Water-cooled radiator

Abstract

The utility model relates to the technical field of radiators, in particular to a water-cooled radiator which comprises a radiating assembly, a water cooling assembly and a liquid pump, a water outlet copper pipe and a water supply copper pipe are arranged between the radiating assembly and the water cooling assembly, and the liquid pump is arranged on the water supply copper pipe. The heat dissipation assembly comprises heat dissipation fins, an aluminum base and a plurality of sets of copper pipes, the copper pipes are embedded in the bottom of the aluminum base at equal intervals, the bottoms of the copper pipes are planes, and the planes are flush with the aluminum base. By means of the assembly composed of the heat dissipation assembly, the water cooling assembly and the liquid pump, use of electronic components such as a processor and a display card is achieved, a set of water cooling type radiator structure is provided, cooling water can be directly conveyed to the positions of the electronic components, the electronic components can be well cooled, and the service life of the electronic components is prolonged. And meanwhile, the semiconductor refrigeration structure and the fins are matched to actively cool the cooling water, so that the cooling water can continuously keep a relatively high cooling effect, and the working stability of the electronic element is better.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, and particularly relates to a water-cooled radiator. Background Art

[0002] A radiator is an indispensable component in a computer. It ensures the stable operation of electronic components by effectively dissipating heat, preventing performance degradation or damage caused by overheating, and is an important auxiliary component for processors and graphics cards.

[0003] The inefficiency of the existing single fin or fan in cooling and dissipating heat of electronic components, and the inability to actively refrigerate and assist in cooling, result in the difficulty for electronic components to maintain a stable temperature during high-power operation, causing problems for electronic components to better exert their own performance. Therefore, a water-cooled radiator is proposed to provide a water-cooled radiator structure for the use of electronic components such as processors and graphics cards. The cooling water can be directly delivered to the position of the electronic components, enabling the electronic components to be better cooled. At the same time, the combination of a semiconductor refrigeration structure and fins actively cools the cooling water, enabling the cooling water to continuously maintain a high cooling effect and making the operation of the electronic components more stable. Summary of the Utility Model

[0004] Aiming at the problems in the prior art, the utility model provides a water-cooled radiator to provide a water-cooled radiator structure for the use of electronic components such as processors and graphics cards. The cooling water can be directly delivered to the position of the electronic components, enabling the electronic components to be better cooled. At the same time, the combination of a semiconductor refrigeration structure and fins actively cools the cooling water, enabling the cooling water to continuously maintain a high cooling effect and making the operation of the electronic components more stable.

[0005] The technical solution adopted by the utility model to solve its technical problems is a water-cooled radiator, which includes a heat dissipation component, a water-cooling component and a liquid pump. An outlet copper pipe and a water supply copper pipe are arranged between the heat dissipation component and the water-cooling component, and the liquid pump is arranged on the water supply copper pipe.

[0006] The heat dissipation component includes heat dissipation fins, an aluminum base and several groups of copper pipes. The several groups of copper pipes are equidistantly embedded at the bottom of the aluminum base, and the bottom of the copper pipe is a plane, which is flush with the aluminum base.

[0007] By adopting the above technical solution, through the components composed of the heat dissipation component, the water-cooling component and the liquid pump, a water-cooled radiator structure is provided for the use of electronic components such as processors and graphics cards. The cooling water can be directly delivered to the position of the electronic components, enabling the electronic components to be better cooled. At the same time, the combination of a semiconductor refrigeration structure and fins actively cools the cooling water, enabling the cooling water to continuously maintain a high cooling effect and making the operation of the electronic components more stable.

[0008] Specifically, both ends of the copper tube penetrate through the top ends of both ends of the heat dissipation fins, and one end of the copper tube is a water outlet joint, and the other end is a water inlet joint.

[0009] Specifically, the water cooling assembly includes a lower aluminum plate, an upper aluminum plate and a U-shaped copper tube. The U-shaped copper tube is embedded between the lower aluminum plate and the upper aluminum plate. The corners between the lower aluminum plate and the upper aluminum plate are fixed by bolts, and the water inlet end and the water outlet end of the U-shaped copper tube penetrate outside the lower aluminum plate and the upper aluminum plate.

[0010] By adopting the above technical solution, water cooling of the fin area is achieved through the water cooling assembly.

[0011] Specifically, a semiconductor refrigeration sheet is embedded in the top of the upper aluminum plate. The refrigeration end of the semiconductor refrigeration sheet is in contact with the upper aluminum plate. A suction fan is arranged at the heat dissipation end of the semiconductor refrigeration sheet, and the casing of the suction fan is installed on the upper aluminum plate by bolts.

[0012] By adopting the above technical solution, active refrigeration is achieved through the semiconductor refrigeration sheet to improve the cooling effect on electronic components.

