] Figure 2 It is a schematic structure diagram of the PCB solder resist floating printing head and the protection mechanism of the present utility model;

[0017] Figure 3 It is a schematic structure diagram of the protection mechanism of the present utility model;

[0018] Figure 4 It is a schematic cross-sectional structure diagram of the protection mechanism of the present utility model.

[0019] In the figure:

[0020] 10. Workbench; 11. PCB board; 12. Slide table support plate; 13. Slide rail;

[0021] 20. Slide block; 21. Nozzle fixing plate; 22. Connecting frame; 23. Printing nozzle;

[0022] 30. Roller; 31. Assembly block; 32. Connecting shaft rod; 33. Connecting block;

[0023] 40. Guide inclined plate. Detailed implementation mode

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] The following is a further detailed description of this application in conjunction with the attached Figures 1-4 This application will be further described in detail.

[0026] The embodiment of this application discloses a protection mechanism for a floating spray printing head for PCB solder mask. Refer to Figures 2-4 , a protection mechanism for a floating spray printing head for PCB solder mask, includes a PCB board 11 and a slide table support plate 12. A slide rail 13 is fixedly assembled on the slide table support plate 12, and a slide block 20 is movably assembled on the slide rail 13. One end of the slide block 20 is fixedly assembled with a nozzle fixing plate 21. The nozzle fixing plate 21 is located on one side of the slide rail 13. Assembly blocks 31 are symmetrically and fixedly assembled on the nozzle fixing plate 21. A connecting shaft rod 32 is fixedly assembled between the assembly blocks 31. A roller 30 is movably assembled on the connecting shaft rod 32. Connecting blocks 33 are fixedly assembled on the assembly blocks 31. A guide inclined plate 40 is fixedly assembled on the two connecting blocks 33. One end of the guide inclined plate 40 is located below and on one side of the roller 30, and the guide inclined plate 40 is close to the roller 30. According to the warping angle of the PCB board 11, when the warping angle of the PCB board 11 is too large and the slide table support plate 12 moves horizontally, the bottom of the guide inclined plate 40 fits with the warped part of the PCB board 11, and the warped part of the PCB board 11 slides on the bottom of the guide inclined plate 40 until it fits with the bottom surface of the roller 30. When the warping angle of the PCB board 11 is too small and the slide table support plate 12 moves horizontally, the warped part of the PCB board 11 fits with the bottom surface of the roller 30, so that the assembly block 31 drives the nozzle fixing plate 21 to move up and down on the slide rail 13 through the slide block 20, facilitating adjustment according to the situation of the PCB board 11.

[0027] Refer to Figure 1 and Figure 2, a workbench 10 is assembled at the bottom of the slide table support plate 12, a PCB board 11 is placed on the workbench 10, a connecting frame 22 is fixedly assembled on the nozzle fixing plate 21, and a printing nozzle 23 is fixedly assembled at one end of the connecting frame 22. When the PCB board 11 is deformed and warped, the guiding inclined plate 40 and the roller 30 drive the printing nozzle 23 to float up and down, automatically keeping the gap between the printing nozzle 23 and the PCB board 11 fixed, which is convenient for the printing nozzle 23 to print the solder resist on the PCB board 11 to protect the circuit from damage and improve the use effect.

[0028] Working principle: According to the warping angle of the PCB board 11, when the warping angle of the PCB board 11 is too large, when the slide table support plate 12 moves horizontally, the bottom of the guiding inclined plate 40 fits with the warped part of the PCB board 11, and the warped part of the PCB board 11 slides on the bottom of the guiding inclined plate 40 until it fits with the bottom surface of the roller 30. When the warping angle of the PCB board 11 is too small, when the slide table support plate 12 moves horizontally, the warped part of the PCB board 11 fits with the bottom surface of the roller 30, so that the assembly block 31 drives the nozzle fixing plate 21 to move up and down through the slider 20 on the slide rail 13, which is convenient for adjustment according to the situation of the PCB board 11, automatically keeping the gap between the printing nozzle 23 and the PCB board 11 fixed, so that the printing nozzle 23 prints the solder resist on the PCB board 11 to protect the circuit from damage and improve the use effect.

[0029] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A PCB solder mask floating print head protection mechanism, characterized in that: The nozzle fixing plate (21) comprises a PCB board (11), a slide support plate (12) and a nozzle fixing plate (21), wherein the nozzle fixing plate (21) is symmetrically fixedly mounted with assembly blocks (31), a connecting shaft (32) is fixedly mounted between the assembly blocks (31), a roller (30) is movably mounted on the connecting shaft (32), a connecting block (33) is fixedly mounted on each assembly block (31), a guide inclined plate (40) is fixedly mounted on the two connecting blocks (33), one end of the guide inclined plate (40) is located below one side of the roller (30), and the guide inclined plate (40) is close to the roller (30).

2. A PCB solder resist floating print head protection mechanism according to claim 1, characterized in that: A slide rail (13) is fixedly mounted on the slide platform support plate (12), and a slider (20) is movably mounted on the slide rail (13).

3. A PCB solder resist floating print head protection mechanism according to claim 2, characterized in that: One end of the sliding block (20) is fixedly assembled with a nozzle fixing plate (21), and the nozzle fixing plate (21) is located on one side of the slide rail (13).

4. A PCB solder resist floating print head protection mechanism according to claim 1, characterized in that: A workbench (10) is mounted on the bottom of the slide support plate (12), and a PCB board (11) is placed on the workbench (10).

5. A PCB solder resist floating print head protection mechanism according to claim 1, characterized in that: A connecting frame (22) is fixedly mounted on the nozzle fixing plate (21), and a printing nozzle (23) is fixedly mounted on one end of the connecting frame (22).

6. A PCB solder resist floating print head protection mechanism according to claim 5, characterized in that: When the surface of the PCB board (11) is attached to the roller (30), the distance between the print head (23) and the surface of the PCB board (11) is the same.

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