Fixing device

Abstract

The utility model discloses a fixing device. The fixing device comprises a fixing platform, a fixing part and a driving part, the fixing platform is provided with a transmission station used for transmitting silicon wafers, the fixing platform is provided with a plurality of adjusting channels, the adjusting channels are distributed around the transmission station, part of the adjusting channels extend in the first direction, and the other part of the adjusting channels extend in the second direction. Each adjusting channel is internally provided with a fixing piece, the fixing pieces can move along the adjusting channels, the driving part is connected to the fixing pieces, and the fixing pieces are used for fixing the silicon wafers on the conveying station from different positions. The fixing device provided by the utility model can effectively fix the silicon wafer and better protect the silicon wafer, the fixed silicon wafer is not easy to deviate, the deviation rate is reduced, the silicon wafer does not need to be manually adjusted by an operator, the silicon wafer is prevented from being polluted by human factors, poor coating is avoided, and the battery efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic technology, and particularly to a fixing device. Background Art

[0002] In the field of photovoltaics, when solar cells are produced and prepared, silicon wafers need to be transported through a conveyor belt. After the conveyor belt transports the silicon wafers to a predetermined transport channel, lifting platforms on both sides of the transport channel rise, and four fixed-position pins are arranged on each of the lifting platforms on both sides. The silicon wafers on the transport channel are fixed by the eight pins on the raised lifting platforms to prevent the silicon wafers from shifting when being sucked by a suction cup.

[0003] In actual production, after the silicon wafers are transported onto the transport channel by the conveyor belt, it is impossible to ensure that the positions of a large number of silicon wafers are the same each time they are transported into the transport channel. Inevitably, a small number of silicon wafers will shift in position during this process. Since the positions of the eight pins on the lifting platform are fixed positions, when the lifting platform rises at this time, the silicon wafers are not fixed but are instead lifted up, causing the machine to pause. At this time, operators need to manually adjust the positions of the silicon wafers again, which will delay the production line process and increase the time cost. At the same time, during the process of manually adjusting the silicon wafers, it is very likely to contaminate the silicon wafers and cause poor coating, thereby reducing the efficiency of the battery chips. Further, the pins in the fixed positions in the traditional technology only work for silicon wafers of a fixed size and cannot adapt to more sizes of silicon wafers. The contact area between the pins in the traditional technology and the side of the silicon wafer is small, and only one point can be contacted, often resulting in unstable fixing of the silicon wafers. Summary of the Utility Model

[0004] Based on this, it is necessary to provide a fixing device. The fixing device of the utility model can effectively fix silicon wafers, better protect the silicon wafers, the fixed silicon wafers are not prone to shift, reduce the shift rate, and there is no need for operators to manually adjust the silicon wafers during the operation process, avoiding contamination of the silicon wafers by human factors, avoiding poor coating, and effectively improving the battery efficiency.

[0005] An embodiment of the present application provides a fixing device.

[0006] A fixing device includes a fixing platform, fixing members, and a driving component. The fixing platform has a transport station for transporting silicon wafers. The fixing platform has a plurality of adjustment channels, and the plurality of adjustment channels are distributed around the transport station. Some of the adjustment channels extend along a first direction, and some of the adjustment channels extend along a second direction. Each of the adjustment channels is provided with the fixing member, and the driving component is connected to the fixing member. The fixing member can move along the adjustment channel to fix the silicon wafers on the transport station from different positions.

[0007] In some of these embodiments, the first direction is perpendicular to the second direction.

[0008] In some of these embodiments, at least two sets of the adjustment channels are spaced apart in the first direction, and each set of the adjustment channels is respectively located on both sides of the transfer station.

[0009] At least two sets of the adjustment channels are spaced apart in the second direction, and each set of the adjustment channels is respectively located on both sides of the transfer station.

[0010] In some of these embodiments, the fixing member has a prismatic structure, and one of the surfaces of the fixing member faces the transfer station.

[0011] In some of these embodiments, the fixing member has a quadrangular prism structure.

[0012] Alternatively, the fixing member has a quadrangular pyramid structure.

[0013] In some of these embodiments, the fixing platform includes a first fixing sub-platform and a second fixing sub-platform. The first fixing sub-platform and the second fixing sub-platform are spaced apart, and a part of the first fixing sub-platform close to the second fixing sub-platform and a part of the second fixing sub-platform close to the first fixing sub-platform form the transfer station.

[0014] In some of these embodiments, the fixing device further includes a lifting mechanism. The lifting mechanism is connected to the first fixing sub-platform and the second fixing sub-platform, and the lifting mechanism is configured to drive the first fixing sub-platform and the second fixing sub-platform to move up and down.

[0015] In some of these embodiments, the fixing device further includes a transmission component. The fixing member is connected to the driving component through the transmission component.

