Refrigeration equipment for quantum computer and quantum computer

Abstract

The utility model discloses refrigeration equipment for a quantum computer and the quantum computer. The refrigeration equipment comprises a room temperature disc, a plurality of cold discs, a pulse tube refrigeration unit, a damping assembly and a plurality of cold conduction pieces. Wherein the pulse tube refrigeration unit comprises a machine head and a plurality of cold heads which are sequentially connected through pulse tubes; the machine head is installed on the room temperature disc in a sealed mode through the damping assembly. Any cold head is installed on the cold disc close to the cold head through the cold guide piece, and the cold guide piece comprises a metal woven belt. Vibration generated when the pulse tube refrigeration unit works can be reduced by arranging the damping assembly at the machine head, the cold conduction piece is arranged at the connecting position of the cold head and the cold disc, and the cold conduction piece comprises the metal woven belt, so that the cold conduction piece has good cold conduction performance and flexibility, and the service life of the pulse tube refrigeration unit is prolonged. Vibration generated when the pulse tube refrigeration unit works can be further reduced while the cold conduction performance is ensured, and normal work of the quantum chip is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a refrigeration device for quantum computers and a quantum computer. Background Art

[0002] Quantum computing is a new computing model that follows the laws of quantum mechanics to control basic information units for computing. The basic information unit of classical computing is the classical bit, and the basic information unit of quantum computing is the quantum bit. The classical bit can only be in one state, that is, 0 or 1, but based on the principle of quantum mechanics superposition, the state of the quantum bit can be in a superposition state of multiple possibilities. Therefore, the computing efficiency of quantum computing far exceeds that of classical computing.

[0003] In a quantum computer of a superconducting system, quantum chips need to work in an extremely low temperature environment, which can effectively reduce the impact of environmental noise. The commonly used refrigeration equipment at present is a dilution refrigerator, which adopts graded refrigeration technology and uses the phase change heat absorption of helium in the extremely low temperature zone to further cool down and obtain the lowest temperature zone. Among them, the quantum chip is usually set at the bottom layer of the dilution refrigerator. In the prior art, when a quantum computer executes quantum calculations, the pulse tube refrigeration unit in the dilution refrigerator starts refrigeration accompanied by relatively strong vibrations, which will bring additional environmental noise to the quantum chip and affect the normal operation of the quantum chip.

[0004] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The purpose of the utility model is to provide a refrigeration device for a quantum computer and a quantum computer with a shock-absorbing effect, so as to avoid the influence of environmental noise on the normal operation of a collar chip.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] On one hand, the utility model provides a refrigeration device for a quantum computer, comprising: a room temperature plate, a plurality of cold plates, a pulse tube refrigeration unit, a shock absorbing assembly, and a plurality of cooling members;

[0008] Wherein, the pulse tube cooling unit comprises a head and a plurality of cold heads connected in sequence through a pulse tube;

[0009] The machine head is sealed and mounted on the room temperature plate through the shock absorbing assembly;

[0010] Any one of the cold heads is installed on the cold plate adjacent thereto through the heat conduction member, and the heat conduction member includes a metal braided belt.

[0011] The refrigeration device for a quantum computer as described above, further, the heat conduction member is U-shaped or C-shaped.

[0012] The refrigeration device for a quantum computer as described above, further, the plurality of cold heads include a first cold head and a second cold head connected by a pulse tube; the plurality of heat conduction members include a first heat conduction member connected to the first cold head and a second heat conduction member connected to the second cold head;

[0013] The opening direction of the U shape or C shape of the first heat conduction member is the first direction;

[0014] The opening direction of the U shape or C shape of the second heat conduction member is the second direction;

[0015] Both the first direction and the second direction are parallel or perpendicular to the direction of the cold plate and the first direction and the second direction are perpendicular.

[0016] The refrigeration device for a quantum computer as described above, further, a plurality of the first heat conduction members are arranged, and the plurality of first heat conduction members are arranged in a circular array around the first cold head;

[0017] And / or, a plurality of the second heat conduction members are arranged, and the plurality of second heat conduction members are arranged in a circular array around the second cold head.

