Temperature monitoring module and semiconductor manufacturing equipment

Abstract

The utility model provides a temperature monitoring module and semiconductor manufacturing equipment. The temperature monitoring module comprises a monitoring unit, a storage unit and a communication unit, the monitoring unit and the storage unit are arranged on a wafer; the communication unit is located in the semiconductor machine table, and the wafer is connected with the communication unit before monitoring is started or after monitoring is finished; and the communication unit is in communication connection with an external machine table and is used for transmitting temperature data to the external machine table so as to compare the temperature data with temperature data measured by a temperature sensor in the semiconductor machine table. According to the configuration, the communication unit is arranged in the semiconductor machine table, so that the temperature monitoring module can complete information interaction in the machine table, and normal operation of the machine table is not affected; meanwhile, the temperature data measured by the monitoring unit is compared with the temperature data measured by the temperature sensor in the machine table, a mutual monitoring mechanism between the monitoring unit and the temperature sensor is formed, and the accuracy of measuring the temperature of the hot plate is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a temperature monitoring module and a semiconductor manufacturing device. Background Art

[0002] In the semiconductor manufacturing process, the stability and uniformity of the hot plate temperature of the coating and developing equipment will greatly affect the uniformity of the photoresist thickness on the substrate. The monitoring of the hot plate temperature is usually measured by manually holding a thermometer. This method is inefficient and prone to human error, affecting the product yield and the production efficiency of the equipment.

[0003] Subsequently, a temperature sensor is embedded on the silicon wafer and used in conjunction with a memory. The temperature data measured by the temperature sensor is recorded in the memory. By introducing the above silicon wafer into the machine tool and participating in a complete production run, the change of temperature data is recorded. Although the above solution can accurately record the temperature data, during the monitoring process, the production run of the equipment needs to be stopped, affecting the normal operation of the machine tool.

[0004] Based on this, how to improve the accuracy of temperature monitoring and not affect the normal operation of the machine tool has become a technical problem that needs to be solved by those skilled in the art. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a temperature monitoring module and a semiconductor manufacturing device to solve the problems of low accuracy in monitoring the hot plate temperature and affecting the normal operation of the machine tool in the prior art.

[0006] To achieve the above purpose, the utility model provides a temperature monitoring module, including: a monitoring unit, a storage unit, and a communication unit;

[0007] Both the monitoring unit and the storage unit are arranged on the wafer. The monitoring unit is used to obtain the temperature data of the hot plate, and the storage unit is used to store the temperature data measured by the monitoring unit;

[0008] The communication unit is located inside the semiconductor machine tool. Before starting monitoring or after ending monitoring, the wafer is connected to the communication unit to realize the information interaction between the storage unit and the communication unit;

[0009] The communication unit is communicatively connected to an external machine tool and is used to transmit temperature data to the external machine tool for comparison with the temperature data measured by the temperature sensor inside the semiconductor machine tool.

[0010] Optionally, an interaction station is provided inside the semiconductor machine tool, and the communication unit is arranged on the interaction station;

[0011] When the semiconductor machine is operating normally, the wafer is located at the interaction station and connected to the communication unit; during the production gap of the semiconductor machine and / or at preset time intervals, the wafer starts from the interaction station, moves along the production path of the semiconductor machine, and returns to the interaction station.

[0012] The monitoring unit is communicatively connected to the storage unit. During the movement of the wafer, the monitoring unit acquires the temperature data of the hot plate and stores it in the storage unit.

[0013] Optionally, the temperature monitoring module further includes a logic unit, which is communicatively connected to the communication unit.

[0014] The logic unit is configured to compare the temperature data measured by the monitoring unit with the temperature data measured by the temperature sensor, and determine whether the difference is within a preset range.

[0015] Optionally, the temperature monitoring module further includes a power supply, which is integrally arranged on the wafer with the storage unit. The power supply is electrically connected to the monitoring unit and is used to supply electrical energy to the monitoring unit.

