Bonding glue removing machine

Abstract

The utility model relates to the technical field of wafer glue removing, in particular to a bonding glue removing machine which comprises a shell, a first separating frame and a second separating frame which are perpendicular to each other are arranged in the shell, and the first separating frame and the second separating frame are used for separating the inner space of the shell. A transfer cavity, a first cleaning bin, a second cleaning bin and a distribution bin are formed; according to the wafer cleaning device, when liquid medicine is sprayed out to wash and remove photoresist on bonding gold on the surface of a wafer, the wafer and the wafer carrying table are driven to rotate together through rotation of the bearing component, meanwhile, the wafer is adsorbed in a vacuum adsorption mode, and the cleaning mechanism is arranged in the first cleaning bin and the second cleaning bin. The wafer is kept stable in the rotation process through the rotation of the wafer, washing and photoresist removing are more sufficient, residual glue is reduced, the pressing cover is located above the slide holder, and the slide holder is prevented from moving upwards while rotation of the slide holder and the wafer is not affected.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer debonding, specifically a bonding glue remover. Background Technique

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. During the wafer processing, it is often necessary to bond the wafer through bonding glue. After the wafer is debonded after processing, there will be residual bonding glue on the wafer surface, and it is necessary to clean the bonding glue on the wafer surface through cleaning.

[0003] In the prior art, such as a non-silicon semiconductor wafer debonding device proposed in the patent application number "CN202222882204.5", including: a workbench, the workbench has a debonding area and a cleaning area for cooperation; an ultrasonic cleaning mechanism, arranged in the debonding area; a bearing vessel is arranged inside the ultrasonic cleaning mechanism, and a debonding solvent is contained in the bearing vessel.

[0004] However, in the above patent application, when debonding the wafer surface, only the debonding is carried out by flushing, and the debonding effect is not good, and the residual bonding glue on the wafer surface cannot be completely and fully removed. Content of the Utility Model

[0005] The purpose of the utility model is to provide a bonding glue remover to solve the problems put forward in the above background technique.

[0006] The purpose of the utility model can be realized by the following technical solutions:

[0007] The bonding glue remover includes a housing. Inside the housing, a first partition frame and a second partition frame perpendicular to each other are arranged. The first partition frame and the second partition frame are used to divide the internal space of the housing, forming a transfer cavity, a first cleaning chamber, a second cleaning chamber and a supply chamber;

[0008] Cleaning mechanisms are arranged inside the first cleaning chamber and the second cleaning chamber. The cleaning mechanism includes a cleaning chamber. One side of the cleaning chamber close to the transfer cavity is provided with an electric chamber door that can move up and down to open and close. A closed cover is fixedly connected inside the cleaning chamber. A rotatable bearing component is arranged at the bottom of the cleaning chamber. The bearing component is used to provide bearing for the wafer stage. One side of the electric chamber door and above the closed cover is fixedly connected with a pressing cover, and the pressing cover is used to limit the upward movement of the wafer stage.

[0009] Preferably, a plurality of negative pressure adsorption holes are evenly arranged at the top of the bearing component. The negative pressure adsorption holes are used to adsorb the wafer on the wafer stage, and a positioning shaft is fixedly connected to the top of the bearing component.

[0010] Preferably, a first drain hole arranged in an annular array is opened on the inner wall of the closed cover, and a second drain hole is opened at the bottom of the inner wall of the cleaning chamber.

[0011] Preferably, a support platform is fixedly connected to the outside of the housing. The support platform is arranged on one side close to the transfer cavity. A transfer manipulator assembly is arranged inside the transfer cavity, and the transfer manipulator assembly is used to transfer the wafer stage and the wafer.

[0012] Preferably, two dosing pipes are arranged in the dosing bin. Control pipes are fixedly connected to the two dosing pipes, and the two control pipes are respectively fixedly connected to the first cleaning bin and the second cleaning bin.

[0013] Preferably, the top of the dosing pipe penetrates through the housing and extends to the outside of the housing. An installation flange is fixedly connected to the top of the dosing pipe, and a sewage output pipe is fixedly installed at the bottom of the housing.