[0018] The refrigeration device for a quantum computer as described above, further, the shock absorption assembly includes a first connecting member, a first elastic member, a second connecting member, and a sealing tube;

[0019] The first elastic member is located between the first connecting member and the second connecting member, and both ends of the first elastic member are fixedly connected to the first connecting member and the second connecting member respectively;

[0020] The sealing tube is located inside the first elastic member and sleeved outside the pulse tube. One end of the sealing tube is fixedly connected to the second connecting member, and the other end of the sealing tube extends towards the direction close to the first connecting member and protrudes out of the first connecting member. The part of the sealing tube protruding out of the first connecting member is connected to the machine head; the first connecting member is hermetically fixed on the room temperature plate.

[0021] The refrigeration device for a quantum computer as described above, further, the shock absorption assembly further includes a plurality of first axial limiting members arranged on the periphery of the first elastic member;

[0022] The first axial limiting member includes a first screw rod and a second screw rod arranged coaxially;

[0023] The first screw is fixed at the first threaded hole of the first connecting member, the second screw is fixed at the second threaded hole of the second connecting member, and the front end of the second screw abuts against the rear end of the first screw.

[0024] For the refrigeration device for a quantum computer as described above, further, the shock-absorbing assembly further includes a plurality of second elastic components, and the plurality of second elastic components are evenly spaced around the first elastic member;

[0025] The second elastic component includes a positioning rod and a second elastic member. One end of the positioning rod passes through the second connecting member and is fixed on the first connecting member. The second elastic member is located below the second connecting member and sleeved on the positioning rod.

[0026] For the refrigeration device for a quantum computer as described above, further, the shock-absorbing assembly further includes a plurality of third elastic members provided between the first connecting member and the second connecting member, and the plurality of third elastic members are evenly spaced around the first elastic member.

[0027] For the refrigeration device for a quantum computer as described above, further, it further includes a bracket for supporting the refrigeration device, and a shock-absorbing pad is provided at the bottom of the bracket.

[0028] On the other hand, the present utility model provides a quantum computer, including the above refrigeration device and a quantum chip disposed in the refrigeration device.

[0029] The beneficial effects of the present utility model are as follows:

[0030] In this application, by providing a shock-absorbing assembly at the head, the vibration generated during the operation of the pulse tube refrigeration unit can be reduced. By providing a heat conduction member at the connection between the cold head and the cold plate, since the heat conduction member includes a metal braided belt, which has good heat conduction performance and flexibility, it can further reduce the vibration generated during the operation of the pulse tube refrigeration unit while ensuring the heat conduction performance, and ensure the normal operation of the quantum chip.

[0031] The quantum computer provided by the present utility model includes the above refrigeration device, so it has the same beneficial effects, which will not be elaborated here. Description of the Drawings

[0032] Figure 1 It is a schematic structural diagram of a refrigeration device for a quantum computer provided by an embodiment of the present utility model;

[0033] Figure 2 It is a schematic structural diagram of a shock-absorbing assembly provided by an embodiment of the present utility model Figure 1 ;

[0034] Figure 3 Structural schematic diagram of the first axial limiting member provided by an embodiment of the present utility model;

[0035] Figure 4 Structural schematic of the shock absorption assembly provided by an embodiment of the present utility model Figure 2 ;

[0036] Figure 5 Structural schematic diagram of the second elastic component provided by an embodiment of the present utility model;

[0037] In the reference numerals:

[0038] 10. Shock absorption assembly; 11. First connecting member; 12. First elastic member; 13. Second connecting member; 14. Sealing tube; 15. First axial limiting member; 151. First screw; 152. Second screw; 16. Second elastic component; 161. Positioning rod; 162. Second elastic member; 163. Upper cover; 164. Base; 165. Adjusting nut; 20. Pulse tube refrigeration unit; 21. Machine head; 22. First cold head; 23. Second cold head; 30. Room temperature plate; 40. Cold plate; 50. First heat conduction member; 60. Second heat conduction member. Detailed implementation manners

[0039] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as a limitation to this application.

[0040] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0041] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0042] Figure 1 The structural schematic diagram of the refrigeration device for a quantum computer provided by the embodiment of the present utility model is as Figure 1 shown: The embodiment of the present application discloses a refrigeration device for a quantum computer, including: a room-temperature disk 30, a plurality of cold disks 40, a pulse tube refrigeration unit 20, a shock-absorbing assembly 10, and a heat conduction member; wherein, the pulse tube refrigeration unit 20 includes a machine head 21 and a plurality of cold heads sequentially connected through a pulse tube; the machine head 21 is hermetically installed on the room-temperature disk 30 through the shock-absorbing assembly 10; any one of the cold heads is installed on the cold disk 40 adjacent thereto through the heat conduction member, and the heat conduction member includes a metal braided belt.