[0016] Optionally, a receiving cavity is provided on the surface of the wafer, and the power supply and the storage unit are integrally arranged in the receiving cavity.

[0017] Optionally, a charging interface is provided on the communication unit. When the wafer is at the interaction station, the communication unit charges the power supply through the charging interface.

[0018] Optionally, an interaction interface is provided on the communication unit. When the wafer is at the interaction station, the communication unit performs information interaction with the storage unit through the interaction interface.

[0019] Optionally, a plurality of monitoring units are provided, and the plurality of monitoring units are evenly distributed on the surface of the wafer.

[0020] Optionally, the monitoring unit is embedded in the surface of the wafer.

[0021] To achieve the above object, the present invention further provides a semiconductor manufacturing device, including: a semiconductor machine and the temperature monitoring module as described above.

[0022] The temperature monitoring module is arranged inside the semiconductor machine, and the monitoring unit is used to acquire temperature data; a temperature sensor is provided in the semiconductor machine. By comparing the temperature data acquired by the monitoring unit with the temperature data acquired by the temperature sensor, the measurement accuracy of the temperature sensor is ensured.

[0023] Compared with the existing temperature monitoring system, the temperature monitoring module and the semiconductor manufacturing equipment provided by this application have the following advantages:

[0024] In the temperature monitoring module provided by this application, by setting the communication unit inside the semiconductor machine tool, after the monitoring unit measures the temperature data, information interaction can be completed inside the machine tool without the need to exit the machine tool, and it also enables the machine tool not to stop running goods, without affecting the normal operation of the machine tool. At the same time, the temperature data measured by the monitoring unit is transmitted to the external machine tool through the communication unit and compared with the temperature data measured by the temperature sensor inside the machine tool, thus forming a mutual monitoring mechanism between the monitoring unit and the temperature sensor, which can promptly detect problems when the temperature sensor fails, improving the accuracy of hot plate temperature measurement, and further ensuring the quality of wafer film formation.

[0025] Furthermore, by setting a logic unit to compare whether the difference between the temperature data measured by the monitoring unit and the temperature data measured by the temperature sensor is within a preset range, problems in temperature measurement can be promptly detected, and then the temperature sensor in the machine tool can be adjusted to avoid a large number of defective wafers, improving the product yield rate and correspondingly reducing the production cost.

[0026] In the semiconductor manufacturing equipment provided by this application, by using the above temperature monitoring module, during the entire process of monitoring the hot plate temperature, there is no need to exit the semiconductor machine tool, and thus the monitoring of hot plate temperature measurement can be completed without affecting the normal operation of the semiconductor machine tool. At the same time, by comparing the data measured by the monitoring unit with the data measured by the temperature sensor, a mutual monitoring mechanism is formed, improving the accuracy of temperature measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic structural diagram of the temperature monitoring module provided by an embodiment of the present utility model;

[0028] Figure 2 It is a schematic structural diagram of a wafer provided by an embodiment of the present utility model;

[0029] Figure 3 It is a schematic diagram of the transmission relationship of the communication unit provided by an embodiment of the present utility model.

[0030] Among them, the descriptions of the reference numerals are as follows:

[0031] 1 - Wafer; 11 - Monitoring unit; 12 - Storage unit; 13 - Power supply; 14 - Accommodation cavity; 15 - Support point;

[0032] 2 - Communication unit; 21 - Charging interface; 22 - Interaction interface;

[0033] 3 - Semiconductor machine tool. Detailed implementation manners

[0034] To make the objectives, advantages and features of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the objectives of the embodiments of the present utility model. In addition, the structures shown in the accompanying drawings are often a part of the actual structures. In particular, the accompanying drawings need to show different emphases, and sometimes different scales will be used.