[0016] In some of these embodiments, the transmission component includes a transmission shaft and a telescopic arm. The driving component is connected to the transmission shaft. The transmission shaft is threadedly connected to the telescopic arm. The telescopic arm is movably connected to the fixing platform and can move along the adjustment channel.

[0017] In some of these embodiments, the fixing device further includes a sensing component. The sensing components are respectively disposed at the bottoms of the fixing members.

[0018] The above-mentioned fixing device can effectively fix the silicon wafer, better protect the silicon wafer. The fixed silicon wafer is not prone to shift, reducing the shift rate. There is no need for operators to manually adjust the silicon wafer, avoiding silicon wafer contamination caused by human factors and avoiding poor coating, effectively improving the efficiency of solar cells.

[0019] Compared with the traditional technology, the fixing device of the present application has the following beneficial effects:

[0020] (1) In one example of the present application, the conical pin in the traditional technology is changed to a quadrangular prism structure or a quadrangular pyramid pin, which increases the contact area between the fixing device and the silicon wafer, makes the silicon wafer fixation more stable, and will not scratch the silicon wafer at the same time.

[0021] (2) The fixing device of the present application can adjust the silicon wafer with position offset, reducing the poor film coating of the silicon wafer caused by the offset.

[0022] (3) The structure of the fixing device of the present application is flexible and variable. Even if the silicon wafer is offset, it can be fixed to the correct position, is not easy to trigger the machine alarm, avoids the machine from stopping, reduces the production time cost, and improves the production efficiency.

[0023] (4) The fixing device of the present application can sense the size of the silicon wafer and adjust it in time, has a wide application range, can adapt to silicon wafers of various different specifications and sizes, and avoids the situation where the silicon wafer cannot be fixed when it is offset. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0025] In order to more fully understand the present application and its beneficial effects, the following will be described in conjunction with the drawings. Among them, the same reference numerals in the following description represent the same parts.

[0026] Figure 1 Schematic diagram of the fixing device according to an embodiment of the present invention;

[0027] Figure 2 Side view schematic diagram of the fixing device according to an embodiment of the present invention;

[0028] Figure 3 Schematic diagram of the fixing member according to an embodiment of the present invention.

[0029] DESCRIPTION OF THE REFERENCE NUMERALS

[0030] 10. Fixing device; 100. Fixing platform; 101. Adjusting channel; 200. Fixing member; 300. Transmission member; 310. Transmission shaft; 320. Telescopic arm; 400. Sensing member; 20. Silicon wafer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] To make the above objects, features, and advantages of the present utility model more apparent and understandable, the following describes the specific embodiments of the present utility model in detail with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0032] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model.

[0033] In the present utility model, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over", and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath", and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0035] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0037] The embodiment of the present application provides a fixing device 10 to solve the problems existing in the conventional technology after the silicon wafer is transferred from the conveyor belt to the transmission channel: (1) it is impossible to ensure that the position of each silicon wafer is the same each time it is transferred to the transmission channel, and a small part of the silicon wafers are offset; (2) the position of the pin is a fixed position, which is easy to lift up the offset silicon wafer and cause the machine to stop, and the operator needs to manually adjust the position of the silicon wafer, which delays the production line process, increases time costs, contaminates the silicon wafer, and causes poor coating; (3) the pins of the conventional technology only work on silicon wafers of fixed size and cannot adapt to silicon wafers of more sizes; (4) the conical pins in the conventional technology have a small contact area with the side of the silicon wafer, and the silicon wafer often has at least one of the following problems. The fixing device 10 will be described below in conjunction with the accompanying drawings.

[0038] The fixing device 10 provided in the embodiment of the present application is exemplary, see Figure 1 As shown, Figure 1 The structural diagram of the fixing device 10 provided in the embodiment of the present application is shown in FIG. The fixing device 10 of the present application can be used for fixing the position of the silicon wafer 20 during the transmission process.

[0039] In order to more clearly illustrate the structure of the fixing device 10, the fixing device 10 will be described below in conjunction with the accompanying drawings. Figure 1 As shown, Figure 1 A schematic diagram of the structure of a fixing device 10 provided in an embodiment of the present application.

[0040] A fixing device 10 includes a fixing platform 100, a fixing member 200, and a driving member. The fixing platform 100 has a transfer station for transferring the silicon wafer 20. The fixing platform 100 has a plurality of adjustment channels 101. The plurality of adjustment channels 101 are distributed around the transfer station. Some of the adjustment channels 101 extend along a first direction, and some of the adjustment channels 101 extend along a second direction. A fixing member 200 is respectively disposed in each of the adjustment channels 101. The driving member is connected to the fixing member 200. The fixing member 200 can move along the adjustment channel 101. Under the drive of the driving member, the plurality of fixing members 200 can respectively fix the silicon wafer 20 on the transfer station from different positions.