[0043] For the refrigeration device of this embodiment, by providing the shock-absorbing assembly 10 at the machine head 21, the vibration generated during the operation of the pulse tube refrigeration unit 20 can be reduced. By providing a heat conduction member at the connection between the cold head and the cold disk 40, since the heat conduction member includes a metal braided belt, which has good heat conduction performance and flexibility, while ensuring the heat conduction performance, it can further reduce the vibration generated during the operation of the pulse tube refrigeration unit 20 and ensure the normal operation of the quantum chip.

[0044] In this embodiment, the shape of the heat conduction member is not specifically limited. In some embodiments of this embodiment, the heat conduction member is U-shaped or C-shaped to improve the shock-absorbing effect.

[0045] In this embodiment, in order to further improve the shock-absorbing performance of the heat conduction member, and at the same time, taking into account improving the heat conduction performance and installation convenience, the heat conduction member further includes metal plates located at both ends of the metal braided belt; the metal braided belt includes a plurality of strands of metal wire; the metal plates are formed by pressing the metal braided belt. One end of the metal plate is used to fix the cold disk 40, and the other end of the metal plate is used to fix the cold head. The metal braided belt is formed by braiding a plurality of strands of metal wire, which can ensure the flexibility of the heat conduction belt while ensuring the heat conduction performance, not only improving the shock-absorbing performance but also facilitating installation; and the two ends of the metal braided belt are processed by a crimping process to form metal plates. The metal plates and the metal braided belt are of an integral structure. The shape of the metal plate is a plate-like structure, and the contact surface is flat. The metal plates can be in good contact with both the cold head and the cold disk 40, greatly improving the heat conduction performance.

[0046] In this embodiment, the material of the metal braided belt is not specifically limited and may be an oxygen-free copper material.

[0047] In order to further improve the shock absorption effect, in some embodiments of this embodiment, the plurality of cold heads include a first cold head 22 and a second cold head 23 connected by a pulse tube; the heat conducting member includes a first heat conducting member 50 connected to the first cold head 22 and a second heat conducting member 60 connected to the second cold head 23; the U-shaped or C-shaped opening direction of the first heat conducting member 50 is the first direction; the U-shaped or C-shaped opening direction of the second heat conducting member 60 is the second direction; both the first direction and the second direction are parallel or perpendicular to the direction of the cold plate 40 and the first direction and the second direction are perpendicular. Through the above settings, the heat conducting member of this embodiment can achieve shock absorption in different directions and improve the shock absorption effect.

[0048] In this embodiment, the number and arrangement manner of the first heat conducting members 50 are not specifically limited. In order to further improve the shock absorption effect, in some embodiments of this embodiment, a plurality of the first heat conducting members 50 are arranged, and the plurality of the first heat conducting members 50 are arranged in a circular array around the first cold head 22. Of course, the plurality of the first heat conducting members 50 can also be arranged in parallel at intervals.

[0049] In this embodiment, the number and arrangement manner of the second heat conducting members 60 are not specifically limited. In order to further improve the shock absorption effect, in some embodiments of this embodiment, a plurality of the second heat conducting members 60 are arranged, and the plurality of the second heat conducting members 60 are arranged in a circular array around the second cold head 23. Of course, the plurality of the second heat conducting members 60 can also be arranged in parallel at intervals.

[0050] In this embodiment, the number of the pulse tube refrigeration units 20 is not specifically limited and may be one or multiple. Exemplarily, as Figure 1 shown, the refrigeration device includes 3 pulse tube refrigeration units 20; a plurality of first heat conducting members 50 connected to the same first cold head 22 are arranged, the U-shaped opening directions of the plurality of first heat conducting members 50 are perpendicular to the direction of the cold plate 40, and the plurality of first heat conducting members 50 are arranged in a circular array around the first cold head 22; a plurality of second heat conducting members 60 connected to the same second cold head 23 are arranged, the U-shaped opening directions of the plurality of second heat conducting members 60 are parallel to the direction of the cold plate 40, and the plurality of second heat conducting members 60 are arranged in parallel at intervals; in order to further improve the shock absorption effect, although the opening directions of the plurality of second heat conducting members 60 in different pulse tube refrigeration units 20 are all parallel to the direction of the cold plate 40, their specific directions in the same plane are different.