[0035] As used in this specification, the singular forms "a", "an" and "the" include plural objects. The term "or" is generally used in the sense of including "and / or". The term "several" is generally used in the sense of including "at least one". The term "at least two" is generally used in the sense of including "two or more". In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third" may explicitly or implicitly include one or at least two of such features. "One end" and "the other end" as well as "the proximal end" and "the distal end" generally refer to two corresponding parts, which not only include the endpoints. The terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected, or indirectly connected through an intermediate medium. It may be the internal communication of two components or the interaction relationship between two components. In addition, as used in this specification, when an element is provided on another element, it generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the two elements may be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, an element may be inside, outside, above, below or on one side of another element, etc. in any orientation, unless otherwise clearly specified in the content. The terms "upper", "lower", "top", "bottom" are generally relative position relationships arranged in the direction of gravity; the terms "vertical, vertical direction" generally refer to the direction along the gravity direction, which is generally perpendicular to the ground. The "horizontal, horizontal plane direction" is generally along the direction parallel to the ground; for those of ordinary skill in the art, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0036] The objective of the present utility model is to provide a temperature monitoring module and a semiconductor manufacturing device, so as to solve the problems in the prior art that the accuracy of hot plate temperature monitoring is relatively low and it affects the normal operation of the machine.

[0037] In this embodiment, a coating and developing machine tool in semiconductor manufacturing processes is taken as an example. Those skilled in the art can understand that the coating and developing machine tool can be used in cooperation with an exposure machine tool to complete the whole process from coating to developing. Among them, as an important component in the coating and developing machine tool, the hot plate participates in the following steps during the process from coating to developing. First, the hot plate is used to perform soft baking on the substrate after coating the photoresist to remove the solvent and increase the viscosity of the photoresist. Secondly, after exposure, the hot plate is used for the post-exposure bake (PEB) process to further expel the residual solvent, stabilize the structure of the photoresist, and reduce the occurrence of deformation or blurring after exposure. Finally, after developing, the hot plate is used for hard baking to enhance the corrosion resistance of the photoresist. Therefore, the temperature uniformity on the hot plate will directly affect the product yield. Although temperature sensors are provided in the coating and developing machine tool, a monitoring mechanism still needs to be provided to monitor the measurement accuracy of the temperature sensors, improve the reliability of the measured temperature data, and further ensure the product yield. However, the existing monitoring mechanisms either rely on manual measurement, which cannot guarantee accuracy, or obtain data by running wafers with monitoring devices around the machine tool. Although this method can guarantee the accuracy of the data, it requires the machine tool to stop running, affecting the normal operation of the machine tool. Based on this, this embodiment provides a temperature monitoring module and a semiconductor manufacturing device. By adding a communication unit inside the machine tool, the monitoring unit can complete information interaction inside the machine tool without the need to exit the machine tool, and the machine tool does not need to stop running, without affecting the normal operation of the machine tool, ensuring both measurement accuracy and improving the production efficiency of the machine tool.