[0013] Specifically, both ends of the water outlet copper tube are respectively connected to the water outlet joint and the water inlet end of the U-shaped copper tube. Both ends of the water supply copper tube are respectively connected to the water inlet joint and the liquid outlet end of the liquid pump. The liquid inlet end of the liquid pump is connected to the water outlet end of the U-shaped copper tube.

[0014] The U-shaped copper tube, the water outlet copper tube, the water supply copper tube and the copper tube are filled with cooling water.

[0015] By adopting the above technical solution, the cooling water is circulated by the liquid pump.

[0016] The beneficial effects of the present utility model: Through the assembly composed of the heat dissipation assembly, the water cooling assembly and the liquid pump, a water cooling type radiator structure is provided for the use of electronic components such as processors and graphics cards. The cooling water can be directly delivered to the position of the electronic components, so that the electronic components can be better cooled. At the same time, the semiconductor refrigeration structure and the fins cooperate to actively cool the cooling water, so that the cooling water can continuously maintain a high cooling effect, making the operation of the electronic components more stable. It solves the problems of low efficiency of cooling and heat dissipation of electronic components by existing single fins or fans, and the inability to actively refrigerate and assist in cooling, resulting in difficulty for electronic components to maintain a stable temperature during high-power operation and affecting the performance of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present utility model will be further described below with reference to the drawings and embodiments.

[0018] Figure 1 It is a schematic diagram of the whole of the present utility model;

[0019] Figure 2 Schematic top view of the heat dissipation component of the present utility model;

[0020] Figure 3 Schematic bottom view of the heat dissipation component of the present utility model;

[0021] Figure 4 Schematic diagram of the water cooling component of the present utility model;

[0022] In the figure: 1. Heat dissipation component; 11. Heat dissipation fins; 12. Aluminum base; 13. Copper pipe; 14. Water outlet joint; 15. Water inlet joint; 16. Plane; 2. Water cooling component; 21. Lower aluminum plate; 22. Upper aluminum plate; 23. U-shaped copper pipe; 24. Semiconductor refrigeration sheet; 25. Exhaust fan; 3. Water outlet copper pipe; 4. Water supply copper pipe; 5. Liquid pump. Specific embodiments

[0023] In order to make the technical means, creative features, achieved purposes and functions realized by the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0024] To improve the cooling effect, as Figures 1-4 shown, a water-cooled radiator of the present utility model includes a heat dissipation component 1, a water cooling component 2 and a liquid pump 5. An outlet copper pipe 3 and a water supply copper pipe 4 are arranged between the heat dissipation component 1 and the water cooling component 2, and the liquid pump 5 is arranged on the water supply copper pipe 4;

[0025] The heat dissipation component 1 includes heat dissipation fins 11, an aluminum base 12 and several groups of copper pipes 13. The several groups of copper pipes 13 are embedded in the bottom of the aluminum base 12 at equal distances, and the bottom of the copper pipe 13 is a plane 16, and the plane 16 is flush with the aluminum base 12.

[0026] During use, the components composed of the heat dissipation component 1, the water cooling component 2 and the liquid pump 5 are used to provide a water-cooled radiator structure for the use of electronic components such as processors and graphics cards. The cooling water can be directly delivered to the position of the electronic components, so that the electronic components can be better cooled. At the same time, the semiconductor refrigeration structure and the fins cooperate to actively cool the cooling water, so that the cooling water can continuously maintain a high cooling effect and make the operation of the electronic components more stable.

[0027] Both ends of the copper pipe 13 penetrate through the top ends of both ends of the heat dissipation fins 11, and one end of the copper pipe 13 is a water outlet joint 14 and the other end is a water inlet joint 15.

[0028] For water cooling, by way of example, as Figure 1 、 3As shown, the utility model also includes that the water cooling component 2 includes a lower aluminum plate 21, an upper aluminum plate 22 and a U-shaped copper tube 23, the U-shaped copper tube 23 is embedded between the lower aluminum plate 21 and the upper aluminum plate 22, the corner between the lower aluminum plate 21 and the upper aluminum plate 22 is fixed by bolts, and the water inlet end and the water outlet end of the U-shaped copper tube 23 pass through the outside of the lower aluminum plate 21 and the upper aluminum plate 22.

[0029] In order to actively cool down, for example, Figures 1-3 As shown, the utility model also includes that a semiconductor refrigeration sheet 24 is embedded on the top of the upper aluminum plate 22, the cooling end of the semiconductor refrigeration sheet 24 is in contact with the upper aluminum plate 22, and an exhaust fan 25 is provided at the heat dissipation end of the semiconductor refrigeration sheet 24, and the casing of the exhaust fan 25 is installed with the upper aluminum plate 22 by bolts.