[0051] In this embodiment, the structure of the shock absorption assembly 10 is not specifically limited. Figure 2 For the structural schematic diagram of the shock absorption assembly 10 provided by the embodiment of the present utility model Figure 1; as Figure 2 As shown in Figure 2 , in some embodiments of the present embodiment, the shock absorption assembly 10 includes a first connecting member 11, a first elastic member 12, a second connecting member 13, and a sealing tube 14; the first elastic member 12 is located between the first connecting member 11 and the second connecting member 13, and both ends of the first elastic member 12 are fixedly connected to the first connecting member 11 and the second connecting member 13 respectively; the sealing tube 14 is located inside the first elastic member 12 and sleeved outside the pulse tube, one end of the sealing tube 14 is fixedly connected to the second connecting member 13, the other end of the sealing tube 14 extends towards the direction close to the first connecting member 11 and extends out of the first connecting member 11, and the part of the sealing tube 14 extending out of the first connecting member 11 is connected to the machine head 21; the first connecting member 11 is hermetically fixed on the room temperature plate 30.

[0052] Specifically, the first elastic member 12 is located between the first connecting member 11 and the second connecting member 13, and both ends of the first elastic member 12 are fixedly connected to the first connecting member 11 and the second connecting member 13 respectively. By providing the first connecting member 11 and the second connecting member 13, the first elastic member 12 can be fixedly connected more stably. At the same time, the first connecting member 11 can easily fix the shock absorption device on the room temperature plate 30. In addition, since the quantum chip also requires a vacuum working environment to reduce the interference of environmental noise on the quantum chip, so as to perform the quantum computing process more accurately and quickly. Based on this, in the shock absorption device proposed in the embodiment of the present application, a sealing tube 14 is further included, wherein the sealing tube 14 is located inside the first elastic member 12, and the sealing tube 14 is sleeved outside the pulse tube, so as to achieve the sealing of the refrigeration equipment during the actual installation process and maintain the vacuum environment.

[0053] Further, a first sealing groove is provided on the end surface of the sealing tube 14 fixedly connected to the second connecting member 13, and a sealing ring or other sealing materials can be filled in the first sealing groove to prevent air from entering the interior of the refrigeration equipment and isolate it from the outside.

[0054] Further, a second sealing groove is formed at the mating part of the part of the sealing tube 14 extending out of the first connecting member 11 and the machine head 21, and a sealing ring or other sealing materials can be filled in the second sealing groove to prevent air from entering the interior of the refrigeration equipment and maintain the vacuum environment.

[0055] Further, a third sealing groove is provided on the end surface of the first connecting member 11 fixedly connected to the room temperature plate 30, and a sealing ring or other sealing materials can be filled in the third sealing groove to prevent air from entering the interior of the refrigeration equipment and isolate it from the outside.

[0056] In this embodiment, the first elastic member 12 is preferably a corrugated pipe. The corrugated pipe has a high sensitivity to vibration and can compensate for the vibration generated by the pulse tube refrigeration unit 20 relatively quickly, thereby effectively alleviating the vibration and avoiding additional noise interference to the quantum chip. At the same time, the corrugated pipe has high strength and good durability.

[0057] Figure 3 is a schematic structural diagram of the first axial limiting member 15 provided by an embodiment of the present invention; as Figure 2 and 3 shown: In some embodiments of this embodiment, the shock absorption assembly 10 further includes a plurality of first axial limiting members 15 disposed around the first elastic member 12; the first axial limiting member 15 includes a first screw 151 and a second screw 152 arranged coaxially; the first screw 151 is fixed at the first threaded hole of the first connecting member 11, the second screw 152 is fixed at the second threaded hole of the second connecting member 13, and the front end of the second screw 152 abuts against the rear end of the first screw 151.