[0038] Please refer to Figures 1 to 3, the present utility model provides a temperature monitoring module, including: a monitoring unit 11, a storage unit 12, and a communication unit 2; both the monitoring unit 11 and the storage unit 12 are disposed on the wafer 1. The monitoring unit 11 is used to obtain the temperature data of the hot plate, and the storage unit 12 is used to store the temperature data measured by the monitoring unit 11; the communication unit 2 is located inside the semiconductor machine tool 3. Before starting monitoring or after ending monitoring, the wafer 1 is connected to the communication unit 2 to realize the information interaction between the storage unit 12 and the communication unit 2; the communication unit 2 is communicatively connected to an external machine tool and is used to transmit the temperature data to the external machine tool for comparison with the temperature data measured by the temperature sensor inside the semiconductor machine tool 3. It should be noted that in this embodiment, the monitoring unit 11 can be a temperature sensor, for example, it can be an RTD PT100 temperature probe, whose temperature probe is fixed on the surface of the wafer 1 and protrudes outward to measure the temperature of the hot plate at the corresponding position. The storage unit 12 can be a storage chip with a transmission interface, for example, it can be a 433M co-packaged chip, which is communicatively connected to the monitoring unit 11 to transmit the measured temperature data to the storage unit 12 for storage. The communication unit 2 can be a data transmission device, for example, it can be a DTD110H signal transmitter, which can be provided with a mobile communication module and / or a radio frequency transceiver module. For the requirement of a long communication distance, the mobile communication module can be used for data transmission; for the requirement of a short communication distance and high real-time performance, the radio frequency transceiver module can be used for data transmission; or the data can also be transmitted to the internal system through a Failure Data Collection (FDC) device for the operator to view. At the same time, a transmission member (not shown in the figure, which can be a transmission pin) is provided on the wafer 1. When the wafer 1 is in contact with the communication unit 2, data interaction between the communication unit 2 and the storage unit 12 is realized through the connection between the transmission member and the transmission interface. In addition, the wafer 1 with the monitoring unit 11 and the storage unit 12 attached can be a previously scrapped problem wafer 1, which is only disposed inside the machine tool to implement the monitoring mechanism without participating in the normal production process.

[0039] With such a configuration, by disposing the communication unit 2 inside the semiconductor machine tool 3, after the monitoring unit 11 measures the temperature data, information interaction can be completed inside the machine tool without the need to exit the machine tool, and it also enables the machine tool not to stop running goods, without affecting the normal operation of the machine tool; at the same time, the temperature data measured by the monitoring unit 11 is transmitted to the external machine tool through the communication unit 2 and compared with the temperature data measured by the temperature sensor inside the machine tool, thus forming a mutual monitoring mechanism between the monitoring unit 11 and the temperature sensor, which can promptly detect when the temperature sensor has problems, improving the accuracy of the hot plate temperature measurement, and further ensuring the quality of the film formation on the wafer 1.

[0040] As an alternative embodiment, please refer to Figures 1 to 2, an interaction station (not shown in the figure) is provided inside the semiconductor machine tool 3, and the communication unit 2 is arranged on the interaction station; when the semiconductor machine tool 3 is operating normally, the wafer 1 is located at the interaction station and is connected to the communication unit 2; during the production gap of the semiconductor machine tool 3, and / or at preset time intervals, the wafer 1 starts from the interaction station, moves along the production path of the semiconductor machine tool 3, and returns to the interaction station; the monitoring unit 11 is communicatively connected to the storage unit 12. During the movement of the wafer 1, the monitoring unit 11 acquires the temperature data of the hot plate and stores it in the storage unit 12. It should be noted that when the semiconductor machine tool 3 is operating normally and the wafer 1 is being temperature monitored, the communication unit 2 always remains at the interaction station and does not move with the wafer 1. And when the semiconductor machine tool 3 is operating normally, the wafer 1 is always in contact with the communication unit 2 and they are both at the interaction station. The wafer 1 can move along the production path of the semiconductor machine tool 3 (i.e., the running goods path of the semiconductor machine tool 3) during the production gap of the semiconductor machine tool 3 (such as after completing a batch of production or producing a predetermined number of wafers 1), or at preset time intervals (such as 30 minutes or 1 hour). During this period, the monitoring unit 11 acquires the corresponding temperature data at a predetermined position and promptly transmits it to the storage unit 12 for storage. After moving one circle and returning to the interaction station, it is connected to the communication unit 2 to realize data interaction between the storage unit 12 and the communication unit 2. Of course, in some other embodiments, the movement interval of the wafer 1 can also be set by the operator according to the on-site situation for the corresponding monitoring interval. If there is a large deviation from the measurement data of the temperature sensor built in the semiconductor machine tool 3, the monitoring frequency can be increased by reducing the monitoring interval; if the deviation is small, the monitoring frequency can be reduced. At the same time, in this embodiment, the operator only needs to insert the wafer 1 with the monitoring unit into the production queue through the control system of the semiconductor machine tool 3 to achieve monitoring. Since the communication unit 2 is also arranged inside the machine tool and there is no need to leave the machine tool for data transmission, the above temperature monitoring module can monitor the temperature of the hot plate without affecting the normal operation of the semiconductor machine tool 3 at all.