[0014] Advantages of the present utility model:

[0015] When the present utility model sprays the liquid medicine to rinse and remove the glue from the bonded alloy on the surface of the wafer, by using the rotation of the bearing member, the wafer and the wafer stage are driven to rotate together. At the same time, the wafer is adsorbed by means of vacuum adsorption, so that the wafer remains stable during the rotation process. By using the rotation of the wafer, the rinsing and degluing are more thorough, reducing the colloid residue. At the same time, the pressing cover is located above the wafer stage. While not affecting the rotation of the wafer stage and the wafer, it prevents the wafer stage from moving upward, further improving the stability of the wafer during degluing. Description of the drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings;

[0017] Figure 1 is the overall structural schematic diagram of the present utility model;

[0018] Figure 2 is the present utility model Figure 1 is the cross-sectional view of the top-down part of the housing in the present utility model;

[0019] Figure 3 is the present utility model Figure 2 is the structural schematic diagram of the cleaning bin in the present utility model;

[0020] Figure 4 is the present utility model Figure 3 is the structural schematic diagram of the bearing member and the pressing cover in the present utility model;

[0021] Figure 5 is the present utility model Figure 1 is the structural schematic diagram of the bottom of the housing in the present utility model.

[0022] The reference numerals in the figure are as follows:

[0023] 1. Outer shell, 101. Transfer cavity, 102. First cleaning chamber, 103. Second cleaning chamber, 104. Rationing chamber, 2. First partition rack, 3. Second partition rack, 4. Enclosure, 5. Cleaning chamber, 6. Electrically operated chamber door, 7. Carrying component, 8. Pressing cover, 9. Negative pressure adsorption hole, 10. Positioning shaft, 11. First drain hole, 12. Second drain hole, 13. Support platform, 14. Rationing pipeline, 15. Control pipeline, 16. Installation flange, 17. Sewage output pipeline, 20. Transfer manipulator assembly. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] The bonding glue remover includes an outer shell 1. Inside the outer shell 1, a first partition rack 2 and a second partition rack 3 perpendicular to each other are provided. The first partition rack 2 and the second partition rack 3 are used to partition the internal space of the outer shell 1 to form a transfer cavity 101, a first cleaning chamber 102, a second cleaning chamber 103, and a rationing chamber 104.

[0026] Cleaning mechanisms are provided inside both the first cleaning chamber 102 and the second cleaning chamber 103. The cleaning mechanism includes a cleaning chamber 5. On one side of the cleaning chamber 5 close to the transfer cavity 101, an electrically operated chamber door 6 that can move up and down for opening and closing is provided. At the bottom of the cleaning chamber 5, a rotatable carrying component 7 is provided. The carrying component 7 is used to provide support for the wafer stage. On one side of the electrically operated chamber door 6 and above the carrying component 7, a pressing cover 8 is fixedly connected. The pressing cover 8 is used to limit the upward movement of the wafer stage.

[0027] As Figure 1 and Figure 2 , the first partition rack 2 and the partition rack 3 partition the internal space of the outer shell 1 to form four regions in a cross shape. The first cleaning chamber 102 and the second cleaning chamber 103 are respectively located in the regions adjacent to the transfer cavity 101. The rationing chamber 104 is located in the region of the diagonal of the transfer cavity 101. Cleaning mechanisms are provided inside both the first cleaning chamber 102 and the second cleaning chamber 103. Below the carrying component 7, a motor drives the carrying component 7 to rotate. At the same time, there is a negative pressure adsorption device that performs air extraction and adsorption through the negative pressure adsorption hole 9. Both the negative pressure adsorption device and the motor are designed to be waterproof, so that during the process of cleaning the wafer, the negative pressure adsorption device and the motor will not be affected.