[0058] When the quantum computer refrigeration device is operating, due to the vibration of the pulse tube refrigeration unit 20, the shock absorption assembly 10 will be driven to shake uncontrollably in all directions. However, this shock absorption device can only play a role in compensating for the vibration generated by the pulse tube refrigeration unit 20 when it is displaced perpendicular to the room temperature plate 30, and the displacement parallel to the room temperature plate 30 will accelerate the wear of the first elastic member 12. Therefore, arranging a plurality of first axial limiting members 15 around the first elastic member 12 can protect the first elastic member 12 to a certain extent, and at the same time ensure that the shock absorption assembly 10 can play a shock absorption role in a better state and enhance the shock absorption effect. In addition, since a vacuum environment needs to be maintained inside the refrigeration device and vacuum pumping treatment is required, at this time, the first axial limiting member 15 also plays a role in protecting the first elastic member 12 and preventing the first elastic member 12 from being damaged due to excessive stretching.

[0059] In this embodiment, the number of the first axial limiting members 15 is not specifically limited and can be 2, 3, 4, etc. A plurality of first axial limiting members 15 are arranged at equal intervals.

[0060] Figure 4 is a schematic structural diagram of the shock absorption assembly 10 provided by an embodiment of the present invention Figure 2 ; Figure 5 is a schematic structural diagram of the second elastic assembly 16 provided by an embodiment of the present invention; as Figure 4 and Figure 5 shown: In some embodiments of this embodiment, Figure 2Based on the middle shock absorption assembly 10, the shock absorption assembly 10 further includes a plurality of second elastic components 16, and the plurality of second elastic components 16 are evenly spaced around the periphery of the first elastic member 12; the second elastic component 16 includes a positioning rod 161 and a second elastic member 162, one end of the positioning rod 161 passes through the second connecting member 13 and is fixed to the first connecting member 11, and the second elastic member 162 is located below the second connecting member 13 and sleeved on the positioning rod 161.

[0061] In this embodiment, the shape of the positioning rod 161 is not specifically limited. Exemplarily, the positioning rod 161 is a cylinder, and the cylinder passes through the mounting hole on the second connecting member 13 (the aperture of the mounting hole here is larger than the outer diameter of the cylinder) and is fixed to the first connecting member 11. Specifically, a threaded hole can be provided on the first connecting member 11, and a thread matching the threaded hole is provided at the top end of the cylinder to fix the cylinder to the first connecting member 11.

[0062] In this embodiment, the second elastic member 162 can be a spring. To facilitate the installation of the spring on the positioning rod 161; the second elastic component 16 further includes an adjusting nut 165 and an upper cover 163 and a base 164 respectively fixed to the top end and the bottom end of the spring. A section of thread matching the adjusting nut 165 is provided at the lower end of the positioning rod 161; during installation, the spring fixed with the upper cover 163 and the base 164 is sleeved on the positioning rod 161, and then the adjusting nut 165 is installed on the positioning rod 161 and arranged in contact with the base 164. By providing the adjusting nut 165, not only the stable installation of the spring is realized, but also the compression degree of the spring can be adjusted by adjusting the different installation positions of the adjusting nut 165 on the positioning rod 161 to meet the actual requirements. The number of the second elastic members 162 is not specifically limited. To improve the shock absorption effect, more can be provided, such as 10, 11 or 12, etc., and the plurality of second elastic members 162 are evenly spaced.

[0063] In some other embodiments of this embodiment, on Figure 2 Based on the middle shock absorption assembly 10, the shock absorption assembly 10 further includes a plurality of third elastic members provided between the first connecting member 11 and the second connecting member 13, and the plurality of third elastic members are evenly spaced around the periphery of the first elastic member 12. By providing a plurality of third elastic members, the shock absorption effect of the shock absorption assembly 10 is further improved.

[0064] In this embodiment, the third elastic member can be a spring. The spring has a simple structure, diverse rigidity options, good shock absorption effect, and relatively low cost. The number of the third elastic members is not specifically limited. To improve the shock absorption effect, more can be provided, for example, it can be 10, 11, or 12, etc. A plurality of the third elastic members are arranged at uniform intervals.

[0065] In some embodiments of this example, the refrigeration device for a quantum computer further includes a bracket for supporting the refrigeration device, and a shock pad is provided at the bottom of the bracket. By providing the shock pad, the shock absorption effect is further improved, and the stability of the refrigeration device is enhanced.