[0041] Please refer to Figure 1 and Figure 3, the temperature monitoring module further includes a logic unit, which is communicatively connected to the communication unit 2; the logic unit is configured to: compare the temperature data measured by the monitoring unit 11 with the temperature data measured by the temperature sensor, and determine whether the difference is within a preset range. It should be noted that the logic unit can be set in an external device, such as the control terminal of the semiconductor machine 3, or on the operator's working device. The logic unit can be integrated on an internal chip or configured as an APP, such as the EAMic device management system, which can compare the temperature data of the monitoring unit 11 and the temperature sensor built in the machine and form a difference. At the same time, the temperature monitoring module can also introduce an alarm mechanism to cooperate with the logic unit. When the temperature data measured by the monitoring unit 11 deviates greatly from the temperature data measured by the temperature sensor built in the machine, for example, exceeding a certain temperature threshold (the temperature threshold can be comprehensively selected based on the measurement accuracy of the sensor and the previous temperature deviation data), an alarm signal is generated to remind the operator to perform corresponding processing. The alarm signal can be a sound signal, and / or a light signal, or an APP prompt signal, etc. Those skilled in the art can configure this according to the actual situation.

[0042] In an alternative embodiment, please refer to Figure 2 , the temperature monitoring module further includes a power supply 13. The power supply 13 and the storage unit 12 are integrally arranged on the wafer 1. The power supply 13 is electrically connected to the monitoring unit 11 and is used to supply electrical energy to the monitoring unit 11. Further, a receiving cavity 14 is provided on the surface of the wafer 1, and the power supply 13 and the storage unit 12 are integrally arranged in the receiving cavity 14. It should be noted that please refer to Figure 2 , in this embodiment, the power supply 13 can be a rechargeable battery, which is connected to the monitoring unit 11 through a charging cable to supply electrical energy to the monitoring unit 11; at the same time, a rectangular receiving cavity 14 is provided on the surface of the wafer 1, and both the power supply 13 and the storage unit 12 are arranged in the receiving cavity 14. The connection relationship between them can be that the power supply 13 is embedded in the receiving cavity 14 and the storage unit 12 is inserted on the side wall of the receiving cavity 14, or the power supply 13 and the storage unit 12 are integrated into one body to form a memory with a charging function, and the above-mentioned memory is arranged in the receiving cavity 14. Those skilled in the art can reasonably configure the power supply 13 and the storage unit 12 according to the actual situation, and this embodiment does not limit this.

[0043] Please refer to Figure 1 , in an alternative embodiment, a charging interface 21 is provided on the communication unit 2. When the wafer 1 is at the interaction station, the communication unit 2 charges the power supply 13 through the charging interface 21. Further, an interaction interface 22 is provided on the communication unit 2. When the wafer 1 is at the interaction station, the communication unit 2 performs information interaction with the storage unit 12 through the interaction interface 22. It should be noted that in Figure 1In the illustrated exemplary embodiment, a charging interface 21 and an interaction interface 22 are provided on the communication unit 2, and charging pins (not shown in the figure) and interaction pins (not shown in the figure) are respectively provided on the wafer 1. When the wafer 1 moves to the interaction station and comes into contact with the communication unit 2, the charging pins are inserted into the charging interface 21, and the communication unit 2 charges the power supply 13 through the charging pins; correspondingly, the interaction pins are inserted into the interaction interface 22, and the communication unit 2 realizes information interaction with the storage unit 12 through the interaction pins. In another embodiment, the pins may also be provided on the communication unit 2, and correspondingly, the interfaces are provided on the wafer 1; or, the connection between the communication unit 2 and the wafer 1 may also be realized by means such as Bluetooth, wireless communication, etc., and this embodiment does not limit this. As an alternative embodiment, taking Figure 1 as an example, only a part of the wafer 1 overlaps on the communication unit 2. Therefore, support points 15 can be provided on the surface of the wafer 1 that is not in contact with the communication unit 2, and the support member (which can be a bracket or other member with a support function) supports the wafer 1 through the support points 15. Of course, in some other embodiments, the wafer 1 may also completely overlap on the communication unit 2, or the central part of the wafer 1 overlaps on the communication unit 2 so that the wafer 1 can maintain balance. In the above cases, the support points 15 may not be provided on the wafer 1.