[0030] When in use, the upper aluminum plate 22 in contact with the U-shaped copper tube 23 is actively cooled by the semiconductor refrigeration sheet 24, and the heat dissipation end of the semiconductor refrigeration sheet 24 is cooled by the exhaust fan 25, so that the cooling water passing through the U-shaped copper tube 23 is cooled, so that after the cooling water passes through the copper tube 13, the copper tube 13 can actively cool down the electronic components.

[0031] The two ends of the water outlet copper tube 3 are respectively connected to the water outlet joint 14 and the water inlet end of the U-shaped copper tube 23, and the two ends of the water supply copper tube 4 are respectively connected to the water inlet joint 15 and the liquid outlet end of the liquid pump 5, and the liquid inlet end of the liquid pump 5 is connected to the water outlet end of the U-shaped copper tube 23.

[0032] The U-shaped copper tube 23, the water outlet copper tube 3, the water supply copper tube 4 and the copper tube 13 are filled with cooling water.

[0033] When the utility model is in use, the aluminum base 12 is set to cover the processor or other electronic components on the mainboard, so that the flat surface 16 at the bottom of the copper tube 13 is in contact with the electronic components, the two sides of the aluminum base 12 and the surroundings of the water cooling component 2 are installed on the mainboard or the rack by bolts, and the power supply components in the use scenario provide power for the electrical components in this application, the copper tube 13 is initially cooled by the heat dissipation fins 11, and the cooling water in the U-shaped copper tube 23 is sucked by the liquid pump 5, so that the outlet copper tube 3 and the copper tube 13 are under negative pressure, so that the cooling water flows through the liquid pump 5, the water supply copper tube 4, The water circulates between the copper tube 13 and the water outlet copper tube 3 to further dissipate heat and cool down the components. The upper aluminum plate 22 in contact with the U-shaped copper tube 23 is actively cooled by the semiconductor refrigeration sheet 24, and the heat dissipation end of the semiconductor refrigeration sheet 24 is cooled by the exhaust fan 25, so that the cooling water passing through the U-shaped copper tube 23 is cooled. After the cooling water passes through the copper tube 13, the copper tube 13 can actively cool down the electronic components, so that the electronic components can maintain a relatively stable temperature when running under high load, so that the electronic components can better perform their own performance.

[0034] The basic principles, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above-described embodiments and descriptions in the specification only illustrate the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and all these changes and improvements fall within the scope of protection required by the present utility model. The scope of protection required by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A water-cooled radiator, characterized in that: It comprises a heat dissipation component (1), a water cooling component (2) and a liquid pump (5), wherein a water outlet copper pipe (3) and a water supply copper pipe (4) are arranged between the heat dissipation component (1) and the water cooling component (2), and the liquid pump (5) is arranged on the water supply copper pipe (4); The heat dissipation component (1) comprises heat dissipation fins (11), an aluminum base (12) and a plurality of groups of copper tubes (13); the plurality of groups of copper tubes (13) are embedded at equal distances at the bottom of the aluminum base (12); the bottom of the copper tubes (13) is a plane (16) and the plane (16) is flush with the aluminum base (12).

2. A water-cooled radiator according to claim 1, characterized in that: The two ends of the copper tube (13) respectively penetrate the tops of the two ends of the heat dissipation fins (11), and one end of the copper tube (13) is a water outlet joint (14), and the other end is a water inlet joint (15).

3. A water-cooled radiator according to claim 2, characterized in that: The water cooling assembly (2) comprises a lower aluminum plate (21), an upper aluminum plate (22) and a U-shaped copper tube (23); the U-shaped copper tube (23) is embedded between the lower aluminum plate (21) and the upper aluminum plate (22); the corner between the lower aluminum plate (21) and the upper aluminum plate (22) is fixed by bolts, and the water inlet end and the water outlet end of the U-shaped copper tube (23) pass through the outside of the lower aluminum plate (21) and the upper aluminum plate (22).

4. A water-cooled radiator according to claim 3, characterized in that: A semiconductor cooling sheet (24) is embedded on the top of the upper aluminum plate (22), the cooling end of the semiconductor cooling sheet (24) is in contact with the upper aluminum plate (22), and an exhaust fan (25) is provided at the heat dissipation end of the semiconductor cooling sheet (24), and the casing of the exhaust fan (25) is mounted on the upper aluminum plate (22) by bolts.

5. The water-cooled radiator according to claim 4, characterized in that: The two ends of the water outlet copper tube (3) are respectively connected to the water outlet joint (14) and the water inlet end of the U-shaped copper tube (23); the two ends of the water supply copper tube (4) are respectively connected to the water inlet joint (15) and the liquid outlet end of the liquid pump (5); and the liquid inlet end of the liquid pump (5) is connected to the water outlet end of the U-shaped copper tube (23).

6. A water-cooled radiator according to claim 5, characterized in that: The U-shaped copper tube (23), the water outlet copper tube (3), the water supply copper tube (4) and the copper tube (13) are filled with cooling water.

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