[0066] Based on the same inventive concept, an embodiment of this application further provides a quantum computer, including the above refrigeration device. Since the quantum computer of this application includes the above refrigeration device, it has the same beneficial effects as the above refrigeration device, which will not be elaborated herein.

[0067] In the description of this specification, the description with reference to terms such as "some embodiments" or "examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0068] The above are only the preferred embodiments of the present utility model and do not impose any limitation on the present utility model. Any person skilled in the art within the technical field, without departing from the technical solution of the present utility model, makes any form of equivalent replacement or modification and other changes to the technical solution and technical content disclosed by the present utility model, all of which belong to the content of the technical solution of the present utility model and are still within the protection scope of the present utility model.

Claims

1. A refrigeration device for a quantum computer, characterized in that: include: A room temperature plate, a plurality of cold plates, a pulse tube cooling unit, a shock absorbing assembly, and a plurality of cooling conductors; Wherein, the pulse tube cooling unit comprises a head and a plurality of cold heads connected in sequence through a pulse tube; The machine head is sealed and mounted on the room temperature plate through the shock absorbing assembly; Any of the cold heads is mounted on the cold plate close thereto through the cooling member, and the cooling member comprises a metal braided belt.

2. The refrigeration device for a quantum computer according to claim 1, characterized in that: The cooling member is U-shaped or C-shaped.

3. The refrigeration device for a quantum computer according to claim 2, characterized in that: The plurality of cold heads include a first cold head and a second cold head connected by a pulse tube; the plurality of cold conducting members include a first cold conducting member connected to the first cold head and a second cold conducting member connected to the second cold head; The U-shaped or C-shaped opening direction of the first cooling member is a first direction; The U-shaped or C-shaped opening direction of the second cooling member is a second direction; The first direction and the second direction are both parallel or perpendicular to the cold plate direction, and the first direction and the second direction are perpendicular.

4. The refrigeration device for a quantum computer according to claim 3, characterized in that: There are a plurality of first cooling members, and the plurality of first cooling members are arranged in a circular array around the first cold head; And / or, a plurality of the second cooling conductors are arranged, and the plurality of the second cooling conductors are arranged in a circular array around the second cold head.

5. The refrigeration device for a quantum computer according to claim 1, characterized in that: The shock absorbing assembly comprises a first connecting member, a first elastic member, a second connecting member and a sealing tube; The first elastic member is located between the first connecting member and the second connecting member, and two ends of the first elastic member are fixedly connected to the first connecting member and the second connecting member respectively; The sealing tube is located inside the first elastic member and is sleeved on the outside of the pulse tube. One end of the sealing tube is fixedly connected to the second connecting member, and the other end of the sealing tube extends toward the direction close to the first connecting member and extends out of the first connecting member. The portion of the sealing tube extending out of the first connecting member is connected to the machine head; the first connecting member is sealed and fixed on the room temperature disk.

6. The refrigeration device for a quantum computer according to claim 5, characterized in that: The shock absorbing assembly further comprises a plurality of first axial stoppers arranged at the periphery of the first elastic member; The first axial stopper comprises a first screw and a second screw arranged coaxially; The first screw rod is fixed at the first threaded hole of the first connecting member, the second screw rod is fixed at the second threaded hole of the second connecting member, and the front end of the second screw rod abuts against the rear end of the first screw rod.

7. The refrigeration device for a quantum computer according to claim 6, characterized in that: The shock absorbing assembly further comprises a plurality of second elastic components, and the plurality of second elastic components are evenly spaced and arranged at the periphery of the first elastic member; The second elastic component includes a positioning rod and a second elastic member. One end of the positioning rod passes through the second connecting member and is fixed to the first connecting member. The second elastic member is located below the second connecting member and is sleeved on the positioning rod.

8. The refrigeration device for a quantum computer according to claim 6, characterized in that: The shock absorbing assembly further includes a plurality of third elastic members disposed between the first connecting member and the second connecting member, and the plurality of third elastic members are evenly spaced and disposed around the periphery of the first elastic member.

9. The refrigeration device for a quantum computer according to claim 1, characterized in that: It also includes a bracket for supporting the refrigeration equipment, and a shock-absorbing pad is provided at the bottom of the bracket.

10. A quantum computer, characterized in that: The invention comprises a refrigeration device as described in any one of claims 1 to 9, and a quantum chip arranged in the refrigeration device.

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