[0044] Please refer to Figure 2 , in an alternative embodiment, a plurality of monitoring units 11 are provided, and the plurality of monitoring units 11 are evenly distributed on the surface of the wafer 1. Further, the monitoring unit 11 is embedded in the surface of the wafer 1. It should be noted that, in Figure 1 the illustrated exemplary embodiment, eight monitoring units 11 are provided, and they are evenly distributed on the surface of the wafer 1. Each dot represents the probe of a temperature sensor. Four probes are located on the circumference farther from the center of the wafer 1, and the other four probes are provided on the circumference closer to the center of the wafer 1. In other embodiments, a plurality of probes may also be provided on the same circumference, or a plurality of probes are respectively provided on different circumferences regularly. Those skilled in the art can reasonably configure the arrangement positions of the probes according to different process nodes.

[0045] In another embodiment, please refer to Figure 3, the present utility model further provides a semiconductor manufacturing device, including: a semiconductor machine table 3 and the temperature monitoring module as described above; the temperature monitoring module is disposed inside the semiconductor machine table 3, and the monitoring unit 11 is used to obtain temperature data; a temperature sensor is disposed in the semiconductor machine table 3, and by comparing the temperature data obtained by the monitoring unit 11 with the temperature data obtained by the temperature sensor, the measurement accuracy of the temperature sensor is ensured. With such a configuration, during the entire process of monitoring the hot plate temperature by using the above temperature monitoring module, it is not necessary to exit the semiconductor machine table 3, and thus the monitoring of the hot plate temperature measurement can be completed without affecting the normal operation of the semiconductor machine table 3; at the same time, by comparing the data measured by the monitoring unit 11 with the data measured by the temperature sensor, a mutual monitoring mechanism is formed, improving the accuracy of temperature measurement.

[0046] In summary, in the temperature monitoring module and the semiconductor manufacturing device provided by the embodiments of the present utility model, the temperature monitoring module includes: a monitoring unit, a storage unit, and a communication unit; both the monitoring unit and the storage unit are disposed on the wafer, the monitoring unit is used to obtain the temperature data of the hot plate, and the storage unit is used to store the temperature data measured by the monitoring unit; the communication unit is located inside the semiconductor machine table, and the wafer is connected to the communication unit before starting monitoring or after ending monitoring to realize information interaction between the storage unit and the communication unit; the communication unit is communicatively connected to an external machine table and is used to transmit the temperature data to the external machine table for comparison with the temperature data measured by the temperature sensor inside the semiconductor machine table.

[0047] With such a configuration, by disposing the communication unit inside the semiconductor machine table, after the monitoring unit measures the temperature data, information interaction can be completed inside the machine table without the need to exit the machine table, and it also enables the machine table not to stop running goods and does not affect the normal operation of the machine table; at the same time, the temperature data measured by the monitoring unit is transmitted to the external machine table through the communication unit and compared with the temperature data measured by the temperature sensor inside the machine table, thereby forming a mutual monitoring mechanism between the monitoring unit and the temperature sensor, which can timely detect problems when the temperature sensor fails, improving the accuracy of hot plate temperature measurement and thus ensuring the quality of wafer film formation.