[0028] Above the first cleaning chamber 102 and the second cleaning chamber 103, there are high-pressure nozzles (not shown in the figure). The high-pressure nozzles are connected to the space inside the housing 1 for storing the liquid medicine, and can spray the liquid medicine to perform high-pressure flushing on the wafers inside the first cleaning chamber 102 and the second cleaning chamber 103. The liquid medicine sprayed by the nozzle above the first cleaning chamber 102 is a high-pressure de-bonding liquid medicine, and the liquid medicine sprayed by the high-pressure nozzle above the second cleaning chamber 103 is a two-fluid de-bonding liquid medicine.

[0029] A plurality of negative pressure adsorption holes 9 are uniformly arranged on the top of the bearing member 7. The negative pressure adsorption holes 9 are used for adsorbing the wafers on the wafer stage. A positioning shaft 10 is fixedly connected to the top of the bearing member 7.

[0030] Such as Figure 2 、 Figure 3 And Figure 4 , the wafer stage for externally carrying the wafers will always be transferred together with the wafers. When the wafer stage and the wafers are transferred above the bearing member, there are card holes on the wafer stage that are clamped together with the positioning shaft 10, so that when the bearing member 7 rotates, the wafer stage is driven to rotate through the positioning shaft 10. At the same time, there are openings on the wafer stage that are aligned with the negative pressure adsorption holes 9, so that the pumping negative pressure generated through the negative pressure adsorption holes 9 can perform negative pressure adsorption on the wafers above the wafer stage.

[0031] The inner wall of the bearing member 7 is provided with a first drain hole 11 arranged in an annular array, and the bottom of the inner wall of the cleaning chamber 5 is provided with a second drain hole 12.

[0032] Such as Figure 2 、 Figure 3 And Figure 4 , the waste liquid generated by cleaning can enter the cleaning chamber 5 through the second drain hole 12, and then flow out of the cleaning chamber 5 through the first drain hole 11.

[0033] A support platform 13 is fixedly connected to the outside of the housing 1. The support platform 13 is arranged on one side close to the transfer cavity 101. A transfer manipulator assembly 20 is arranged inside the transfer cavity 101. The transfer manipulator assembly 20 is used for transferring the wafer stage and the wafers.

[0034] Such as Figure 1 , there is an openable baffle in the area above the support platform 13 on the surface of the housing 1. When the baffle is opened, the transfer manipulator assembly 20 can extend to the outside of the housing 1 to clamp the wafer stage above the support platform 13 and transfer the wafer stage and the wafers together. The transfer manipulator assembly is composed of a mechanical clamp and a robotic arm that can rotate and extend, so that the wafer stage and the wafers can be transferred in different directions.

[0035] There are two rationing pipes 14 arranged inside the rationing bin 104. A control pipe 15 is fixedly connected to the two rationing pipes 14, and the two control pipes 15 are respectively fixedly connected to the first cleaning bin 102 and the second cleaning bin 103.

[0036] As Figure 2 , Figure 3 and Figure 4 , there is an electromagnetic valve on the control pipe 15, which can control the water output. The rationing pipe 14 can transport clean water to the inside of the first cleaning bin 102 and the second cleaning bin 103 through the control pipe 15 to clean the inside of the first cleaning bin 102 and the second cleaning bin 103.

[0037] The top of the rationing pipe 14 penetrates through the housing 1 and extends to the outside of the housing 1. An installation flange 16 is fixedly connected to the top of the rationing pipe 14, and a sewage output pipe 17 is fixedly installed at the bottom of the housing 1.

[0038] As Figure 1 , the first drain hole 11 is communicated with the sewage output pipe 17 through a pipeline below, and the sewage generated by the internal cleaning can be transported outwards.