[0041] The above-mentioned fixing device 10 can effectively fix the silicon wafer 20, better protect the silicon wafer 20, the fixed silicon wafer 20 is not easy to shift, reduce the shift rate, there is no need for operators to manually adjust the silicon wafer 20, avoid human factor pollution of the silicon wafer 20, avoid causing poor coating, and effectively improve the efficiency of solar cells.

[0042] In some embodiments, refer to Figure 1 As shown, the first direction is perpendicular to the second direction.

[0043] In some embodiments, at least two groups of adjustment channels 101 are spaced apart in the first direction, and each group of adjustment channels 101 is respectively located on both sides of the transfer station; at least two groups of adjustment channels 101 are spaced apart in the second direction, and each group of adjustment channels 101 is respectively located on both sides of the transfer station.

[0044] In some embodiments, the fixing member 200 has a prismatic structure, and one surface of the fixing member 200 faces the transfer station.

[0045] In some embodiments, the fixing member 200 has a quadrangular prism structure. In this application, the conical pin in the traditional technology is designed into a prismatic structure such as a quadrangular prism structure, so that one surface of the fixing member 200 can better fix the silicon wafer 20, is less likely to shift, and reduces the shift rate.

[0046] Preferably, in some embodiments, the fixing member 200 has a pyramidal structure. For example, the fixing member 200 has a quadrangular pyramid structure, and the pyramidal structure can give a certain space for the silicon wafer 20 to give way.

[0047] In some of these embodiments, the fixed platform 100 includes a first fixed sub-platform and a second fixed sub-platform. The first fixed sub-platform and the second fixed sub-platform are spaced apart, and a partial position on the first fixed sub-platform close to the second fixed sub-platform and a partial position on the second fixed sub-platform close to the first fixed sub-platform form a transfer station. A transfer component is arranged within the interval between the first fixed sub-platform and the second fixed sub-platform, and the transfer component is used to transfer the silicon wafer 20.

[0048] In some of these embodiments, the fixing device 10 further includes a lifting mechanism. The lifting mechanism is connected to the first fixed sub-platform and the second fixed sub-platform. The lifting mechanism is used to drive the first fixed sub-platform and the second fixed sub-platform to move up and down.

[0049] For example, referring to Figure 1 as shown, the first fixed sub-platform and the second fixed sub-platform integrally form a gantry structure.

[0050] In some of these embodiments, the lifting mechanism is a lifting cylinder or a lifting motor.

[0051] In some of these embodiments, the fixing device 10 further includes a transmission component 300. The fixing member 200 is connected to the driving component through the transmission component 300.

[0052] In some of these embodiments, the transmission component 300 can be a lead screw component. Using a lead screw component as the transmission component 300 can improve the transmission stability.

[0053] In some of these embodiments, referring to Figure 2 as shown, Figure 2 is a side schematic view of the fixing device 10 according to an embodiment of the present invention. The transmission component 300 includes a transmission shaft 310 and a telescopic arm 320. The driving component is connected to the transmission shaft 310. The transmission shaft 310 is threadedly connected to the telescopic arm 320. The telescopic arm 320 is movably connected to the fixed platform 100 and can move along the adjustment channel 101. The arrangement of the transmission shaft 310 and the telescopic arm 320 can improve the movement stability of the fixing member 200, and by the mutual cooperation of the transmission shaft 310 and the telescopic arm 320, the position of the fixing member 200 is adjusted to adapt to different types and different sizes of silicon wafers 20. Based on different types and different sizes of silicon wafers 20, the position of the fixing member 200 can be adaptively adjusted.

[0054] In some of these embodiments, the driving component is a driving motor.

[0055] In some of these embodiments, referring to Figure 3As shown in the figure, the fixing device 10 further includes an induction component 400. The bottom parts of the respective fixing members 200 are respectively provided with the induction component 400. The bottom part position of the fixing member 200 is used to internally place the induction component 400. For example, the induction component 400 is an infrared sensor, and the infrared irradiation direction is upward. The induction component 400 is used to detect the position of the silicon wafer 20. When the fixing member 200 moves along the adjustment channel 101 towards the silicon wafer 20, the induction component 400 can sense the distance of the silicon wafer 20 in advance, and can react before contacting the silicon wafer 20, and stop driving the movement of the fixing member 200 in time. By setting the induction component 400 in this application, the position between the fixing member 200 and the edge of the silicon wafer 20 can be accurately controlled, avoiding damage to the silicon wafer 20 by the fixing member 200 and improving the quality of the silicon wafer 20.

[0056] In some of the embodiments, the induction component 400 is a position sensor or a proximity switch. For example, in a specific example, the induction component 400 is an infrared sensor.