[0048] Further, by setting a logic unit to compare whether the difference between the temperature data measured by the monitoring unit and the temperature data measured by the temperature sensor is within a preset range, problems in temperature measurement can be timely detected, and then the temperature sensor in the machine table can be adjusted to avoid a large number of defective wafers, improving the product yield and correspondingly reducing the production cost.

[0049] Further, by using the above temperature monitoring module, during the entire process of monitoring the hot plate temperature, it is not necessary to exit the semiconductor machine tool. Therefore, the monitoring of the hot plate temperature measurement can be completed without affecting the normal operation of the semiconductor machine tool. At the same time, by comparing the data measured by the monitoring unit with the data measured by the temperature sensor, a mutual monitoring mechanism is formed, improving the accuracy of temperature measurement.

[0050] The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention in any way. Any changes and modifications made by those of ordinary skill in the field of the present invention according to the above disclosure are within the scope of protection of the claims.

Claims

1. A temperature monitoring module, characterized in that: include: A monitoring unit, a storage unit, and a communication unit; The monitoring unit and the storage unit are both arranged on the wafer, the monitoring unit is used to obtain the temperature data of the hot plate, and the storage unit is used to store the temperature data measured by the monitoring unit; The communication unit is located inside the semiconductor machine, and the wafer is connected to the communication unit before starting monitoring or after completing monitoring to achieve information exchange between the storage unit and the communication unit; The communication unit is connected to an external machine for transmitting temperature data to the external machine for comparison with temperature data measured by a temperature sensor inside the semiconductor machine.

2. The temperature monitoring module according to claim 1, characterized in that: An interactive station is provided inside the semiconductor machine, and the communication unit is arranged on the interactive station; When the semiconductor machine is operating normally, the wafer is located at the interactive station and connected to the communication unit; during the production interval of the semiconductor machine and / or at a preset time interval, the wafer starts from the interactive station, moves along the production path of the semiconductor machine, and returns to the interactive station; The monitoring unit is in communication connection with the storage unit. During the movement of the wafer, the monitoring unit obtains temperature data of the hot plate and stores the data in the storage unit.

3. The temperature monitoring module according to claim 2, characterized in that: The temperature monitoring module further includes a logic unit, and the logic unit is communicatively connected with the communication unit; The logic unit is configured to compare the temperature data measured by the monitoring unit with the temperature data measured by the temperature sensor, and determine whether the difference is within a preset interval.

4. The temperature monitoring module according to claim 2, characterized in that: The temperature monitoring module also includes a power supply, which is integrated with the storage unit on the wafer, and is electrically connected to the monitoring unit to provide electrical energy to the monitoring unit.

5. The temperature monitoring module according to claim 4, characterized in that: A receiving cavity is arranged on the surface of the wafer, and the power source and the storage unit are integrated in the receiving cavity.

6. The temperature monitoring module according to claim 4, characterized in that: The communication unit is provided with a charging interface, and when the wafer is located at the interactive station, the communication unit charges the power supply through the charging interface.

7. The temperature monitoring module according to claim 2, characterized in that: The communication unit is provided with an interaction interface, and when the wafer is located at the interaction station, the communication unit performs information interaction with the storage unit through the interaction interface.

8. The temperature monitoring module according to claim 1, characterized in that: A plurality of monitoring units are provided, and the plurality of monitoring units are evenly distributed on the surface of the wafer.

9. The temperature monitoring module according to claim 8, characterized in that: The monitoring unit is embedded in the surface of the wafer.

10. A semiconductor manufacturing equipment, characterized in that: include: A semiconductor machine and a temperature monitoring module as claimed in any one of claims 1 to 9; The temperature monitoring module is arranged inside the semiconductor machine, and the monitoring unit is used to obtain temperature data; a temperature sensor is arranged in the semiconductor machine, and the temperature data obtained by the monitoring unit is compared with the temperature data obtained by the temperature sensor to ensure the measurement accuracy of the temperature sensor.

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