[0039] The working principle of the bonding glue remover provided by the present utility model is as follows:

[0040] When it is necessary to remove the bonding glue on the wafer, the wafer is located on the wafer stage. The wafer stage is placed on the support stage 13, and the transfer manipulator assembly 20 extends out from inside the housing 1, clamps the wafer stage, and the electric hatch 6 opens to drive the pressing cover 8 to move downwards. The transfer manipulator assembly 20 sends the wafer stage into the position above the bearing member 7 inside the first cleaning bin 102, and then the transfer manipulator assembly 20 retracts into the transfer cavity 101. The electric hatch 6 moves downwards, driving the pressing cover 8 to move downwards. The pressing cover 8 moves downwards above the wafer stage to restrict the upward movement of the wafer stage, and the wafer is adsorbed through the negative pressure adsorption hole 9. The bearing member 7 drives the wafer stage and the wafer to rotate to assist in the high-pressure flushing of the wafer;

[0041] After the high-pressure flushing is completed, similarly, the transfer manipulator assembly can transfer the wafer stage and the wafer inside the first cleaning bin 102 to the inside of the second cleaning bin 103 for cleaning. After the cleaning is completed, it is transferred to above the support stage 13 from the second cleaning bin 103.

[0042] Compared with the related technology, the bonding glue remover provided by the present utility model has the following beneficial effects:

[0043] When the liquid medicine is ejected to wash and remove the glue from the bonded alloy on the surface of the wafer, the rotation of the bearing member 7 is utilized to drive the wafer and the wafer stage to rotate together. At the same time, the wafer is adsorbed by means of vacuum adsorption, so that the wafer remains stable during rotation. By using the rotation of the wafer, the washing and degumming are more sufficient, reducing the residual colloid. Meanwhile, the pressing cover is located above the wafer stage. While not affecting the rotation of the wafer stage and the wafer, it prevents the wafer stage from moving upward, further improving the stability of the wafer during degumming.

[0044] The above shows and describes the basic principle, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. A bonding adhesive removal machine, comprising a housing (1), characterized in that: A first partition frame (2) and a second partition frame (3) which are perpendicular to each other are arranged inside the shell (1); the first partition frame (2) and the second partition frame (3) are used to partition the internal space of the shell (1) to form a transfer cavity (101), a first cleaning chamber (102), a second cleaning chamber (103) and a distribution chamber (104); The first cleaning chamber (102) and the second cleaning chamber (103) are both provided with cleaning mechanisms, the cleaning mechanisms comprising a cleaning chamber (5), a side of the cleaning chamber (5) close to the transfer cavity (101) is provided with an electric chamber door (6) that can be opened and closed by moving up and down, a closed cover (4) is fixedly connected inside the cleaning chamber (5), a rotatable bearing component (7) is provided at the bottom of the cleaning chamber (5), the bearing component (7) is used to provide bearing for the wafer stage, and a pressing cover (8) is fixedly connected to one side of the electric chamber door (6) and located above the closed cover (4), and the pressing cover (8) is used to limit the upward movement of the wafer stage.

2. The bonding glue removal machine according to claim 1, characterized in that: A plurality of negative pressure adsorption holes (9) are evenly arranged on the top of the bearing component (7), and the negative pressure adsorption holes (9) are used to adsorb the wafer on the wafer carrier. A positioning shaft (10) is fixedly connected to the top of the bearing component (7).

3. The bonding glue removal machine according to claim 2, characterized in that: The inner wall of the bearing component (7) is provided with first drainage holes (11) in a circular array, and the bottom of the inner wall of the cleaning chamber (5) is provided with second drainage holes (12).

4. The bonding adhesive removal machine according to claim 1, characterized in that: The outer part of the housing (1) is fixedly connected to a support platform (13), the support platform (13) is arranged on a side close to the transfer cavity (101), and the interior of the transfer cavity (101) is provided with a transfer robot assembly (20), the transfer robot assembly (20) is used to transfer the wafer carrier and the wafer.

5. The bonding adhesive removal machine according to claim 1, characterized in that: Two distribution pipes (14) are arranged in the distribution bin (104), and control pipes (15) are fixedly connected to the two distribution pipes (14). The two control pipes (15) are fixedly connected to the first cleaning bin (102) and the second cleaning bin (103), respectively.

6. The bonding adhesive removal machine according to claim 5, characterized in that: The top of the distribution pipe (14) passes through the outer shell (1) and extends to the outside of the outer shell (1); a mounting flange (16) is fixedly connected to the top of the distribution pipe (14); and a sewage output pipe (17) is fixedly mounted on the bottom of the outer shell (1).

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