[0057] When the transmission component transports the silicon wafer between the first fixing sub-platform and the second fixing sub-platform, the lifting mechanism drives the first fixing sub-platform and the second fixing sub-platform to rise, and the fixing members 200 on the first fixing sub-platform and the second fixing sub-platform are used to fix the position of the silicon wafer. When performing position fixing, through the mutual cooperation of the induction component 400, the transmission component 300, and the driving component, the driving component drives the transmission component 300 to act. For example, each transmission component 300 drives the fixing member to move a preset stroke according to a preset trajectory, so as to fix the silicon wafer at a predetermined position.

[0058] In summary, compared with the traditional technology, the fixing device 10 of this application has the following beneficial effects:

[0059] (1) In one example of this application, the conical pin in the traditional technology is changed to a quadrangular pyramid pin, which increases the contact area between the fixing device 10 and the silicon wafer 20, makes the fixing of the silicon wafer 20 more stable, and will not scratch the silicon wafer 20 at the same time.

[0060] (2) The fixing device 10 of this application can adjust the silicon wafer 20 after position offset, and reduce the poor coating of the silicon wafer 20 caused by the offset.

[0061] (3) The structure of the fixing device 10 of this application is flexible and changeable. Even if the silicon wafer 20 is offset, the offset silicon wafer 20 can be adjusted to the correct position and fixed. The adjustment time is short and the machine will not alarm, reducing the time cost and improving the production efficiency.

[0062] (4) The fixing device 10 of the present application is provided with a sensing component 400 to detect the position of the silicon wafer 20, which can sense the size of the silicon wafer 20 and adjust in a timely manner. It has a wide range of applications and can adapt to various silicon wafers 20 of different specifications and sizes, avoiding the situation where the silicon wafer 20 cannot be fixed when it is offset.

[0063] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0064] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0065] The above embodiments only represent several implementation manners of the present utility model. The descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model should be subject to the appended claims.

Claims

1. A fixing device (10), characterized in that: The invention comprises a fixed platform (100), a fixing member (200) and a driving component. The fixed platform (100) is provided with a transfer station for transferring a silicon wafer (20) and a plurality of adjustment channels (101). The plurality of adjustment channels (101) are distributed around the transfer station. Some of the adjustment channels (101) extend along a first direction, and other parts of the adjustment channels (101) extend along a second direction. The fixing member (200) is respectively arranged in each of the adjustment channels (101). The driving component is connected to the fixing member (200). The fixing member (200) can adjust the position along the adjustment channel (101) to fix the silicon wafer (20) on the transfer station from different positions.

2. The fixing device (10) according to claim 1, characterized in that: The first direction is perpendicular to the second direction.

3. The fixing device (10) according to claim 2, characterized in that: At least two groups of the adjustment channels (101) are arranged at intervals in the first direction, and each group of the adjustment channels (101) is located at two sides of the transfer station respectively; At least two groups of the adjustment channels (101) are arranged at intervals in the second direction, and each group of the adjustment channels (101) is located at two sides of the transfer station respectively.

4. The fixing device (10) according to claim 1, characterized in that: The fixing member (200) is in the form of a polygonal column, and one surface of the fixing member (200) faces the transfer station.

5. The fixing device (10) according to claim 1, characterized in that: The fixing member (200) is in the shape of a quadrangular prism; Alternatively, the fixing member (200) is in the shape of a quadrangular pyramid.

6. The fixing device (10) according to any one of claims 1 to 5, characterized in that: The fixed platform (100) comprises a first fixed sub-platform and a second fixed sub-platform, the first fixed sub-platform and the second fixed sub-platform are arranged at an interval, and a part of the first fixed sub-platform close to the second fixed sub-platform and a part of the second fixed sub-platform close to the first fixed sub-platform constitute the transfer station.

7. The fixing device (10) according to claim 6, characterized in that The fixing device (10) further comprises a lifting mechanism, wherein the lifting mechanism is connected to the first fixing sub-platform and the second fixing sub-platform, and the lifting mechanism is used to drive the first fixing sub-platform and the second fixing sub-platform to move upward and downward.

8. The fixing device (10) according to any one of claims 1 to 5 and 7, characterized in that: The fixing device (10) further comprises a transmission component (300), and the fixing member (200) is connected to the driving component via the transmission component (300).

9. The fixing device (10) according to claim 8, characterized in that The transmission component (300) comprises a transmission shaft (310) and a telescopic arm (320), the driving component is connected to the transmission shaft (310), the transmission shaft (310) is threadedly connected to the telescopic arm (320), and the telescopic arm (320) is movably connected to the fixed platform (100) and can move along the adjustment channel (101).

10. The fixing device (10) according to any one of claims 1 to 5, 7 and 9, characterized in that: The fixing device (10) further comprises an induction component (400), and the bottom of each fixing member (200) is respectively provided with the induction component (400).

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